HDMI2C2-14HD
ESD protection and signal booster for HDMI™ 1.4 sink interface
Datasheet − production data
• Protection of ultra-sensitive HDMI ASICs
• Low power consumption in stand-by mode
• Wake-up from stand-by through CEC bus
• Improved HDMI interface ruggedness and user
experience
• Long and/or poor quality cable support
• Companion chip for STMicroelectronics’
STixxxx HDMI decoders.
Complies with the following standards
• HDMI 1.4 version
• IEC 61000-4-2 level 4
QFN 36L
3.5 X 6.5
• JESD22-A114D level 2
Applications
Features
• HDMI 1.3 and 1.4 compliant: from -40 to 85 °C
• 8 kV contact ESD protection on connector side
• Supports direct connection to low-voltage
HDMI ASIC and/or CEC driver (down to 1.8 V)
• High integration level in 1 package
• TMDS high bandwidth ESD protection
• DDC (I2C) link protection, bi-directional signal
conditioning circuit, and dynamic pull-up
• CEC bus protection, bi-directional level-shifter,
backdrive protection, and independent
structure from main power supply
• HEAC/HPD link protection and line matching
• Proposed in QFN 36 leads 500 µm pitch
Benefits
• Consumer and computer electronics HDMI™
sink device such as:
– HD set-top boxes
– DVD and Blu-Ray Disk systems
– Home theater
– Game console
Description
The HDMI2C2-14HD is a fully integrated ESD
protection and signal conditioning device for
control links and TMDS data video channels of
HDMI receivers (Sink).
The HDMI2C2-14HD is a simple solution that
provides HDMI designers with an easy and fast
way to reach full compliancy with the stringent
HDMI 1.4 CTS on a wide temperature range.
• Speed-up hardware design and certification of
HDMI 1.4 application
• Pin map sequence compliant with HDMI
connector type A
• Minimal PCB footprint in consumer area
August 2014
This is information on a product in full production.
TM: HDMI: the HDMI logo and High-Definition
Multimedia Interface are trademarks or registered
trademarks of HDMI Licensing LLC.
DocID024813 Rev1
1/31
www.st.com
Contents
HDMI2C2-14HD
Contents
1
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
CEC line description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
DDC functional block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3
HEAC link and HPD line protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
TMDS channels ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5
Application block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5
Recommendation on PCB assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.1
Stencil opening design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2
Solder paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.3
Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.4
PCB design preference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.5
Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2/31
DocID024813 Rev1
HDMI2C2-14HD
1
Functional description
Functional description
The HDMI2C2-14HD is a fully integrated ESD protection and signal conditioning device for
control links and TMDS data video channels of HDMI receiver (Sink).
The control stage provides a bidirectional buffer, integrating signal conditioning and dynamic
pull-up on DDC bus for maximum system robustness and signal integrity. The HEAC (HDMI
Ethernet and Audio return Channels) function is supported, making the component fully
compliant with HDMI 1.4 version. A bidirectional CEC block is integrated, able to wake-up
the application from stand-by mode (all power supply off, except the CEC power supply).
The integrated TMDS links ESD protection allows a video data rate up to 10.2 Gbps,
corresponding to the maximal speed specified by HDMI standard. All video format specified
by HDMI standard (from 720p30 up to 1080p60 3D) are supported, giving maximum
flexibility to designer. All these features are provided in a single 36 leads QFN package
featuring natural PCB routing and saving space on the board.
The HDMI2C2-14HD is a simple solution that provides HDMI™ designers with an easy and
fast way to reach full compliancy with the stringent HDMI 1.4 CTS on a wide temperature
range. STMicroelectronics proposes a dual version dedicated for the Sources interfaces:
the HDMI2C1-14HD.
DocID024813 Rev1
3/31
31
Functional description
HDMI2C2-14HD
VDD_CEC_IC
nc
VDD_IC
nc
CEC_IC
Figure 1. Pin out, top view
SCL_IC
VDD_CEC
SDA_IC
DDC_EN
5V_IN
nc
ESD_DISCH
nc
DAT_D2+_IC
DAT_D2+
DAT_D2 - _IC
DAT_D2GND
DAT_D1+_IC
DAT_D1+
DAT_D1-_IC
DAT_D1-
DAT_D0+_IC
DAT_D0+
DAT_D0-
DAT_D0-_IC
4/31
DocID024813 Rev1
CEC
Utility
SCL
SDA
DAT_CK-
HPD
DAT_CK -_IC
HEAC-/HPD_IC
DAT_CK+
HEAC+
DAT_CK+_IC
HDMI2C2-14HD
Application information
2
Application information
2.1
CEC line description
The CEC bus is described in the HDMI standard as the Consumer Electronics Control. It
provides control functions between all the various audiovisual equipments chained in the
user's environment.
