FERD30H100S
100 V field-effect rectifier diode
Datasheet - production data
Description
A
The device is based on a proprietary technology
that achieves the best in class VF/IR trade-off for a
given silicon surface. This 100 V rectifier has
been optimized for use in confined casing
applications where both efficiency and thermal
performance matter. With a lower dependency of
leakage current (IR) and forward voltage (VF) in
function of temperature, the thermal runaway risk
is reduced. Therefore, it can advantageously
replace 100 V Schottky diodes.
K
K
A
K
A
K
A
IPAK
A
TO-220AB
K
A
K
K
A
A
A
A
DPAK
Table 1: Device summary
Symbol
Value
Features
IF(AV)
30 A
VRRM
100 V
VF (max.)
0.405 V
IR(max.)
130 µA
Tj(max.)
175 °C
ST advanced rectifier process
Stable leakage current over reverse voltage
Reduced leakage current
Low forward voltage drop
High frequency operation
ECOPACK®2 compliant component
November 2017
DocID029159 Rev 2
This is information on a product in full production.
1/13
www.st.com
Characteristics
1
FERD30H100S
Characteristics
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified, with anode
terminals short circuited)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
Forward rms current
45
A
TC = 145 °C
30
A
tp = 10 ms sinusoidal,
DPAK/IPAK
150
tp = 10 ms sinusoidal,
TO-220AB
250
Average forward current δ = 0.5,
square wave
IF(AV)
IFSM
Surge non repetitive forward current
Tstg
A
Storage temperature range
Maximum operating junction temperature
Tj
-65 to +175
°C
+175
°C
Value
Unit
0.9
°C/W
(1)
Notes:
(1)(dP
tot/dTj)
< (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal resistance parameters
Symbol
Rth(j-c)
Parameter
Junction to case
Table 4: Static electrical characteristics with anode terminals short circuited
Symbol
Parameter
Test conditions
Tj = 25 °C
IR(1)
Reverse leakage current
Tj = 125 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 125 °C
VR = VRRM
VR = 70 V
IF = 3 A
IF = 5 A
IF = 10 A
IF = 30 A
Notes:
(1)Pulse
test: tp = 5 ms, δ < 2%
(2)Pulse
test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.424 x IF(AV) + 0.0133 IF2(RMS)
2/13
DocID029159 Rev 2
Min.
Typ.
-
Max.
Unit
130
µA
-
8
16
-
4
7
-
0.390
0.440
-
0.350
0.405
-
0.440
0.495
-
0.415
0.470
-
0.550
0.620
-
0.530
0.585
-
0.680
0.745
mA
V
FERD30H100S
1.1
Characteristics
Characteristics (curves)
Figure 1: Average forward current versus ambient
temperature (δ = 0.5)
IF(AV)(A)
35
Figure 2: Relative variation of thermal impedance
junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
Rth(j-a) = Rth(j-c)
0.9
30
0.8
25
0.7
0.6
20
0.5
15
0.4
10
0.3
T
Single pulse
0.2
5
δ = tp/T
tp
Tamb (°C)
0.1
0
0
25
50
75
100
125
150
175
Figure 3: Reverse leakage current versus reverse
voltage applied (typical values)
1.E+02
IR(mA)
tp (s)
0.0
1.E-04
1.E-03
1.E-02
1.E-01
Figure 4: Junction capacitance versus reverse
voltage applied (typical values)
10000
C(pF)
F = 1MHz
Vosc = 30 mVRMS
Tj = 25 °C
Tj = 150 °C
1.E+01
Tj = 125 °C
Tj = 100 °C
1.E+00
Tj = 75 °C
1000
Tj = 50 °C
1.E-01
Tj = 25 °C
1.E-02
VR(V)
VR(V)
100
1.E-03
0
10
20
30
40
50
60
70
80
90
1
100
Figure 5: Forward voltage drop versus forward
current (typical values)
100.0
10
100
Figure 6: Forward voltage drop versus forward
current (typical values)
IF(A)
IF(A)
30
Tj = 25 °C
Tj = 75 °C
10.0
20
Tj = 125 °C
Tj = 75 °C
Tj = 125 °C
