L6758A
High performance (4+1) dual controller for the VR12
Datasheet - production data
Applications
• High-current VRM / VRD for desktops / servers
/ workstations / new generation CPUs
Description
L6758A is a dual controller designed to
power Intel® VR12 processors: all required
parameters are programmable through dedicated
pinstrapping.
VFQFPN48 - 6x6 mm
Features
• VR12 compliant with 25 MHz SVID bus rev 1.5
– serialVID with programmable IMAX, TMAX,
VBOOT, ADDRESS
• Second generation LTB Technology™
• Dual controller:
– two-to-four phase for core
– 1 phase for graphics (GFX) or system
agent (VSA)
• Single NTC design for TM, LL and IMON
thermal compensation (for each section)
• VFDE and GDC - gate drive control for
efficiency optimization
The device features two-to-four phase
programmable operation for multi-phase sections
and a single-phase with independent control
loops. Both sections feature second generation
LTB Technology to provide fast load transient
response, minimizing and optimizing the output
filter composition.
The L6758A supports power state transitions
featuring VFDE, programmable DPM and GDC,
maintaining the best efficiency over all loading
conditions without compromising transient
responses. The device assures fast and
independent protection against load overcurrent,
under/overvoltage and feedback disconnections.
The device is available in VFQFPN48 package.
• DPM - dynamic phase management
Table 1. Device summary
• Dual remote sense
Order code
• 0.5% output voltage accuracy
Package
Packaging
• Fully-differential current sense across DCR
L6758A
VFQFPN48 6x6 mm
Tray
• AVP - adaptive voltage positioning
L6758ATR
VFQFPN48 6x6 mm
Tape and
reel
• Dual independent adjustable oscillator
• Dual current monitor
• Pre-biased output management
• 5 V supply, 12 V monitor
• Average and per-phase OC protection
• OV, UV and FB disconnection protection
• Dual VR_RDY
• VFQFPN48 6x6 mm package
July 2013
This is information on a product in full production.
DocID023298 Rev 2
1/42
www.st.com
Contents
L6758A
Contents
1
2
3
Typical application circuit and block diagram . . . . . . . . . . . . . . . . . . . . 4
1.1
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description and connection diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
2.1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
VR12 serial data bus and IC configuration . . . . . . . . . . . . . . . . . . . . . . 15
5
Device description and operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6
Output voltage positioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7
2/42
6.1
Multi-phase section: phase # programming . . . . . . . . . . . . . . . . . . . . . . . 21
6.2
Multi-phase section: current reading and current sharing loop . . . . . . . . 22
6.3
Multi-phase section: defining load-line . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.4
Multi-phase section: IMON information . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5
Single-phase section: current reading . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.6
Single-phase section: defining load-line . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.7
Dynamic VID transition support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.8
DVID optimization: REF/SREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Output voltage monitoring and protection . . . . . . . . . . . . . . . . . . . . . . 27
7.1
Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.2
Overcurrent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2.1
Multi-phase section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2.2
Overcurrent and power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.2.3
Single-phase section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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L6758A
8
9
Contents
Single NTC thermal monitor and compensation . . . . . . . . . . . . . . . . . 30
8.1
Thermal monitor and VR_HOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.2
Thermal compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.3
TM and TCOMP design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Efficiency optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9.1
Dynamic phase management (DPM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9.2
Variable frequency diode emulation (VFDE) . . . . . . . . . . . . . . . . . . . . . . 33
10
Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
11
System control loop compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
11.1
Compensation network guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
11.2
LTB technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
12
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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42
Typical application circuit and block diagram
L6758A
1
Typical application circuit and block diagram
1.1
Application circuit
Figure 1. Typical 4-phase application circuit
+12V
+5V
+12V
CDEC
GND
(PAD)
EN_VTT
VCC5
SOSC
OSC
SREF
VCC
GDC
BOOT
IMAX / SIMAX
BOOT / ADDR
TCOMP
STCOMP
CHF
EN
STM
PWM
VCC5
UGATE
HS1
L1
PHASE
LGATE
LS1
R
C
GND
CSREFRSREF
NTC (NTHS0805N02N6801)
Place close to SPhase inductor
SCOMP / TMAX
CSF
VR_RDY
SVR_RDY
VR_HOT
CSP
RSF
L6743
VCC12
EN
SFB
VRRDY
SVRRDY
VR_HOT
TM
CSI
RG
+12V
CDEC
VCC5
VCC
RSFB
RSI
BOOT
NTC (NTHS0805N02N6801)
CHF
SVSEN
SFBG
SIMON
ST L6758A
+5V RSIMON
L6743
ENDRV
EN
PWM1
CS1P
CS1N
PWM
UGATE
HS2
L2
PHASE
LGATE
LS2
R
C
GND
REF
COMP / DPM
PWM2
CS2P
CS2N
FB
PWM3
CS3P
CS3N
CREF RREF
RG
CF
CP
+12V
RF
CDEC
VCC
BOOT
CI
CHF
RI
PWM4
CS4P
CS4N
VSEN
FBG
LTB
RIMON
+5V
EN
SCSN
SCSP
SPWM
SENDRV
IMON
SVCLK
VR12
ALERT#
SVID Bus
SVDATA
CLTB RLTB
L6743
RFB
PWM
UGATE
HS3
L3
PHASE
LGATE
LS3
R
C
GND
RG
+12V
+12V
CDEC
CDEC
VCC
BOOT
VCC
BOOT
CHF
SL
UGATE
PHASE
SLS
L6743
SHS
EN
EN
PWM
PWM
LGATE
GND
L6743
CHF
UGATE
HS4
L4
PHASE
LGATE
LS4
R
C
GND
RG
CSMLCC
VR12 uP LOAD
CORE
CSOUT
UNCORE
RG
CMLCC
COUT
VR12 SVID Bus
AM11134v1
4/42
DocID023298 Rev 2
L6758A
Block diagram
FLT
SImon
Imon
TempZone
L6758
DDR3
GDC
EN_VTT
OSC / FLT
To SinglePhase
FLT Manager
VR_RDY
GND (PAD)
Figure 2. Block diagram
S_EN
VCC5
Start-up Logic
& GDC Control
EN
ADDR / DPM
VCC12
VSEN
VR12 Bus Manager
BOOT
IMAX / SDRP
SIMAX / TMAX
SVCLK
ALERT#
MultiPhase
Fault Manager
VR12 Registers
FLT
Ramp & Clock
Generator
with VFDE
LTB Technology
Modulator
& Frequency Limiter
LTB
