GS-BT2416C1H

GS-BT2416C1.H Bluetooth® class 1 module with embedded HCI FW Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Bluetooth® specification V.1.2 compliant Transmission rate up to 721 Kbps Output power class 1 ( 20 dBm max) Working distance up to 100 meters ACL and SCO links AFH interference resistance Supports USB (1.1) /UART/PCM (pulse code modulation)/SPI/ I²C interfaces Optimized link manager and control Support wireless LAN coexistence in collocated scenario Integrated 4 Mbit Flash, 64 Kbytes RAM, 4 Kbytes ROM 3.3 V single supply voltage Hardware based UART flow control Description Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ bs O Serial cable replacement Industrial control Laptops POS terminals Data acquisition equipment Internet access points Machine control Sensor monitoring Robotic and bionic control Security control Patient monitoring Audio gateway applications Hands-free sets Wireless printers Cordless terminals Laptops, PCs and accessories Hand held devices and accessories HID devices (keyboard, mouse, joystick, game controller...) let o Pr e du o (s) ct so Ob - ST Bluetooth® modules are highly integrated for easy implementation in embedded applications. Class 1 modules enable wireless communication with other Bluetooth® enabled devices up to 100 m away. The GS-BT2416C1.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 kHz and 13 MHz oscillator, Vreg as well PA function. The module embeds customer framework up to HCI level allowing interoperability with HCI top resident on Host. The antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be SMA aerial or a low cost antenna trace designed on PCB. For more details pleas refer to GS-BT2416C1DB application note. The GS-BT2416C1.H is the HCI module of the GS-BT2416C1.xx series. GS-BT2416C1.H is BQB pre-qualified. Conformance testing through Bluetooth® qualification program enables a fast time to market after system integration by ensuring a high degree of compliance and interoperability. te le ro P uc d s) t( May 2008 Rev 2 1/19 www.st.com 19 Contents GS-BT2416C1.H Contents 1 2 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Bluetooth® section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.1 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.1 5.2 5.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 8 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8.1 8.2 bs O 10 11 12 9 let o Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Pr e Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 du o (s) ct so Ob - te le ro P uc d s) t( Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/19 GS-BT2416C1.H Certifications 1 Certifications ● CE compliant (IMQ Exp. opinion 0081-AREF00017) – – – – – Safety EN60950-1 (2001) EMC EN301 489 17V1.2.1 Radio ES 300 328 V1.6. FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please refer to GS-BT2416C1DB application note) FCC ID: S9NBT2416C1DB ● BQB compliant bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 3/19 Maximum ratings GS-BT2416C1.H 2 2.1 Maximum ratings Absolute maximum ratings Absolute maximum ratings (see Table 1) indicate limits beyond which damage to the device may occur. Sustained exposure to these limits will adversely affect device reliability. Operating ranges (see Table 2) define the limits for functional operation and parametric characteristics of the module. Functionality outside these limits is not implied. Table 1. Symbol VDD VIN Tstg Tsold Absolute maximum ratings Values Parameter Min Module supply voltage Input voltage on any digital pin Storage temperature Soldering temperature Max 4 Vss1-0.5 Vdd+0.3 -40 +85 V Unit 2.2 Operating ranges Table 2. Symbol VDD Tstg Operating ranges Parameter Module supply voltage Operating ambient temperature bs O let o od Pr e ct u (s) Ob - Conditions so te le ro P Min 3.13 -20 uc d 240 Typ 3.3 s) t( V °C Values Unit Max 3.47 +70 V °C - 20 °C < T < 70 °C 4/19 GS-BT2416C1.H Electrical characteristics 3 3.1 Electrical characteristics DC I/O specification Table 3. Symbol Vil Vih Vhyst Vol Voh DC input / output specification Values Parameter Low level input voltage High level input voltage Schmitt trigger hysteresis Low level output voltage High level output voltage Conditions Min 3.13 V < VDD < 3.47 V 3.13 V < VDD < 3.47 V 3.13 V < VDD < 3.47 V Io load = pin drive capability Io load = pin drive capability VDD0.15 2 0.4 0.15 Typ Max 0.8 V V V V V Unit 4 Bluetooth® section Table 4. Symbol CHs Hop 13M CK Bluetooth® section Parameter Channel space Hopping System clock LP CK bs O let o Pr e Tra Trs Iop System clock stability Low power clock du o (s) ct so Ob - te le ro P Min uc d s) t( Values Unit Typ 1 