Tj = 25 °C
10
1.0
VF (V)
VF (V)
0
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
DocID029159 Rev 2
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
3/13
1.0
Characteristics
FERD30H100S
Figure 7: Thermal resistance junction to ambient versus copper surface under tab for DPAK (typical values)
Rth(j-a) (°C/W)
100
DPAK
90
80
70
60
50
40
30
Epoxy printed board FR4, e Cu= 35 µm
20
10
SCu(cm²)
0
0
4/13
5
10
15
20
25
DocID029159 Rev 2
30
35
40
FERD30H100S
2
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL94,V0
Recommended torque value: 0.55 N·m (for TO-220AB)
Maximum torque value: 0.6 N·m (for TO-220AB)
DocID029159 Rev 2
5/13
Package information
2.1
FERD30H100S
TO-220AB package information
Figure 8: TO-220AB package outline
6/13
DocID029159 Rev 2
FERD30H100S
Package information
Table 5: TO-220AB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.024
0.035
b1
1.14
1.70
0.045
0.067
c
0.48
0.70
0.019
0.028
D
15.25
15.75
0.600
0.620
E
10.00
10.40
0.394
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.195
0.203
F
0.51
0.60
0.020
0.024
J1
2.40
2.72
0.094
0.107
H1
6.20
6.60
0.244
0.256
L
13.00
14.00
0.512
0.551
L1
3.50
3.93
0.138
0.155
L20
16.40 typ.
0.646 typ.
L30
28.90 typ.
1.138
ØP
3.75
3.85
0.148
0.156
Q
2.65
2.95
0.104
0.116
DocID029159 Rev 2
7/13
Package information
2.2
FERD30H100S
DPAK package information
Figure 9: DPAK package outline
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
8/13
DocID029159 Rev 2
FERD30H100S
Package information
Table 6: DPAK package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.18
2.40
0.085
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
b
0.64
0.90
0.025
0.035
b4
4.95
5.46
0.194
0.215
c
0.46
0.61
0.018
0.024
c2
0.46
0.60
0.018
0.023
D
5.97
6.22
0.235
0.244
D1
4.95
5.60
0.194
0.220
E
6.35
6.73
0.250
0.265
E1
4.32
5.50
0.170
0.216
e
2.286 typ.
0.090 typ.
e1
4.40
4.70
0.173
0.185
H
9.35
10.40
0.368
0.409
L
1.0
1.78
0.039
0.070
L2
1.27
0.050
L4
0.60
1.02
0.023
0.040
V2
-8°
+8°
-8°
+8°
Figure 10: DPAK recommended footprint (dimensions in mm)
DocID029159 Rev 2
9/13
Package information
2.3
FERD30H100S
IPAK package information
Figure 11: IPAK package outline
10/13
DocID029159 Rev 2
FERD30H100S
Package information
Table 7: IPAK package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
b
0.64
0.90
0.025
0.035
b2
b4
0.95
5.20
B5
5.43
0.037
0.205
0.30 typ.
0.214
0.012 typ.
c
0.45
0.60
0.018
0.024
c2
0.46
0.60
0.018
0.024
D
6.00
6.20
0.236
0.244
E
6.40
6.65
0.252
0.261
e
e1
2.28 typ.
4.40
H
typ.0.090
4.60
0.173
16.10 typ.
0.181
0.634 typ.
L
9.0
9.60
0.354
0.378
L1
0.80
1.20
0.031
0.047
L2
0.80 typ.
1.25
0.031 typ.
0.049
V1
+10°
+10
DocID029159 Rev 2
11/13
Ordering information
3
FERD30H100S
Ordering information
Table 8: Ordering information
4
Order code
Marking
Package
Weight
Base qty.
Delivery mode
FERD30H100STS
FD30H100STS
TO-220AB
1.38 g
50
Tube
FERD30H100SH
FD30 H100S
IPAK
0.32 g
75
Tube
FERD30H100SB-TR
FD30 H100S
DPAK
0.35 g
2500
Tape and reel
Revision history
Table 9: Document revision history
12/13
Date
Revision
07-Apr-2016
1
Initial release.
14-Nov-2017
2
Updated cover page.
DocID029159 Rev 2
Changes
FERD30H100S
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© 2017 STMicroelectronics – All rights reserved
DocID029159 Rev 2
13/13
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