HSP061-2M6

HSP061-2M6, HSP061-2N4 Datasheet 3 V dual and four-line high speed port protection in QFN-4L and QFN-6L Features • • • • • • Flow-through routing to keep signal integrity Large bandwidth: 5.5 and 6 GHz Ultra low capacitance: 0.6 pF Operating junction temperature range: -40 °C to 150 °C RoHS compliant and halogen free Complies with IEC 61000-4-2 - C = 150 pF, R = 330 Ω exceeds level 4 – ±8 kV (contact discharge) – ±15 kV (air discharge) Applications • • • • • • • HDMI 1.4 DVI Display Port USB3.0 SATA Ethernet HMI Description The HSP061-2 series are ESD arrays designed for high speed differential lines. The ultralow variation of the capacitance ensures negligible influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps. The HSP061-2M6 is packaged in QFN-6L and the HSP061-2N4 in QFN-4L. Product status link Package HSP061-2M6 QFN-6L HSP061-2N4 QFN-4L DS8881 - Rev 4 - September 2023 For further information contact your local STMicroelectronics sales office. www.st.com HSP061-2M6, HSP061-2N4 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 8 kV Air discharge 15 IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage IPP Peak pulse current (8/20 µs) 3 Tstg Storage temperature range -65 to +150 Tj Operating junction temperature range -40 to +150 TL Maximum lead temperature for soldering during 10 s A °C 260 Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VBR Breakdown voltage at 1 mA VRM Stand-off voltage IRM VRM = 3 V VCL IEC 61000-4-2, +8 kV contact, measured at 30 ns CI/O - GND ΔCI/O - GND fc DS8881 - Rev 4 Test conditions Min. Max. 6 F = 200 to 3000 MHz, VOSC = 30 mV Capacitance variation I/O to ground, VI/O = 0 V, F = 200 to 3000 MHz, VOSC = 30 mV Unit V 3 V 100 nA 18 Capacitance I/O to ground, VI/O = 0 V, Cut-off frequency at - 3dB Typ. V 0.6 0.85 pF 0.03 0.13 pF HSP061-2M6 5.5 HSP061-2N4 6 GHz page 2/15 HSP061-2M6, HSP061-2N4 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Leakage current versus junction temperature Figure 2. ESD response to IEC 61000-4-2 (+8 kV contact discharge) IR (n A ) 10V/Div 10.00 VR= VRM = 3 V 1.00 0.10 100ns/Div Tj (°C) 0.01 25 50 75 100 125 150 Figure 3. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 4. S21 attenuation measurement (HSP061-2M6) S21(db) 0 10V/Div -4 -8 -12 100ns /Div F (H z ) -16 300k Figure 5. S21 attenuation measurement (HSP061-2N4) 0 S 2 1 (d B ) 1M 3M 10M 30M 100M 300M 1G 3G Figure 6. Eye diagram - HDMI mask at 3.4 Gbps (per channel, HSP061-2M6) 2 5 0 m V /d i v -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 300k DS8881 - Rev 4 F (H z ) 1M 3M IO1 10M 30M 100M 300M 1G IO2 3G 4 9 p s /d i v page 3/15 HSP061-2M6, HSP061-2N4 Characteristics (curves) Figure 7. Eye diagram - HDMI mask at 3.4 Gbps (per channel, HSP061-2N4) 2 5 0 m V /d i v 4 9 p s /d i v Note: DS8881 - Rev 4 HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. page 4/15 HSP061-2M6, HSP061-2N4 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 QFN-4L package information Figure 8. QFN-4L package outline Table 3. QFN-4L package mechanical data Dimensions Millimeters Ref. DS8881 - Rev 4 Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.0177 0.0197 0.0217 A1 0.00 0.02 0.05 0.0000 0.0008 0.0020 b 0.15 0.20 0.25 0.0059 0.0079 0.0099 D 0.95 1.00 1.05 0.0374 0.0394 0.0414 D2 0.55 0.60 0.65 0.0216 0.0236 0.0256 E 0.75 0.80 0.85 0.0295 0.0315 0.0335 E2 0.15 0.20 0.25 0.0059 0.0079 0.0099 e 0.35 0.40 0.45 0.0137 0.0157 0.0178 k 0.17 0.20 0.23 0.0066 0.0079 0.0091 L 0.15 0.20 0.25 0.0059 0.0079 0.0099 page 5/15 HSP061-2M6, HSP061-2N4 QFN-6L package information 2.2 QFN-6L package information Figure 9. QFN-6L package