ITAxxB1
Bidirectional Transil™ array for data line protection
Features
■
High surge capability Transil array:
IPP = 40 A (8/20 µs)
■
Peak pulse power: 300 W (8/20 µs)
■
Up to 5 bidirectional Transil functions
■
Low clamping factor (VCL / VBR) at high current
level
■
Low leakage current
■
ESD protection up to 15 kV
SO-8
Figure 1.
Functional diagram
Complies with the following standards
I/O1
1
8 GND
■
I/O2
2
7
I/O3
3
6
I/O4
4
5 GND
■
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G- Method 3015-7: class 3B
– 25 kV (human body model)
Applications
Differential data transmission line protection, such
as:
■
RS-232
■
RS-423
■
RS-422
■
RS-485
Description
Transil diode arrays provide high overvoltage
protection by clamping action. Their
instantaneous response to transient overvoltages
makes them particularly suited to protect voltage
sensitive devices such as MOS technology and
low voltage supplied IC’s.
The ITA series combines high surge capability
against energetic pulses with high voltage
performance against ESD.
TM: Transil is a trademark of STMicroelectronics
November 2007
Rev 2
1/7
www.st.com
7
Characteristics
ITAxxB1
1
Characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
PPP
IPP
Parameter
Peak pulse power (8/20 µs)(1)
Peak pulse current (8/20 µs)
Unit
Tj initial = Tamb
300
W
Tj initial = Tamb
40
A
2
I t
Wire I t value
0.6
A2s
Tj
Maximum operating junction temperature
125
°C
-55 to +150
°C
260
°C
Tstg
TL
2
(1)
Value
(1)
Storage temperature range
Maximum lead temperature for soldering during 10 s at 5 mm for case
1. For surges greater than the specified maximum value, the I/O will first present a short-circuit and after an open circuit
caused by the wire melting.
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameter
I
IPP
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current
IPP
Peak pulse current
αT
Voltage temperature coefficient
C
Capacitance
VBR
Order code
IRM
VRM
V
VBR
@ IR
IRM
@
VRM
VCL
min.
max.
(1)
@
IPP
VCL
8/20 µs
max.
(1)
IPP
αT
C
8/20 µs
max.
max.
@
(1)
(2)
V
mA
µA
V
V
A
V
A
10-4/ °C
pF
ITA6V5B1
6.5
1
10
5
10
10
12
25
4
750
ITA10B1
10
1
4
8
15
10
19
25
8
570
ITA18B1
18
1
4
15
25
10
28
25
9
350
ITA25B1
25
1
4
24
33
10
38
25
12
300
1. Betwenn I/O pin and ground.
2. Between two input pins at 0 V Bias, F = 1 MHz.
2/7
VCL
ITAxxB1
Characteristics
Figure 2.
Pulse waveform
Figure 3.
Typical peak pulse power versus
exponential pulse duration
PPP(W)
%IPP
1E+04
Tj initial=25°C
8 µs
100
ITA25B1
ITA18B1
1E+03
Pulse waveform 8/20 µs
50
ITA6V5B1
ITA10B1
1E+02
0
t
20 µs
tP(ms) expo
1E+01
1E-03
Figure 4.
Clamping voltage versus peak
pulse current (exponential
waveform 8/20 µs)
Figure 5.
VCL(V)
1E-02
1E-01
1E+00
1E+01
1E+02
Peak current IDC inducing open
circuit of the wire for one
input/output versus pulse duration
(typical values)
IDC(A)
1E+03
1E+03
%IPP
Tj initial=25°C
Exponential waveform
100
50
0
1E+02
tr
t
tp
1E+02
ITA25B1
ITA18B1
1E+01
1E+01
ITA6V5B1
ITA10B1
IPP(A)
1E+00
1E-01
Figure 6.
1E+00
tP(ms)
1E+00
1E+01
1E-02
1E+02
Junction capacitance versus
reverse applied voltage for one
input/output (typical values)
Figure 7.
C(pF)
Tj=25°C
F=1MHz
1E+00
1E+01
Relative variation of leakage
current versus junction
temperature
IR(Tj)
IR(Tj=25°C)
1E+03
ITA6V5B1
1E-01
5E+3
VR=VRM
1E+3
1E+2
ITA10B1
1E+1
ITA18B1
1E+0
ITA25B1
Tj(°C)
VR(V)
1E+02
1E-1
0
1E+00
1E+01
25
50
75
100
125
150
1E+02
3/7
Application information
2
ITAxxB1
Application information
This monolithic Transil Array is based on 6 unidirectional Transils with a common cathode
and can be configurated to offer up to 5 bidirectional functions. This imposes a maximum
differential voltage between 2 input pins (see Table 3).
Table 3.
Maximum differential voltages
Order code
Maximum differential voltage between two input pins at 25 °C
ITA6V5B1
± 3.5 V
ITA10B1
± 5.0 V
ITA18B1
± 9.0 V
ITA25B1
± 12.5 V
Figure 8.
RS-232 junction (typical application)
TX
RX
RTS
CTS
GND
3
Ordering information scheme
Figure 9.
Ordering information scheme
ITA
Integrated Transil Array
Breakdown Voltage (min)
25 = 25 Volt
Type of lines protected
B = Bidirectional
Package
1 = SO-8
Packaging
RL = Tape & reel
Blank = Tube
4/7
25
B
1
RL
ITAxxB1
4
Package information
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 4.
SO-8 dimensions
Dimensions
ccc C
Ref.
A2
e
b
C
(Seating
Plane)
A
Millimeters
Min.
Typ.
A
A1
Inches
Max.
Min.
Typ.
1.75
A1
0.1
0.25
A2
1.25
Max.
0.069
0.004
0.010
h x 45°
0.25mm
(Gage Plane)
C
L
k
L1
D
b
0.28
0.48
0.011
0.019
C
0.17
0.23
0.007
0.009
D
4.80
4.90
5.00
0.189 0.193 0.197
E
5.80
6.00
6.20
0.228 0.236 0.244
E1
3.80
3.90
4.00
0.150 0.154 0.157
e
8
5
E1
E
1.27
4
0.050
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
8
0
L1
1
0.049
k°
1.04
0
ccc
0.041
0.10
8
0.004
Figure 10. SO-8 footprint (dimensions in mm)
6.7
0.54
4.03
1.27
1.335
5/7
Ordering Information
5
Ordering Information
Table 5.
6
Ordering information
Order code
Marking
Base qty
Delivery mode
ITA6V5B1
6V5B1
2000
Ammopack
ITA6V5B1RL
6V5B1
2500
Tape and reel
ITA10B1
10B1
2000
Ammopack
ITA18B1
18B1
2000
Ammopack
ITA18B1RL
18B1
2500
Tape and reel
ITA25B1
25B1
2000
Ammopack
ITA25B1RL
25B1
2500
Tape and reel
Package
SO-8
Weight
0.08 g
Revision history
Table 6.
6/7
ITAxxB1
Document revision history
Date
Revision
Description of changes
13-Dec-2004
1
First issue.
15-Nov-2007
2
Reformatted to current standards.
SO-8 package dimensions update.
Updated pulse waveform parameters in Figure 2.
ITAxxB1
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