FERD40U45CT

FERD40U45C Field effect rectifier Datasheet - production data Description A1 This dual rectifier is based on a proprietary technology that achieves the best in class VF/IR for a given silicon surface. K A2 K Packaged in TO-220AB, and D2PAK, this device is intended to be used in switch mode power supplies, or automotive applications K A1 K A2 TO-220AB FERD40U45CT A2 A1 D2PAK FERD40U45CG Table 1. Device summary IF(AV) 2 x 20 A VRRM 45 V VF(typ) 0.31 V Features  ST advanced rectifier process  Stable leakage current over reverse voltage  Low forward voltage drop  High frequency operation November 2013 This is information on a product in full production. DocID024891 Rev 1 1/10 www.st.com Characteristics 1 FERD40U45C Characteristics Table 2. Absolute ratings (limiting values, per diode at 25° C, unless otherwise stated) Symbol VRRM IF(RMS) 1. Parameter Value Unit Repetitive peak reverse voltage 45 V Forward rms current 40 A 20 40 A 275 A -65 to + 175 °C Per diode Per device IF(AV) Average forward current,  = 0.5 Tc =150° C Tc =145° C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range Tj Maximum operating junction temperature (1) dPtot --------------dTj TO-220AB, D2PAK 175 D2PAK (DC forward current without reverse bias, t = 1 hour) 200 °C 1 - condition to avoid thermal runaway for a diode on its own heatsink  ------------------------Rth  j – a  Table 3. Thermal resistances Symbol Rth (j-c) Rth(c) Parameter Per diode Total Junction to case Coupling Value Unit 1.6 1.1 °C/W 0.5 °C/W When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode2) x Rth(c). Table 4. Static electrical characteristics (per diode) Symbol IR(1) Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C VF(2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM IF = 10 A Typ. Max. Unit 1800 µA 50 100 mA 0.35 0.385 0.31 0.34 0.42 0.46 0.42 0.46 V IF = 20 A 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.28 x IF(AV) + 0.009 IF2(RMS) 2/10 Min. DocID024891 Rev 1 FERD40U45C Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode) 16 PF(AV) (W) 25 d = 0.1 14 Figure 2. Average forward current versus ambient temperature ( = 0.5, per diode) d = 0.2 IF(AV) (A) d = 0.5 d = 0.05 Rth(j-a)=Rth(j-c) 20 12 d=1 10 15 8 10 6 T 4 T 5 2 IF(AV) (A) d=tp/T 0 0 5 10 15 20 tp 25 30 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 d=tp/T 0 Zth(j-c)/Rth(j-c) 0 Tamb (°C) tp 25 50 75 100 125 150 175 Figure 4. Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+02 IR (mA) 0.9 Tj=125°C 0.8 0.7 1.E+01 0.6 0.5 0.4 1.E+00 0.3 0.2 Tj=25°C Single pulse 0.1 tp (s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 0 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values, per diode) 10000 VR (V) 1.E-01 C (pF) 5 10 15 20 25 30 35 40 45 Figure 6. Forward voltage drop versus forward current (typical values, per diode) 100.0 IF (A) F=1MHz Vosc =30mVRMS Tj=25°C 10.0 1000 Tj=125°C Tj=25°C 1.0 VF (V) VR (V) 100 0.1 1 10 100 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 DocID024891 Rev 1 3/10 10 Characteristics FERD40U45C Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values) 80 Rth(j-a) (°C/W) D²PAK Epoxy printed circuit board FR4, copper thickness: 35 µm 70 60 50 40 30 20 10 S(Cu) (cm²) 0 0 4/10 5 10 15 20 DocID024891 Rev 1 25 30 35 40 FERD40U45C 2 Package Information Package Information  Epoxy meets UL94,V0  Cooling method: by conduction (C)  Recommended torque value: 0.4 to 0.6 N·m (TO-220AB) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. TO-220AB dimension definitions A E ∅P Resin gate 0.5 mm max. protrusion(1) F Q H1 D D1 L30 L20 b1 J1 L1 L b e e1 Resin gate 0.5 mm max. protrusion(1) c (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites DocID024891 Rev 1 5/10 10 Package Information FERD40U45C Table 5. TO-220AB dimension values Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 D1 6/10 Inches 1.27 typ. 0.05 typ. E 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.094 0.107 L 13 14 0.51 0.55 L1 3.50 3.93 0.137 0.154 L20 16.40 typ. 0.64 typ. L30 28.90 typ. 1.13 typ. P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 DocID024891 Rev 1 FERD40U45C Package Information Figure 9. D2PAK dimension definitions A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Table 6. D2PAK dimension values Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.30 1.75 0.051 0.069 M 2.29 2.79 0.090 0.110 R V2 0.40 typ. 0° 0.016 typ. 8° DocID024891 Rev 1 0° 8° 7/10 10 Package Information FERD40U45C Figure 10. D2PAK footprint (dimensions in mm) 16.90 12.2 5.08 2.54 1.60 9.75 8/10 DocID024891 Rev 1 3.50 FERD40U45C 3 Ordering Information Ordering Information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode FERD40U45CT FERD40U45CT TO-220AB 2.2 g 50 Tube 1.8 g 500 Tape and reel FERD40U45CG-TR 4 FERD40U45CG 2 D PAK Revision history Table 8. Document revision history Date Revision 13-Nov-2013 1 Description of Changes Previous version DocID024891 Rev 1 9/10 10 FERD40U45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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