The CEC block integrated in the HDMI2C2-14HD implements a level shifter, shifting the
cable CEC +3.3 V voltage (VDD_CEC) down to the ASIC power supply voltage (VDD_IC) that
can be as low as 1.8 V. The Figure 2 shows the functional diagram of the integrated CEC
block.
Figure 2. CEC functional block diagram
VDD_CEC_IC
VDD_CEC
VDD_CEC_IC
RPU_CEC_IC
HBM
IEC61000-4-2
CEC_IC
CEC
diode
decoupling
capacitance
Enable
Ctrl
circuit
RPU_CEC_BUS Anti back drive
decoupling
capacitance
CEC
driver
HDMI
connector
VDD_CEC
UVLO
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
In case of no activity on the CEC bus, or if the CEC driver is off (VDD_CEC_IC = 0), the CEC
pin is put in high impedance mode (open circuit) protecting the circuitry and the application
against hazardous backdrive.
The Figure 3 illustrates the normal operating mode of the CEC functional block when either
the IC from the source on the sink drives the communication.
Figure 3. CEC simplified
ASIC side
CEC_IC
CEC_IC
VDD_CEC_IC
VDD_CEC_IC
VIH_CEC_IC
VIL_CEC_IC
t
t
CEC
Cable side
CEC
VDD_CEC
V DD_CEC
90%
VTup_CEC
VHYST_CEC
V Tdown_CEC
10%
Block in high
impedance
tFALL_CEC
t
Block in high
impedance
Level shifting
Source IC drives
tRISE_CEC
DocID024813 Rev1
t
Block in high
impedance
Level shifting
Block in high
impedance
Sink drives through HDMI cable
5/31
31
Application information
HDMI2C2-14HD
In case the application is set in stand-by mode, the +5 V main supply of the application is
generally powered off in order to reduce as much as possible the global power
consumption. The CEC driver can be the only device still working in low power mode,
allowing a wake up of the whole application through the CEC line. When the main power
supply +5 V is switched off, and if the CEC bus is still active (VDD_CEC power in on state),
the HDMI2C2-14HD keeps the CEC bus working properly while all other outputs of the
component are put in high impedance mode.
The CEC output (cable side) integrates a protection against ESD which is compliant with
IEC61000-4-2 standard, level 4 (8kV contact).
2.2
DDC functional block description
The DDC bus is described in the HDMI 1.4 standard as the Display Data Channel. The
topology corresponds to an I2C bus that must be compliant with the I2C bus specification
version 2.1 (January 2000). The DDC bus is made of 2 lines: data line (SDA) and clock line
(SCL). It is used to create a point to point communication link from the source to the sink.
EEDID and HDCP protocols are flowing through this link, making this I2C communication
channel a critical element in the HDMI application.
The DDC block integrated in the HDMI2C2-14HD allows a bidirectional communication
between the cable and the ASIC. It is fully compliant with the HDMI 1.4 standard and its
CTS, but also with the I2C bus specification version 2.1. The DDC block shifts the electrical
and threshold levels of SDA and SCL lines from the +5 V voltage from the cable (V5V_IN)
down to the ASIC voltage level (VDD_IC), that can be as low as 1.8 V. The Figure 4 shows
the functional diagram of the DDC block integrated in the HDMI2C2-14HD device.
Figure 4. The DDC functional block diagram (SCL and SDA lines)
VDD_IC
+5V
decoupling
capacitance
VDD_IC
DDC_EN
1
3
5
5V_IN
SCL_IC
SDA_IC
HBM
reshaping
circuit
Drive
RPU_BUS
SCL
SDA
IEC61000-4-2
5V_IN
Enable
Dynamic pull-up
HDMI
ASIC
RPU_ASIC
5V_IN
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
HDMI
connector
The DDC_EN allows to authorize or not a bidirectional communication through the
functional block. It can be connected to the main +5V of the board, or to the ASIC power
supply, detecting then if the application is ready for communication or not.
The DDC outputs (SCL and SDA on cable side) integrate a protection against ESD which is
compliant with IEC61000-4-2 standard, level 4 (8kV contact).
6/31
DocID024813 Rev1
HDMI2C2-14HD
Application information
The Figure 5 illustrates the electrical parameters of the DDC block specified in Table 7.
