HSP061-2
2-line ESD protection for high speed lines
Datasheet - production data
Benefits
• High ESD robustness of the equipment
• Suitable for high density boards
Complies with following standards
• MIL-STD 883G Method 3015-7 Class 3B:
– 8 kV
+631
4)1/
+630
4)1/
• IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Figure 1. Functional schematic (top view)
I/O1
1
6
• HDMI 1.3 and 1.4
I/O1
I/O1
GND
2
5
• Digital Video Interface
GND
I/O2
V BU S
3
4
I/O2
• Display Port
• USB 3.0
NC
NC
I/O2
The HSP061-2 series is designed to protect
against electrostatic discharge on sub micron
technology circuits driving:
µQFN 4 leads
• Serial ATA
• Ethernet
• HMI
µQFN 6 leads
Description
Features
• Flow-through routing to keep signal integrity
• Ultralarge bandwidth: 6 GHz
The ultralow variation of the capacitance ensures
very low influence on signal-skew. The large
bandwidth makes it compatible with 5 Gbps.
• Ultralow capacitance: 0.6 pF
• Low leakage current: 100 nA at 25 °C
• Extended operating junction temperature
range: -40 °C to 150 °C
• RoHS compliant
October 2015
This is information on a product in full production.
The HSP061-2 is a 2-channel ESD array with a
rail-to-rail architecture designed specifically for
the protection of high speed differential lines.
The HSP061-2M6 is packaged in µQFN-6L (1.45
x 1.0 mm) with a 500 µm pitch. The HSP061-2N4
is packaged in µQFN-4L (1.0 x 0.8 mm) with a
400 µm pitch.
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Characteristics
1
HSP061-2
Characteristics
Table 1. Absolute maximum ratings Tamb = 25 °C
Symbol
Parameter
Value
IEC 61000-4-2 contact discharge
8
IEC 61000-4-2 air discharge
15
Unit
VPP
Peak pulse voltage
Ipp
Repetitive peak pulse current (8/20 µs)
3
A
Tj
Operating junction temperature range
-40 to +150
°C
Tstg
Storage temperature range
-65 to +150
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
kV
Table 2. Electrical characteristics Tamb = 25 °C
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
VBR
Breakdown voltage
IR = 1 mA
IRM
Leakage current
VRM = 3 V
VCL
Clamping voltage
IEC 61000-4-2, +8 kV contact
(IPP = 30 A), measured at 30 ns
18
CI/O - GND
Capacitance (input/output to
ground)
VI/O = 0 V, F = 200 to 3000 MHz,
VOSC = 30 mV
0.6
0.85
pF
ΔCI/O - GND
Capacitance variation
(input/output to ground)
VI/O = 0 V F = 200 to 3000 MHz,
VOSC = 30 mV
0.03
0.13
pF
Cut-off frequency
-3 dB
fC
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6
Unit
V
100
HSP061-2M6
5.5
HSP061-2N4
6
nA
V
GHz
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HSP061-2
Characteristics
Figure 2. Leakage current versus junction
temperature (typical values)
Figure 3. S21 attenuation measurement
(HSP061-2M6)
10.00
S21(db)
0.00
VR = V RM = 3 V
IR (nA)
- 4.00
1.00
- 8.00
0.10
- 12.00
F(Hz)
Tj (°C)
0.01
25
50
75
100
125
150
Figure 4. S21 attenuation measurement
(HSP061-2N4)
0
S21 (dB)
- 16.00
300.0k
1.0M
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
Figure 5. Eye diagram - HDMI mask at 3.4 Gbps
per channel(1)
(HSP061-2M6)
250 mV/div
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
300k
F (Hz)
1M
3M
IO1
10M
30M
100M 300M 1G
IO2
3G
49 ps/div
1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office.
