IMP34DT05TR

IMP34DT05 Datasheet MEMS audio sensor omnidirectional digital microphone for industrial applications Features • • • • • • • • Single supply voltage Low power consumption AOP = 122.5 dBSPL 64 dB signal-to-noise ratio Omnidirectional sensitivity –26 dBFS ±3 dB sensitivity PDM output HCLGA package – Top-port design – SMD-compliant – EMI-shielded – ECOPACK, RoHS, and “Green” compliant Applications Product status link IMP34DT05 Product summary • • • • • • • • Anti-tampering devices Vibration monitoring Audio-activated functions Predictive maintenance Noise cancelling Sound detection for alarm systems Human / machine voice interface Anti-theft systems Description Order code IMP34DT05TR Temperature range [°C] -40 to +85 Package HCLGA 4LD (3 x 4 x 1 mm) The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. Packing Tape and reel The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. Product label The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dB sensitivity. The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. DS12725 - Rev 4 - June 2021 For further information contact your local STMicroelectronics sales office. www.st.com IMP34DT05 Pin description 1 Pin description Figure 1. Pin connections LR CLK DOUT Vdd GND BOTTOM VIEW Table 1. Pin description DS12725 - Rev 4 Pin # Pin name Function 1 Vdd Power supply 2 LR Left/Right channel selection 3 CLK Synchronization input clock 4 DOUT Left/Right PDM data output 5 (ground ring) GND Ground page 2/20 IMP34DT05 Acoustic and electrical specifications 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 2. Acoustic and electrical characteristics Symbol Parameter Vdd Supply voltage Idd Current consumption in normal mode IddPdn Mean value Typ. (1) Max. 1.8 3.6 650 AOP Acoustic overload point 1 -29 SNR Signal-to-noise ratio A-weighted @1 kHz, 94 dB SPL PSR Power supply rejection 100 mVpp sine 1 kHz fCLK frequency(3) Input clock time(4) Ton Turn-on Top Operating temperature range VIOL Low-level logic input/output voltage VIOH High-level logic input/output voltage µA 10 mA dBSPL -26 -23 64 1.2 V 5 122.5 Sensitivity Unit µA Current consumption in power-down mode(2) Short-circuit current CLOAD Min. 1.6 Scc So Test condition dBFS dB(A) 2.4 -90 dBFS 3.25 MHz Specified by design - not tested in production 10 ms -40 +85 °C Iout = 1 mA -0.3 0.35xVdd V Iout = 1 mA 0.65xVdd Vdd+0.3 V 100 pF Capacitive load 1. Typical specifications are not guaranteed. 2. Input clock in static mode. 3. Duty cycle: min = 40% max = 60%. 4. Time from the first clock edge to valid output data. Table 3. Distortion specifications @ 1 kHz Parameter Test condition Typical value (1) Distortion 94 dBSPL 0.2% THD + N Distortion 110 dBSPL 0.7% THD + N Distortion 120 dBSP 6% THD + N 1. Typical specifications are not guaranteed. DS12725 - Rev 4 page 3/20 IMP34DT05 Timing characteristics 2.2 Timing characteristics Table 4. Timing characteristics Parameter Description fCLK Clock frequency for normal mode fPD Clock frequency for power-down mode TCLK Clock period for normal mode Tdv Time delay to valid data (CLOAD = 100 pF) Ten Tdis Min. Max. Unit 1.2 3.25 MHz 0.23 MHz 308 1000 - 105 Time delay to driven data 18 - Time delay to High-Z 2 10 ns Figure 2. Timing waveforms 1/fclk CLK Tdv Tdis Ten DOUT High-Z High-Z Mic Data (L/R = Vdd) Tdv Tdis Ten DOUT (L/R = Gnd) DS12725 - Rev 4 High-Z Mic Data page 4/20 IMP34DT05 Frequency response 2.3 Frequency response Figure 3. Typical frequency response normalized to 1 kHz DS12725 - Rev 4 page 5/20 IMP34DT05 Application recommendations 3 Application recommendations Figure 4. IMP34DT05 electrical connections (top view) Vdd 1µF 100nF L/R 1 4 2 3 Dout CLK CODEC TOP VIEW 5 Ground ring Figure 5. IMP34DT05 electrical connections for stereo configuration (top view) Vdd 1µF 100nF TOP VIEW L/R 1 4 2 3 Dout Dout Vdd 1 4 2 3 5 Ground ring CLK CODEC Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin 1 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection). DS12725 - Rev 4 page 6/20 IMP34DT05 Carrier tape mechanical specifications 4 Carrier tape mechanical specifications Figure 6. Carrier tape without microphone (top view) Figure 7. Carrier tape with microphone (top view) DS12725 - Rev 4 page 7/20 IMP34DT05 Process recommendations 5 Process recommendations To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations: • The recommended pick-up area for the IMP34DT05 package must be defined using the worst case (ie. no device alignment during picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). Picker tolerance shall be considered as well. • To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area • For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the picking. • Device alignment before picking is highly recommended. • A vacuum force greater than 7 psi must be avoided • 1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm • MSL (moisture sensitivity level) Class 3 • Maximum of 3 reflow cycles is recommended • All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment