FERD20H100SFP

FERD20H100S Datasheet 100 V, 20 A field-effect rectifier diode Features A K K K A A TO-220AB A K K A A IPAK K K A A A A DPAK A TO-220FPAB • • • • • • ST advanced rectifier process Stable leakage current over reverse voltage Reduced leakage current Low forward voltage drop High frequency operation Insulated package TO-220FPAB: – Insulated voltage: 2000 VRMS sine • ECOPACK2 compliant component K A Applications • • • • • Switching diode Notebook adapter LED lighting DC/DC converter MPPT Description The device is based on a proprietary technology that achieves the best in class VF/IR trade-off for a given silicon surface. Product status This 100 V rectifier has been optimized for use in confined casing applications where both efficiency and thermal performance matter. FERD20H100S Product summary Symbol Value IF(AV) 20 A VRRM 100 V VF(max.) 0.415 V IR(max.) 140 µA T j(max.) 175 °C With a lower dependency of leakage current (IR) and forward voltage (VF) in function of temperature, the thermal runaway risk is reduced. Therefore, it can advantageously replace 100 V Schottky diodes. DS11526 - Rev 4 - June 2020 For further information contact your local STMicroelectronics sales office. www.st.com FERD20H100S Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 40 A 20 A TO-220AB, IF(AV) TC = 155 °C Average forward current, δ = 0.5 square wave DPAK, IPAK TO-220FPAB IFSM Surge non repetitive forward current Tstg Storage temperature range Tj DPAK, IPAK TO-220AB, TO-220FPAB TC = 110 °C 150 tp = 10 ms sinusoidal A 250 -65 to +175 °C +175 °C Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-c) Parameter Junction to case Max. value TO-220AB, DPAK, IPAK 1.0 TO-220FPAB 3.8 Unit °C/W Table 3. Static electrical characteristics (anode terminals short circuited) Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 25 °C (2) VF Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 125 °C VR = VRRM VR = 70 V IF = 2 A IF = 5 A IF = 10 A IF = 20 A Min. Typ. - Max. Unit 140 µA - 8 16 - 4 7 - 0.370 0.415 - 0.315 0.365 - 0.455 0.515 - 0.450 0.510 - 0.580 0.655 - 0.550 0.605 - 0.640 0.705 mA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.415 x IF(AV) + 0.019 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier DS11526 - Rev 4 page 2/16 FERD20H100S Characteristics (curves) • 1.1 AN4021: Calculation of reverse losses on a power diode Characteristics (curves) Figure 1. Average forward current versus ambient temperature (δ = 0.5) 35 IF(AV) (A) Figure 2. Relative variation of thermal impedance junction to case versus pulse duration 1.0 0.9 30 Rth(j-a)=Rth(j-c) 25 0.7 0.6 0.5 15 0.4 0.3 10 Single pulse T 0.2 5 δ = tp/T tp 0.1 Tamb (°C) 0 25 50 75 100 125 t p(s) 0.0 0 150 175 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 0.9 TO-220AB / DPAK / IPAK 0.8 TO-220AB / DPAK / IPAK TO-220FPAB 20 1.0 Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.E-04 1.E-03 1.E-02 Figure 4. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 IR(mA) TO-220FPAB Tj = 150 °C 1.E+01 0.8 Tj = 125 °C 0.7 Tj = 100 °C 1.E+00 0.6 Tj = 75 °C 0.5 Tj = 50 °C 1.E-01 0.4 0.3 1.E-01 Single pulse Tj = 25 °C 1.E-02 0.2 0.1 VR(V) t p (s) 1.E-03 0.0 1.E-03 DS11526 - Rev 4 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0 10 20 30 40 50 60 70 80 90 100 page 3/16 FERD20H100S Characteristics (curves) Figure 5. Junction capacitance versus reverse voltage applied (typical values) 10000 C(pF) Figure 6. Forward voltage drop versus forward current (typical values) 100.0 IF(A) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C 10.0 1000 Tj = 75 °C Tj = 125 °C Tj = 25 °C 1.0 VF(V) VR(V) 0.1 100 1 10 0.0 100 Figure 7. Forward voltage drop versus forward current (typical values) IF(A) 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Figure 