ISO8200BTR

ISO8200B Datasheet Galvanic isolated octal high-side smart power solid state-relay Features Product status link ISO8200B Product summary Package Packing ISO8200B Product label RDS(on) (1) IOUT (1) Vcc ISO8200B Vcc- 45 V 0.12 Ω 0.7 A 45 V • • • • • • • • • • Parallel input interface Direct and synchronous control mode High common mode transient immunity Output current: 0.7 A per channel Short-circuit protection Channel overtemperature protection Thermal independence of separate channels Common output disable pin Case overtemperature protection Loss of GNDcc and Vcc protection • • Undervoltage shutdown with auto-restart and hysteresis Overvoltage protection (Vcc clamping) • • • • • • • • Very low supply current Common fault open-drain output 5 V and 3.3 V TTL/CMOS compatible I/Os Fast demagnetization of inductive loads Reset function for IC output disable ESD protection IEC 61000-4-2, IEC 61000-4-4, IEC 61000-4-5 and IEC 61000-4-8 compliant UL1577 certification ISO8200BTR Power SO36 Tube Vdemag (1) 1. Per channel. PowerSO-36 Order code Type Tape & Reel Applications • • • • Programmable logic control Industrial PC peripheral input/output Numerical control machines Drivers for all types of loads (resistive, capacitive, inductive) Description The ISO8200B is a galvanic isolated 8-channel driver featuring a very low supply current. It contains 2 independent galvanic isolated voltage domains (Vcc for the power stage and Vdd for the digital stage). Additional embedded functions are: loss of GND protection, undervoltage shutdown with hysteresis, and reset function for immediate power output shutdown. DS9322 - Rev 11 - October 2019 For further information contact your local STMicroelectronics sales office. www.st.com ISO8200B IC is intended to drive any kind of load with one side connected to ground. Active channel current limitation combined with thermal shutdown, (independent for each channel), and automatic restart, protect the device against overload and short-circuit. In overload conditions, if junction temperature overtakes threshold, the channel involved is turned off and on again automatically after the IC temperature decreases below a reset threshold. If this condition causes case temperature to reach TCR limit threshold, the overloaded channel is turned off and it only restarts when case and junction temperature decrease down to the reset thresholds. Non-overloaded channels continue operating normally. An internal circuit provides an OR-wired nonlatched common FAULT indicator signaling the channel OVT. The FAULT pin is an open-drain active low fault indication pin. DS9322 - Rev 11 page 2/37 ISO8200B Block diagram 1 Block diagram Figure 1. Block diagram Vdd Power management Vcc Undervoltage detection Vcc clamp SYNC LOAD OUT_EN IN1 Output clamp Logic Logic OUTi Current limit IN8 Junction temperature detection FAULT GNDdd Rpd Case temperature detection GNDcc AM14889v1 DS9322 - Rev 11 page 3/37 ISO8200B Pin connection 2 Pin connection Figure 2. Pin connection (top through view) Table 1. Pin description Pin DS9322 - Rev 11 Name Description 1 NC Not connected 2 Vdd Positive logic supply 3 OUT_EN Output enable 4 SYNC Input-to-output synchronization signal. Active low, see Section 6.3 Synchronous control mode (SCM) 5 LOAD Load input data signal. Active low, see Section 6.3 Synchronous control mode (SCM) 6 IN1 Channel 1 input 7 IN2 Channel 2 input 8 IN3 Channel 3 input 9 IN4 Channel 4 input 10 IN5 Channel 5 input 11 IN6 Channel 6 input 12 IN7 Channel 7 input 13 IN8 Channel 8 input 14 FAULT Common fault indication, active low 15 GNDDD Input logic ground, negative logic supply 16 NC Not connected 17 NC Not connected page 4/37 ISO8200B Pin connection Pin Name 18 NC Not connected 19 GNDCC Output power ground 20 NC Not connected 21 OUT8 Channel 8 power output 22 OUT8 Channel 8 power output 23 OUT7 Channel 7 power output 24 OUT7 Channel 7 power output 25 OUT6 Channel 6 power output 26 OUT6 Channel 6 power output 27 OUT5 Channel 5 power output 28 OUT5 Channel 5 power output 29 OUT4 Channel 4 power output 30 