ENDRV
Dual DAC & Ref
Generator
SVDATA
PWM1
OV
S
PWM1
PWM2
SREF
S
VSEN
PWM2
PWM3
FBG
+175mV
IREF
S
PWM3
PWM4
S
PWM4
Chan #
REF
Current Balance
& Peak Curr Limit
N
COMP
IREF
OC
1.1V
FB
Differential Current Sense
CS1P
ERROR
AMPLIFIER
IMON
IDROOP
Thermal
Compensation
and Gain adjust
1.1V
IMON
CS1N
CS2P
CS2N
CS3P
CS3N
CS4P
CS4N
TCOMP
TempZone
SVSEN
TM
Thermal Sensor
and Monitor
SOV
VR_HOT
SFBG
DDR3
SREF
ISREF
+175mV
SPWM
SPWM
SENDRV
SREF
S_EN
SCOMP
SFLT
ERROR
AMPLIFIER
ISREF
Ramp & Clock
Generator
withVFDE
LTB Technology
Modulator
& Frequency Limiter
SOSC
SFB
1.1V
SIMON
ISDROOP
ISMON
SOC
SinglePhase
Fault Manager
To MultiPhase FLT Manage
SFLT
Differential
Current Sense
1.1V
SVR_RDY
1.2
Typical application circuit and block diagram
DocID023298 Rev 2
SCSP
SCSN
AM11135v1
5/42
42
Pin description and connection diagrams
2
L6758A
Pin description and connection diagrams
SOSC / FLT
IMAX / SIMAX
BOOT / ADDR
STM
STCOMP
TCOMP
TM
OSC
VR_RDY
ENDRV
PWM2
36 35 34 33 32 31 30 29 28 27 26 25
24
37
VCC5
PWM3
38
23
SREF
PWM1
39
22
SCOMP / TMAX
SVR_RDY
40
21
SFB
CS4P
41
20
SVSEN
CS4N
42
19
SRGND
CS2P
43
18
SIMON
CS2N
44
17
SCSN
CS3P
45
16
SCSP
CS3N
46
15
VRHOT
CS1P
47
14
SPWM / SEN
CS1N
48
1
13
ENVTT
L6758A
SVDATA
ALERT#
SVCLK
9 10 11 12
VCC12
8
GDC
7
REF
6
COMP / DPM
5
FB
4
VSEN
3
RGND
2
IMON
LTB
2.1
SENDRV
PWM4
Figure 3. Pin connection (top view)
AM11136v1
Pin description
Table 2. Pin description
6/42
Pin#
Name
1
LTB
Function
LTB Technology input pin. See Section 11.2 for details.
Current monitor output.
A current proportional to the multi-phase load current is sourced from this
pin. Connect through a resistor RMON to local GND. When the pin voltage
reaches 1.55 V, overcurrent protection is set and the IC latches. Filtering
through CIMON to GND allows to control the delay for OC intervention.
IMON
3
RGND
4
VSEN
5
FB
Error amplifier inverting input.
Connect with a resistor RFB to VSEN and with an (RF - CF)// CP to COMP.
6
COMP /
DPM
Error amplifier output.
Connect with an (RF - CF)// CP to FB. The device cannot be disabled by
pulling low this pin. Connect a proper resistor RDPM to GND to define DPM
strategy.
Multi-phase section
2
Remote ground sense.
Connect to the negative side of the load to perform remote sense.
Output voltage monitor, manages OV and UV protection. Connect to the
positive side of the load to perform remote sense. A fixed 50 μA current is
sunk from this pin.
DocID023298 Rev 2
L6758A
Pin description and connection diagrams
Table 2. Pin description (continued)
Name
Function
Multi-phase
section
Pin#
The reference used for the regulation of the multi-phase section is
available on this pin with -100 mV offset. Connect through an RREF-CREF
to RGND to optimize DVID transitions. Connect through an ROS resistor to
FB pin to implement small positive offset to the regulation.
REF
8
GDC
Gate drive control pin.
Used for efficiency optimization, see Section 9 for details. If not used, it
can be left floating.
9
VCC12
+12 V bus monitor to synchronize startup.
The IC waits for the 12 V to become available before implementing softstart when enabled. Connect directly to the +12 V bus (i.e. the high-side
MOSFET drain).
10
SVCLK
Serial clock.
11
ALERT#
12
SVDATA
Serial data.
13
EN_VTT
VTT level sensitive enable pin (3.3 V compatible).
Pull low to disable the device, pull up above the turn-on threshold to
enable the controller.
SPWM /
SEN
Single-ph section
14
SVI bus
7
Alert.
PWM output.
Connect to external driver PWM input. During normal operation the device
is able to manage HiZ status by setting and holding the pin to a fixed
voltage defined by PWMx strapping. Connect to VCC5 with 1 kΩ to
disable single-phase section.
VR_HOT
16
SCSP
Single-phase section current sense positive input.
Connect through an R-C filter to the phase-side of the channel 1 inductor.
17
SCSN
Single-phase section current sense negative input.
Connect through an Rg resistor to the output-side of the channel inductor.
Filter the output-side of Rg with 100 nF (typ.) to GND.
Single-phase section
15
Voltage regulator HOT.
Open drain output; this is an alarm signal asserted by the controller when
the temperature sensed through the TM and or ST pins exceed TMAX
(active low). See Section 8 for details.
Current monitor output.
A current proportional to the single-phase current is sourced from this pin.
Connect through a resistor RSIMON to local GND. When the pin voltage
reaches 1.55 V, overcurrent protection is set and the IC latches. Filtering
through CSIMON to GND allows to control the delay for OC intervention.
18
SIMON
19
SRGND
20
SVSEN
Output voltage monitor, manages OV and UV protection. Connect to the
positive side of the load to perform remote sense.
21
SFB
Error amplifier inverting input.
Connect with a resistor RSFB to SVSEN and with an (RSF - CSF)// CSP to
SCOMP.
Remote ground sense.
Connect to the negative side of the load to perform remote sense.
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42
Pin description and connection diagrams
L6758A
Table 2. Pin description (continued)
SREF
24
VCC5
25
SOSC
26
IMAX /
SIMAX
27
BOOT /
ADDR
30
31
8/42
Main IC power supply.
Operative voltage is 5 V ±5%. Filter with 1 μF MLCC to GND (typ.).
STCOMP
TCOMP
TM
The reference used for the regulation of the single-phase section is
available on this pin with -100 mV offset. Connect through an RSREFCSREF to SRGND to optimize DVID transitions. Connect through an RSOS
resistor to the SFB pin to implement small positive offset to the regulation.
Oscillator pin.
It allows the programming of the switching frequency FSSW for the singlephase section. The pin is internally set to 1.0 V, frequency for single-phase
is programmed according to the resistor connected to GND or VCC with a
gain of 10 kHz/μA. Leaving the pin floating programs a switching
frequency of 200 kHz. See Section 10 for details.
Connect a resistor divider to GND/VCC5 in order to define the IMAX
register for both single-phase and multi-phase sections. See Table 8,
Table 10 and Section 6 for details.
Connect a resistor divider to GND/VCC5 in order to define BOOT register
and SVI address. See Table 8 and Section 6 for details.
Thermal monitor sensor.
Connect with proper network embedding NTC to the single-phase power
section. The IC senses the power section temperature and uses the
information to define the VR_HOT signal and temperature zone register.