Figure 5. Simplified view of the electrical parameters of the DDC functional block
ASIC side
SDA_IC
VDD_IC
Vtup_IC
V Tdown_IC
t
SDA
Cable side
5V_IN
70%
Vtup_BUS
V Tdown_BUS
V HYST_BUS
30%
t
T FALL_BUS
T RISE_BUS
IC drives
Cable drives
The HDMI standard specifies that the maximum capacitance of the cable can be as high as
700 pF. Knowing that the maximum capacitance of the source input can reach up to 50 pF,
this means that the I2C driver must be able to drive a load capacitance up to 750pF. On the
other hand, the I2C standard specifies that the maximum rise time of the signal must be
lower than 1 µs in order to keep the signal integrity. Taking into account the maximum cable
capacitance of 750 pF, it is not possible to guarantee a rise time lower than 1 µs in worst
case. Therefore, a dynamic pull-up, synchronized with the I2C driver, has been integrated at
the output of SDA and SCL lines. This signal booster accelerates for a short period the
charging time of the equivalent cable capacitance, allowing to drive any HDMI cable. This
dynamic pull-up is recommended by the I2C standard. The Figure 6 illustrates the benefit of
the dynamic pull-up integrated in the HDMI2C2-14HD device.
DocID024813 Rev1
7/31
31
Application information
HDMI2C2-14HD
Figure 6. Benefit of the dynamic pull-up on the DDC bus
I2C driver without dynamic pull-up
I2C driver with dynamic pull-up
5V_IN
Dynamic pull-up
5V_IN
R PU_BUS
750pF
R PU_BUS
750pF
HDMI™ cable model
HDMI™ cable model
IC control
IC control
VDD_IC
V DD_IC
Signal on the cable
Signal on the cable
5V_IN
5V_IN
Rise time
out of I2C specification
Risk of communication failure
Rise time compliant with I2C specification
Signal integrity even on 750pF load capacitance
In order to activate the DDC bus, both following conditions must be respected: the VDD_5V
must be higher than the VDD_ON threshold (see Table 3) and all inputs and outputs of the
bidirectional level shifters (SCL, SDA, SCL_IC, SDA_IC) must be set to a high level at the
same time.
The DDC outputs (SCL and SDA on cable side) integrate a protection against ESD which is
compliant with IEC61000-4-2 standard, level 4 (8kV contact).
8/31
DocID024813 Rev1
HDMI2C2-14HD
HEAC link and HPD line protection
The HDMI2C2-14HD proposes a unique solution in order to manage and protect both the
HEAC and the HPD links.
The HPD line is describe in the HDMI standards as a Hot Plug Defect function.This line is
used by the source device in order to detect if a sink device is connected through an HDMI
cable.
The HEAC link is described in the HDMI 1.4 standards as the HDMI ethernet and audio
return channel. It corresponds physically to one differential wired pair made of the utility line
and the HPD line. Two signals are transmitted through this link.
The first signal corresponds to the HDMI Ethernet Channel (HEC). The signal is transmitted
in differential mode (bidirectional) through the HEAC link. It is specified by the
100Base TX IEEE 802.3 standard (Fast Ethernet 100Mbps over twisted pair). Therefore,
the HEC integrates an Ethernet link into the video cable, enabling IP-based applications
over the HDMI cable.
The second signal corresponds to the Audio Return Channel (ARC). The signal is
transmitted in common mode (unidirectional, from sink to source) through the HEAC link. It
is specified by the IEC 60958-1 standard. The ARC integrates an upstream audio capability,
simplifying the cabling of the audiovisual equipments. It is no more necessary to use a
coaxial cable from TV to audio amplifier.
The HDMI2C1-14HD helps the designer to implement this high added value HEAC function
in the application, protecting the link against the ESD with no disturbance of the signal,
thanks to the integrated matching circuitry on HEAC+ line. It provides 2 distinct outputs
HEAC+ and HEAC- in order to ease as much as possible the PCB layout.
Both HPD and utility inputs (cable side) integrate a protection against ESD which is
compliant with IEC61000-4-2 standard, level 4 (8kV contact).
Figure 7. HEAC / HPD / utility functional block diagram
VDD_IC
decoupling
capacitance
HDMI
connector
HPD
HDMI2C2-14HD
HDMI
ASIC
HEAC-
HPD / HEAC-
HEAC- / HPD_IC
IC
HEAC+
DocID024813 Rev1
7
9
11
13
Utility
HEAC+
1
3
5
IEC61000-4-2
or
HPD
IEC61000-4-2
2.3
Application information
15
Utility / HEAC+
17
2
4
6
8
10
12
14
16
18
19
9/31
31
Application information
2.4
HDMI2C2-14HD
TMDS channels ESD protection
The TMDS (Transient Minimized Differential Signaling) channels are described by the HDMI
1.4 standard. A total of 4 unidirectional differential pairs are used to transmit the video data
to the sink device. There are 3 channels dedicated to the video data, and 1 channel
dedicated to the clock. The frequency of the TMDS clock is 1/10 of the video data frequency.