OUT4 Channel 4 power output 31 OUT3 Channel 3 power output 32 OUT3 Channel 3 power output 33 OUT2 Channel 2 power output 34 OUT2 Channel 2 power output 35 OUT1 Channel 1 power output 36 OUT1 Channel 1 power output TAB Vcc DS9322 - Rev 11 Description Exposed tab internally connected to Vcc, positive power supply voltage page 5/37 ISO8200B Absolute maximum ratings 3 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Min. Max. Unit VCC Power supply voltage -0.3 45 V Vdd Digital supply voltage -0.3 6.5 V VIN DC input pin voltage (INx, OUT_EN, LOAD , SYNC ) -0.3 +6.5 V VFAULT Fault pin voltage -0.3 +6.5 V IGNDdd DC digital ground reverse current -25 mA IOUT Channel output current (continuous) Internally limited A IGNDcc DC power ground reverse current -250 mA IR Total reverse output current (from OUTx to GND) -5 A IIN DC input pin current (INx, OUT_EN, LOAD , SYNC ) -10 + 10 mA IFAULT Fault pin current -10 + 10 mA 2000 V VESD EAS Electrostatic discharge with human body model (R = 1.5 kΩ; C = 100 pF) Single pulse avalanche energy per channel not simultaneously @Tamb= 125 °C, IOUT = 0.5 A 0.9 Single pulse avalanche energy per channel, all channels driven simultaneously @Tamb= 125 °C, IOUT = 0.5 A 0.2 J PTOT Power dissipation at Tc = 25 °C Internally limited (1) W TJ Junction operating temperature Internally limited(1) °C TSTG Storage temperature -55 to 150 °C 1. Protection functions are intended to avoid IC damage in fault conditions and are not intended for continuous operation. Continuous or repetitive operations of protection functions may reduce the IC lifetime. DS9322 - Rev 11 page 6/37 ISO8200B Thermal data 4 Thermal data Table 3. Thermal data Symbol Parameter Rthj-case Thermal resistance, Rthj-amb Thermal resistance, junction-ambient (2) junction-case(1) Max. value Unit 1.3 °C/W 15 °C/W 1. For each channel. 2. PSSO-36 mounted on the product evaluation board STEVAL-IFP015V2 (FR4, 4 layers, 8 cm2 for each layer, copper thickness 35 μm). DS9322 - Rev 11 page 7/37 ISO8200B Electrical characteristics 5 Electrical characteristics (10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C, unless otherwise specified) Table 4. Power section Symbol Parameter Test conditions Min. Typ. Max. Unit 10.5 V VCC(THON) VCC undervoltage turn-ON threshold 9.5 VCC(THOFF) VCC undervoltage turn-OFF threshold 9 V VCC(hys) VCC undervoltage hysteresis 0.35 0.5 V VCC clamp Clamp on VCC pin 45 50 RDS(on) On-state resistance (1) Rpd Output pull-down resistor ICC Power supply current ILGND Ground disconnection output current VOUT(OFF) Off-state output voltage IOUT(OFF) Off-state output current Iclamp = 20 mA IOUT = 0.5 A, TJ = 25 °C 52 V 0.12 IOUT = 0.5 A TJ = 125 °C Ω 0.24 210 All channels in OFF-state 5 All channels in ON-state 9 kΩ mA VCC = VGND = 0 V VOUT = -24 V Channel OFF and IOUT = 0 A Channel OFF and VOUT = 0 V 500 µA 1 V 5 µA 1. See Figure 4. RDS(on) measurement Table 5. Digital supply voltage Symbol Vdd(under) Vdd undervoltage protection turn-OFF threshold Vdd(hys) Vddundervoltage hysteresis Idd DS9322 - Rev 11 Parameter Idd supply current Test conditions Min. Typ. Max. Unit 2.8 2.9 3.0 0.1 V V Vdd = 5 V and input channel with a steady logic level 4.5 6 mA Vdd = 3.3 V and input channel with a steady logic level 4.4 5.9 mA page 8/37 ISO8200B Electrical characteristics Table 6. Diagnostic pin and output protection function Symbol Parameter Test conditions VFAULT FAULT pin open-drain voltage output low IFAULT = 10 mA ILFAULT FAULT output leakage current VFAULT = 5 V IPEAK Maximum DC output current before limitation ILIM Short-circuit current limitation Hyst ILIM tracking limits TJSD Junction shutdown temperature TJ R VCC = 24 V RLOAD = 0 Ω Min. Typ. Max. Unit 0.4 V 1 µA 1.4 0.7 A 1.1 1.7 A 0.3 A 170 °C Junction reset temperature 150 °C THIST Junction thermal hysteresis 20 °C TCSD Case shutdown temperature TCR Case reset temperature 110 °C TCHYST Case thermal hysteresis 20 °C Vdemag Output voltage at turn-OFF 150 115 IOUT = 0.5 A ILOAD > = 1 mH 130 VCC-45 145 VCC-50 °C VCC-52 V Table 7. Power switching characteristics (VCC = 