L6388
HIGH-VOLTAGE HIGH AND LOW SIDE DRIVER
1
FEATURES
Figure 1. Package
■
HIGH VOLTAGE RAIL UP TO 600 V
■
dV/dt IMMUNITY ± 50 V/nsec IN FULL
TEMPERATURE RANGE
■
DRIVER CURRENT CAPABILITY:400 mA
SOURCE,650 mA SINK
■
SWITCHING TIMES 70/40 nsec RISE/FALL
WITH 1nF LOAD
SO8
Table 1. Order Codes
3.3V, 5V, 15V CMOS/TTL INPUTS
COMPARATORS WITH HYSTERESYS AND
PULL DOWN
■
INTERNAL BOOTSTRAP DIODE
■
OUTPUTS IN PHASE WITH INPUTS
■
DEAD TIME AND INTERLOCKING FUNCTION
DESCRIPTION
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Package
L6388
DIP8
L6388D
SO8
SO8 in Tape & Reel
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It has a Driver structure that enables to drive independent referenced N Channel Power MOS or IGBT. The Upper (Floating) Section is enabled to
work with voltage Rail up to 600V.
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The Logic Inputs are CMOS/TTL compatible for
ease of interfacing with controlling devices.
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BOOTSTRAP DRIVER
VCC
3
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HIN
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LIN
UV
DETECTION
8
UV
DETECTION
LOGIC
2
SHOOT
THROUGH
PREVENTION
R
R
LEVEL
SHIFTER
Vboot
H.V.
HVG
DRIVER
Cboot
HVG
7
S
OUT
VCC
1
LVG
DRIVER
May 2005
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The L6388 is an high-voltage device, manufactured with the BCD"OFF-LINE" technology.
Figure 2. Block Diagram
Part Number
L6388D013TR
■
2
DIP8
6
TO LOAD
5
LVG
4
GND
Rev. 2
1/11
L6388
Table 2. Absolute Maximum Rating
Symbol
Parameter
Value
Unit
Vout
Output Voltage
-3 to Vboot - 18
V
Vcc
Supply Voltage
- 0.3 to +18
V
Vboot
Floating Supply Voltage
- 1 to 618
V
Vhvg
High Side Gate Output Voltage
- 1 to Vboot
V
Vlvg
Low Side Gate Output Voltage
-0.3 to Vcc +0.3
V
Logic Input Voltage
-0.3 to Vcc +0.3
V
Allowed Output Slew Rate
50
V/ns
Total Power Dissipation (Tj = 85°C)
750
mW
Tj
Junction Temperature
150
°C
Tstg
Storage Temperature
-50 to 150
°C
Vi
dVout/dt
Ptot
Note: ESD immunity for pins 6, 7 and 8 is guaranteed up to 900V (Human Body Model)
Figure 3. Pin Connection (Top view)
LIN
1
8
Vboot
HIN
2
7
HVG
VCC
3
6
GND
4
5
Table 3. Pin Description
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N.
Name
Type
1
LIN
I
Low Side Driver Logic Input
2
HIN
I
High Side Driver Logic Input
3
Vcc
I
Low Voltage Power Supply
4
GND
6
bs
7
O
8
LVG
Function
Ground
LVG (*)
O
Low Side Driver Output
OUT
O
High Side Driver Floating Reference
HVG (*)
O
High Side Driver Output
Vboot
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D97IN517A
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OUT
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Bootstrap Supply Voltage
(*) The circuit guarantees 0.3V maximum on the pin (@ Isink = 10mA). This allows to omit the "bleeder" resistor connected between the gate
and the source of the external MOSFET normally used to hold the pin low.
Table 4. Thermal Data
Symbol
Rth j-amb
2/11
Parameter
Thermal Resistance Junction to Ambient
SO8
Minidip
Unit
150
100
°C/W
L6388
Table 5. Recommended Operating Conditions
Symbol
Pin
Parameter
Vout
6
Output Voltage
VBS (*)
8
Floating Supply Voltage
Test Condition
Switching Frequency
fsw
3
Vcc
Min.
Typ.
Max.
Unit
Note 1
580
V
Note 1
17
V
400
kHz
17
V
125
°C
Max.
Unit
HVG,LVG load CL = 1nF
Supply Voltage
Junction Temperature
Tj
-45
Note 1: If the condition Vboot - Vout < 18V is guaranteed, Vout can range from -3 to 580V
(*): VBS = Vboot - Vout
Table 6. Electrical Characteristics
(Vcc = 15V; Tj = 25°C)
Symbol
Pin
Parameter
Test Condition
Min.
Typ.
