FERD30H60CTS

FERD30H60C 60 V field-effect rectifier diode Datasheet - production data Description A1 The device is based on a proprietary technology that achieves the best in class VF/IR trade-off for a given silicon surface. K A2 K K This 60 V rectifier has been optimized for use in confined applications where both efficiency and thermal performance are key. A2 K A2 A1 A1 TO-220AB This device is suitable for use in adapters and chargers. D²PAK Table 1: Device summary Features      ST advanced rectifier process Stable leakage current over reverse voltage Reduced leakage current Low forward voltage drop High frequency operation September 2017 DocID030944 Rev 1 This is information on a product in full production. Symbol Value IF(AV) 2 x 15 A VRRM 60 V VF (typ.) 0.41 V Tj (max.) 175 °C 1/12 www.st.com Characteristics 1 FERD30H60C Characteristics Table 2: Absolute ratings (limiting values at 25 °C, per diode, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 60 A Per diode 15 Per device 30 Average forward current δ = 0.5, square wave TC = 155 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range IF(AV) Maximum operating junction temperature Tj A 250 A -65 to +175 °C +175 °C Max. value Unit (1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal resistance parameters Symbol Rth(j-c) Parameter Per diode 1.5 Total 0.9 Junction to case Coupling Rth(c) °C/W 0.25 Table 4: Static electrical characteristics, per diode Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM VR = 45 V IF = 3 A IF = 7.5 A IF = 15 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.320 x IF(AV) + 0.019 x IF2(RMS) 2/12 DocID030944 Rev 1 Min. Typ. - Max. Unit 170 µA - 10 20 - 6 12 - 0.355 0.395 - 0.295 0.335 - 0.430 0.475 - 0.410 0.460 - 0.530 0.585 - 0.540 0.600 mA V FERD30H60C 1.1 Characteristics Characteristics (curves) Figure 1: Average forward current versus ambient temperature (δ = 0.5, per diode) 50 IF(AV)(A) Figure 2: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) /Rth(j-c) 1.0 0.9 Rth(j-a) = Rth(j-c) 0.8 40 0.7 0.6 30 0.5 0.4 20 Single pulse 0.3 T 0.2 10 δ =tp/T 0.1 Tamb(°C) tp 0 0 25 50 75 100 125 150 175 Figure 3: Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+02 t p(s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 4: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(mA) 10000 F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 Tj = 125 °C Tj = 100 °C 1.E+00 1000 Tj = 75 °C Tj = 50 °C 1.E-01 Tj = 25 °C VR(V) VR(V) 1.E-02 0 10 20 30 40 50 60 100 1 Figure 5: Forward voltage drop versus forward current (typical values, per diode) 10 100 Figure 6: Forward voltage drop versus forward current (typical values, per diode) DocID030944 Rev 1 3/12 Characteristics FERD30H60C Figure 7: Thermal resistance junction to ambient versus copper surface under tab for D²PAK (typical values) R th (j-a) (°C/W ) 80 D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu(cm²) 0 0 4/12 5 10 15 20 25 DocID030944 Rev 1 30 35 40 FERD30H60C 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.55 N·m (for TO-220AB) Maximum torque value: 0.6 N·m (for TO-220AB) DocID030944 Rev 1 5/12 Package information 2.1 FERD30H60C TO-220AB package information Figure 8: TO-220AB package outline 6/12 DocID030944 Rev 1 FERD30H60C Package information Table 5: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 0.51 0.60 0.020 0.024 J1 2.40 2.72 0.094 0.107 H1 6.20 6.60 0.244 0.256 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 ØP 3.75 3.85 0.148 0.156 Q 2.65 2.95 0.104 0.116 DocID030944 Rev 1 7/12 Package information 2.2 FERD30H60C D²PAK package information Figure 9: D²PAK package outline 8/12 DocID030944 Rev 1 FERD30H60C Package information Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 0.051 0.060 E 10 E1 8.50 E2 6.85 e 1.50 0.043 10.40 0.394 8.70 8.90 0.335 0.343 0.346 7.05 7.25 0.266 0.278 0.282 2.54 0.409 0.100 e1 4.88 5.28 0.190 0.205 H 15 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.4 0° 0.015 8° DocID030944 Rev 1 0° 8° 9/12 Package information FERD30H60C Figure 10: D²PAK recommended footprint (dimensions are in mm) 10/12 DocID030944 Rev 1 FERD30H60C 3 Ordering information Ordering information Table 7: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode FERD30H60CTS FD30H60CTS TO-220AB 1.38 g 50 Tube FERD30H60CG-TR FD30H60CG D²PAK 1.43 g 1000 Tape and reel Revision history Table 8: Document revision history Date Revision 01-Sep-2017 1 DocID030944 Rev 1 Changes Initial release. 11/12 FERD30H60C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID030944 Rev 1