24 V; -40 °C < TJ < 125 °C) Symbol Parameter Test conditions Min. Typ. Max. Unit dV/dt(ON) Turn-ON voltage slope IOUT = 0.5 A, resistive load 48 Ω - 5.6 - V/µs dV/dt(OFF) Turn-OFF voltage slope IOUT = 0.5 A, resistive load 48 Ω - 2.81 - V/µs td(ON) Turn-ON delay time (1) IOUT = 0.5 A, resistive load 48 Ω - 17 22 µs td(OFF) Turn-OFF delay time ( 1) IOUT = 0.5 A, resistive load 48 Ω - 22 40 µs tf Fall time (1) IOUT = 0.5 A, resistive load 48 Ω - 5 - µs tr Rise time (1) IOUT = 0.5 A, resistive load 48 Ω - 5 - µs 1. See Figure 4. RDS(on) measurement , Figure 6. td(ON)-td(OFF) synchronous mode and Figure 7. td(ON)td(OFF) direct control mode . DS9322 - Rev 11 page 9/37 ISO8200B Electrical characteristics Figure 3. RDS(on) measurement TAB Vcc VRDS(on) Load AM14891v1 Figure 4. dV/dT 90% dV (ON) Vout dV (OFF) 80% 10% tr t tf AM14892v1 Figure 5. td(ON)-td(OFF) synchronous mode SYNC SCM 50% t td(OFF) Vout 90% 10% td(ON) DS9322 - Rev 11 AM14893v1 t page 10/37 ISO8200B Electrical characteristics Figure 6. td(ON)-td(OFF) direct control mode Table 8. Logic input and output Symbol Parameter Test conditions VIL Logic input pin low level voltage (INx, OUT_EN, LOAD , SYNC ) VIH Logic input pin high level voltage (INx, OUT_EN, LOAD , SYNC) VI(HYST) Logic input hysteresis voltage (INx, OUT_EN, LOAD , SYNC ) Vdd = 5 V IIN Logic input pin current (INx, OUT_EN, LOAD , SYNC ) VIN = 5 V tWM Power side watchdog time Min. Typ. Max. Unit -0.3 0.3 x Vdd V 0.7 x Vdd Vdd + 0.3 V 100 mV 10 272 µA 320 400 µs Max. Unit Table 9. Parallel interface timings (Vdd = 5 V; VCC= 24 V; -40 °C < TJ < 125 °C) Symbol DS9322 - Rev 11 Parameter Test conditions Min. Typ. tdis(SYNC) SYNC disable time Sync. control mode 10 µs tdis(DCM) SYNC , LOAD disable time Direct control mode 80 ns tw(SYNC) SYNC negative pulse width Sync. control mode 20 tsu(LOAD) LOAD setup time Sync. control mode 80 ns th(LOAD) LOAD hold time Sync. control mode 400 ns tw(LOAD) LOAD pulse width Sync. control mode 240 ns tsu(IN) Input setup time 80 ns th(IN) Input hold time 10 ns tw(IN) Input pulse width Sync. control mode 160 ns Direct control mode 20 µs tINLD IN to LOAD time 80 ns tLDIN LOAD to IN time 400 ns Direct control mode From IN variation to LOAD falling edge Direct control mode From LOAD falling edge to IN variation 195 µs page 11/37 ISO8200B Electrical characteristics Symbol tw(OUT_EN) tp(OUT_EN) tjitter(SCM) tjitter(DCM) frefresh Parameter Test conditions OUT_EN pulse width Min. Typ. Max. 150 OUT_EN propagation ns 22 delay Jitter on single channel 40 Sync. mode 6 Direct mode 20 Refresh delay Unit µs µs 15 kHz Table 10. Insulation and safety-related specifications Symbol Parameter Test conditions Value Unit CLR Clearance (minimum external air gap) Measured from input terminals to output terminals, the shortest distance through air 2.6 mm CPG Creepage (minimum external tracking) Measured from input terminals to output terminals, the shortest distance path analog body 2.6 mm Comparative tracking index (tracking resistance) DIN IEC 112/VDE 0303 part 1 ≥ 400 V Isolation group Material group (DIN VDE 0110, 1/89), table 1 II - CTI Table 11. Insulation characteristics Symbol dVISO/dt Parameter Common mode transient immunity Test conditions Value Unit Characterization test at Vcm = 500 V +/- 25 V/ns 100% production VTEST = 1.2 x VISO=1644 V, t = 1 s 1370 VPEAK 100% production test method b, tm = 1 s partial discharge < 5 pC 1644 Characterization test method a, tm = 10 s partial discharge < 5 pC 1315 Characterization test VTEST = 1.2 x VIOTM, t = 60 s 3500 IEC 60747-5-2 insulation characteristics VISO Isolation voltage per UL 1577 VPR Input-to-output test voltage as per IEC 60747-5-2 VIOTM DS9322 - Rev 11 Transient overvoltage as per IEC 60747-5-2 VPEAK VPEAK page 12/37 ISO8200B Functional description 6 Functional description 6.1 Parallel interface Smart parallel interface built-in ISO8200B offers three interfacing signals easily managed by a microcontroller. The LOAD signal enables the input buffer storing the value of the channel inputs. The SYNC signal copies the input buffer