EV-VNH7100AS
VNH7100AS Evaluation Board
Data brief
additional effort in external component design and
connection.
VNH7100AS is a full bridge motor driver intended
for a wide range of automotive applications. The
device incorporates a dual monolithic high-side
driver and two low-side switches. Both switches
are designed using ST proprietary VIPower M0
technology that allows to efficiently integrate on
the same die a true Power MOSFET with an
intelligent signal/protection circuitry. The three
dies are assembled in SO-16N package on
electrically isolated leadframes.
Moreover, its fully symmetrical mechanical design
allows superior manufacturability at board level.
Features
Max transient supply voltage
VCC
41 V
Operating voltage range
VCC
4 to 28 V
Typ. on-state resistance (per
Ch)
RON
100 mΩ
Current limitation (typ)
ILIMH
15 A
Stand-by current (max)
ISTBY
1 µA
Simple single IC application board dedicated
for VNH7100AS
Provides electrical connectivity and thermal
heat-sinking for easy prototyping
The input signals INA and INB can directly
interface the microcontroller to select the motor
direction and the brake condition. A SEL0 pin is
available to address the information available on
the MultiSense to the microcontroller. The
MultiSense pin allows to monitor the motor
current by delivering a current proportional to the
motor current value.
The PWM, up to 20 kHz, allows to control the
speed of the motor in all possible conditions.
Table 1. Device summary
Order Code
Reference
EV-VNH7100AS
VNH7100AS Evaluation Board
Description
EV-VNH7100AS provides you an easy way to
connect STMicroelectronics® VIPower® M0-7
H-Bridge drivers into your existing prototype
circuity. This evaluation board comes
preassembled with VNH7100AS H-Bridge. On
board minimum set of electrical components (as
for device datasheet recommendation) is enabling
the user to directly connect the load, the power
supply and the microcontroller without any
October 2016
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For further information contact your local STMicroelectronics sales office.
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Design recommendation
1
EV-VNH7100AS
Design recommendation
This evaluation board provides mounting and some heat sinking capability for prototype
development.
Figure 1. VNH7100AS evaluation board schematic
Figure 2. VNH7100AS evaluation board top layout
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Design recommendation
Figure 3. VNH7100AS evaluation board bottom layout
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Board connections
2
EV-VNH7100AS
Board connections
Table 2. Pin connection and function
Connector
Board lead number
Device pin function
J1
1, 2
GND
J1
3, 4, 5, 6
OUTA
J1
7
INA
J1
8
GND
J1
9
INA
J1
10, 11, 12, 13
OUTB
J1
14, 15
GND
J2
1, 2
GND
J2
4
SEL0
J2
5
GND
J2
6
CS
J2
7, 8, 9, 10, 11
VCC
J2
12
GND
J2
13
PWM
J2
14, 15
GND
Table 3. BOM
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Component
Value
C1
33 nF
C2
220 uF 35V
R1, R2,R3, R4
1k Ohm
R5
10K Ohm
R6
1.5k Ohm
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Thermal data
Thermal data
Table 4. EV-VNH7100AS thermal data
Symbol
Parameter
Max
Unit
Rthj-amb
Thermal resistance junction-ambient HSD (MAX)
55
°C/W
Rthj-amb
Thermal resistance junction-ambient HSD (MAX)
75
°C/W
Table 5. PCB specifications
Parameter
Value
Unit
47 x 41
mm
Number of Cu layer
2
-
Layer Cu thickness
35
μm
1.6 +/- 10%
mm
FR4
-
Board dimensions
Board finish thickness
Board Material
Thermal vias separation
1.1 mm
Thermal vias diameter
0.5 mm
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Package information
EV-VNH7100AS
4
Package information
4.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Revision history
Revision history
Table 6. Document revision history
Date
Revision
26-Oct-2016
1
Changes
Initial release.
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EV-VNH7100AS
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved
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