The HDMI2C2-14HD provides a simple PCB layout solution, directly compliant with HDMI
connector type A. It protects the application against the ESD according the IEC61000-4-2
level 4 standard (+/-8 kV contact). The high bandwidth of this ESD protection allows to
transmit HD video high speed data with no disturbance of the signal. The TDR is compliant
with the HDMI specification.
A capacitor can be optionally connected to the ESD_DISCH pin in order to enhance the
ESD protection performances.
Figure 8. TMDS lines ESD protection functional diagram
5V_IN
HDMI
connector
VDD_IC
HDMI
ASIC
DAT_D2+_IC
DAT_D2+
DAT_D2 - _IC
DAT_D2-
3
DAT_D1+_IC
DAT_D1+
5
DAT_D1- _IC
DAT_D1-
DAT_D0+_IC
DAT_D0+
7
9
11
DAT_D0 - _IC
DAT_D0 -
13
DAT_CLK+_IC
DAT_CLK+
15
17
DAT_CLK - _IC
DAT_CLK-
19
1
2
4
6
8
10
12
14
16
18
IEC61000-4-2
ESD_DSICH
2.5
Application block diagrams
The Figure 9 shows a typical application block diagram proposal implementing all the
possible options. The TMDS channels are simply connected to the connector and to the
HDMI ASIC. The diagram shows that the CEC driver can be totally independent from the
HDMI ASIC. By this way, even if the +5 V power supply and/or if the HDMI ASIC is sleeping,
the CEC bus is still active in low power mode. The designer has then all the tools to optimize
the power consumption of the global application in stand-by mode, and has the possibility to
implement a smart wake-up through the CEC bus enhancing the final user experience.
10/31
DocID024813 Rev1
HDMI2C2-14HD
Application information
Figure 9. Modification of block diagram
VDD_IC
HDMI2C2 - 14HD
TMDS
lines IN
4 TMDS channels
8 lines
TMDS data 2+
TMDS data 2TMDS data 1+
TMDS data 1TMDS data 0+
TMDS data 0TMDS Clock+
TMDS Clock-
TMDS
lines OUT
ESD_DISCH
DDC_EN
C6
VDD_IC
+5V power
5V_IN
VDD_IC
HDMI
ASIC
C2
EEPROM
(EEDID)
R3
C3
R2
HDMI
connector
VDD_IC
R4
R5
DDC data
SDA_IC
SCL_IC
HEAC+
HEAC- /HPD_IC
DDC clock
HEAC+
HEAC -
HPD
HPD / HEAC
-
SDA
SCL
SDA
SCL
Utility
Utility / HEAC+
HPD
VDD_CEC_IC
VDD_CEC
VDD_CEC_IC
VDD_CEC
C1
C5
R6
CEC
driver
D1
R1
CEC_IC
CEC
CEC bus
GND
Table 1. Block diagrams references
Ref.
Typical values
R1
27 kΩ
Pull-up resistance on CEC bus, specified by the HDMI standard
R2, R3
47 kΩ
Pull-up resistances on DDC bus, specified by the HDMI standard
R4, R5
10 kΩ
Pull-up resistance on DDC bus, ASIC side, value selected to be
compliant with I2C levels
R6
Comment
270 kΩ to 1 ΜΩ Pull-up resistance on CEC line, ASIC side
D1
BAT54
Small schottky diode blocking backdrive current flowing toward the
VDD_CEC supply
C1, C2, C3
and C5
100 nF
Decoupling capacitance on power supplies
C6
1 µF
ESD protection enhancement capacitance (option)
Note:
SCL_IC, SDA_IC, and CEC_IC have to be driven with an ASIC working with open drain
outputs.
Note:
even if not specified by HDMI standard, it is recommended to add pull-up resistance on SDA
line (cable side) to avoid floating line.