By programming proper STCOMP gain, the IC also implements load-line
thermal compensation for the single-phase section. Short to GND if not
used. See Section 8 for details.
Thermal monitor sensor gain.
Connect proper resistor divider between VCC5 and GND to define the
gain to apply to the signal sensed by ST to implement thermal
compensation for the single-phase section. Short to GND to disable
thermal compensation for single-phase. See Section 8 for details.
Multi-ph section
29
STM
Error amplifier output.
Connect with an (RSF - CSF)// CSP to SFB. The device cannot be disabled
by pulling low this pin. Connect proper resistor RTMAX to GND to define
TMAX register.
Thermal monitor sensor gain.
Connect proper resistor divider between VCC5 and GND to define the
gain to apply to the signal sensed by TM to implement thermal
compensation for the multi-phase section. Short to GND to disable
thermal compensation for multi-phase. See Section 8 for details.
Multi-ph section
28
Single-phase section
23
Single-phase section
22
SCOMP /
TMAX
Function
Pinstrapping
Name
Single-phase section
Pin#
Thermal monitor sensor.
Connect with proper network embedding NTC to the multi-phase power
section. The IC senses the power section temperature and uses the
information to define the VR_HOT signal and temperature zone register.
By programming proper TCOMP gain, the IC also implements load-line
thermal compensation for the multi-phase section. Short to GND if not
used. See Section 8 for details.
DocID023298 Rev 2
L6758A
Pin description and connection diagrams
Table 2. Pin description (continued)
34
35
36
37
38
39
VR_RDY
Multi-phase section
OSC
ENDRV
SENDRV
PWM4
PWM2
VR ready.
Open drain output set free after SS has finished in multi-phase section
and pulled low when triggering any protection. Pull up to a voltage lower
than 3.3 V (typ.), if not used it can be left floating.
Enable driver.
CMOS output driven high when the IC commands the drivers. Used in
conjunction with the HiZ window on the PWM pins to optimize the singlephase section overall efficiency. Connect directly to external driver enable
pin.
PWM4 output.
Connect to external driver PWM input. During normal operation the device
is able to manage HiZ status by setting and holding the PWMx pin to fixed
voltage. Pull to 5 V through a 1 k resistor to configure the multi-phase
section to work at 3 phases.
PWM2 output.
Connect to external driver PWM input.
This pin is also used to configure HiZ levels for compatibility with drivers
and DrMOS. During normal operation the device is able to manage HiZ
status by setting and holding the PWMx pin to pre-defined fixed voltage.
PWM3 output.
Connect to external driver PWM input. During normal operation the device
is able to manage HiZ status by setting and holding the PWMx pin to fixed
voltage. Pull to 5 V through 1 k resistor in conjunction with PWM4 to
configure the multi-phase section to work at 2 phases.
PWM3
PWM1
Oscillator pin.
It allows the programming of the switching frequency FSW for the multiphase section. The pin is internally set to 1.0 V, frequency for multi-phase
is programmed according to the resistor connected to GND or VCC with a
gain of 10 kHz/μA. Leaving the pin floating programs a switching
frequency of 200 kHz. Effective frequency observable on the load results
as being multiplied by the number of active phases N. See Section 10 for
details.
Enable driver.
CMOS output driven high when the IC commands the drivers. Used in
conjunction with the HiZ window on the PWM pins to optimize the multiphase section overall efficiency. Connect directly to external driver enable
pin.
Single-ph section
33
Function
Multi-phase section
32
Name
Multi-phase section
Pin#
PWM1 output.
Connect to external driver PWM input.
This pin is also used to configure HiZ levels for compatibility with drivers
and DrMOS. During normal operation the device is able to manage HiZ
status by setting and holding the PWMx pin to pre-defined fixed voltage.
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42
Pin description and connection diagrams
L6758A
Table 2. Pin description (continued)
10/42
Name
Function
40
SVR_RDY
41
CS4P
Channel 4 current sense positive input.
Connect through an R-C filter to the phase-side of the channel 4 inductor.
When working at 2 or 3 phases, short to the regulated voltage.
42
CS4N
Channel 4 current sense negative input.
Connect through an Rg resistor to the output-side of the channel inductor.
When working at 2 or 3 phases, still connect through Rg to CS4+ and then
to the regulated voltage. Filter the output-side of Rg with 100 nF (typ.) to
GND.
43
CS2P
Channel 2 current sense positive input.
Connect through an R-C filter to the phase-side of the channel 2 inductor.
44
CS2N
45
CS3P
Multi-phase section
Single-ph section
Pin#
VR ready. Open drain output set free after SS has finished in single-phase
section and pulled low when triggering any protection. Pull up to a voltage
lower than 3.3 V (typ.), if not used it can be left floating.
Channel 2 current sense negative input.
Connect through an Rg resistor to the output-side of the channel inductor.
Filter the output-side of Rg with 100 nF (typ.) to GND.
Channel 3 current sense positive input.
Connect through an R-C filter to the phase-side of the channel 3 inductor.
When working at 2 phases, short to the regulated voltage.
46
CS3N
Channel 3 current sense negative input.
Connect through an Rg resistor to the output-side of the channel inductor.
When working at 2 phases, still connect through Rg to CS3P and then to
the regulated voltage. Filter the output-side of Rg with 100 nF (typ.) to
GND.
47
CS1P
Channel 1 current sense positive input.
Connect through an R-C filter to the phase-side of the channel 1 inductor.
48
CS1N
Channel 1 current sense negative input.
Connect through an Rg resistor to the output-side of the channel inductor.
Filter the output-side of Rg with 100 nF (typ.) to GND.
PAD
GND
GND connection. All internal references and logic are referenced to this
pin. Filter to VCC with proper MLCC capacitor and connect to the PCB
GND plane.