1600 13 Max MHz Hops/ sec MHZ 20 32 - 200 200 721 432 180 60 ppm kHz ppm Kbits/ sec Kbits/ sec mA mA Conditions - 20 °C to 70 °C - 20 Low power clock accuracy Transmission rate asynchronous Transmission rate synchronous Operation current TX mode Operation RX mode 5/19 Bluetooth® section GS-BT2416C1.H 4.1 RF performance characteristics In the performance characteristics table the following applies: ● Test condition: nominal – Voltage typical Vdd 3.3 V – Temperature typical TA = 25 °C Parameters are given at antenna pin Table 5. Symbol Transmitter and receiver performance characteristics Parameter Conditions 2.402 GHz Min Typ 18 18 18 - 36 - 44 - 84 Max 20 20 20 Unit dBm dBm dBm dBm dBm TX Pout TX output power 2.441 GHz 2.480 GHz ACP RX sens TX output spectrum adjacent channel power Receiver sensitivity lM-Nl = 2 lM-Nl ≥ 3 @BER 0.1 % Table 6. Symbol RF in RF out TX out ∆F Synthesizer performance characteristics Parameter Input and output frequency range TX output spectrum at -20 dB Bandwidth TX initial carrier frequency tolerance Conditions l∆F –pn l TX carrier frequency drift bs O let o l∆F/50µsl ro P e uc d (s) t so Ob - eP let Min 2402 - 75 od r Typ 920 uc s) t( dBm Max 2480 1000 75 25 40 40 20 Unit MHz kHz kHz kHz kHz kHz Hz DH1 data packet DH3 data packet DH5 data packet Drift rate 6/19 GS-BT2416C1.H Integrate firmware 5 Integrate firmware The GS-BT2416C1.H includes customer framework up to HCI (host control interface) Figure 1. HCI firmware implementation HCI Top resident on the Host HCI Physical HCI Bottom Serial Interface Layer UART, USB, … SCO channels – Synchronous Connection Oriented resident on the Module AUDIO HCI FIRMWARE LINK MANAGER Host Control Interface Between lower and upper levels Hardware Layer Set up the physical connection BASEBAND HW RF H W 5.1 Features The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications. 5.2 Command interface bs O 5.3 let scenarios o Usage The HCI commands are accessible through the serial port using the host control SW any HCI SW for example bluesoleil (most popular Bluetooth® PC open SW). Pr e du o (s) ct so Ob - te le ro P Set up, manage and secure the link: it’s responsible for paging, including ACL, SCO, inquiry, authentication, encryption, low consumption... uc d s) t( The module with embedded HCI FW is completely open to any custom implementation, strictly depending on the BT stack and profiles that will be added. Module can be configured both as master or slave. Master can support point to point connection or standard point to multi point Pico net up to seven points. 7/19 Application information GS-BT2416C1.H 6 Application information Here below there are some suggestions to better implement the module in the final application. ● Module is usually put on a motherboard, avoid that traces with switching signals are routed below the module. The best would be to have a ground plane underneath the module. Connect the supply voltage ground of the module with the other grounds present on the motherboard in a star way. Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Module foot print ● ● Figure 2. Module foot print Supply voltage GND RF gnd bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 8/19 GS-BT2416C1.H Application information 6.1 Antenna reference RF output pin must be connected to an antenna which could be: ● ● ● Antenna directly printed on the pcb (Figure 3.) Integrated antenna as, for example, antenova® 30-30-A5839-01, Murata ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. (Figure 4.) External antenna connected by means a SMA connector (Figure 5.) Figure 4. Antenna examples Figure 5. SMA connector for external antenna Figure 3. Antenna on PCB ● Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0) of 50 Ω to get the maximum power transfer. Matching for 50 Ω is depending on the various factors, elements to be taken into consideration are: – – – – Type of material, i.e. FR4 The electrical characteristics of the material, i.e. the εr, electric constant at 2.4 GHz Mechanical dimensions of the PCB and traces, i.e. PCB thickness, trace/ reference ground thickness, trace width, trace thickness. Just to give an example, using a 1 mm thick FR4 board, with an εr = 4.3 at 2.4 GHz, with Cu thickness of 41 µm, the resulted width of 50 Ω strip-line is 1.9 mm (Microstrip type calculation). Parameters for trace matching ● Figure 6. bs O let o Trace width Pr e du o (s) ct so Ob - te le ro P uc d s) t( Trace thickness PCB thickness εr (Dielectric constant) Reference ground Tools for calculating the characteristic impedance, based on the physical and mechanical characteristics of the PCB, can be easily found on the web. 9/19 Block