8. Thermal resistance junction to ambient versus copper surface under tab (typical values) 100 20 0.1 Rth(j-a) (°C/W) DPAK 90 80 Tj = 75 °C 70 15 Tj = 125 °C 60 Tj = 25 °C 50 10 40 30 5 Epoxy printed board FR4, eCu= 35 µm 20 10 VF(V) 0 0 0.0 0.1 DS11526 - Rev 4 0.2 0.3 0.4 0.5 0.6 0.7 0.8 SCu (cm²) 0 5 10 15 20 25 30 35 40 page 4/16 FERD20H100S Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 IPAK package information • • Cooling method: by conduction (C) Epoxy meets UL 94,V0 Figure 9. IPAK package outline E b4 A c2 V1 L2 D L1 A1 e B5 b2 b e1 DS11526 - Rev 4 H L c page 5/16 FERD20H100S IPAK package information Table 4. IPAK package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 b 0.64 0.90 0.025 0.035 b2 b4 0.95 5.20 B5 5.43 0.037 0.205 0.30 typ. 0.214 0.012 typ. c 0.45 0.60 0.018 0.024 c2 0.46 0.60 0.018 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.65 0.252 0.261 e e1 2.28 typ. 4.40 H DS11526 - Rev 4 Inches typ.0.090 4.60 0.173 16.10 typ. 0.181 0.634 typ. L 9.0 9.60 0.354 0.378 L1 0.80 1.20 0.031 0.047 L2 0.80 typ. 1.25 0.031 typ. 0.049 V1 +10° +10 page 6/16 FERD20H100S DPAK package information 2.2 DPAK package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 10. DPAK package outline Note: DS11526 - Rev 4 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 7/16 FERD20H100S DPAK package information Table 5. DPAK package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 DS11526 - Rev 4 Inches (for reference only) 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° page 8/16 FERD20H100S DPAK package information Figure 11. DPAK recommended footprint (dimensions in mm) DS11526 - Rev 4 page 9/16 FERD20H100S TO-220FPAB package information 2.3 TO-220FPAB package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 12. TO-220FPAB package outline DS11526 - Rev 4 page 10/16 FERD20H100S TO-220FPAB package information Table 6. TO-220FPAB package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 4.40 4.60 0.1739 0.1818 B 2.50 2.70 0.0988 0.1067 D 2.50 2.75 0.0988 0.1087 E 0.45 0.70 0.0178 0.0277 F 0.75 1.00 0.0296 0.0395 F1 1.15 1.70 0.0455 0.0672 F2 1.15 1.70 0.0455 0.0672 G 4.95 5.20 0.1957 0.2055 G1 2.40 2.70 0.0949 0.1067 H 10.00 10.40 0.3953 0.4111 L2 DS11526 - Rev 4 Inches (for reference only) 16.00 typ. 0.6324 typ. L3 28.60 30.60 1.1304 1.2095 L4 9.80 10.60 0.3874 0.4190 L5 2.90 3.60 0.1146 0.1423 L6 15.90 16.40 0.6285 0.6482 L7 9.00 9.30 0.3557 0.3676 Dia 3.00 3.20 0.1186 0.1265 page 11/16 FERD20H100S TO-220AB package information 2.4 TO-220AB package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.60 N·m Figure 13. TO-220AB package outline DS11526 - Rev 4 page 12/16 FERD20H100S TO-220AB package information Table 7. TO-220AB package mechanical data Dimensions Millimeters Ref. DS11526 - Rev 4 Inches (for reference only) Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 0.51 0.60 0.020 0.024 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 page 13/16 FERD20H100S Ordering information 3 Ordering information Table 8. Ordering information DS11526 - Rev 4 Order code Marking Package Weight Base qty. Delivery mode FERD20H100STS FD20H100STS TO-220AB 1.38 g 50 Tube FERD20H100SFP FD20H100SFP TO-220FPAB 1.7 g 50 Tube FERD20H100SB-TR FD20 H100S DPAK 0.35 g 2500 Tape and reel FERD20H100SH FD20 H100S IPAK 0.32 g 75 Tube page 14/16 FERD20H100S Revision history Table 9. Document revision history DS11526 - Rev 4 Date Revision Changes 08-Mar-2016 1 Initial release. 09-May-2016 2 Update of document title. 13-Nov-2017 3 Updated cover page and Table 8. Ordering information. 22-Jun-2020 4 Updated Section 2.2 DPAK package information. page 15/16 FERD20H100S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS11526 - Rev 4 page 16/16