DocID023298 Rev 2
L6758A
2.2
Pin description and connection diagrams
Thermal data
Table 3. Thermal data
Symbol
Parameter
Value
Unit
RTHJA
Thermal resistance junction-to-ambient
(device soldered on 2s2p PC board)
40
°C/W
RTHJC
Thermal resistance junction-to-case
1
°C/W
TMAX
Maximum junction temperature
150
°C
TSTG
Storage temperature range
-40 to 150
°C
TJ
Junction temperature range
0 to 125
°C
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42
Electrical specifications
L6758A
3
Electrical specifications
3.1
Absolute maximum ratings
Table 4. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC12, GDC
to GND
-0.3 to 14
V
VCC, STM, TM, SPWM, PWMx,
SIMAX/IMAX, BOOT/ADDR, SENDRV,
ENDRV,
to GND
-0.3 to 7
V
All other pins
to GND
-0.3 to 3.6
V
3.2
Electrical characteristics
Table 5. Electrical characteristics (VCC = 5 V ± 5%, TJ = 0 °C to 70 °C unless otherwise specified)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Supply current and power-on
ICC
EN = high
22
mA
EN = low
15
mA
VCC supply current
VCC turn-ON
VCC rising
VCC turn-OFF
VCC falling
VCC12 turn-ON
VCC12 rising
VCC12 turn-OFF
VCC12 falling
4.1
V
UVLOVCC5
3.0
V
6.5
V
UVLOVCC12
4.5
V
Oscillator, soft-start and enable
Main oscillator accuracy
180
200
220
kHz
450
500
550
kHz
207
230
253
kHz
493
580
667
kHz
FSW
Oscillator adjustability
ROSC = 30 kΩ to GND
Main oscillator accuracy
FSSW
Oscillator adjustability
ΔVOSC
RSOSC = 30 kΩ to GND
PWM ramp amplitude
1.5
V
Voltage at pin SOSC
After any latch
3.0
V
Voltage at pin OSC
After OVP latch
3.0
V
FAULT
SOFT
START
12/42
VBOOT > 0, from pinstrapping;
multi-phase section
4
5
6
mV/μs
VBOOT > 0, from pinstrapping;
single-phase section
2
2.5
3
mV/μs
SS time
DocID023298 Rev 2
L6758A
Electrical specifications
Table 5. Electrical characteristics (VCC = 5 V ± 5%, TJ = 0 °C to 70 °C unless otherwise specified)
Symbol
EN_VTT
Parameter
Test conditions
Turn-ON
VENVTT rising
Turn-OFF
VENVTT falling
Min.
Typ.
Max.
Unit
0.6
V
0.4
Leakage current
V
μA
1
SVI serial bus
SVCLCK,
SVDATA
SVDATA,
ALERT#
Input high
0.6
V
Input low
Voltage low (ACK)
ISINK = -5 mA
0.4
V
50
mV
Reference and current reading
kVID
VOUT accuracy (MPhase)
IOUT=0 A; N=4; RG=1 kΩ;
RFB=2.125 kΩ; VID > 1.000 V
-0.5
-
0.5
%
kSVID
VOUT accuracy (SPhase)
IOUT=0 A; RG=1.3 kΩ; RFB=6.663
kΩ; VID > 1.000 V
-0.5
-
0.5
%
VID = 0.8 V to 1 V
-5
-
5
mV
kVID, kSVID
VOUT accuracy
VID < 0.8 V
-8
-
8
mV
IINFOx=0; N=4;
RG=1 kΩ; RFB=2.125 kΩ
-2
-
2
μA
IINFOx= 25 μA; N=4;
RG=1 kΩ; RFB=2.125 kΩ
-3.5
-
3.5
μA
ISCSN=0;
RG=1.3 kΩ; RFB=6.663 kΩ
-0.75
-
0.75
μA
ISCSN= 25 μA;
RG=1.3 kΩ; RFB=6.663 kΩ
-1.5
-
1.5
μA
1.5
μA
2
μA
0.75
μA
1
μA
ΔDROOP
ΔSDROOP
kIMON
kSIMON
LL accuracy (MPhase)
0 to full load
LL accuracy (SPhase)
0 to full load
IMON accuracy (MPhase)
SIMON accuracy
(SPhase)
A0
EA DC gain
SR
Slew rate
IINFOx=0 μA; N=4;
RG=1 kΩ; RFB=2.125 kΩ
0
IINFOx=25 μA; N=4;
RG=1 kΩ; RFB=2.125 kΩ
-2
ISCSN=25 μA;
RG=1.3 kΩ; RFB=6.663 kΩ
0
ISCSN=25 μA;
RG=1.3 kΩ; RFB=6.663 kΩ
-1
COMP to SGND = 10 pF
Slew rate fast
DVID
-
100
dB
20
V/μs
20
mV/μs
5
mV/μs
10
mV/μs
2.5
mV/μs
Multi-phase section
Slew rate slow
Slew rate fast
DVID
Single-phase sections
Slew rate slow
DocID023298 Rev 2
13/42
42
Electrical specifications
L6758A
Table 5. Electrical characteristics (VCC = 5 V ± 5%, TJ = 0 °C to 70 °C unless otherwise specified)
Symbol
Parameter
Test conditions
Min.
GetReg(15h)
IMON ADC
Typ.
Max.
CC
Unit
Hex
VIMON = 0.992 V
Accuracy
C0
CF
Hex
PWM outputs and ENDRV
PWMx,
SPWM
Output high
I = 1 mA
Output low
I = -1 mA
IPWM1
Test current
Sourced from pin, EN_VTT=0.
IPWM2
Test current
IPWMx, SPWM Test current
Sourced from pin, EN_VTT=0.
(S) ENDRV
I(S)ENDRV = -4 mA; both sections
Voltage low
5
V
0.2
V
10
μA
0
μA
-10
μA
0.4
V
Protections (both sections)
OVP
Overvoltage protection
VSEN rising; wrt Ref.
+125
+200
mV
UVP
Undervoltage protection
VSEN falling; wrt Ref; Ref > 500 mV
-525
-375
mV
FBR Disc
FB disconnection
VCS- rising, above VSEN/SVSEN
650
700
750
mV
FBG Disc
FBG disconnection
EA NI input wrt VID
450
500
550
mV
VR_RDY,
SVR_RDY
Voltage low
I = -4 mA
0.4
V
VOC_TOT
Overcurrent threshold
VIMON, VSIMON rising
1.60
V
IOC_TH
Constant current
MPhase only
VR_HOT
Voltage low
ISINK = -5 mA
1.50
1.55
μA
35
13
Ω
GATE DRIVE CONTROL
Max. current
GDC
Any PS.
200
mA
PS00h (GDC=VCC12)
6
Ω
> PS00h; (GDC=VCC5)
6
Ω
Impedance
14/42
DocID023298 Rev 2
L6758A
4
VR12 serial data bus and IC configuration
VR12 serial data bus and IC configuration
The L6758A is fully compliant with Intel VR12/IMVP7 SVID protocol rev 1.5, document
# 456098. To guarantee proper device and CPU operation, refer to this document for bus
design and layout guidelines. Different platforms may require different pull-up impedance on
the SVI bus. Impedance matching and spacing among SVDATA, SVCLK and ALERT# must
be followed.