DocID024813 Rev1
11/31
31
Application information
HDMI2C2-14HD
Figure 10. Modification of block diagram (with HDMI connector type A)
VDD_CEC_IC
VDD_CEC_IC
R6
CEC
driver
EEPROM
VDD_IC
VDD_CEC_IC VDD_CEC
C5
5V_IN
C1
C2
C3
R5
R4
DDC clock
DDC data
SCL_IC
VDD_CEC
SDA_IC
DDC_EN
nc
TMDS Data2+
ESD_DISCH
nc
DAT_D2+_IC
DAT_D2+
DAT_D2-_IC
DAT_D2-
TMDS Data2 Shield
4 TMDS channels, 8 lines
HDMI ASIC
C6
HDMI connector type A
5V_IN
TMDS Data2TMDS Data1+
DAT_D1+_IC
GND
DAT_D1+
TMDS Data1 Shield
DAT_D1-_IC
DAT_D1-
DAT_D0+_IC
DAT_D0+
TMDS Data1TMDS Data0+
DAT_D0-_IC
DAT_D0-
DAT_CK+_IC
DAT_CK+
DAT_CK-_IC
DAT_CK-
TMDS Data0 Shield
TMDS Data0TMDS Clock+
VDD_CEC
TMDS Clock Shield
D1
R1
TMDS ClockCEC
HEAC+
HEAC -
Utility / HEAC+
SCL
HPD
SDA
R3
5V_IN
R2
DDC/CEC GND / HEAC shield
+5V power
HPD / HEAC -
The Figure 10 illustrates the fact that the HDMI2C2-14HD pin configuration eases and
optimizes the PCB layout of the HDMI interface. The proposed pin-out sequence is directly
compliant with HDMI connector type A.
12/31
DocID024813 Rev1
HDMI2C2-14HD
Application information
Table 2. Pin description
Pin
Name
Description
Pin
Name
1
SDA_IC
2
nc
3
DDC input ASIC side
19
DAT_CK-
TMDS output Clock CK-
not connected
20
DAT_CK+
TMDS output Clock CK+
ESD_DISCH
ESD protection enhancement
capacitance
21
DAT_D0-
TMDS output Data D0-
4
DAT_D2+_IC
TMDS input Data D2+
22
DAT_D0+
TMDS output Data D0+
5
DAT_D2-_IC
TMDS input Data D2-
23
DAT_D1-
TMDS output Data D1-
6
DAT_D1+_IC
TMDS input Data D1+
24
DAT_D1+
TMDS output Data D1+
7
DAT_D1-_IC
TMDS input Data D1-
25
DAT_D2-
TMDS output Data D2-
8
DAT_D0+_IC
TMDS input Data D0+
26
DAT_D2+
TMDS output Data D2+
9
DAT_D0-_IC
TMDS input Data D0-
27
nc
10
DAT_CK+_IC TMDS input Clock CK+
28
5V_IN
+5V power supply HDMI cable
side
11
DAT_CK-_IC
TMDS input Clock CK-
29
5V_SYS_DETECT
SENSING OF +5V main power
supply
12
HEAC+
HEAC+ output ASIC side
30
VDD_CEC
13
HEAC-
HEAC- output ASIC side
31
VDD_CEC_IC
14
HPD
HPD/HEAC- input HDMI
cable side
32
nc
15
SDA
DDC output HDMI cable side
33
VDD_IC
16
SCL
DDC output HDMI cable side
34
nc
17
Utility
Utility/HEAC+ input HDMI
cable side
35
CEC_IC
CEC input ASIC side
18
CEC
CEC output HDMI cable side
36
SCL_IC
DDC input ASIC side
DocID024813 Rev1
Description
not connected
CEC supply HDMI cable side
CEC driver power supply
not connected
HDMI ASIC power supply
not connected
13/31
31
Application information
HDMI2C2-14HD
33
VDD_CEC_IC
VDD_IC
34
32
31
30
VDD_CEC
SDA_IC
1
29
DDC_EN
nc
2
28
5V_IN
ESD_DISCH
3
27
nc
DAT_D2+_IC
4
26
DAT_D2+
DAT_D2 - _IC
5
25
DAT_D2-
DAT_D1+_IC
6
24
DAT_D1+
DAT_D1-_IC
7
23
DAT_D1-
DAT_D0+_IC
8
22
DAT_D0+
9
21
DAT_D0-
DAT_CK+_IC
10
20
DAT_CK+
DAT_CK -_IC
11
19
DAT_CK-
13
14
15
16
17
18
HPD
SDA
SCL
Utility
CEC
HEAC+
12
GND
HEAC-/HPD_IC
DAT_D0-_IC
14/31
35
nc
36
nc
SCL_IC
CEC_IC
Figure 11. Pin numbering
DocID024813 Rev1
HDMI2C2-14HD
3
Electrical characteristics
Electrical characteristics
Table 3. Absolute maximum ratings (limiting values)
Symbol
Parameter
Test conditions
Value
Unit
Vpp_BUS
ESD discharge on HDMI BUS side (pin 14 to 26, and pin
Contact discharge
28), IEC 61000-4-2 level 4
±8(1)