AC OPERATION
ton
1 vs 5 High/Low Side Driver Turn-On
2 vs 7 Propagation Delay
Vout = 0V
toff
High/Low Side Driver Turn-Off
Propagation Delay
Vout = 0V
tr
7,5
Rise Time
CL = 1000pF
tf
7,5
Fall Time
CL = 1000pF
DT
7,5
Dead Time
DC OPERATION
Low Supply Voltage Section
3
Vccth1
Vcc UV Turn On Threshold
(t s)
Vccth2
Vcc UV Turn Off Threshold
Vcchys
Vcc UV Hysteresis
Iqccu
Rdson
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300
ns
220
ns
70
100
ns
40
80
ns
220
320
420
ns
9.1
9.6
10.1
V
7.9
8.3
8.8
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160
0.9
V
Undervoltage Quiescent Supply
Current
Vcc ≤ 9V
250
330
µA
Quiescent Current
Vcc = 15V
350
450
µA
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Iqcc
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225
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Bootstrap Driver on Resistance (**) Vcc
Ω
125
Bootstrapped Supply Voltage Section
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VBSth1
VBSth2
8
VBShys
VBS UV Turn On Threshold
8.5
9.5
10.5
V
VBS UV Turn Off Threshold
7.2
8.2
9.2
V
VBS UV Hysteresis
0.9
V
IQBS
VBS Quiescent Current
HVG ON
250
µA
ILK
High Voltage Leakage Current
Vhvg = Vout = Vboot = 600V
10
µA
High/Low Side Driver
Iso
Isi
5,7
Source Short Circuit Current
VIN = Vih (tp < 10µs)
300
400
mA
Sink Short Circuit Current
VIN = Vil (tp < 10µs)
500
650
mA
3/11
L6388
Table 6. Electrical Characteristics (continued)
(Vcc = 15V; Tj = 25°C)
Symbol
Pin
Parameter
Test Condition
Min.
Typ.
Max.
Unit
1.1
V
Logic Inputs
1, 2
Vil
Low Level Logic Input Voltage
Vih
High Level Logic Input Voltage
Iih
High Level Logic Input Current
VIN = 15V
Iil
Low Level Logic Input Current
VIN = 0V
1.8
V
20
70
µA
µA
-1
( V CC – V CBOOT1 ) – ( V CC – V CBOOT2 )
(**) RDSON is tested in the following way: R DSON = -------------------------------------------------------------------------------------------------------------I 1 ( V CC, V CCBOOT1 ) – I 2 ( V CC, V CCBOOT2 )
where I1 is pin 8 current when VCBOOT = VCBOOT1, I2 when VCBOOT = VCBOOT2.
Figure 4. Dead Time Waveforms Definitions
H IN
DT
LVG
DT
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HVG
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Interlocking function
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LIN
Figure 5. Propagation Delay Waveform Definitions
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LIN
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HIN
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50%
50%
> DT
> DT
50%
50%
ton
90%
LVG
10%
ton
90%
HVG
4/11
50%
10%
toff
toff
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L6388
3
INPUT LOGIC
Input logic is provided with an interlocking circuitry which avoids the two outputs (LVG, HVG) to be active at the
same time when both the logic input pins (LIN, HIN) are at a high logic level. In addition, to prevent cross conduction of the external MOSFETs, after each output is turned-off the other output cannot be turned-on before a
certain amount of time (DT) (see Figure 4).
Figure 6. Typical Rise and Fall Times vs. Load
Capacitance
time
(nsec)
D99IN1054
Figure 7. Quiescent Current vs. Supply
Voltage
Iq
(µA)
104
250
D99IN1055
200
Tr
103
150
Tf
100
102
50
0
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10
0
1
2
3
4
5 C (nF)
For both high and low side buffers @25˚C Tamb
0
2
4
6
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3.1 BOOTSTRAP DRIVER
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10
12
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14
16 VS(V)
A bootstrap circuitry is needed to supply the high voltage section. This function is normally accomplished by a
high voltage fast recovery diode (fig. 8a). In the L6388 a patented integrated structure replaces the external diode. It is realized by a high voltage DMOS, driven synchronously with the low side driver (LVG), with in series
a diode, as shown in fig. 8b
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An internal charge pump (fig. 8b) provides the DMOS driving voltage .
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The diode connected in series to the DMOS has been added to avoid undesirable turn on of it.
3.2 CBOOT selection and charging
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To choose the proper CBOOT value the external MOS can be seen as an equivalent capacitor. This capacitor
CEXT is related to the MOS total gate charge :
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Q gate
C EXT = --------------V gate
The ratio between the capacitors CEXT and CBOOT is proportional to the cyclical voltage loss .
It has to be:
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CBOOT>>>CEXT
e.g.: if Qgate is 30nC and Vgate is 10V, CEXT is 3nF. With CBOOT = 100nF the drop would be 300mV.