Table 6. VID table, both sections
HEX code
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
0
0
0.000
4
0
0.565
8
0
0.885
C
0
1.205
0
1
0.250
4
1
0.570
8
1
0.890
C
1
1.210
0
2
0.255
4
2
0.575
8
2
0.895
C
2
1.215
0
3
0.260
4
3
0.580
8
3
0.900
C
3
1.220
0
4
0.265
4
4
0.585
8
4
0.905
C
4
1.225
0
5
0.270
4
5
0.590
8
5
0.910
C
5
1.230
0
6
0.275
4
6
0.595
8
6
0.915
C
6
1.235
0
7
0.280
4
7
0.600
8
7
0.920
C
7
1.240
0
8
0.285
4
8
0.605
8
8
0.925
C
8
1.245
0
9
0.290
4
9
0.610
8
9
0.930
C
9
1.250
0
A
0.295
4
A
0.615
8
A
0.935
C
A
1.255
0
B
0.300
4
B
0.620
8
B
0.940
C
B
1.260
0
C
0.305
4
C
0.625
8
C
0.945
C
C
1.265
0
D
0.310
4
D
0.630
8
D
0.950
C
D
1.270
0
E
0.315
4
E
0.635
8
E
0.955
C
E
1.275
0
F
0.320
4
F
0.640
8
F
0.960
C
F
1.280
1
0
0.325
5
0
0.645
9
0
0.965
D
0
1.285
1
1
0.330
5
1
0.650
9
1
0.970
D
1
1.290
1
2
0.335
5
2
0.655
9
2
0.975
D
2
1.295
1
3
0.340
5
3
0.660
9
3
0.980
D
3
1.300
1
4
0.345
5
4
0.665
9
4
0.985
D
4
1.305
1
5
0.350
5
5
0.670
9
5
0.990
D
5
1.310
1
6
0.355
5
6
0.675
9
6
0.995
D
6
1.315
1
7
0.360
5
7
0.680
9
7
1.000
D
7
1.320
1
8
0.365
5
8
0.685
9
8
1.005
D
8
1.325
1
9
0.370
5
9
0.690
9
9
1.010
D
9
1.330
1
A
0.375
5
A
0.695
9
A
1.015
D
A
1.335
1
B
0.380
5
B
0.700
9
B
1.020
D
B
1.340
DocID023298 Rev 2
15/42
42
VR12 serial data bus and IC configuration
L6758A
Table 6. VID table, both sections (continued)
HEX code
16/42
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
1
C
0.385
5
C
0.705
9
C
1.025
D
C
1.345
1
D
0.390
5
D
0.710
9
D
1.030
D
D
1.350
1
E
0.395
5
E
0.715
9
E
1.035
D
E
1.355
1
F
0.400
5
F
0.720
9
F
1.040
D
F
1.360
2
0
0.405
6
0
0.725
A
0
1.045
E
0
1.365
2
1
0.410
6
1
0.730
A
1
1.050
E
1
1.370
2
2
0.415
6
2
0.735
A
2
1.055
E
2
1.375
2
3
0.420
6
3
0.740
A
3
1.060
E
3
1.380
2
4
0.425
6
4
0.745
A
4
1.065
E
4
1.385
2
5
0.430
6
5
0.750
A
5
1.070
E
5
1.390
2
6
0.435
6
6
0.755
A
6
1.075
E
6
1.395
2
7
0.440
6
7
0.760
A
7
1.080
E
7
1.400
2
8
0.445
6
8
0.765
A
8
1.085
E
8
1.405
2
9
0.450
6
9
0.770
A
9
1.090
E
9
1.410
2
A
0.455
6
A
0.775
A
A
1.095
E
A
1.415
2
B
0.460
6
B
0.780
A
B
1.100
E
B
1.420
2
C
0.465
6
C
0.785
A
C
1.105
E
C
1.425
2
D
0.470
6
D
0.790
A
D
1.110
E
D
1.430
2
E
0.475
6
E
0.795
A
E
1.115
E
E
1.435
2
F
0.480
6
F
0.800
A
F
1.120
E
F
1.440
3
0
0.485
7
0
0.805
B
0
1.125
F
0
1.445
3
1
0.490
7
1
0.810
B
1
1.130
F
1
1.450
3
2
0.495
7
2
0.815
B
2
1.135
F
2
1.455
3
3
0.500
7
3
0.820
B
3
1.140
F
3
1.460
3
4
0.505
7
4
0.825
B
4
1.145
F
4
1.465
3
5
0.510
7
5
0.830
B
5
1.150
F
5
1.470
3
6
0.515
7
6
0.835
B
6
1.155
F
6
1.475
3
7
0.520
7
7
0.840
B
7
1.160
F
7
1.480
3
8
0.525
7
8
0.845
B
8
1.165
F
8
1.485
3
9
0.530
7
9
0.850
B
9
1.170
F
9
1.490
3
A
0.535
7
A
0.855
B
A
1.175
F
A
1.495
3
B
0.540
7
B
0.860
B
B
1.180
F
B
1.500
3
C
0.545
7
C
0.865
B
C
1.185
F
C
1.505
3
D
0.550
7
D
0.870
B
D
1.190
F
D
1.510
DocID023298 Rev 2
L6758A
VR12 serial data bus and IC configuration
Table 6. VID table, both sections (continued)
HEX code
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
HEX code
VOUT [V]
3
E
0.555
7
E
0.875
B
E
1.195
F
E
1.515
3
F
0.560
7
F
0.880
B
F
1.200
F
F
1.520
Table 7. Phase number programming
PWM1
PWM2
3+1 phase
2+1 phase
PWM4
SPWM
to driver
1 kΩ to VCC5
1 kΩ pull up to
VCC5
1 kΩ to VCC5
1 kΩ pull up to
VCC5
1 kΩ pull up to
VCC5
to driver
to driver
3+0 phase
2+0 phase
PWM3
to driver
to driver
Table 8. IMAX / SIMAX pinstrapping (1)
IMAX / SIMAX
R down
R up
[kΩ]
[kΩ]
SIMAX [A]
IMAX [A](2)
GFX
VSA
40
29
35
21
10
1.5
10
2.7
22
6.8
30
13
10
3.6
25
5
27
11
40
29
12
5.6
35
21
82
43
30
13
13
7.5
25
5
56
36
40
29
18
13
35
21
15
12
30
13
18
16
25
5
15
14.7
40
29
10
11
35
21
18
22
30
13
56
75
25
5
N ⋅ 30 + 35
N ⋅ 30 + 30
N ⋅ 30 + 25
N ⋅ 30 + 20
DocID023298 Rev 2
17/42
42
VR12 serial data bus and IC configuration
L6758A
Table 8. IMAX / SIMAX pinstrapping (1) (continued)
IMAX / SIMAX
R down
R up
[kΩ]
[kΩ]
SIMAX [A]
IMAX [A](2)