Figure 6. Eye diagram - HDMI mask at 3.4 Gbps
per channel(1)
(HSP061-2N4)
250 mV/div
Figure 7. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
10V/Div
100ns/Div
49 ps/div
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Characteristics
HSP061-2
Figure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge)
10V/Div
100ns/Div
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HSP061-2
2
Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Package information
2.1
HSP061-2
µQFN 1.45x1.00 6L package information
Table 3. µQFN 1.45x1.00 6L dimensions
Dimensions
1
2
L
Ref.
k
Typ.
Max.
Min.
A
0.50
0.55
0.60
0.020 0.022 0.024
A1
0.00
0.02
0.05
0.000 0.001 0.002
b
0.18
0.25
0.30
0.007 0.010 0.012
A
A1
Inches
Min.
b
e
Millimeters
D
Typ.
D
1.45
0.057
E
1.00
0.039
e
0.50
0.020
Max.
N
E
1
0.30
0.35
0.40
0.012 0.014 0.016
0.25
[0.010]
0.30
[0.012]
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L
0.008
Figure 10. Marking for µQFN 1.45x1.00 6L
0.65
[0.026]
Note:
0.20
2
Figure 9. Footprint recommendations
dimensions in mm (inches)
0.50
[0.020]
K
1.60
[0.063]
T
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
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HSP061-2
2.2
Package information
µQFN-4L package information
Table 4. µQFN-4L dimensions
Dimensions
Ref.
Side
view
A
A1
D
D2
e
Bottom
view
k
E2
E
L
b
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
A
0.45
0.50
0.55
0.018
0.020 0.022
A1
0.00
0.02
0.05
0.000
0.001 0.002
b
0.15
0.20
0.25
0.006
0.008 0.010
D
0.75
0.80
0.85
0.030
0.031 0.033
D2
0.55
0.6
0.65
0.022
0.024 0.026
e
0.35
0.40
0.45
0.014
0.016 0.018
E
0.95
1.00
1.05
0.037
0.039 0.041
E2
0.15
0.20
0.25
0.006
0.008 0.010
k
0.17
0.20
0.23
0.007
0.008 0.009
L
0.15
0.20
0.25
0.006
0.008 0.010
Figure 11. Footprint recommendations
(dimensions in mm)
Max.
Figure 12. Marking for µQFN-4L
0.4
(0.016)
Pin 1
0.4
(0.016)
0.2 (0.008)
0.2 (0.008)
1.4
(0.055)
1
0.6
(0.024)
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
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Recommendation on PCB assembly
HSP061-2
3
Recommendation on PCB assembly
3.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 13. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 14. Recommended stencil window position for µQFN-6L
7 µm
7 µm
620 µm
650 µm
15 µm
236 µm
15 µm
Footprint
250 µm
Stencil window
Footprint
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HSP061-2
Recommendation on PCB assembly
Figure 15. Recommended stencil window position for µQFN-4L
T=100 µm and opening
ratio is 100%
430 µm
0.4
0.4
0.2
0.2
1.4
0.6
180 µm
580 µm
0.6
200 µm
Footprint
Stencil windo w
Footprint
3.2
3.3
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
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Recommendation on PCB assembly
HSP061-2
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
3.4
3.5
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
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&V
VHF
PD[
&V
&V
&V
7LPHV
Note:
10/12
Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
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HSP061-2
4
Ordering information
Ordering information
Figure 17. Ordering information scheme
HSP 06 1 - 2 xx
High speed line protection
Breakdown voltage
Vers io n
Number of lines
Pack age
M6 = µQFN-6L
N4 = µQFN-4L
Table 5. Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
HSP061-2M6
T(1)
µQFN-6L
2.3 mg
3000
Tape and reel (7”)
HSP061-2N4
1(1)
µQFN-4L
1.17 mg
10000
Tape and reel (7”)
1. The marking can be rotated by multiple of 90° to differentiate assembly location
5
Revision history
Table 6. Document revision history
Date
Revision
Changes
07-Feb-2012
1
Initial release.
19-Mar-2014
2
Minor text changes.
13-Oct-2015
3
Removed device in SOT-666.
Updated document accordingly.
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HSP061-2
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