value into the transmission buffer and manages the synchronization between low voltage side and the channel outputs on the isolated side. The OUT_EN signal enables the channel outputs. An internal refresh signal updates the configuration of the channel outputs with a frefresh frequency. This signal can be disabled forcing low the SYNC input when LOAD is high. SYNC and LOAD pins can operate in direct control mode (DCM) or synchronous control mode (SCM). The operation of these two signals is described as follows: Table 12. Interface signal operation (general) LOAD SYNC OUT_EN Don’t care Don’t care Low High High High Low High High High Low High (1) Device behavior The outputs are disabled (turned off) The outputs are left unchanged The input buffer is enabled The outputs are left unchanged The internal refresh signal is disabled The transmission buffer is updated The outputs are left unchanged Low Low High The device operates in direct control mode as described in the respective paragraph 1. The outputs are turned off on OUT_EN falling edge and they are kept disabled as long as it is low. 6.1.1 Input signals (IN1 to IN8) Inputs from IN1 to IN8 are the driving signals of the corresponding OUT1 to OUT8 outputs. Data are direct loaded on related outputs if SYNC and LOAD inputs are low (DCM operation) or stored into input buffer when LOAD is low and SYNC is high. 6.1.2 Load input data (LOAD) The input is active low; it stores the data from IN1 to IN8 into the input buffer. 6.1.3 Output synchronization (SYNC) The input is active low; it enables the ISO8200B transmission buffer loading input buffer data and manages the transmission between the two isolated sides of the device. 6.1.4 Watchdog The isolated side of the device provides a watchdog function in order to guarantee a safe condition when Vdd supply voltage is missing. If the logic side does not update the output status within tWD, all outputs are disabled until a new update request is received. The refresh signal is also considered a valid update signal, so the isolated side watchdog does not protect the system from a failure of the host controller (MCU freezing). DS9322 - Rev 11 page 13/37 ISO8200B Direct control mode (DCM) Figure 7. Watchdog behavior Vdd ______ Don’t care SYNC Don’t care _____ LOAD A D0…D7 B REFRESH C C Don’t care SKIPPED ! A OUT0…OUT7 B If the isolated side does not Outputs are kept receive an update request within the watchdog timeout OFF until an update all outputs are turned OFF request is received C C Timeout counter Any update request resets the watchdog counter 6.1.5 IPG1912131338LM Output enable (OUT_EN) This pin provides a fast way to disable all outputs simultaneously. When the OUT_EN pin is driven low the outputs are disabled. To enable the output stage, the OUT_EN pin has to be raised. This timing execution is compatible with an external reset push, safety requirement, and allows, in a PLC system, the microcontroller polling to obtain all internal information during a reset procedure. Figure 8. Output channel enable timing 6.2 Direct control mode (DCM) When SYNC and LOAD inputs are driven by the same signal, the device operates in direct control mode (DCM). In DCM the SYNC / LOAD signal operates as an active low input enable: • when the signal is high, the current output configuration is kept regardless the input values • when the signal is low, each channel input directly drives the respective output This operation mode can also be set shorting both signals to the digital ground; in this case the channel outputs are always directly driven by the inputs except when OUT_EN is low (outputs disabled). Table 13. Interface signal operation in direct control mode SYNC / LOAD OUT_EN Device behavior Don’t care Low (1) The outputs are disabled (turned off) High High The outputs are left unchanged Low High The channel inputs drive the outputs 1. The outputs are turned off on OUT_EN falling edge and they are kept disabled as long as it is low. DS9322 - Rev 11 page 14/37 ISO8200B Synchronous control mode (SCM) Figure 9. Direct control mode