GFX
VSA
40
29
35
21
10
15
12
20
12
22.6
30
13
39
82
25
5
47
110
40
29
10
27
35
21
22
68
30
13
10
36
25
5
18
75
40
29
15
75
35
21
10
59
30
13
10
75
25
5
10
100
40
29
10
150
35
21
10
220
30
13
10
Open
25
5
N ⋅ 30 + 15
N ⋅ 30 + 10
N ⋅ 30 + 5
N ⋅ 30
1. Suggested values, divider must be connected between VCC5 pin and GND.
2. N is the number of phases programmed for the multi-phase section.
Table 9. BOOT / ADDR pinstrapping(1)
BOOT
18/42
R down
R up
[kΩ]
[kΩ]
Multi-phase
[V]
10
1.5
0.000
1.100
VSA
10
3.6
0.000
1.100
VSA
27
11
0.000
1.000
VSA
13
7.5
0.000
1.000
VSA
56
36
0.000
0.900
VSA
18
16
0.000
0.900
VSA
1 μs
00
15
14.7
0.000
1.100
GFX
32 μs
06
56
75
0.000
1.100
GFX
10
15
1.100
1.100
GFX
Single-phase Single-phase
[V]
mode
DocID023298 Rev 2
ADDR[h](2)
Link-Rest
1 μs
1 μs
06
00
06
1 μs
00
06
32 μs
00
06
L6758A
VR12 serial data bus and IC configuration
Table 9. BOOT / ADDR pinstrapping(1) (continued)
BOOT
R down
R up
[kΩ]
[kΩ]
Multi-phase
[V]
39
82
1.100
1.100
GFX
47
110
1.000
1.000
GFX
10
36
1.000
1.000
GFX
18
75
0.900
0.900
GFX
10
75
0.900
0.900
GFX
32 μs
00
10
100
0.000
0.000
GFX
1 μs
06
10
Open
0.000V
0.000
GFX
1 μs
00
Single-phase Single-phase
[V]
mode
ADDR[h](2)
Link-Rest
00
32 μs
06
00
32 μs
06
1. Suggested values, divider must be connected between VCC5 pin and GND.
2. N is the number of phases programmed for the multi-phase section.
Table 10. Device configuration - single - phase section
Mode (from VBOOT)
VBOOT
GFX
DROOP
SIMAX [A]
Enabled
25 to 40
Disabled
5 to 29
See Table 9
VSA
Table 11. DPM and TMAX pinstrapping (see Section 9.1)
COMP/SCOMP
DPM threshold set
TMAX [C]
33 k to GND
Set 3
130
17.5 k to GND
Set 2
120
12.5 k to GND
Set 1
110
5.6 k to GND
OFF
100
DocID023298 Rev 2
19/42
42
Device description and operation
5
L6758A
Device description and operation
The L6758A is a programmable two-to-four phase PWM controller that provides complete
control logic and protection to implement a high performance step-down DC-DC voltage
regulator optimized for advanced microprocessor power supply. The device features 2nd
generation LTB Technology: through a load transient detector, it is able to simultaneously
turn on all the phases. This allows the output voltage deviation to be minimized and, in turn,
the system cost to be minimized by providing the fastest response to a load transition.
The L6758A implements current reading across the inductor in fully-differential mode. A
sense resistor in series to the inductor can be also considered in order to improve reading
precision. The current information read corrects the PWM output in order to equalize the
average current carried by each phase.
The controller supports VR12 specifications featuring 25 MHz SVI bus and all the required
registers. The platform may program the defaults for these registers through dedicated
pinstrapping.
A complete set of protection is available: overvoltage, undervoltage, overcurrent (per-phase
and total) and feedback disconnection guarantee the load to be safe under all conditions.
Special power management features like DPM, VFDE and GDC modify phase number, gate
driving voltage and switching frequency to optimize the efficiency over the load range.
The L6758A is available in VFQFPN48 with 6x6 mm body package.
Figure 4. Device initialization
VCC5
VCC12
UVLO
2mSec POR
UVLO
50uSec
EN_VTT
ENVTT
SVI BUS
Command ACK but not executed
SVI Packet
SVI Packet
V_SinglePhase
64uSec
SVRRDY
V_MultiPhase
64uSec
VRRDY
AM11137v1
20/42
DocID023298 Rev 2
L6758A
6
Output voltage positioning
Output voltage positioning
Output voltage positioning is performed by selecting the controller operative-mode (CPU,
VSA and GFX) for the two sections and by programming the droop function effect (see
Figure 5). The controller reads the current delivered by each section by monitoring the
voltage drop across the DCR inductors. The current (IDROOP / ISDROOP) sourced from the
FB / SFB pins, directly proportional to the read current, causes the related section output
voltage to vary according to the external RFB / RSFB resistor, therefore implementing the
desired load-line effect.
The L6758A embeds a dual remote-sense buffer to sense remotely the regulated voltage of
each section without any additional external components. In this way, the output voltage
programmed is regulated compensating for board and socket losses. Keeping the sense
traces parallel and guarded by a power plane results in common mode coupling for any
picked-up noise.
Figure 5. Voltage positioning
IDROOP
REFERENCE
from DAC...
Protection
Monitor
FB
COMP
RF
VSEN
RGND
CF
To VddCORE
(Remote Sense)
RFB
ROS
AM11138v1
6.1
Multi-phase section: phase # programming
The multi-phase section implements a flexible two-to-four interleaved-phase converter. To
program the desired number of phases, pull up to VCC5 the PWMx signal that is not
required to be used, according to Table 6.
Caution:
For the disabled phase(s), the current reading pins must be properly connected to avoid
errors in current sharing and voltage positioning: CSxP must be connected to the regulated
output voltage while CSxN must be connected to CSxP through the same RG resistor used
for the active phases.
DocID023298 Rev 2
21/42
42
Output voltage positioning
6.2
L6758A
Multi-phase section: current reading and current sharing
loop
The L6758A embeds a flexible, fully-differential current sense circuitry that is able to read
across inductor parasitic resistance or across a sense resistor placed in series to the
inductor element. The fully-differential current reading rejects noise and allows the placing
of sensing elements in different locations without affecting the measurement accuracy. The
trans-conductance ratio is issued by the external resistor RG placed outside the chip
between the CSxN pin toward the reading points. The current sense circuit always tracks
the current information, the CSxP pin is used as a reference keeping the CSxN pin to this
voltage. To correctly reproduce the inductor current an R-C filtering network must be
introduced in parallel to the sensing element. The current that flows from the CSxN pin is
then given by the following equation (see Figure 6):
Equation 1
DCR 1 + s ⋅ L ⁄ DCR
ICSxN = ------------- ⋅ -------------------------------------- ⋅ I
1+s⋅R⋅C
RG
PHASEx
Considering now to match the time constant between the inductor and the R-C filter applied
(time constant mismatches cause the introduction of poles into the current reading network
causing instability. In addition, it is also important for the load transient response and to let
the system show resistive equivalent output impedance), it results:
Equation 2
L
------------- = R ⋅ C
DCR
RL
I CSxN = -------- ⋅ IPHASEx = I INFOx
RG
Figure 6. Current reading
IPHASEx
Lx
ICSxN=IINFOx
DCRx
VOUT
R
C
CSxP
CSxN
RG
Inductor DCR Current Sense
AM11139v1
The current read through the CSxP / CSxN pairs is converted into a current IINFOx
proportional to the current delivered by each phase and the information about the average
current IAVG = ΣIINFOx / N is internally built into the device (N is the number of working
phases). The error between the read current IINFOx and the reference IAVG is then converted
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Output voltage positioning
into a voltage that, with a proper gain, is used to adjust the duty cycle whose dominant value
is set by the voltage error amplifier in order to equalize the current carried by each phase.
