HSP031-1BM6

HSP031-1BM6 Datasheet Very low clamping Ethernet 10 Gbps single line ESD protection Features • • • • High ESD protection level exceeding IEC 61000-4-2 level 4: – ±30kV (contact discharge) – ±30kV (air discharge) High IEC 61000-4-5 surge capability: 10 A Very low dynamic resistance: 0.25 Ohm Low capacitance: 0.7 pF Application • 1G/2.5G/5G/10G Ethernet Description The HSP031-1BM6 is a single channel ESD array with a rail to rail architecture designed to protect 2 differential lines from over voltages event caused by ESD, surge (8/20 µs). Packaged in a QFN-6L, the device is designed specifically for the protection of highspeed differential lines such as Ethernet 10 Gbps. Product status link HSP031-1BM6 Product summary Order code HSP031-1BM6 Package QFN-6L Packing Tape and reel DS13343 - Rev 1 - May 2020 For further information contact your local STMicroelectronics sales office. www.st.com HSP031-1BM6 Characteristics 1 Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Parameter VPP Peak pulse voltage IPP Peak pulse current Tj Tstg TL Value IEC 61000-4-2 contact discharge 30 IEC 61000-4-2 air discharge 30 8/20 µs Unit kV 10 A Operating junction temperature range -55 to +150 °C Storage temperature range -55 to +150 °C 260 °C Maximum lead temperature for soldering during 10 s Figure 1. Electrical characteristics (definition) DS13343 - Rev 1 page 2/13 HSP031-1BM6 Characteristics Table 2. Electrical characteristics Tamb = 25 °C Symbol Parameter VRM Reverse working voltage IRM Leakage current Test conditions Value Min. Typ. Max. VRM = 3.3 V 3.3 V 50 nA 10.5 V VTRIG Maximum off-state voltage 9 IHOLD Minimum on-state current 38 mA VH Minimum on-state voltage 1.3 V 1 Ipp = 10 A - 8/20 µs VCL Clamping voltage IEC 61000-4-2, +/- 8 kV contact discharge at 30 ns TLP measurement (pulse duration 100 ns), IPP = 16 A Rd CLINE S21 fc DS13343 - Rev 1 Unit TLP, pulse duration = 100 ns 7 V 8 V 5.9 V 0.25 Ω Line capacitance V I/O = 0 V, f = 3 GHz, VOSC = 30 mV 0.7 Attenuation measurement f < 600 MHz 0.1 dB 5 GHz -3 db 0.9 pF page 3/13 HSP031-1BM6 Characteristics (curves) 1.1 Characteristics (curves) Typical curves unless otherwise specified. Figure 2. Peak pulse current versus initial junction temperature (maximum value) 15 I PP(A) Figure 3. Peak pulse current versus clamping voltage (maximum value) VCL(V) 8 8/20µs 8/20µs 8/20 µs Tj initial = 25 °C 7 10 6 5 5 4 Tj( °C) I PP(A) 3 0 25 50 75 100 125 150 Figure 4. Leakage current versus junction temperature 10000 1 175 IR(nA) 3 4 5 6 7 8 10 IR(nA) Tj = 25 °C 1.5 1000 9 Figure 5. Leakage current versus reverse voltage 2 V RM = 3.3V 2 1 0.5 100 0 10 -0.5 -1 1 -1.5 Tj( °C) 0.1 25 DS13343 - Rev 1 50 75 100 125 VR(V) -2 150 -4 -3 -2 -1 0 1 2 3 4 page 4/13 HSP031-1BM6 Characteristics (curves) Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 8. Positive TLP measurement Figure 9. Negative TLP measurement 35 VCL (V) I(A) -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 0 30 -5 25 -10 20 -15 15 -20 10 -25 5 VCL(V) -30 0 0 1 2 3 4 5 6 7 8 9 Figure 10. Line capacitance versus frequency 1 C (pF) I(A) 10 Figure 11. Line capacitance versus junction temperature 0.8 Vosc = 30 mVRMS Tj = 25 °C 0.9 -35 C (pF) f = 3 GHz Vosc = 30 mVRMS 0.7 0.8 0.6 0.7 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0 1.0E+07 DS13343 - Rev 1 Tj(°C) f(Hz) 1.0E+08 1.0E+09 0 -40 -20 0 20 40 60 80 100 120 140 160 page 5/13 HSP031-1BM6 Characteristics (curves) Figure 12. Line capacitance at a frequency of 3 GHz versus reverse voltage 1.0 Figure 13. S21 C (pF) Vosc = 30 mVRMS Tj = 25 °C 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -4.0 Vr (V) -3.0 DS13343 - Rev 1 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 page 6/13 HSP031-1BM6 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 QFN-6L package information Figure 14. QFN-6L package outline E D Sideview A1 A Top view L e 0.05 b1 b2 Bottom view Table 3. QFN-6L mechanical data Symbol Dimesions (milimeters) Min. Typ. Max. A 0.45 0.50 0.55 A1 0.00 A3 0.127 b1 0.15 0.20 0.25 b2 0.35 0.40 0.45 D 1.55 1.60 1.65 E 0.95 1.00 1.05 e L DS13343 - Rev 1 0.05 0.50 0.28 0.38 0.48 page 7/13 HSP031-1BM6 QFN-6L package information Figure 15. Tape outline Pin 1 located according to EIA - 481 P0 Ø D0 E F W P1 P2 Ø D1 K0 User direction of unreeling Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Table 4. Tape dimensions values Dimensions Millimeters Ref. DS13343 - Rev 1 Min. Typ. Max. D0 1.45 1.55 1.65 D1 0.50 0.60 0.70 F 3.45 3.50 3.55 E 1.65 1.75 1.85 K0 0.67 0.72 0.77 P0 3.9 4 4.1 P1 3.9 4 4.1 P2 1.95 2.00 2.05 W 7.9 8.0 8.2 page 8/13 HSP031-1BM6 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Footprint SMD footprint design is recommended. Figure 16. Footprint in mm 0.200 0.240 1.400 0.580 0.400 0.200 1.300 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 μm / 3 mils b. Stencil aperture ratio: 90% Figure 17. Recommended stencil window position in mm 0.310 0.190 0.270 1.370 0.550 0.380 0.215 1.285 3.3 Solder paste 1. 2. 3. 4. DS13343 - Rev 1 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. page 9/13 HSP031-1BM6 Placement 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 Note: Minimize air convection currents in the reflow oven to avoid component movement. Note: Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DS13343 - Rev 1 300 page 10/13 HSP031-1BM6 Ordering information 4 Ordering information Figure 19. Ordering information scheme HSP 03 1 - 1B M6 High speed protection Breakdown voltage 03 = 3.3V Version Direction 1B = 1 bidirectional line Package M6 = QFN - 6L (1.0 mm x 1.6 mm) Table 5. Ordering information Order code Marking Package Weight Base qty. Delivery mode HSP031-1BM6 HE (1) QFN-6L 2.27 mg 3000 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location DS13343 - Rev 1 page 11/13 HSP031-1BM6 Revision history Table 6. Document revision history DS13343 - Rev 1 Date Version 25-May-2020 1 Changes Initial release. page 12/13 HSP031-1BM6 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS13343 - Rev 1 page 13/13