IC configuration Vdd Vdd Vdd Vdd Vdd Vdd OUT_EN SYNC LOAD OUT_EN SYNC LOAD IN1 IN2 IN3 IN4 IN5 IN6 MCU GPIO ISO8200B IN1 IN2 IN3 IN4 IN5 IN6 IN7 IN8 MCU GPIO IN7 IN8 Vdd Vdd FAULT FAULT GND ISO8200B GNDdd GND Inputs are enabled by MCU through the SYNC/LOAD signals GNDdd Inputs are always enabled (outputs can be disabled through OUT_EN) AM14897v1 Figure 10. Direct control mode time diagram SYNC LOAD tds(DMC) INx t INLD t LDIN t SU(IN) t h(IN) Internal refresh 1/ f refresh OUTx td(OFF) 6.3 tf td(ON) tr AM14898v1 Synchronous control mode (SCM) When SYNC and LOAD inputs are independently driven, the device can operate in synchronous control mode (SCM). The SCM is used to reduce the jittering of the outputs and to drive all outputs of different devices at the same time. In SCM the LOAD signal is forced low to update the input buffer while the SYNC signal is high. The LOAD signal is raised and the SYNC one is forced low for at least tSYNC(SCM). During this period, the internal refresh is disabled and any pending transmission between the low voltage and the isolated side is completed. When the SYNC signal is raised the channel output configuration is changed according to the one stored in the input. If the tSYNC(SCM) limit is met, the maximum jitter of the channel outputs is tjitter(SCM). If more devices share the same SYNC signal, all device outputs change simultaneously with a maximum jitter related to maximum delay and maximum jitter for single device. DS9322 - Rev 11 page 15/37 ISO8200B Synchronous control mode (SCM) Table 14. Interface signal operation in synchronous control mode LOAD SYNC OUT_EN Device behavior Don’t care Don’t care Low (1) The outputs are disabled (turned off) High High High The outputs are left unchanged Low High High The input buffer is enabled The outputs are left unchanged The internal refresh signal is disabled High Low High The transmission buffer is updated The outputs are left unchanged High Rising edge High The outputs are updated according to the current transmission buffer value Low Low High Should be avoided (DCM operation only) 1. The outputs are turned off on OUT_EN falling edge and they are kept disabled as long as it is low. Figure 11. Synchronous control mode IC configuration Vdd Vdd Vdd OUT_EN SYNC LOAD IN1 MCU IN2 IN3 ISO8200B IN4 GPIO IN5 IN6 IN7 IN8 Vdd FAULT GND GNDdd AM14899v1 DS9322 - Rev 11 page 16/37 ISO8200B Fault indication Figure 12. Synchronous control mode time diagram Figure 13. Multiple device synchronous control mode DEV1 MCU SYNC LOAD SYNC LD1 LD2 DATA1..DATA8 8 IN1..IN8 OUT0..OUT7 SYNC 8 LD1 LD2 DEV2 DATA1..DATA8 SYNC LOAD IN1..IN8 OUT0..OUT7 8 OUT1..OUT8 DEV1 OUT1..OUT8 DEV2 A B X A X B AM14901v1 6.4 Fault indication The FAULT pin is an active low open-drain output indicating fault conditions. This pin is active when at least one of the following conditions occurs: • Junction overtemperature of one or more channels (TJ >TTJSD) • Communication error The communication error is intended as an internal data corruption event in the data transfer through isolation. In case of communication error the outputs are initially kept in the previous status and then reset (turned off) at the first communication error during data transfer of the refresh signal. 6.4.1 Junction overtemperature and case overtemperature The thermal status of the device is updated during each transmission sequence between the two isolated sides. In SCM operation, when the LOAD signal is high and the SYNC one is low, the communication is disabled. In this case the thermal status of the device cannot be updated and the FAULT indication can be different from the current status. In any case, the thermal protection of the channel outputs is always operative. DS9322 - Rev 11 page 17/37 ISO8200B Fault indication Figure 14. Thermal status update (DCM) Figure 15. Thermal status update (SCM) SYNC FAULT Skipped Internal refresh Tx/Rx Tx/Rx Tx/Rx THERMAL FAULT AM14992v1 DS9322 - Rev 11 page 18/37 ISO8200B Power section 7 Power section 7.1 Current limitation The current limitation process is active