kV
Vpp_IC
ESD discharge (all pins), HBM JESD22-A114D level 2 Contact discharge
±2
kV
Tstg
Storage temperature range
-55 to +150
°C
Top
Operating temperature range
-40 to +85
°C
TL
Maximum lead temperature
260
°C
6
V
-0.3 to 6
V
V5V_IN
VDD_IC
Supply voltages
VDD_CEC
VDD_CEC_IC
Inputs
Logical input min/max voltage range
1. With a 100 nF capacitor connected to the 5V_IN pin.
Table 4. Power supply characteristics (Tamb = 25 °C)
Symbol
Parameter
VDD_CEC
CEC supply voltage, bus side
2.97
CEC supply voltage, IC side
VDD_IC
V5V_IN
VDD_CEC_IC
VDD_CEC_ON
IQS_5V_IN
IQS_IC
IQS_CEC
IQS_CEC_IC
Rth
PTOTAL_SB
Test conditions
Min. Typ. Max.
3.63
V
1.62
3.63
V
Low-voltage ASIC supply voltage
1.62
3.63
V
5 V cable supply voltage range
4.7
5.0
5.3
V
CEC power on reset
2.6
2.8
2.95
V
VDD_5V = 5 V, VDD_IC = 1.8 V,
VDD_CEC = 3.3 V
Quiescent currents on
VDD_5V_IN, VDD_IC, VDD_CEC, VDD_CEC_IC = 1.8 V
VDD_CEC_IC
Idle-state on CEC and DDC links,
HPD and 5V_OUT links open
3.3
Unit
500
75
µA
200
40
Junction to ambient thermal
resistance
Copper heatsink as shown by
Figure 24
75
°C/W
Standby conditions
VDD_5V = VDD_IC = 0 V
VDD_CEC = 3.3 V
VDD_CEC_IC = 3.3 V
0.8
mW
DocID024813 Rev1
15/31
31
Electrical characteristics
HDMI2C2-14HD
Table 5. CEC electrical characteristics(1)
Symbol
VTup_CEC
Parameter
Test conditions
Min. Typ. Max.
Upward input voltage threshold on bus side
1.6
VTdown_CEC Downward input voltage threshold on bus side
0.8
Output rise-time (10% to 90%)
TFALL_CEC
Output fall-time (90% to 10%)
IOFF_CEC
VIL_CEC_IC
0.4
RUP = 14.1 kΩ(2) ±5%
CCEC CABLE = 9.7 nF
Leakage current in powered-off state
VDD_5V = 0 V, VDD_IC = 0 V,
VDD_CEC = 3.3 V
Input low level on IC side
CIN_CEC
1.
V
250
µs
50
µs
1.8
µA
0.5
%VDD_IC
VIH_CEC_IC Input high level on IC side
RON_CEC
On resistance across CEC and CEC_IC
pins
CEC pin to 0 V
Input capacitance on CEC link
VDD_5V = 0 V
VDD_CEC = 0 V
VDD_IC = 0 V
VBIAS = 0 V, f = 1 MHz,
VOSC = 30 mV
V
V
VHYST_CEC Input hysteresis on bus side
TRISE_CEC
Unit
115
70
%VDD_IC
160
Ω
40(3)
pF
Tamb = 25 °C, VDD_CEC = 3.3 V, VDD_CEC_IC = 1.8 V, unless otherwise specified
2. Test conditions are compliant with worst case CEC specification:
- Correspond to two 27 kΩ +5% pull-up resistances in parallel (compliant with HDMI CTS)
- Max capacitance corresponding to 9 equipment chained on the CEC bus
3. Maximum capacitance allowed at connector output is 200 pF in HDMI 1.4 specification
Table 6. HPD, HEAC, and utility line electrical characteristics(1)
Value
Symbol
Parameter
Test conditions
Unit
Min.
CIN_HPD
Input capacitance
CIN_UTILITY
fCUT_HEAC
VDD_5V = 0 V, VBIAS = 0 V
f = 100 kHz, VOSC = 30 mV
Cut-off frequency of HEAC bus
1. Tamb = 25°C, VDD_5V = 5 V, unless otherwise specified.
16/31
DocID024813 Rev1
Typ.
Max.
9
pF
500
MHz
HDMI2C2-14HD
Electrical characteristics
Table 7. DDC bus (SDA and SCL lines) electrical characteristics(1)
Value
Symbol
Parameter
Test conditions
Unit
Min. Typ.
