HSP061-4M10

HSP061-4M10 4-line ESD protection for high speed lines Datasheet - production data Applications The HSP061-4M10 is designed to protect against electrostatic discharge on sub micron technology circuits driving: • HDMI 1.3 and 1.4 • Digital Video Interface • Display Port • USB 3.0 • Serial ATA • Thunderbolt µQFN-10L package Figure 1. Functional schematic (top view) Features • Flow-through routing to keep signal integrity Internally not connected I/O 1 1 10 I/O 2 2 9 • Extended operating junction temperature range: -40 °C to 150 °C GND 3 8 GND • Thin package: 0.5 mm max. I/O 3 4 7 I/O 4 5 6 • Ultralarge bandwidth: 8.7 GHz • Ultralow capacitance: 0.3 pF • Low leakage current: 70 nA at 25 °C • RoHS compliant Benefits Internally not connected • High ESD robustness of the equipment • Suitable for high density boards Description Complies with following standards • MIL-STD 883G Method 3015-7 Class 3B: – 8 kV • IEC 61000-4-2 level 4: – 8 kV (contact discharge) – 15 kV (air discharge) The HSP061-4M10 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes the device compatible with 3.4 Gbps. The device is packaged in µQFN-10L 2.5 x 1 mm with a 500 µm pitch, which minimizes the PCB area. June 2014 This is information on a product in full production. DocID023716 Rev 3 1/11 www.st.com Characteristics 1 HSP061-4M10 Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Value Unit 8 20 kV Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C VPP Tj Parameter Peak pulse voltage IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Table 2. Electrical characteristics Tamb = 25 °C Symbol Parameter Test conditions Min. Typ. Max. Unit VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V 70 nA VCL Clamping voltage IPP = 1 A, 8/20 µs 15 V CI/O - I/O Capacitance (I/O to I/O) VI/O = 0 V, F = 1 MHz, VOSC = 30 mV 0.3 0.4 pF CI/O - GND Capacitance (I/O to GND) VI/O = 0 V F = 1 MHz, VOSC = 30 mV 0.6 0.8 pF Cut-off frequency -3dB 8.7 Differential impedance tr = 200 ps (10 - 90%)(1), Z0 Diff = 100 Ω fC ZDiff 6 85 V 100 GHz 115 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. 2/11 DocID023716 Rev 3 Ω HSP061-4M10 Characteristics Figure 2. Leakage current versus junction temperature (typical values) 10 Figure 3. S21 attenuation measurement 0 S21 (db) IR (nA) VR =VRM= 3V -1 1 -2 -3 0,1 -4 TJ(°C) 0,01 25 50 75 100 125 150 Figure 4. Differential impedance (Zdiff)(1) F (Hz) -5 100k 1M 10M 100M 1G 10G Figure 5. Eye diagram - HDMI mask at 3.4 Gbps per channel(1) 250 mV/div tr = 200 ps (10% - 90%) 12.5 Ω /div 50 ps/div 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 20 V/div Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 V/div 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 112 V 1 27 V -16 V 2 20 V 3 2 -11 V 3 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns -119 V 1 20 ns/div DocID023716 Rev 3 20 ns/div 3/11 11 Ordering information scheme 2 HSP061-4M10 Ordering information scheme Figure 8. Ordering information scheme HSP 06 1 - 4 M10 High speed line protection Breakdown voltage Version Number of lines Package µQFN-10L 4/11 DocID023716 Rev 3 HSP061-4M10 3 Package information Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. µQFN-10L dimension definitions D R b1 0. 12 5 1 5 L E PIN 1 ID 6 10 b e A A1 Seating plane A2 Table 3. µQFN-10L dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.40 0.48 0.50 0.018 0.019 0.020 A1 0.00 0.03 0.05 0.00 0.001 0.002 A2 0.13 0.005 b 0.15 0.20 0.30 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.041 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.9 1.00 1.10 0.035 0.039 0.043 e L 0.50 0.30 0.38 0.206 0.425 DocID023716 Rev 3 0.012 0.015 0.017 5/11 11 Package information HSP061-4M10 Figure 10. Footprint recommendations (dimensions in mm) 0.40 Figure 11. Marking 0.50 0.20 0.58 H4M 1.40 2.20 Figure 12. µQFN-10L tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 1.35 H4M H4M H4M 8.0 5.5 2.75 1.75 0.25 4.0 0.55 All dimensions are typical values in mm 6/11 User direction of unreeling DocID023716 Rev 3 HSP061-4M10 4 Recommendation on PCB assembly Recommendation on PCB assembly Figure 13. Recommended stencil window position Copper Thickness: 100 µm Stencil window Footprint 10 µm 5 µm 10 µm 5 µm 380 µm 550 µm 15 µm 580 µm 550 µm 580 µm 15 µm 190 µm 15 µm 15 µm 400 µm 4.1 200 µm Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. DocID023716 Rev 3 7/11 11 Recommendation on PCB assembly 4.2 4.3 HSP061-4M10 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Figure 14. Printed circuit board layout recommendations 1 10 500 µm Via to Via to GND GND 5 Footprint pad 8/11 DocID023716 Rev 3 6 PCB tracks HSP061-4M10 4.4 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID023716 Rev 3 9/11 11 Ordering information 5 HSP061-4M10 Ordering information Table 4. Ordering information 6 Order code Marking Package Weight Base qty Delivery mode HSP061-4M10 H4M µQFN-10L 3.27 mg 3000 Tape and reel Revision history Table 5. Document revision history 10/11 Date Revision Changes 05-Sep-2012 1 Initial release. 18-Oct-2012 2 Updated VPP in Table 1. 17-Jun-2014 3 Updated Figure 12 and reformatted to current standard. DocID023716 Rev 3 HSP061-4M10 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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