when the current sense connected on the output stage measures a current value, which is higher than a fixed threshold. When this condition is verified the gate voltage is modulated to avoid the increase of the output current over the limitation value. Figure below shows typical output current waveforms with different load conditions. Figure 16. Current limitation with different load conditions DS9322 - Rev 11 page 19/37 ISO8200B Thermal protection 7.2 Thermal protection The device is protected against overheating in case of overload conditions. During the driving period, if the output is overloaded, the device suffers two different thermal stresses, the former related to the junction, and the latter related to the case. The two faults have different trigger thresholds: the junction protection threshold is higher than the case protection one; generally the first protection, that is active in thermal stress conditions, is the junction thermal shutdown. The output is turned off when the temperature is higher than the related threshold and turned back on when it goes below the reset threshold. This behavior continues until the fault on the output is present. If the thermal protection is active and the temperature of the package increases over the fixed case protection threshold, the case protection is activated and the output is switched off and back on when the junction temperature of each channel in fault and case temperature is below the respective reset thresholds. Below figures show respectively the thermal protection behavior, and the typical temperature trends and output vs. input state. Figure 17. Thermal protection flowchart Input IN(i) HIGH Output (i) ON Fault(i) Off N TJ(i) >TJSD Y N Output (i) OFF Fault(i) ON TC >TCSD N Y TJR >TJ(i) Y Y TC >TCR N AM14995v1 DS9322 - Rev 11 page 20/37 ISO8200B Thermal protection Figure 18. Thermal protection DS9322 - Rev 11 page 21/37 ISO8200B Reverse polarity protection 8 Reverse polarity protection Reverse polarity protection can be implemented on board using two different solutions: 1. Placing a resistor (RGND) between IC GND pin and load GND 2. Placing a diode between IC GND pin and load GND If option 1 is selected, the minimum resistance value has to be selected according to the following equation: RGND ≥ VCC/IGNDcc where IGNDcc is the DC reverse ground pin current and can be found in Section 3 Absolute maximum ratings of this datasheet. Power dissipated by RGND during reverse polarity situations is: PD = (VCC ) 2/RGND If option 2 is selected, the diode has to be chosen by taking into account VRRM >|VCC| and its power dissipation capability: PD ≥ IS*VF Note: In normal conditions (no reverse polarity), due to the diode, there is a voltage drop between GND of the device and GND of the system. Figure 19. Reverse polarity protection Intputi GNDdd +Vcc Isolation +Vdd RGND Outputi GNDCC Load Diode GIPD2611131255LM This schematic can be used with any type of load. DS9322 - Rev 11 page 22/37 ISO8200B Reverse polarity on Vdd 9 Reverse polarity on Vdd The reverse polarity on Vdd can be implemented on board by placing a diode between GNDdd pin and GND digital ground. The diode has to be chosen by taking into account VRRM >|Vdd| and its power dissipation capability: PD ≥ Idd*VF Note: In normal conditions (no reverse polarity), due to the diode, there is a voltage drop between GNDdd of the device and digital ground of the system. Figure 20. Reverse polarity protection on Vdd Intputi GNDdd Diode +Vcc Isolation +Vdd Outputi GNDCC RGND Load Diode GIPD2611131302LM DS9322 - Rev 11 page 23/37 ISO8200B Conventions 10 Conventions 10.1 Supply voltage and power output conventions Figure below shows the convention used in this paper for voltage and current usage. Figure 21. Supply voltage and power output conventions Idd ICC Vdd IFAULT Vdd VCC FAULT IIN IN I OUT_EN ISYNC ILOAD OUT_EN Iout VCC OUT SYNC LOAD GNDdd GNDcc Vout AM14997v1 DS9322 - Rev 11 page 24/37 ISO8200B Thermal information 11 Thermal information 11.1 Thermal impedance Figure 22. Simplified thermal model Tj1 Rth1a Rth1b