VTup_BUS
Upward input voltage threshold on bus side
3.5
VTdown_BUS Downward input voltage threshold on bus side
1.5
VHYST_BUS Input hysteresis on bus side
1.0
V
V
1.3
V
Output low level
Current sunk by SDA and SCL
pin is 3 mA
0.35
V
TRISE_BUS
Output rise-time (30% to 70%)
CBUS = 750 pF(2)
RUP = 2 KΩ //47 KΩ + 10%(3)
500
ns
TFALL_BUS
Output fall-time (30% to 70%)
50
ns
VOL_BUS
VTup_IC
Upward input voltage threshold on IC side
55
60
65
%VDD_IC
VTdown_IC
Downward input voltage thresholds IC side
35
40
45
%VDD_IC
20
mV
17(4)
pF
VOL_IC
CIN_DDC
Output low level on IC side
Current sunk by SDA_IC or
SCL_IC pins is 500 µA
Input capacitance on DDC link
VDD_5V = 0 V
VDD_IC = 0 V
VDD_CEC = 0 V
VBIAS = 0 V, f = 1 MHz
VOSC = 30 mV
VEN_DCC(5) DCC enabling
1.
Max.
9
4.1
V
Tamb = 25 °C, VDD_5V = 5 V, VDD_IC = 1.8 V, unless otherwise specified
2. Maximum load capacitance allowed on I2C entire link (cable + connector) is 750 pF in HDMI 1.4 specification.
3. Two pull-up resistors in parallel (sink 47 kΩ + source 2 kΩ).
4. Maximum capacitance allowed at connector output is 50 pF in HDMI 1.4 specification
5. In order to activate the DCC lines, the level on DCC_EN pin has to reach the VEN_DCC min value. The inputs and ouputs
of the bidirectional level shifters must be set to a high level after the power-on, and the HPD line has to be activated one
time.
DocID024813 Rev1
17/31
31
Electrical characteristics
HDMI2C2-14HD
Table 8. TMDS links electrical characteristics(1)
Value
Symbol
Parameter
Test conditions
Unit
Min.
Bandwidth at -3 dB
VBR
Breakdown voltage
IRM
Leakage current
Differential mode
1.
GHz
6.5
6
V
VRM = 3.3 V
Capacitance input/output to
VI/O =0 V, f = 1 MHz, VOSC = 30 mV
ground
CI/O-GND
Max.
4.7(2)
Single ended mode
fCUT_TMDS
Typ.
ΔCI/O-GND
Capacitance variation
VI/O = 0 V, f = 1 MHz, VOSC = 30 mV
ZDIFF
Differential impedance
tr = 200ps (10%-90%)
Z0DIFF=100 Ω
100
nA
1.5
pF
50
85
pF
100
115
Ω
Tamb =25°C, VDD_5V = 5V, unless otherwise specified
2. The bandwidth is large enough to operate up to 340 MHz as HDMI clock frequency, corresponding to 10.2 Gbps total data
rate, 3.4 Gbps on each lane
Figure 12. TMDS line S21 frequency curve
0
S dd21
dB
-3
-6
Scc21
-9
-12
F(Hz)
-15
100k
18/31
1M
10M
100M
DocID024813 Rev1
1G
HDMI2C2-14HD
Electrical characteristics
Figure 13. TMDS line differential far end crosstalk curve
0
dB
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
F(Hz)
-120
-130
10M
30M
100M
300M
D2-D1_FEXT
1G
3G
10G
D2-CLK_FEXT
Figure 14. TMDS line: remaining voltage when positive 8 kV ESD surge applied
20 V/div
100.9 V
1
1
2
3
4
VPP: ESD peak voltage
VCL :clamping voltage @ 30 ns
VCL :clamping voltage @ 60 ns
VCL :clamping voltage @ 100 ns
13.1 V 2
11.7 V
3
7.5 V
4
20 ns/div
DocID024813 Rev1
19/31
31
Electrical characteristics
HDMI2C2-14HD
Figure 15. TMDS line: remaining voltage when negative 8 kV ESD surge applied
20 V/div
3.3 V
-67.9 V
2
-5.1 V
3
-4.8 V 4
1
1
2
3
4
VPP: ESD peak voltage
VCL :clamping voltage @ 30 ns
VCL :clamping voltage @ 60 ns
VCL :clamping voltage @ 100 ns
20 ns/div
Figure 16. Eye diagram of TMDS line: D0, D1, D2 and CLK lanes (1.485 Gbps)
250 mV/div
112.2 ps/div
20/31
DocID024813 Rev1
HDMI2C2-14HD
Electrical characteristics
Figure 17. Eye diagram of TMDS line: D0, D1, D2 and CLK lanes (3.350 Gbps)
250 mV/div
49.8 ps/div
Figure 18. TDR of TMDS lines: D0, D1, D2, CLK lanes
TDR rise time (10%-90%): 200ps
100 W
89.8 W
DocID024813 Rev1
21/31
31
Electrical characteristics
HDMI2C2-14HD
Figure 19. CEC typical waveforms (from source to sink communication)
C2 = 1.00 V/div
C3 = 500 m V/div
100 µs/div
Figure 20. CEC typical waveforms (from sink to source communication)
