HSP061-8M16

HSP061-8M16 8-line ESD protection for high speed lines Datasheet - production data Applications The HSP061-8M16 is designed to protect against electrostatic discharge on sub micron technology circuits driving: • HDMI 1.3 and 1.4 • Digital Video Interface • Display Port • Serial ATA µQFN-16L Figure 1. Functional schematic (top view) Features In 1 1 16 Out 1 • Ultralarge bandwidth: 6.3 GHz In 2 2 15 Out 2 • Low time domain reflection In 3 3 14 Out 3 • Low leakage current: 100 nA at 25 °C In 4 4 13 Out 4 • Extended operating junction temperature range: -40 °C to 150 °C In 5 5 12 Out 5 • Package size in mm: 3.3 x 1.5 x 0.55 In 6 6 11 Out 6 • RoHS compliant In 7 7 10 Out 7 Benefits In 8 8 9 • Ultralow capacitance: 0.6 pF • High ESD robustness of the equipment GND on tab • Suitable for high density boards Description Complies with following standards • MIL-STD 883G Method 3015-7 Class 3B: – 8 kV • IEC 61000-4-2 level 4: – 8 kV (contact discharge) – 15 kV (air discharge) Out 8 The HSP061-8M16 is an 8-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 3.4 Gbps. The device is packaged in µQFN-16L with a 400 µm pitch, which minimizes the PCB area. April 2014 This is information on a product in full production. DocID18055 Rev 3 1/10 www.st.com Characteristics 1 HSP061-8M16 Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Parameter Value Unit 8 20 kV IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge VPP Peak pulse voltage(1) Ipp Repetitive peak pulse current (8/20 µs) 3 A Tj Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Table 2. Electrical characteristics Tamb = 25 °C Symbol Parameter Test conditions Min. Typ. Max. VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V VCL Clamping voltage IEC 61000-4-2, +8 kV contact (IPP = 30 A), measured at 30 ns 14 Capacitance (input/output to ground) VI/O = 0 V F = 200 to 3000 MHz, VOSC = 30 mV 0.6 0.8 pF Capacitance variation (input/output to ground) VI/O = 0 V F = 200 to 3000 MHz, VOSC = 30 mV 0.03 0.05 pF Cut-off frequency -3dB 6.3 CI/O - GND ΔCI/O - GND fC ZDiff Differential impedance tr = 200 ps (10 Z0 Diff = 100 Ω 6 Unit V 100 90%)(1) 90 nA V GHz 105 Ω 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. 2/10 DocID18055 Rev 3 HSP061-8M16 Characteristics Figure 2. Leakage current versus junction temperature (typical values) Figure 3. S21 attenuation measurement 0 1000.0 db IR (nA) -1 -2 100.0 -3 -4 10.0 -5 1.0 VR = V RM = 3 V -6 Tj (°C) -7 0.1 25 50 75 100 125 F (Hz) 150 -8 10MHz Figure 4. Differential impedance (Zdiff)(1) 30MHz 100MHz 300MHz 1GHz 3GHz Figure 5. Eye diagram, HDMI mask, at 3.4 Gbps per channel(1) tr = 200 ps (10% - 90%) 12.5 Ω /div Vertical : 200 mV / div Horizontal : 50 ps / div Z0Diff = 100 Ω- 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 50 V / div 20 ns / div 20 GS / s 50 V / div 20 ns / div 20 GS / s DocID18055 Rev 3 3/10 10 Package information 2 HSP061-8M16 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. µQFN-16L dimensions Dimensions Ref. e INDEX AREA (D/2 x E/2) E2 K E D2 L Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 3.20 3.30 3.40 0.126 0.130 0.134 D2 2.45 2.60 2.70 0.096 0.102 0.106 E 1.40 1.50 1.60 0.055 0.059 0.063 E2 0.20 0.35 0.45 0.008 0.014 0.018 b EXPOSED PAD PIN # 1 ID Millimeters D A1 A e Figure 9. Footprint recommendations (dimensions in mm) 0.40 0.40 K 0.20 L 0.20 0.008 0.30 0.40 0.008 0.012 0.016 Figure 10. Marking 0.20 0.45 XX 0.40 0.85 1.75 2.80 3.00 4/10 0.016 DocID18055 Rev 3 WW YP Dot: Pin 1 XX: Marking WW: Assembly week Y: Assembly year P: Assembly plant HSP061-8M16 Package information Figure 11. µQFN-16L tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 12.0 5.5 3.60 1.75 0.25 XX WW YP XX WW YP 1.80 XX WW YP 4.0 0.80 All dimensions are typical values in mm User direction of unreeling DocID18055 Rev 3 5/10 10 Recommendation on PCB assembly HSP061-8M16 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1,5 T L×W Aspect Area = ---------------------------- ≥ 0,66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 13. Recommended stencil window position 4 µm 4 µm 14 µm 422 µm 450 µm T=100 µm 192 µm 14 200 µm µm 2800 µm 400 µm 280 µm 60 µm Footprint 2000 µm 60 µm 400 µm 6/10 400 µm DocID18055 Rev 3 Stencil window Footprint HSP061-8M16 3.2 3.3 3.4 Recommendation on PCB assembly Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. DocID18055 Rev 3 7/10 10 Recommendation on PCB assembly 3.5 HSP061-8M16 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 8/10 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. DocID18055 Rev 3 HSP061-8M16 4 Ordering information Ordering information Figure 15. Ordering information scheme HSP 06 1 - 8 M16 High speed line protection Breakdown Voltage Version Number of lines Package µQFN-16L Table 3. Ordering information 5 Order code Marking Package Weight Base qty Delivery mode HSP061-8M16 HD µQFN-16L 12 mg 3000 Tape and reel (7”) Revision history Table 4. Document revision history Date Revision Changes 19-Nov-2010 1 Initial release. 05-May-2011 2 Updated air discharge value and added footnote in Table 1. 03-Apr-2014 3 Reformatted to current standard. DocID18055 Rev 3 9/10 10 HSP061-8M16 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 DocID18055 Rev 3