Tj2 Rthc_a Rth2 Cth Rth1h Tj8 AM14998v1 DS9322 - Rev 11 page 25/37 ISO8200B Package information 12 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 12.1 PowerSO-36 package information Figure 23. PowerSO-36 package outline Table 15. PowerSO-36 package mechanical data Dim. mm Min. Typ. A a1 3.60 0.10 0.30 a2 3.30 a3 0 0.10 b 0.22 0.38 c 0.23 0.32 D 15.80 16.00 D1 9.40 9.80 E 13.90 14.50 E1 10.90 11.10 E2 E3 DS9322 - Rev 11 Max. 2.90 5.8 6.2 e 0.65 e3 11.05 G 0 0.10 H 15.50 15.90 page 26/37 ISO8200B Footprint recommended data mm Dim. Min. Typ. Max. h 1.10 L 0.80 1.10 N 10° S 12.2 0° 8° Footprint recommended data Figure 24. Footprint recommended data E G L B H C D A Table 16. Footprint data DS9322 - Rev 11 Dim mm A 9.5 B 14.7 - 15.0 C 12.5 - 12.7 D 6.3 E 0.42 G 0.65 H 4.1 L 3.2 page 27/37 ISO8200B Tube shipment information 12.3 Tube shipment information Figure 25. Tube shipment information Table 17. Tube mechanical data DS9322 - Rev 11 Dim mm A 18.80 B 17.2±0.2 C 8.20±0.2 D 10.90±0.2 E 2.90±0.2 F 0.40 G 0.80 H 6.30 I 4.30±0.2 J 3.7±0.2 K 9.4 L 0.40 M 0.80 N 3.50±0.2 page 28/37 ISO8200B Tape and reel shipment information 12.4 Tape and reel shipment information Figure 26. Tape specifications Table 18. Tape mechanical data DS9322 - Rev 11 Dim mm D 1.50+0.1/0 E 1.75 ±0.1 PO 4.00 ±0.1 Tmax 0.40 D1min 1.50 F 11.5 ±0.05 Kmax 6.50 P2 2.00 ±0.1 R 50 W 24.00 ±0.30 P1 24.00 AO, BO, KO, 0.05 min to 1.0 max page 29/37 ISO8200B Tape and reel shipment information Figure 27. Reel specifications Table 19. Reel mechanical data DS9322 - Rev 11 Dim mm Tape size 24.0±0.30 Amax 330.0 Bmin 1.5 C 13.0±0.20 Dmin 20.2 Nmin 60 G 24.4+2/-0 Tmax 30.4 page 30/37 ISO8200B Ordering information 13 Ordering information Table 20. Ordering information Order code DS9322 - Rev 11 Package Packing ISO8200B PowerSO-36 Tube ISO8200BTR PowerSO-36 Tape and reel page 31/37 ISO8200B Revision history Table 21. Document revision history Date Changes 19-Oct-2012 1 Initial release. 01-Jul-2013 2 Updated Figure 24: Footprint recommended data and Table 15: Footprint data. 3 Document status promoted from preliminary to production data. Added IEC bullet to features. Updated Table 4, Table 6, Table 7, and Table 9. Deleted table titled: “Insulation and safety-related specifications” and table titled: “Device immunity specifications”. Changed Table 10: IEC 60747-5-2 insulation characteristics Changed Figure 10. 28-Oct-2013 DS9322 - Rev 11 Revision 12-Nov-2013 4 Added to Table 10 CLR and CPG parameters. 29-Nov-2013 5 Removed VIORM parameter from Table 10. Updated Section 8: Reverse polarity protection. Added Section 9: Reverse polarity on Vdd. Changed Figure 19. Added Figure 20. 24-Jan-2014 6 Changed Figure 7. Added note to Table 3. Added test conditions: TJ = 125 °C to Table 4. Added typ. and max. values of Idd to Table 5. Added max. values of td(ON) and td(OFF) to Table 7. Added typ. and max. values of tp(OUT_EN) to Table 9. Added tjitter(DCM) value to Table 9. 03-Feb-2014 7 Updated Figure 12. 06-Feb-2014 8 Updated Figure 12 and Table 9 22-Apr-2014 9 Updated EAS parameter in Table 2. Updated IPEAK parameter in Table 6. Updated mechanical data. 03-Jul-2017 10 Updated features, Table 1. Pin description, Section 5 Electrical characteristics and Section 6.4 Fault indication. 17-Oct-2019 11 Updated features ,updated the name of the last Pin in Table 1 , updated Table 15, added : Section 12.2 , Section 12.3 ,Section 12.4 , updated Table 11. page 32/37 ISO8200B Contents Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 5 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 6.1 Parallel interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.1 Input signals (IN1 to IN8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.2 Load input data (LOAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.3 Output synchronization (SYNC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.4 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.5 Output enable (OUT_EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2 Direct control mode (DCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.3 