If HVG has to be supplied for a long time, the CBOOT selection has to take into account also the leakage losses.
e.g.: HVG steady state consumption is lower than 200µA, so if HVG TON is 5ms, CBOOT has to supply 1µC to
CEXT. This charge on a 1µF capacitor means a voltage drop of 1V.
The internal bootstrap driver gives great advantages: the external fast recovery diode can be avoided (it usually
has great leakage current). This structure can work only if VOUT is close to GND (or lower) and in the meanwhile
the LVG is on. The charging time (Tcharge) of the CBOOT is the time in which both conditions are fulfilled and it
5/11
L6388
has to be long enough to charge the capacitor.
The bootstrap driver introduces a voltage drop due to the DMOS RDSON (typical value: 125 Ohm). At low frequency this drop can be neglected. Anyway increasing the frequency it must be taken in to account.
The following equation is useful to compute the drop on the bootstrap DMOS:
Q gate
V drop = I ch arg e R dson → V drop = -------------------- R dson
T ch arg e
where Qgate is the gate charge of the external power MOS, Rdson is the on resistance of the bootstrap DMOS,
and Tcharge is the charging time of the bootstrap capacitor.
For example: using a power MOS with a total gate charge of 30nC the drop on the bootstrap DMOS is about
1V, if the Tcharge is 5µs. In fact:
30nC
V drop = --------------- ⋅ 125Ω ∼ 0.8V
5µs
Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop is too high, or the
circuit topology doesn't allow a sufficient charging time, an external diode can be used.
Figure 8. Bootstrap Driver.
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DBOOT
VS
VBOOT
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H.V.
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HVG
(t s)
LVG
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CBOOT
VOUT
TO LOAD
a
VBOOT
VS
H.V.
bs
HVG
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CBOOT
VOUT
TO LOAD
LVG
b
6/11
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L6388
Figure 9. VBOOT UV Turn On Threshold vs.
Temperature
Figure 12. VCC UV Turn Off Threshold vs.
Temperature
11
13
@ Vcc = 15V
12
10
Typ.
10
Vccth2(V)
VBSth1(V)
11
9
8
7
9
Typ.
8
7
6
6
5
-45
-25
0
25
50
Tj (˚C)
75
100
-45
125
25
75
100
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1000
@ Vcc = 15V
13
50
125
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800
current (mA)
12
11
10
9
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Figure 13. Output Source Current vs.
Temperature
14
VBSth2(V)
0
Tj (˚C)
Figure 10. VBOOT UV Turn Off Threshold vs.
Temperature
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600
@ Vcc = 15V
Typ.
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400
200
8
Typ.
7
6
-45
-25
0
25
(s)
t
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50
75
100
13
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0
25 50
Tj (˚C)
75
100 125
@ Vcc = 15V
800
10
9
-25
1000
current (mA)
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-45
Figure 14. Output Sink Current vs.
Temperature
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12
0
125
Figure 11. VCC UV Turn On Threshold vs.
Temperature
Vccth1(V)
-25
Typ.
600
Typ.
400
200
8
0
7
-45
-25
0
25
50
Tj (˚C)
75
100
125
-45
-25
0
25
50
Tj (˚C)
75
100
125
7/11
L6388
Figure 15. DIP8 Mechanical Data & Package Dimensions
mm
inch
DIM.
MIN.
A
TYP.
MAX.
MIN.
3.32
TYP.
MAX.
0.131
a1
0.51
B
1.15
1.65
0.045
0.065
b
0.356
0.55
0.014
0.022
b1
0.204
0.304
0.008
0.012
0.020
D
E
10.92
7.95
9.75
0.430
0.313
0.384
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
6.6
0.260
I
5.08
0.200
L
3.18
Z
3.81
0.125
1.52
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DIP-8
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-
0.060
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0.150
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OUTLINE AND
MECHANICAL DATA
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L6388
Figure 16. SO8 Mechanical Data & Package Dimensions
mm
inch
DIM.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D (1)
4.80
5.00
0.189
0.197
E
3.80
4.00
0.15
0.157
e
1.27
0.050
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
OUTLINE AND
MECHANICAL DATA
ddd
0˚ (min.), 8˚ (max.)
c
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0.10
0.004
Note: (1) Dimensions D does not include mold flash, protrusions or gate burrs.
Mold flash, potrusions or gate burrs shall not exceed
0.15mm (.006inch) in total (both side).
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0016023 C
9/11
L6388
Table 7. Revision History
Date
Revision
Description of Changes
January 2005
1
First Issue
May 2005
2
Changed from Preliminary Data to Final
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L6388
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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11/11
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