tolerances Figure 8. Recommended picking area To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle. The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device). The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel. DS12725 - Rev 4 page 8/20 IMP34DT05 Process recommendations Figure 9. Recommended picker design DS12725 - Rev 4 page 9/20 IMP34DT05 Sensing element 6 Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. DS12725 - Rev 4 page 10/20 IMP34DT05 Absolute maximum ratings 7 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Ratings Vdd Supply voltage Vin Input voltage on any control pin TSTG Storage temperature range Maximum value Unit -0.3 to 5 V -0.3 to Vdd +0.3 V -40 to +125 °C ±2000 (HBM) ESD Electrostatic discharge protection ±200 (MM) V ±750 (CBM) ESD Product standard EN 55024:2010 - 3 air discharges ±15000 V This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part. DS12725 - Rev 4 page 11/20 IMP34DT05 Functionality 8 8.1 Functionality L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 6. L/R channel selection. The L/R pin must be connected to Vdd or GND. Table 6. L/R channel selection L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is not mandatory to connect the pin itself to GND for the respective channel selection. DS12725 - Rev 4 page 12/20 IMP34DT05 Package information 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 Soldering information The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 10. Recommended soldering profile limits tp TP CRITICAL ZONE RAMP-UP TL to T P TL TEMPERATURE TSMAX tL TSMIN ts PREHEAT RAMP-DOWN T25° to PEAK 30 60 90 120 150 180 210 TIME 240 270 300 330 360 390 Table 7. Recommended soldering profile limits Description Parameter Pb free TL to TP 3 °C/sec max Minimum temperature TSMIN 150 °C Maximum temperature TSMAX 200 °C Time (TSMIN to TSMAX) tS 60 sec to 120 sec Average ramp rate Preheat Ramp-up rate Time maintained above liquidus temperature tL 60 sec to 150 sec Liquidus temperature TL 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature DS12725 - Rev 4 TSMAX to TL 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max page 13/20 IMP34DT05 HCLGA package information 9.2 HCLGA package information Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.15mm unless otherwise specified OUTER DIMENSIONS ITEM Length [L] W idth [W ] Height [H] AP DIMENSION [mm] 3 4 1.00 Ø 0.25 TOLERANCE [mm] ±0.1 ±0.1 ±0.1 ±0.1 DM00231908_3 1. 2. DS12725 - Rev 4 The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes. This variation does does not affect acoustic or electrical performance. Ring plating can be subject to change not affecting acoustic and electrical performance. page 14/20 IMP34DT05 HCLGA package information Figure 12. Land pattern 0.85 GND 0.85 0.35 1.30 2.30 GND LR Vdd 0.95 CLK GND DOUT 0.40 0.35 GND Pad + solder paste DS12725 - Rev 4 page 15/20 IMP34DT05 Revision history Table 8. Document revision history DS12725 - Rev 4 Date Version Changes 02-Aug-2018 1 Initial release 04-Sep-2018 2 Added product label indicating ST's 10-year longevity commitment 29-Apr-2019 3 Updated Table 4. Timing characteristics 30-Jun-2021 4 Updated Section 2.2 Timing characteristics page 16/20 IMP34DT05 Contents Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.3 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Sensing element. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 8 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 8.1 9 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9.2 HCLGA package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 DS12725 - Rev 4 page 17/20 IMP34DT05 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Pin description . . . . . . . . . . . . . . . . Acoustic and electrical characteristics. Distortion specifications @ 1 kHz . . . . Timing characteristics . . . . . . . . . . . . Absolute maximum ratings . . . . . . . . L/R channel selection . . . . . . . . . . . . Recommended soldering profile limits. Document revision history . . . . . . . . . DS12725 - Rev 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 3 . 3 . 4 11 12 13 16 page 18/20 IMP34DT05 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. DS12725 - Rev 4 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical frequency response normalized to 1 kHz . . . . . . . . . . . . . . . IMP34DT05 electrical connections (top view) . . . . . . . . . . . . . . . . . IMP34DT05 electrical connections for stereo configuration (top view) Carrier tape without microphone (top view). . . . . . . . . . . . . . . . . . . Carrier tape with microphone (top view) . . . . . . . . . . . . . . . . . . . . . Recommended picking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended picker design . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data . Land pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 4 . 5 . 6 . 6 . 7 . 7 . 8 . 9 13 14 15 page 19/20 IMP34DT05 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS12725 - Rev 4 page 20/20