Synchronous control mode (SCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.4 Fault indication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.4.1 7 Junction overtemperature and case overtemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 7.1 Current limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.2 Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 9 Reverse polarity on Vdd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 10 Conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 10.1 11 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 11.1 12 Supply voltage and power output conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Thermal impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 12.1 PowerSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 12.2 Footprint recommended data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 12.3 Tube shipment information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 DS9322 - Rev 11 page 33/37 ISO8200B Contents 12.4 13 Tape and reel shipment information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 DS9322 - Rev 11 page 34/37 ISO8200B List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagnostic pin and output protection function . . . . . . . . . . . . . . . . . . . Power switching characteristics (VCC = 24 V; -40 °C < TJ < 125 °C) . . . Logic input and output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel interface timings (Vdd = 5 V; VCC= 24 V; -40 °C < TJ < 125 °C) . Insulation and safety-related specifications . . . . . . . . . . . . . . . . . . . . Insulation characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interface signal operation (general) . . . . . . . . . . . . . . . . . . . . . . . . . Interface signal operation in direct control mode. . . . . . . . . . . . . . . . . Interface signal operation in synchronous control mode . . . . . . . . . . . PowerSO-36 package mechanical data . . . . . . . . . . . . . . . . . . . . . . Footprint data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tube mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tape mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reel mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DS9322 - Rev 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 . 6 . 7 . 8 . 8 . 9 . 9 11 11 12 12 13 14 16 26 27 28 29 30 31 32 page 35/37 ISO8200B List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. DS9322 - Rev 11 Block diagram . . . . . . . . . . . . . . . . . . . . . . Pin connection (top through view) . . . . . . . . . RDS(on) measurement . . . . . . . . . . . . . . . . . dV/dT . . . . . . . . . . . . . . . . . . . . . . . . . . . . td(ON)-td(OFF) synchronous mode . . . . . . . . td(ON)-td(OFF) direct control mode . . . . . . . . Watchdog behavior . . . . . . . . . . . . . . . . . . . Output channel enable timing . . . . . . . . . . . . Direct control mode IC configuration . . . . . . . Direct control mode time diagram . . . . . . . . . Synchronous control mode IC configuration . . Synchronous control mode time diagram . . . . Multiple device synchronous control mode . . . Thermal status update (DCM). . . . . . . . . . . . Thermal status update (SCM) . . . . . . . . . . . . Current limitation with different load conditions Thermal protection flowchart . . . . . . . . . . . . Thermal protection . . . . . . . . . . . . . . . . . . . Reverse polarity protection. . . . . . . . . . . . . . Reverse polarity protection on Vdd . . . . . . . . Supply voltage and power output conventions Simplified thermal model . . . . . . . . . . . . . . . PowerSO-36 package outline . . . . . . . . . . . Footprint recommended data . . . . . . . . . . . . Tube shipment information . . . . . . . . . . . . . . Tape specifications . . . . . . . . . . . . . . . . . . . Reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 . 4 10 10 10 11 14 14 15 15 16 17 17 18 18 19 20 21 22 23 24 25 26 27 28 29 30 page 36/37 ISO8200B IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS9322 - Rev 11 page 37/37