L2293Q

L2293Q Push-pull four channel driver with diodes Features ■ 600 mA output current capability per channel ■ 1.2 A peak output current (non repetitive) per channel ■ Enable facility ■ Overtemperature protection ■ Logical “0” input voltage up to 1.5 V (high noise immunity) ■ Internal clamp diodes VFQFPN 5 mm x 5 mm 32L Description The device is a monolithic integrated high voltage, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power transistors. Figure 1. August 2009 To simplify use as two bridges each pair of channels is equipped with an enable input. A separate supply input is provided for the logic, allowing operation at a lower voltage and internal clamp diodes are included. This device is suitable for use in switching applications at frequencies up to 50 kHz. The L2293Q is assembled in a VFQFPN-32L 5x5 package which has exposed pad available for heatsinking. Block diagram Doc ID 14899 Rev 3 1/13 www.st.com 13 Contents L2293Q Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Recommended conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 Doc ID 14899 Rev 3 L2293Q Electrical data 1 Electrical data 1.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Value Unit VS Supply voltage 36 V VSS Logic supply voltage 36 V Input voltage 7 V Enable voltage 7 V 1.2 A 4 W Vi Ven Io 1.2 Parameter Peak output current (100 μs non repetitive) Ptot Total power dissipation at Tpins = 90 °C TJ Junction temperature 150 °C TSTG Storage temperature – 40 to 150 °C Recommended conditions Table 2. Recommended conditions Value Symbol Parameter Unit Min VS VSS TJ Supply voltage VSS Logic supply voltage Junction temperature Typ Max 36 V 2.8 (1) 36 V -20 (1) 125 °C 1. See Figure 2 Doc ID 14899 Rev 3 3/13 Electrical data 1.3 L2293Q Thermal data Figure 2. Typical minimum logic supply voltage vs junction temperature VSS_min [V] 2.8 2.7 -20 Table 3. Symbol Rth(JA) -10 0 Tj [°C] Thermal data Parameter Thermal resistance junction-ambient max. (1) 2 Value Unit 42 °C/W 1. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm on the top side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC). 4/13 Doc ID 14899 Rev 3 L2293Q 2 Pin connection Pin connection Figure 2. Note: Pin connection (top view) NC(1) These NC pins are connected to the exposed PAD. The exposed PAD must be connected to GND pins. NC(2) These NC pins can be connected to GND pins and exposed PAD. Figure 3. Recommended PCB layout for Rth(JA) optimization L2293Q TOP LAYER (connected to GND) BOTTOM LAYER (connected to GND) GND pins VIA holes Doc ID 14899 Rev 3 5/13 Pin connection L2293Q Table 4. 6/13 Pin description Pin n° Name Type Function 1, 18, 19, 20, 21, 22, 23 NC Not connected 2, 3, 4, 5, 6, 7, NC Pins connected to the exposed PAD 8, 9, 17, 24, 28, 32 GND 10 OUTPUT2 O Output 2 11 INPUT2 I Input 2 12, 13 VS 14 ENABLE2 I Enable 2 input, the LOW state disables the Output 3 and Output 4. 15 INPUT3 I Input 3 16 OUTPUT3 O Output 3 25 OUTPUT4 O Output 4 26 INPUT4 I Input 4 27 VSS 29 ENABLE1 I Enable 1 input, the LOW state disables the output 1 and Output 2. 30 INPUT1 I Input 1 31 OUTPUT1 O Output 1 Ground Supply voltage for the power output stages. A non-inductive 100 nF capacitor must be connected between these pins and ground. Supply voltage for the logic blocks. A 100 nF capacitor must be connected between this pin and ground. Doc ID 14899 Rev 3 L2293Q 3 Electrical characteristics Electrical characteristics For each channel, VS = 24 V, VSS = 5 V, TA = 25 °C, unless otherwise specified. Table 5. Symbol IS Electrical characteristics Pin 12,13 Parameter Test condition Total quiescent supply current Min Typ Max Unit Vi = L; IO = 0; Ven = H 2 6 mA Vi = H; IO = 0; Ven = H 16 24 mA 4 mA Ven = L 27 Total quiescent logic supply current ISS Vi = L; IO = 0; Ven = H 44 60 mA Vi = H; IO = 0; Ven = H 16 22 mA Ven = L 16 24 mA – 0.3 1.5 V VSS ≤ 7 V 2.3 VSS V VSS > 7 V 2.3 7 V – 10 μA 100 μA – 0.3 1.5 V VSS ≤ 7 V 2.3 VSS V VSS > 7 V 2.3 7 V VIL 11, 15, 26, 30 Input low voltage VIH 11, 15, 26, 30 Input high voltage IIL 11, 15, 26, 30 Low voltage input current VIL = 1.5 V IIH 11, 15, 26, 30 High voltage input current 2.3 V ≤ VIH ≤ VSS – 0.6 V Ven L 14, 29 Enable low voltage Ven H 14, 29 Enable high voltage Ien L 14, 29 Low voltage enable current Ven L = 1.5 V Ien H 14, 29 High voltage enable current 2.3 V ≤ Ven H ≤ VSS – 0.6 V VCE(sat)H 10, 16, 25, 31 Source output saturation voltage IO = – 0.6 A VCE(sat)L 10, 16, 25, 31 Sink output saturation voltage Clamp diode forward voltage VF 30 – 30 – 100 μA ± 10 μA 1.4 1.8 V IO = + 0.6 A 1.2 1.8 V IO = 600 nA 1.3 Doc ID 14899 Rev 3 V 7/13 Electrical characteristics L2293Q VS = 24 V, VSS = 5 V, TA = 25 °C, unless otherwise specified. Table 6. AC operation Symbol Parameter t r Rise time tf Fall time (1) ton toff Test condition (1) Min Typ Max 0.1 to 0.9 VO 250 ns 0.9 to 0.1 VO 250 ns Turn-on delay (1) 0.5 Vi to 0.5 VO 750 ns Turn-off delay (1) 0.5 Vi to 0.5 VO 200 ns 1. See Figure 4 Figure 4. Switching times Table 7. Truth table (one channel) Input Enable(1) Output H H H L H L H L Z (2) L L Z (2) 1. Relative to the considered channel 2. Z = High output impedance 8/13 Unit Doc ID 14899 Rev 3 L2293Q Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 8. VFQFPN 5x5x1.0 32L pitch 0.50 Databook (mm) Dim. Min Typ Max A 0.80 0.85 0.95 b 0.18 0.25 0.30 b1 0.165 0.175 0.185 D 4.85 5.00 5.15 D2 3.00 3.10 3.20 D3 1.10 1.20 1.30 E 4.85 5.00 5.15 E2 4.20 4.30 4.40 E3 0.60 0.70 0.80 e L 0.50 0.30 ddd Note: 0.40 0.50 0.08 1 VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no lead. Very thin profile: 0.80 < A ≤ 1.00 mm. 2 Details of terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features. Doc ID 14899 Rev 3 9/13 Package mechanical data Figure 5. 10/13 L2293Q Package dimensions Doc ID 14899 Rev 3 L2293Q 5 Order codes Order codes Table 9. Order code Order code Package Packaging L2293Q VFQFPN 5x5x1.0 32L Tube Doc ID 14899 Rev 3 11/13 Revision history 6 L2293Q Revision history Table 10. 12/13 Document revision history Date Revision Changes 10-Jul-2008 1 First release 26-Feb-2009 2 Updated Table 3 on page 4 12-Aug-2009 3 Updated description in coverpage Doc ID 14899 Rev 3 L2293Q Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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