FERD20U60DJFD-TR

FERD20U60DJFD Field effect rectifier Datasheet - production data Description This single rectifier is based on a proprietary technology, enabling to achieve the best in class VF/IR trade-off for a given silicon surface. Packaged in PowerFLAT™ 5x6, this device is intended to be used in rectification and freewheeling operations in switch-mode power supplies. Table 1: Device summary Symbol Value IF(AV) 20 A VRRM 60 V Tj (max.) +150 °C VF (typ.) 350 mV Features     ST proprietary process Stable leakage current over reverse voltage Low forward voltage drop High frequency operation TM: PowerFLAT is a trademark of STMicroelectronics September 2017 DocID027416 Rev 2 This is information on a product in full production. 1/8 www.st.com Characteristics 1 FERD20U60DJFD Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current δ = 0.5, square wave TC = 115 °C 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Tstg Storage temperature range -65 to +175 °C +150 °C Value Unit 2.6 °C/W Tj Maximum operating junction temperature (1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal resistance parameters Symbol Parameter Junction to case Rth(j-c) Table 4: Static electrical characteristics, anode terminals short circuited Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.295 x IF(AV) + 0.0105 IF2(RMS) 2/8 DocID027416 Rev 2 Min. Typ. - Max. Unit 800 µA mA - 30 70 - 0.380 0.425 - 0.350 0.400 - 0.465 0.510 - 0.465 0.505 V FERD20U60DJFD 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current Figure 2: Average forward current versus ambient temperature (δ = 0.5) PF(AV)(W) 16 IF(A V)(A) 35 14 R th(j-a) = R th(j-c) 30 12 25 10 20 8 15 6 5 2 I F(AV) (A) δ =tp/T δ =tp/T tp 0 tp Tamb (°C) 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration 1.0 T 10 T 4 Zth(j-c) /R th(j-c) 0 25 50 75 100 125 150 Figure 4: Reverse leakage current versus reverse voltage applied (typical values) I R (m A) 1.E+02 0.9 Tj = 125 °C 0.8 1.E+01 0.7 Tj = 100 °C Tj = 75 °C 0.6 0.5 1.E+00 Tj = 50 °C 0.4 0.3 Single pulse 0.2 Tj = 25 °C 1.E-01 0.1 t p (s) 0.0 V R (V ) 1.E-02 1.E-04 1.E-03 1.E-02 1.E-01 0 1.E+00 Figure 5: Junction capacitance versus reverse voltage applied (typical values) 5 10 15 20 25 30 35 40 45 50 55 60 Figure 6: Forward voltage drop versus forward current (typical values) C(pF) 100.0 10000 IF ( A ) F = 1 MHz Vosc = 30 mV RMS T j = 25 °C 10.0 Tj = 75 °C 1000 Tj = 125 °C 1.0 Tj = 25 °C VR (V) VF (V) 100 1 10 100 0.1 0.00 DocID027416 Rev 2 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 3/8 0.50 Characteristics FERD20U60DJFD Figure 7: Thermal resistance junction to ambient versus copper surface under tab (typical values) R t h( j - a)(°C/W) 150 Epoxy printed board Fr4, copper thickness = 35 µm 125 100 75 50 25 SCu (cm²) 0 0 4/8 1 2 3 4 5 DocID027416 Rev 2 6 7 8 9 10 Package information FERD20U60DJFD 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL 94,V0 Cooling method: by conduction (C) PowerFLAT™ 5x6 8L package information Figure 8: PowerFLAT™ 5x6 8L package outline DocID027416 Rev 2 5/8 Package information FERD20U60DJFD Table 5: PowerFLAT™ 5x6 8L mechanical data Dim. Millimeters Inches Ref Min. Typ. Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 b 0.30 0.50 0.011 0.019 c 0.25 D D2 0.10 5.10 3.91 e 4.11 0.201 0.153 1.27 0.162 0.05 E 5.90 6.10 0.232 0.240 E2 3.34 3.54 0.131 0.139 K 1.10 1.575 0.043 0.062 L 0.50 0.80 0.019 0.031 L1 0.06 0.20 0.002 0.008 L2 0.10 0.004 Figure 9: PowerFLAT™ 5x6 8L recommended footprint (dimensions are in mm) 6/8 DocID027416 Rev 2 Ordering information FERD20U60DJFD 3 Ordering information Table 6: Ordering information Order code FERD20U60DJFD-TR 4 Marking Package Weight Base qty. Delivery mode FD20U60 PowerFLAT 5x6 0.9 g 3000 Tape and reel Revision history Table 7: Document revision history Date Revision 11-Feb-2015 1 27-Sep-2017 2 Changes Initial release. Updated description in cover page. Minor text changes. DocID027416 Rev 2 7/8 FERD20U60DJFD IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 8/8 DocID027416 Rev 2