C2 = 1.00 V/div
C3 = 500 m V/div
100 µs/div
22/31
DocID024813 Rev1
HDMI2C2-14HD
Electrical characteristics
Figure 21. DDC typical waveforms (from sink to source communication)
C2 = 1.00 V/div
C3 = 500 m V/div
2 µs/div
Figure 22. DDC typical waveforms (source to sink communication)
C2 = 1.00 V/div
C3 = 500 m V/div
2 µs/div
DocID024813 Rev1
23/31
31
Package information
4
HDMI2C2-14HD
Package information
•
Epoxy meets UL94, V0
•
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 23. QFN dimension definitions
24/31
DocID024813 Rev1
HDMI2C2-14HD
Package information
Table 9. QFN dimension values
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.85
0.90
0.95
0.033
0.035
0.037
A1
0.00
0.05
0.000
b
0.18
0.25
0.30
0.007
0.010
0.012
D
3.40
3.50
3.60
0.134
0.137
0.141
D2
2.25
2.30
2.35
0.088
0.090
0.092
E
6.40
6.50
6.60
0.251
0.255
0.259
E2
5.25
5.30
5.35
0.206
0.208
0.210
e
0.50
0.002
0.020
La
0.00
0.10
0.20
0.00
0.004
0.008
Lb
0.15
0.25
0.30
0.006
0.01
0.012
Lc
0.20
0.30
0.40
0.008
0.012
0.016
ddd
0.09
0.003
Figure 24. QFN footprint recommendation (dimensions in mm)
0.23
0.50
0.30
0.50
0.25
2.30
0.25
5.30
DocID024813 Rev1
0.45
25/31
31
Package information
HDMI2C2-14HD
Figure 25. Marking specification
2C2 - 14HD
CCC
Y
W W
e3
G
WX
CCC : Country of origin
Y : Assy Year
W W : Assy Week
G : Eco Level
W X : Diffusion traceability
Figure 26. Tape and reel specification
2.0
Ø1.55
4.0
1.75
7.5
16.0
6.75
Ø1.5
0.9
All dimension in mm
26/31
3.75
8.0
User direction of unreeling
DocID024813 Rev1
HDMI2C2-14HD
Recommendation on PCB assembly
5
Recommendation on PCB assembly
5.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 27. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c)
Stencil opening for leads: Opening to footprint ratio is 90%.
DocID024813 Rev1
27/31
31
Recommendation on PCB assembly
HDMI2C2-14HD
Figure 28. Recommended stencil window position
300 µm
13 µm
474 µm
500 µm
286 µm
7 µm
0.23
0.50
0.30
0.50
0.25
2.30
5.3 mm
300 µm
2.3 mm
1.7 mm
5.30
0.45
0.25
750 µm
3.8 mm
Stencil window
Footprint
5.2
28/31
Solder paste
1.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste recommended.
3.
Offers a high tack force to resist component displacement during PCB movement.
4.
Use solder paste with fine particles: powder particle size 20-45 µm.
DocID024813 Rev1
HDMI2C2-14HD
5.3
5.4
5.5
Recommendation on PCB assembly
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB is recommended during solder paste
printing, pick and place and reflow soldering by using optimized tools.
PCB design preference
1.
To control the solder paste amount, closed vias are recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced.
Symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Reflow profile
Figure 29. ST ECOPACK® recommended soldering reflow profile for PCB mounting
240-245 °C
Temperature (°C)
250
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement.
DocID024813 Rev1
29/31
31
Ordering information
6
HDMI2C2-14HD
Ordering information
Figure 30. Ordering information scheme
HDMI2C
2
-
14
HD
HDMI and I2C compliant links
HDMI port type
2: sink ports
Number of protected links
14 lines protected according to IEC 6100-4-2
Version
HD: Full speed of HDMI supported
Table 10. Ordering information
7
Order code
Marking
Package
Weight
Base qty
Delivery mode
HDMI2C2-14HD
2C2-14HD
QFN
51.6 mg
4.000
Tape and reel
Revision history
Table 11. Document revision history
30/31
Date
Revision
04-Aug-2014
1
Changes
Initial release
DocID024813 Rev1
HDMI2C2-14HD
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2014 STMicroelectronics – All rights reserved
DocID024813 Rev1
31/31
31
工商网监
湘ICP备2023018690号
