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EV-VNQ5027AK

EV-VNQ5027AK

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    -

  • 描述:

    BOARD EVAL FOR VNQ5027AK

  • 数据手册
  • 价格&库存
EV-VNQ5027AK 数据手册
EV-VNQ5027AK VNQ5027AK evaluation board Data brief − production data Features Parameter device limits the dissipated power to safe level up to thermal shutdown intervention. Symbol Value Unit Max supply voltage VCC 41 V Operating voltage range VCC 4.5 to 36 V Max On-State resistance RON 27 mΩ Current limitation (typ) ILIMH 42 A Off-state supply current IS 2 µA(1) Thermal shutdown with automatic restart allows the device to recover normal operation as soon as fault condition disappears. Figure 1. VNQ5027AK evaluation board Table 1. Device summary 1. Typical value with all loads connected. ■ Simple single IC application board dedicated for VNQ5027AK-E ■ Provides thermal heat-sinking for ease of use in prototyping ■ Provides electrical connectivity for easy prototyping Description EV-VNQ5027AK provides you an easy way to connect ST’s surface mounted VIPower® drivers into your existing prototype circuitry. This evaluation board comes pre-assembled with VNQ5027AK-E high-side driver. The VNQ5027AK-E is a monolitic device made using STMicroelectronics® VIPower technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes. This device integrates an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is in a high impedance condition. Output current limitation protects the device in overload condition. In case of long overload duration, the September 2013 Order code EV-VNQ5027AK Reference VNQ5027AK evaluation board Doc ID 023981 Rev 2 This is information on a product in full production. For further information contact your local STMicroelectronics sales office. 1/9 www.st.com 1 Design recommendations 1 EV-VNQ5027AK Design recommendations This evaluation board provides mounting solution and some heat sinking capability for prototype development, but there are still external components that are required to make these devices work in any application. For further information on how the evaluation board has to be used you can refer to the AN4212 (see Appendix A: Reference documents). Figure 2 illustrates the necessary components for any application. Figure 2. VNQ5027AK evaluation board 9&& %DWWHU\ O' 7$% 7$%   O'   N  ,1387 *1' 287387 287387 &855(176(16( 287387 ,1387 287387  N  ,1387 N &855(176(16( /54054 ,1387 N &855(176(16( 9&& &855(176(16(  &855(176(16( 287387 ,1387 N &855(176(16(  N ,1387 7$% ,1387 287387 287387 &6B',6 287387 9&& 287387   O'   9 /RDGV  O'   9 /RDGV  O' N &6B',6$%/( 5VHQVH 9 /RDGV  287387 &855(176(16( N &855(176(16( 287387  N ,1387  5VHQVH 5VHQVH 5VHQVH     9 /RDGV 2SWLRQDO N 6PDOO6LJQDO 'LRGH )RU5HYHUVH %DWWHU\3URWHFWLRQ *$3*&)7 ST has produced a user manual for safe designs using ST’s VIPower devices. This is UM1556 (see Appendix A: Reference documents). UM1556 is a VIPower Hardware design guide that provides all necessary information to successfully design your circuit using our VIPower drivers. All designs have different needs and requirements. Whatever design you decide to use, it will still need to be verified in order to meet your application specifications. ST implies no guarantee or warranty (see Appendix A: Reference documents). 2/9 Doc ID 023981 Rev 2 EV-VNQ5027AK 2 Thermal data Thermal data Table 2. VNQ5027AK-E thermal data Symbol Rthj-amb Table 3. Parameter Thermal resistance junction-ambient (MAX) Max. value Unit 29 °C/W PCB specifications Parameter Value Unit 38 x 43 mm Number of Cu layer 2 — Layer Cu thickness 70 µm 1.6 +/- 10% mm Board Material FR4 — Thermal vias separation 1.2 mm 0.3 /- 0.08 mm Board dimensions Board finish thickness Thermal vias diameter Doc ID 023981 Rev 2 3/9 Board connector reference 3 4/9 EV-VNQ5027AK Board connector reference Figure 3. Board layout Table 4. Board connector specification Connector Board lead number Device pin function(1) J1 TAB VCC J1 1 VCC J1 2 GND J1 3 INPUT1 J1 4 CURRENT SENSE1 J1 5 INPUT2 J1 6 CURRENT SENSE2 J1 7 INPUT3 J1 8 CURRENT SENSE3 J1 9 INPUT4 J1 10 CURRENT SENSE4 J1 11 CS_DIS J1 12 VCC J2 TAB VCC J2 13 OUTPUT4 J2 14 OUTPUT4 J2 15 OUTPUT4 Doc ID 023981 Rev 2 EV-VNQ5027AK Board connector reference Table 4. Board connector specification (continued) Connector Board lead number Device pin function(1) J2 16 OUTPUT3 J2 17 OUTPUT3 J2 18 OUTPUT3 J2 19 OUTPUT2 J2 20 OUTPUT2 J2 21 OUTPUT2 J2 22 OUTPUT1 J2 23 OUTPUT1 J2 24 OUTPUT1 1. For further clarification on pin functions please refer to the related datasheet (see Appendix A: Reference documents). Doc ID 023981 Rev 2 5/9 Package information EV-VNQ5027AK 4 Package information 4.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6/9 Doc ID 023981 Rev 2 EV-VNQ5027AK Reference documents Appendix A Reference documents 1. Quad channel high side driver with analog current sense for automotive applications (VNQ5027AK-E, DocID 12730) 2. VIPower M0-5 and M0-5Enhanced high-side drivers (UM1556, DocID 023520) 3. PowerSSO-24 devices evaluation bord (AN4212, DocID 023983) 4. Evaluation Product Licence Agreement on www.st.com Doc ID 023981 Rev 2 7/9 Revision history EV-VNQ5027AK Revision history Table 5. 8/9 Document revision history Date Revision Changes 29-Nov-2012 1 Initial release. 16-Sep-2013 2 Updated disclaimer. Doc ID 023981 Rev 2 EV-VNQ5027AK Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 023981 Rev 2 9/9
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