outline Table 4. QFN-6L package mechanical data Dimensions Millimeters Ref. DS8881 - Rev 4 Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.55 0.60 0.0196 0.0217 0.0237 A1 0.00 0.02 0.05 0.0000 0.0008 0.0020 b 0.18 0.25 0.30 0.0070 0.0098 0.0119 D 1.40 1.45 1.50 0.0551 0.0571 0.0591 E 0.95 1.00 1.05 0.0374 0.0394 0.0414 e 0.45 0.50 0.55 0.0177 0.0197 0.0217 k 0.20 L 0.30 0.0138 0.0158 0.0078 0.35 0.40 0.0118 page 6/15 HSP061-2M6, HSP061-2N4 Packing and marking information (QFN-4L) 2.3 Packing and marking information (QFN-4L) Figure 10. Marking layout (refer to ordering information table for marking) Figure 11. Package orientation in reel Figure 12. Tape leader and trailer dimensions Figure 13. Tape and reel orientation Figure 14. Reel dimensions (mm) Figure 15. Inner box dimensions (mm) 30 205 205 DS8881 - Rev 4 page 7/15 HSP061-2M6, HSP061-2N4 Packing and marking information (QFN-4L) Figure 16. Tape outline Table 5. Tape and reel mechanical data Dimensions Millimeters Ref. DS8881 - Rev 4 Min. Typ. Max. ∅D0 1.50 1.55 1.60 ∅D1 0.39 F 3.45 3.50 3.55 K0 0.58 0.63 0.68 P0 3.9 4 4.1 P1 1.9 2 2.1 P2 1.95 2 2.05 W 7.9 8 8.3 page 8/15 HSP061-2M6, HSP061-2N4 Packing and marking information (QFN-6L) 2.4 Packing and marking information (QFN-6L) Figure 17. Marking layout (refer to ordering information table for marking) Figure 18. Package orientation in reel Figure 19. Tape leader and trailer dimensions Figure 20. Tape and reel orientation Figure 21. Reel dimensions (mm) Figure 22. Inner box dimensions (mm) 30 205 205 DS8881 - Rev 4 page 9/15 HSP061-2M6, HSP061-2N4 Packing and marking information (QFN-6L) Figure 23. Tape outline Table 6. Tape and reel mechanical data Dimensions Millimeters Ref. DS8881 - Rev 4 Min. Typ. Max. ∅D0 1.50 1.55 1.60 ∅D1 0.39 F 3.45 3.50 3.55 K0 0.7 0.75 0.80 P0 3.9 4 4.1 P1 3.9 4 4.1 P2 1.95 2 2.05 W 7.9 8 8.3 page 10/15 HSP061-2M6, HSP061-2N4 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Recommended footprint and stencil opening for QFN-4L Stencil opening thickness: 100 µm Stencil opening ration : 90 % Figure 24. Recommended footprint and stencil opening 3.2 Recommended footprint and stencil opening for QFN-6L Stencil opening thickness: 100 µm Stencil opening ration : 90 % Figure 25. Recommended footprint in mm 3.3 Solder paste 1. 2. 3. 4. DS8881 - Rev 4 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. page 11/15 HSP061-2M6, HSP061-2N4 Placement 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 26. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 Note: Minimize air convection currents in the reflow oven to avoid component movement. Note: Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DS8881 - Rev 4 300 page 12/15 HSP061-2M6, HSP061-2N4 Ordering information 4 Ordering information Table 7. Ordering information DS8881 - Rev 4 Order code Marking Package Weight Base qty. HSP061-2N4 1 QFN-4L 1.17 mg 10000 HSP061-2M6 T QFN-6L 2.3 mg 3000 Delivery mode Tape and reel page 13/15 HSP061-2M6, HSP061-2N4 Revision history Table 8. Document revision history Date Revisi on 07-Feb-2012 1 Initial release. 19-Mar-2014 2 Minor text changes. 13-Oct-2015 3 21-Sep-2023 4 Changes Removed device in SOT-666. Updated document accordingly. Updated Table 3, Table 4, Section 2.3 Packing and marking information (QFN-4L), Section 2.4 Packing and marking information (QFN-6L), Section 3.1 Recommended footprint and stencil opening for QFN-4L, and Section 3.2 Recommended footprint and stencil opening for QFN-6L. Minor text changes. DS8881 - Rev 4 page 14/15 HSP061-2M6, HSP061-2N4 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS8881 - Rev 4 page 15/15