FERD15S50DJF-TR

FERD15S50 Datasheet 50 V, 15 A field effect rectifier Features • • • • ST patented rectifier process Stable leakage current over reverse voltage Low forward voltage drop High frequency operation • ECOPACK®2 compliant Applications • • • Set-top box Battery charger DC / DC converter Description This single rectifier is based on a patented technology, enabling to achieve the best in class VF/IR trade-off for a given silicon surface. Packaged in PowerFLAT™ 5x6, the FERD15S50 is optimized for use in rectification and freewheeling operations in switch mode power supplies. Product status FERD15S50 Product summary Symbol Value IF(AV) 15 A VRRM 50 V T j(max.) 150 °C VF(typ.) 0.48 V DS9849 - Rev 3 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com FERD15S50 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 50 V IF(RMS) Forward rms current 25 A IF(AV) Average forward current, δ = 0.5 square wave TC = 120 °C 15 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 80 A Tstg Storage temperature range -65 to +175 °C +150 °C Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-c) Parameter Junction to case Max. value Unit 2.8 °C/W For more information, please refer to the following application note : • AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages Table 3. Static electrical characteristics (anode terminals short circuited) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C VR = VRRM IF = 5 A IF = 10 A IF = 15 A Min. Typ. Max. Unit - 250 650 µA - 20 40 mA - 0.35 - 0.30 0.35 - 0.42 0.48 - 0.41 0.45 - 0.48 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.25 x IF(AV) + 0.02 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS9849 - Rev 3 page 2/9 FERD15S50 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (anode terminals short circuited) PF(AV )(W) 12 Figure 2. Average forward current versus ambient temperature (δ = 0.5, anode terminals short circuited) 20 10 IF(AV)(A) R th(j- a) = R th(j- c) 15 8 10 6 4 T 5 T 2 0 I F(AV)(A) 0 2 4 6 8 10 12 14 16 δ =tp/T tp δ =tp/T 18 0 20 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 0 tp T amb (°C) 25 50 75 100 125 150 Figure 4. Reverse leakage current versus reverse voltage applied (typical values) I (m A ) 1.E+02 R Zth (j- c) /R th (j - c ) PowerFLAT™ 5x6 0.9 Tj = 125 °C 1.E+01 0.8 0.7 0.6 1.E+00 0.5 0.4 0.3 0.2 Tj = 25 °C 1.E-01 Single pulse 0.1 1.E-02 tP(s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values) 10000 C(pF) V R (V) 0 5 10 15 20 25 30 35 40 45 50 Figure 6. Forward voltage drop versus forward current (typical values, anode terminals short circuited) 100 I F (A ) F = 1MHz Vosc = 30mV RMS Tj = 25 °C 10 1000 Tj = 125 °C Tj = 25°C 1.0 VR(V) 100 1 DS9849 - Rev 3 10 100 0.1 0.0 VF(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 page 3/9 FERD15S50 Characteristics (curves) Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values) Rth(j-a) (°C/W) 150 PowerFlat™_5X6 epoxy printed board FR4, eCu = 35 µm 125 100 75 50 25 SCu (cm²) 0 0 DS9849 - Rev 3 1 2 3 4 5 6 7 8 9 10 page 4/9 FERD15S50 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT™ 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 8. PowerFLAT™ 5x6 package outline (non-contractual) Bottom view Side view Top view DS9849 - Rev 3 page 5/9 FERD15S50 PowerFLAT™ 5x6 package information Table 4. PowerFLAT™ 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 9. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) DS9849 - Rev 3 page 6/9 FERD15S50 Ordering Information 3 Ordering information Table 5. Ordering information DS9849 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode FERD15S50DJF-TR FD15 S50 PowerFLAT™ 5x6 95 mg 3000 Tape and reel page 7/9 FERD15S50 Revision history Table 6. Document revision history DS9849 - Rev 3 Date Version Changes 09-Oct-2013 1 Initial release. 09-Nov-2018 2 Updated Section Cover image and Section Features. Updated Figure 8. PowerFLAT™ 5x6 package outline (non-contractual) Added Section Applications, Table 4. PowerFLAT™ 5x6 mechanical data and Figure 9. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm). 05-Feb-2019 3 Updated Figure 8. PowerFLAT™ 5x6 package outline (non-contractual) and Table 4. PowerFLAT™ 5x6 mechanical data. page 8/9 FERD15S50 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS9849 - Rev 3 page 9/9