6.3
Multi-phase section: defining load-line
The L6758A introduces a dependence of the output voltage on the load current recovering
part of the drop due to the output capacitor ESR in the load transient. Introducing a
dependence of the output voltage on the load current, a static error, proportional to the
output current, causes the output voltage to vary according to the sensed current.
Figure 6 shows the current sense circuit used to implement the load-line. The current
flowing across the inductor(s) is read through the R-C filter across the CSxP and CSxN pins.
RG programs a trans-conductance gain and generates a current ICSx proportional to the
current of the phase. The sum of the ICSx current is then sourced by the FB pin (IDROOP).
RFB gives the final gain to program the desired load-line slope (Figure 5).
Time constant matching between the inductor (L / DCR) and the current reading filter (RC) is
required to implement a real equivalent output impedance of the system and so avoiding
over and/or undershoot of the output voltage as a consequence of a load transient. The
output voltage characteristic vs. load current is then given by:
Equation 3
DCR
VOUT = VID – R FB ⋅ I DROOP = VID – R FB ⋅ ------------- ⋅ I OUT = VID – R LL ⋅ I OUT
RG
where RLL is the resulting load-line resistance implemented by the multi-phase section.
The RFB resistor can be then designed according to the RLL specifications as follows:
Equation 4
RG
R FB = R LL ⋅ ------------DCR
6.4
Multi-phase section: IMON information
IMON is the analog information related to the current delivered by the VR which has a
voltage digitized for VR12 current reporting. The pin sources a copy of the droop current:
Equation 5
DCR
I MON = IDROOP = ------------- ⋅ I OUT
RG
See Section 6.2 for details about current reading.
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Output voltage positioning
L6758A
The Iout register contains analog-to-digital conversion of the voltage present on the IMON
pin considering the following relationships:
a)
6.5
VMON=IMON ⋅ RIMON , where RIMON is the resistor connected between IMON and
GND.
b)
IMON=1.24 V corresponds to IMAX. RIMON is designed according to this
relationship.
c)
IMON=1.55 V sets the OC protection.
Single-phase section: current reading
The single-phase section performs the same differential current reading across DCR as the
multi-phase section. According to Section 6.2, the current that flows from the SCSN pin is
then given by the following equation (see Figure 6):
Equation 6
DCR
ISCSN = ------------- ⋅ ISOUT = I SDROOP
R SG
6.6
Single-phase section: defining load-line
This method introduces a dependence of the output voltage on the load current recovering
part of the drop due to the output capacitor ESR in the load transient. Introducing a
dependence of the output voltage on the load current, a static error, proportional to the
output current, causes the output voltage to vary according to the sensed current.
Figure 6 shows the current sense circuit used to implement the load-line. The current
flowing across the inductor DCR is read through RSG. RSG programs a trans-conductance
gain and generates a current ISDROOP proportional to the current delivered by the singlephase section that is then sourced from the SFB pin. RSFB gives the final gain to program
the desired load-line slope (Figure 5).
The output characteristic vs. load current is then given by:
Equation 7
VSOUT = VID – R SFB ⋅ I SDROOP
DCR
VID – R SFB ⋅ ------------- ⋅ I SOUT = VID – R SLL ⋅ I SOUT
R SG
where RSLL is the resulting load-line resistance implemented by the single-phase section.
The RSFB resistor can be then designed according to the RSLL as follows:
Equation 8
R SG
R SFB = R SLL ⋅ ------------DCR
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6.7
Output voltage positioning
Dynamic VID transition support
The L6758A manages dynamic VID transitions that allow the output voltage of both sections
to be modified during normal device operation for power management purposes. OV, UV
signals are masked during every DVID transition and they are re-activated with proper delay
to prevent from false triggering.
When changing dynamically the regulated voltage (DVID), the system needs to charge or
discharge the output capacitor accordingly. This means that an extra-current IDVID needs to
be delivered (especially when increasing the output regulated voltage) and it must be
considered when setting the overcurrent threshold of both sections. This current results:
Equation 9
dV OUT
I DVID = C OUT ⋅ -----------------dT VID
where dVOUT / dTVID depends on the specific command issued (20 mV/μsec. for
SetVID_Fast and 5 mV/μsec. for SetVID_Slow).
Overcoming the OC threshold during the dynamic VID causes the device to latch and
disable.
As soon as the controller receives a new valid command to set the VID level for one (or
both) of the two sections, the reference of the involved section steps up or down according
to the target-VID with the programmed slope until the new code is reached. If a new valid
command is issued during the transition, the device updates the target-VID level and
performs the dynamic transition up to the new code. OV, UV are masked during the
transition and re-activated with proper delay after the end of the transition to prevent from
false triggering.
6.8
DVID optimization: REF/SREF
High slew rate for dynamic VID transitions cause overshoot and undershoot on the
regulated voltage causing a violation in the microprocessor requirement. To compensate
this behavior and to remove any over/undershoot in the transition, each section features
DVID optimization circuit.
The reference used for the regulation is available on the REF/SREF pin (see Figure 7).
Connect an RREF/CREF to GND (RSREF / CSREF for the single-phase) to optimize the DVID
behavior. Components may be designed as follows (multi-phase, same equations apply to
single-phase):
Equation 10
ΔV OSC
C REF = C F ⋅ 1 – --------------------
k V ⋅ V IN
RF ⋅ CF
R REF = ------------------C REF
where ΔVosc is the PWM ramp and kV the gain for the voltage loop (see Section 11).
During a DVID transition, the REF pin moves according to the command issued
(SetVIDFast, SetVIDSlow); the current requested to charge/discharge the RREF/CREF
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42
Output voltage positioning
L6758A
network is mirrored and added to the droop current compensating for over/undershoot on
the regulated voltage.
IDROOP
Figure 7. DVID optimization circuit
RREF
RF
CREF
RGND
to Vout...
ZF(s)
ZFB(s)
CF
RGND
COMP
FB
REF
VID
VCOMP
Ref
VSEN
Ref
RFB
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7
Output voltage monitoring and protection
Output voltage monitoring and protection
The L6758A monitors the regulated voltage of both sections through pin VSEN and SVSEN
in order to manage OV and UV. The device shows different thresholds when in different
operative conditions but the behavior in response to a protection event is still the same as
described below.
Protection is active also during soft-start while it is properly masked during DVID transitions
with an additional delay to avoid false triggering.
Table 12. L6758A protection at a glance
Section
Multi-phase
Overvoltage (OV)
VSEN, SVSEN = +175 mV above reference.
Action: IC Latch; DVIDFast to 250 mV, LS=ON & PWMx = 0 if required to keep
the regulation to 250 mV; other section: HiZ.
Undervoltage (UV)
VSEN, SVSEN = 500 mV below reference. Active after Ref > 500 mV
Action: IC Latch; both sections HiZ.
Overcurrent (OC)
Current monitor across inductor DCR.
