FERD30SM100DJFTR

FERD30SM100DJF Datasheet 100 V, 30 A field effect rectifier Features • • • • ST patented rectifier process Stable leakage current over reverse voltage Low forward voltage drop High frequency operation • ECOPACK®2 compliant Applications • • • • Switching diode Notebook adapter LED lighting DC / DC converter Description The FERD30SM100DJF is based on a proprietary technology that achieves the best in class VF / IR trade-off for a given silicon surface. Packaged in PowerFLAT™ 5x6, the FERD30SM100DJF is optimized for use in confined applications where both efficiency and thermal performance are key. Product status FERD30SM100DJF Product summary Symbol Value IF(AV) 30 A VRRM 100 V T j(max.) 175 °C VF(typ.) 0.665 V DS10782 - Rev 3 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com FERD30SM100DJF Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5, square wave TC = 100 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Tstg Storage temperature range -65 to +175 °C +175 °C Max. value Unit 2.6 °C/W Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-c) Parameter Junction to case For more information, please refer to the following application note : • AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages Table 3. Static electrical characteristics (anode terminals short-circuited) Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM VR = 70 V IF = 5 A IF = 10 A IF = 30 A Min. Typ. Max. Unit - - 150 µA - 8 16 - - 9 - 0.480 0.395 - 0.435 0.595 0.510 - mA 0.555 V 0.970 0.665 0.735 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.562 x IF(AV) + 0.0057 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS10782 - Rev 3 page 2/9 FERD30SM100DJF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (anode terminals short circuited) 30 PF(AV) (W) δ = 0.5 25 Figure 2. Average forward current versus ambient temperature (δ = 0.5, anode terminals short circuited) 40 δ=1 IF(AV) (A) R th(j-a) =R th(j-c) δ = 0.2 30 δ = 0.1 20 δ = 0.05 15 20 10 T T 10 5 δ= tp/T tp I F(AV) (A) δ= tp/T 0 0 5 10 15 20 25 30 35 40 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 Zth(j-c)/Rth(j-c) 0 Tamb(°C) tp 0 25 50 75 125 150 175 Figure 4. Reverse leakage current versus reverse voltage applied (typical values) 1.E+01 IR(mA) T = 125 °C j POWERFlat™ 5x6 0.9 100 0.8 T = 100 °C j 0.7 1.E+00 0.6 T = 75 °C j 0.5 0.4 T = 50 °C j 1.E-01 Single pulse 0.3 0.2 0.1 0.0 1.E-04 T = 25 °C j tP(s) 1.E-03 1.E-02 1.E-01 V (V) 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values) 10000 R 1.E-02 0 10 20 30 40 50 60 70 80 90 100 Figure 6. Forward voltage drop versus forward current (typical values, anode terminals short circuited) I (A) 100.0 F C(pF) F = 1 MHz VOSC = 30 mVRMS T = 25 °C j 10.0 Tj = 75 °C 1000 1.0 T = 125 °C j T = 25 °C j V (V) R 100 1 DS10782 - Rev 3 10 100 0.1 0.0 V (V) F 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 page 3/9 FERD30SM100DJF Characteristics (curves) Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values) Rth(j-a) (°C/W) 150 PowerFlat™_5X6 epoxy printed board FR4, eCu = 35 µm 125 100 75 50 25 SCu (cm²) 0 0 DS10782 - Rev 3 1 2 3 4 5 6 7 8 9 10 page 4/9 FERD30SM100DJF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT™ 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 8. PowerFLAT™ 5x6 package outline (non-contractual) Bottom view Side view Top view DS10782 - Rev 3 page 5/9 FERD30SM100DJF PowerFLAT™ 5x6 package information Table 4. PowerFLAT™ 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 9. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) DS10782 - Rev 3 page 6/9 FERD30SM100DJF Ordering Information 3 Ordering information Table 5. Ordering information DS10782 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode FERD30SM100DJFTR F30SM 100 PowerFLAT™ 5x6 95 mg 3000 Tape and reel page 7/9 FERD30SM100DJF Revision history Table 6. Document revision history DS10782 - Rev 3 Date Version Changes 09-Jan-2015 1 Initial release. 29-Nov-2018 2 Updated Section Cover image and Section 2.1 PowerFLAT™ 5x6 package information. Added Section Applications. 08-Feb-2019 3 Updated Figure 8. PowerFLAT™ 5x6 package outline (non-contractual) and Table 4. PowerFLAT™ 5x6 mechanical data. page 8/9 FERD30SM100DJF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS10782 - Rev 3 page 9/9