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L6234PD013TR

L6234PD013TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC20

  • 描述:

    IC MOTOR DRIVER 7V-52V 20POWERSO

  • 数据手册
  • 价格&库存
L6234PD013TR 数据手册
L6234 Three-phase motor driver Datasheet - production data Description The L6234 is a triple half bridge to drive a brushless DC motor. It is realized in BCDmultipower technology which combines isolated DMOS power transistors with CMOS and bipolar circuits on the same chip. 1PXFS40 By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance. Features The output DMOS transistors can sustain a very high current due to the fact that the DMOS structure is not affected by the second breakdown effect, the RMS maximum current is practically limited by the dissipation capability of the package.  Supply voltage from 7 to 52 V  5 A peak current  RDSon 0.3  typ. value at 25 °C  Cross conduction protection  TTL compatible driver All the logic inputs are TTL, CMOS and µP compatible. Each channel is controlled by two separate logic inputs.  Operating frequency up to 150 kHz  Thermal shutdown  Intrinsic fast free wheeling diodes  Input and enable function for each half bridge The L6234 device is available in a 20-pin PowerSO20 package. Table 1. Device summary  10 V external reference available March 2017 This is information on a product in full production. Order code Package Packing L6234PD PowerSO20 Tube L6234PD013TR PowerSO20 Tape and reel DocID1107 Rev 11 1/15 www.st.com Contents L6234 Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.1 9 2/15 PowerSO20 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DocID1107 Rev 11 L6234 1 Block diagram Block diagram Figure 1. Block diagram ".W DocID1107 Rev 11 3/15 15 Pin connections 2 L6234 Pin connections Figure 2. Pin connections Table 2. Pin functions 4/15 Pin no. Name Function 1, 10 11, 20 GND Common ground terminal. In the PowerSO package these pins are used to dissipate the heat forward the PCB. 2 SENSE1 A sense resistor connected to this pin provides feedback for motor current control for the bridges 1 and 2. 3 8 13 EN 2 EN 1 EN 3 Enable of the channels 1/2/3. A logic LOW level on this pin switches off both power DMOS of the related channel. 4 7 14 IN 2 IN 1 IN 3 Logic input of channels 1/2/3. A logic HIGH level (when the corresponding EN pin is HIGH) switches ON the upper DMOS power transistor, while a logic LOW switches ON the corresponding low side power DMOS. 5 6 15 OUT 2 OUT 1 OUT 3 9, 12 Vs 16 VREF 17 VCP 18 VBOOT Overvoltage input to drive the upper DMOS 19 SENSE2 A sense resistor connected to this pin provides feedback for motor current control for the bridge 3. Output of the channels 1/2/3. Power supply voltage. Internal voltage reference. A capacitor connected from this pin to GND increases the stability of the power DMOS drive circuit. Bootstrap oscillator. Oscillator output for the external charge pump. DocID1107 Rev 11 L6234 3 Thermal data Thermal data Table 3. Thermal data Symbol Rth j-case Parameter Thermal resistance junction case DocID1107 Rev 11 PowerSO20 Unit 1.5 °C/W 5/15 15 Maximum ratings 4 L6234 Maximum ratings Table 4. Absolute maximum ratings Symbol Parameter VS Power supply voltage VIN, VEN Input enable voltage Ipeak VSENSE Pulsed output current (1) Sensing voltage (DC voltage) Value Unit 52 V – 0.3 to 7 V 5 A -1 to 4 V Vboot Bootstrap peak voltage 62 V VOD Differential output voltage (between any of the 3 OUT pins) 60 V Commutation frequency 150 kHz Reference voltage 12 V Total power dissipation (TA = 70 °C ) 2.3 W -40 to 150 °C Value Unit 7 to 42 V fC VREF Ptot Tstg, Tj Storage and junction temperature range 1. Pulse width limited only by junction temperature and the transient thermal impedance. Recommended operating conditions Table 5. Recommended operating conditions Symbol VS Supply voltage VOD Peak to peak differential voltage (between any of the 3 out pins) 52 V Iout DC output current (TA = 25 °C) 4 A Sensing voltage (pulsed tw < 300 nsec) -4 to 4 V Sensing voltage (DC) -1 to 1 V -40 to 125 °C VSENSE Tj 6/15 Parameter Junction temperature range DocID1107 Rev 11 L6234 5 Electrical characteristics Electrical characteristics VS = 42 V; Tj = 25 °C unless otherwise specified. Table 6. