FERD2045SB-TR

FERD2045S 45 V field-effect rectifier diode Datasheet - production data Description A This single rectifier is based on a proprietary technology that achieves the best in class VF/IR trade-off for a given silicon surface. K A K K Therefore it can advantageously replace 45 V low voltage Schottky diodes. Packaged in DPAK, this device is intended to be used in rectification and freewheeling operations in power supplies. A A A A Table 1: Device summary DPAK Features      ST advanced rectifier process Stable leakage current over reverse voltage Low forward voltage drop High frequency operation ECOPACK®2 compliant component for DPAK on demand January 2018 DocID031305 Rev 1 This is information on a product in full production. Symbol Value IF(AV) 20 A VRRM 45 V VF(typ.) 0.29 V Tj(max.) 150 °C 1/8 www.st.com Characteristics 1 FERD2045S Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short-circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 40 A IF(AV) Average forward current δ = 0.5, square wave TC = 125 °C 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Tstg Storage temperature range -65 to +175 °C -40 to +150 °C Value Unit 1.4 °C/W Maximum operating junction temperature Tj range(1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Table 4: Static electrical characteristics (anode terminals short circuited) Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = 35 V VR = VRRM IF = 5 A IF = 10 A IF = 20 A Min. Typ. Max. Unit - 100 300 µA - 12 24 mA - 200 600 µA - 18 40 mA - 0.35 - 0.29 - 0.41 0.45 - 0.38 0.42 - 0.51 0.55 - 0.52 0.57 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation: P = 0.27 x IF(AV) + 0.015 x IF2(RMS) 2/8 DocID031305 Rev 1 V FERD2045S 1.1 Characteristics Characteristics (curves) Figure 1: Average forward current versus ambient temperature (δ = 0.5) 30 IF(AV)(A) Figure 2: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) /Rth(j-c) 1.0 0.9 Rth(j-a) = Rth(j-c) 25 0.8 0.7 20 0.6 15 0.5 0.4 10 T Single pulse 0.3 5 δ =tp/T 0.2 tp Tamb (°C) 0.1 0 0 25 50 75 100 125 150 Figure 3: Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 t p(s) 0.0 1.E-04 1.E-02 1.E-01 1.E+00 Figure 4: Junction capacitance versus reverse voltage applied (typical values) 10000 IR(mA) 1.E-03 C(pF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C Tj = 150 °C Tj = 125 °C 1.E+01 Tj = 100 °C Tj = 75 °C 1000 1.E+00 Tj = 50 °C Tj = 25 °C 1.E-01 VR(V) 1.E-02 VR(V) 0 5 10 15 20 25 30 35 40 45 100 1 Figure 5: Forward voltage drop versus forward current (typical values) 10 100 Figure 6: Forward voltage drop versus forward current (typical values) DocID031305 Rev 1 3/8 Characteristics FERD2045S Figure 7: Thermal resistance junction to ambient versus copper surface under tab for DPAK Rth(j-a) (°C/W) 100 DPAK 90 80 70 60 50 40 30 Epoxy printed board FR4, e Cu= 35 µm 20 10 SCu(cm²) 0 0 4/8 5 10 15 20 25 DocID031305 Rev 1 30 35 40 FERD2045S 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Cooling method: by conduction (C) Epoxy meets UL 94,V0 DPAK package information Figure 8: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID031305 Rev 1 5/8 Package information FERD2045S Table 5: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 9: DPAK recommended footprint (dimensions in mm) 6/8 DocID031305 Rev 1 FERD2045S 3 Ordering information Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode FERD2045SB-TR FERD 2045 DPAK 0.32 g 2500 Tape and reel Revision history Table 7: Document revision history Date Revision 15-Jan-2018 1 DocID031305 Rev 1 Changes Initial release. 7/8 FERD2045S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved 8/8 DocID031305 Rev 1