diagram GS-BT2416C1.H 7 Block diagram Figure 7. Block diagram RF antenna UART USB PCM SPI I²C GPIO STLC2416 Baseband ARM7 proc STLC2150 Radio chip LNA PA SW Filter 32kHz XTAL 32kHz XTAL bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 10/19 GS-BT2416C1.H Pin settings 8 8.1 Pin settings Pin connections Figure 8. Pin connection diagram bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 11/19 Pin settings GS-BT2416C1.H 8.2 Table 7. Pin N° Pin descriptions Pin descriptions Name I/O Description Power, ground and system signal 1 2 41 42 43 44 45 46 13 26 Vss1 Vdd 1V8 3V3 Vss1 2V7 RESET BOOT LP CLOCK OUT INT1 ----O O --O I I O I GND Module supply voltage- single 3.3 V 1.8 V digital supply out (test purpose) to be left not connected 3.3 V I/O power supply out (test purpose) to be left not connected GND (test purpose) to be left not connected 2.7 digital core supply out (test purpose) to be left not connected Reset pin (active low) External downloading enable (active low) internally pull-upped to 1.8 V by 10 kΩ 32 kHz out External Interrupt signal internally connected to VSS1 with 10 kΩ / If not used connect to VSS1 General purpose signals 3 4 5 6 7 8 10 11 12 14 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO7 GPIO8 GPIO9 I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line I/O General purpose I/O line GPIO11 No connect signals bs O 15 16 17 18 9 let o Pr e I/O General purpose I/O line du o (s) ct so Ob - te le ro P uc d s) t( ------- I/O Not to be used internally used for RX/TX switch I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting I/O Not to be used internally used for TX gain setting ---------- 12/19 GS-BT2416C1.H Table 7. Pin N° Pin settings Pin descriptions (continued) Name I/O Description Test interface signals 19 20 21 22 23 TDI TDO TMS NTRST TCK ----------JTAG pin JTAG pin JTAG pin JTAG pin JTAG pin If not used connect to VSS1 I2C interface signals 24 25 I2C_dat I2C_clk I/O I2C bus interface data to be connected to VDD with 10 kΩ resistor I/O I2C bus interface clock to be connected to VDD with 10 kΩ resistor PCM interface signals 27 28 29 30 PCM_SYNC PCM_CLK PCM_A PCM_B I/O PCM 8 kHz synch I/O PCM clock I/O PCM data in/out I/O PCM data in//out USB interface signals 31 32 USB_DN USB_DP I/O USB data - If not used connect to VSS1 I/O USB data + If not used connect to VSS1 UART interface signals 33 34 35 36 47 48 UART2_RXD UART2_TXD UART2_I1 UART2_02 UART10_TXD I O I O O I UART2 data input If not used connect to VDD UART2 data output UART2 clear to send input If not used connect to VDD UART11_RXD SPI interface signals 37 O bs 38 39 40 49 50 51 let o SPI_FRM SPI_CLK Pr e I du o UART2 ready to send output (s) ct so Ob - te le ro P uc d s) t( UART1 data output UART1 data input If not used connect to VDD I/O Synchronous serial interface frame synch I/O Synchronous serial Interface clock SPI_TXD SPI_RXD O/T Synchronous serial Interface transmit data Synchronous serial Interface receive data If not used connect to VSS1 Antenna signals Vss2 ( RF GND) +ANTENNA Vss2 (RF GND) ------RF GND Antenna out RF GND 13/19 Soldering GS-BT2416C1.H 9 Soldering Soldering phase has to be execute with care: in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Table 8. Soldering Profile feature Average ramp up rate (TSMAX to TP) Preheat Temperature min (TS min) Temperature max (TS max) Time (tS min to tS max) (tS) Time maintained above: Temperature TL Time tL Peak temperature (Tp) Time within 5 °C of actual peak temperature (tP) Ramp down rate Time from 25 °C to peak temperature PB free assembly 3 °C / sec max 150 °C 200 °C 60 – 100 sec 217 °C 40 – 70 sec Figure 9. Soldering bs O let o Pr e du o (s) ct so Ob - te le ro P 240 + 0 °C 10 – 20 sec 6 °C / sec uc d s) t( 8 minutes max 14/19 GS-BT2416C1.H Mechanical dimensions 10 Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 10. Mechanical dimensions bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 15/19 Mechanical dimensions Figure 11. Land pattern GS-BT2416C1.H bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 16/19 GS-BT2416C1.H Ordering information scheme 11 Ordering information scheme Table 9. Ordering information scheme GS-BT Bluetooth® modules 2416 C1 H V 1.2 compliant Class 1 Embedded HCI bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 17/19 Revision history GS-BT2416C1.H 12 Revision history Table 10. Date 31-Aug-2006 27-May-2008 Revision history Revision 1 2 First release Updated: Cover page Added: Section 9 on page 14 Changes bs O let o Pr e du o (s) ct so Ob - te le ro P uc d s) t( 18/19 GS-BT2416C1.H Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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