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit VS Supply voltage - 7 - 52 V Vref Reference voltage - - 10 - V IS Quiescent supply current - - 6.5 - mA TS Thermal shutdown - 150 - - °C TD Dead time protection - - 300 - ns Leakage current - - - 1 mA ON resistance - - 0.3 - Ω Output DMOS transistor IDSS RDSon Source drain diode VSD Forward ON voltage ISD = 4 A; EN = LOW - 1.2 - V TRR Reverse recovery time IF = 4 A - 900 - ns Tpr Forward recovery time - - 200 - ns VINL, VENL Input LOW voltage - -0.3 - 0.8 V VINH, VENH Input HIGH voltage - 2 - 7 V -10 µA - µA Logic levels IINL, IENL Input LOW current VIN, VEN = L - IINH, IENH Input HIGH current VIN, VEN = H - DocID1107 Rev 11 30 7/15 15 Circuit description 6 L6234 Circuit description The L6234 is a triple half bridge designed to drive brushless DC motors. Each half bridge has 2 power DMOS transistors with RDSon = 0.3 . The 3 half bridges can be controlled independently by means of the 3 inputs IN1, IN2, IN3 and the 3 inputs EN1, EN2, and EN3. An external connection to the 3 common low side DMOS sources is provided to connect a sensing resistor for the constant current chopping application. The driving stage and the logic stage are designed to work from 7 V to 52 V. 8/15 DocID1107 Rev 11 L6234 Typical characteristics 7 Typical characteristics Figure 3. Quiescent current vs. supply voltage Figure 4. Normalized quiescent current vs. switching frequency ,T > P $ @ ,T ,T#  +]    7M ƒ& 7 M  ƒ& 7M ƒ&  7 M  ƒ&    7M  ƒ& 7 M   ƒ&   7 M   ƒ&            9 V >9 @        IVZ >N+]@   $0Y Figure 5. Typical RDSon vs. supply voltage  $0Y Figure 6. Source drain forward on voltage vs. junction temperature 96 ' >9@ 5 ' 6  2 1 > : @         7 M     ƒ &        7 M    ƒ &    7 M  ƒ&    ,RXW $    ,R X W     $    9 V >9 @     $0Y DocID1107 Rev 11     7M>ƒ& @        $0Y 9/15 15 Typical characteristics L6234 Figure 7. Typical diode forward ON characteristics Figure 8. Reference voltage vs. supply voltage ,6 ' > $ @ 9UHI>9 @   7 M  ƒ&   ' 0 2 6  2 1 ' 0 2 6 2 ))      7 M  ƒ&        9 6 ' >9 @    $0Y Figure 9. Reference voltage vs. junction temperature    9 V >9 @   $0Y Figure 10. PowerSO20 transient thermal resistance 9 UH I> 9 @  9 V   9  9 V   9   9 V   9   9 V   9            7 M >ƒ & @        $0Y 10/15 DocID1107 Rev 11 $0Y L6234 Typical characteristics Figure 11. PowerSO20 thermal resistance (mounted on aluminium substrate) Figure 12. PowerSO20 thermal resistance (mounted on FR4 monolayer substrate) $0Y Figure 13. PowerSO20: with external heatsink $0Y Figure 14. Thermal impedance of PowerSO20 and standard SO20 $0Y DocID1107 Rev 11 $0Y 11/15 15 Package information 8 L6234 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 PowerSO20 package information Figure 15. PowerSO20 package outline 1 5 1 D E $ H '(7$,/$ F D '(7$,/% ( H + '(7$,/$ OHDG ' VOXJ D '(7$,/%    *DJH3ODQH & 6 6($7,1*3/$1( / * ( ( %277209,(: & &23/$1$5,7< 7 (  K[  3620(& '  12/15 DocID1107 Rev 11 L6234 Package information Table 7. PowerSO20 package mechanical data Dimensions (mm ) Symbol Min. Typ. Max. A - - 3.6 a1 0.1 - 0.3 a2 - - 3.3 a3 0 - 0.1 b 0.4 - 0.53 c 0.23 - 0.32 D(1) 15.8 - 16 D1 9.4 - 9.8 E 13.9 - 14.5 e - 1.27 - e3 - 11.43 - 10.9 - 11.1 E2 - - 2.9 E3 5.8 - 6.2 G 0 - 0.1 H 15.5 - 15.9 h - - 1.1 L 0.8 - 1.1 (1) E1 N 8° (typ.) S 8° (max.) T - 10 - 1. “D” and “E1” do not include mold flash or protrusions. - Mold flash or protrusions shall not exceed 0.15 mm (0.006"). DocID1107 Rev 11 13/15 15 Revision history 9 L6234 Revision history Table 8. Document revision history Date Revision 15-Nov-2011 10 Updated Features in coverpage and Table 4. 11 Removed PowerDIP 20-pin package and all references throughout document. Updated Figure 1 on page 3 (replaced by new figure). Added note 1. below Table 7 on page 13. Minor modifications throughout document. 15-Mar-2017 14/15 Changes DocID1107 Rev 11 L6234 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID1107 Rev 11 15/15 15
L6234PD013TR 价格&库存

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