Dual protection, per-phase and average.
Action: UV-Like.
Dynamic VID
7.1
Single-phase
Protection masked with additional delay to prevent from false triggering.
Overvoltage
When the voltage sensed by VSEN and/or SVSEN overcomes the OV threshold, the
controller acts in order to protect the load from excessive voltage levels avoiding any
possible undershoot. To reach this target, a special sequence is performed as per the
following list:
–
The reference performs a DVID_Fast transition down to 250 mV on the section
which triggered the OV protection.
–
The PWMs of the section which triggered the protection are switched between HiZ
and zero (ENDRV is kept high) in order to follow the voltage imposed by the
DVID_Fast on-going. This limits the output voltage excursion, protects the load
and assures no undershoot is generated (if VOUT < 250 mV, the section is HiZ).
–
The PWMs of the non-involved section are set permanently to HiZ (ENDRV is kept
low) in order to realize a HiZ condition.
–
OSC/ FLT pin is driven high.
–
Power supply or EN pin cycling is required to restart operations.
If the cause of the failure is removed, the converter ends the transition with all PWMs in HiZ
state and the output voltage of the section which triggered the protection lower than 250 mV.
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Output voltage monitoring and protection
7.2
L6758A
Overcurrent
The overcurrent threshold must be programmed to a safe value, in order to be sure that
each section does not enter OC during normal operation of the device. This value must take
into consideration also the extra current needed during the DVID transition (IDVID) and the
process spread and temperature variations of the sensing elements (inductor DCR).
7.2.1
Multi-phase section
The L6758A performs two different types of OC protection for the multi-phase section: it
monitors both the total current and the per-phase current and allows an OC threshold to be
set for both.
•
Per-phase OC
–
•
Maximum information current per-phase (IINFOx) is internally limited to 35 μA. This
end-of-scale current (IOC_TH) is compared with the information current generated
for each phase (IINFOx). If the current information for the single-phase exceeds the
end-of-scale current (i.e. if IINFOx > IOC_TH), the device turns on the LS MOSFET
until the threshold is re-crossed (i.e. until IINFOx < IOC_TH).
Total current OC
–
The IMON pin allows a maximum total output current to be defined for the system
(IOC_TOT). IMON current is sourced from the IMON pin. By connecting a resistor
RIMON to SGND, a load indicator with 1.55 V (VOC_TOT) end-of-scale can be
implemented. When the voltage present at the ILIM pin crosses VOC_TOT, the
device detects an OC and immediately latches with all the MOSFETs of all the
sections OFF (HiZ).
Typical design considers the intervention of the total current OC before the per-phase OC,
leaving this last one as an extreme-protection in case of hardware failures in the external
components. Total current OC is dependant on the IMON design and on the application
TDC and MAX current supported. The typical design flow is the following:
–
Define the maximum total output current (IOC_TOT) according to system
requirements (IMAX, ITDC). Considering IMON design, IMAX must correspond to 1.24
V (for correct IMAX detection) so, IOC_TOT results as defined, as a consequence:
I OC_TOT = I MAX ⋅ 1.55 ⁄ 1.24
–
Design per-phase OC and RG resistor in order to have IINFOx = IOC_TH (35 mA)
when IOUT is about 10% higher than the IOC_TOT current. It results:
( 1.1 ⋅ I OC_TOT ) ⋅ DCR
R G = -------------------------------------------------------N ⋅ IOCTH
where N is the number of phases and DCR the DC resistance of the inductors. RG
should be designed in worst-case conditions.
–
Design the total current OC and RIMON in order to have the IMON pin voltage to
1.24 V at the IMAX current specified by the design. It results:
1.24V ⋅ R G
R IMON = -----------------------------IMAX ⋅ DCR
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DCR
I
= ------------- ⋅ IOUT
MON
RG
L6758A
Output voltage monitoring and protection
where IMAX is max. current requested by the processor (see Intel docs for details).
–
Adjust the defined values according to the bench test of the application.
–
CIMON in parallel to RIMON can be added with proper time constant to prevent false
OC tripping.
Note:
This is the typical design flow. Custom design and specifications may require different
settings and ratios between the per-phase OC threshold and the total current OC threshold.
Applications with big ripple across inductors may be required to set per-phase OC to values
different than 110%: design flow should be modified accordingly.
7.2.2
Overcurrent and power states
When the controller receives an SetPS command through the SVI interface, it automatically
changes the number of working phases. In particular, the maximum number of phases
which the L6758A may work in >PS00h is limited to 2 phases regardless of the number N
configured in PS00h. The OC level is then scaled as the controller enters >PS00h, as per
Table 13.
Table 13. Multi-phase section OC scaling and power states
N (active phases in PS00h)
OC level in PS00h
4
3
0.800 V
1.550 V
2
7.2.3
OC level in PS01h, PS02h
1.050 V
1.550 V
Single-phase section
The single-phase section features the same protection as the multi-phase section. All the
previous relationships remain applicable upon updating variables, referencing them to the
single-phase section and considering it is working in single-phase.
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42
Single NTC thermal monitor and compensation
8
L6758A
Single NTC thermal monitor and compensation
The L6758A features single NTC for thermal sensing for both thermal monitoring and
compensation. The feature is per section, i.e. it is required to have one NTC per section
which drives both thermal monitoring and thermal compensation. The thermal monitor
consists of monitoring the converter temperature eventually reporting an alarm by asserting
the VR_HOT signal. This is the base for the temperature zone register fill. Thermal
compensation consists of compensating the inductor DCR derating with temperature, so
preventing drifts in any variable correlated to the DCR: voltage positioning, overcurrent,
IMON, current reporting. Both functions share the same thermal sensor (NTC) to optimize
the overall application cost without compromising the performance.
8.1
Thermal monitor and VR_HOT
The diagram for the thermal monitor is reported in Figure 8. NTC should be placed close to
the power stage hot-spot in order to sense the regulator temperature. As the temperature of
the power stage increases, the NTC resistive value decreases, therefore reducing the
voltage observable at the TM and STM pins.
The recommended NTC is NTHS0805N02N6801 (or equivalent with β25/75=3500 +/-10%)
for accurate temperature sensing and thermal compensation. Different NTC may be used:
to reach the required accuracy in temperature reporting, a proper resistive network must be
used in order to match the resulting characteristic with the one coming from the
recommended NTC.
The voltage observed at the TM / STM pins is internally converted and then used to fill in the
temperature zone register of the related section. When the temperature observed exceeds
TMAX (programmed via pinstrapping), the L6758A asserts VR_HOT (active low - as long as
the overtemperature event lasts) and the ALERT# line (until reset by the GetReg command
on the status register).
Figure 8. Thermal monitor connections (also applies to STM pin)
2k
NTC
TM
TEMPERATURE
DECODING
VCC5
VR_HOT
Temp. Zone
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8.2
Single NTC thermal monitor and compensation
Thermal compensation
The L6758A supports DCR sensing for output voltage positioning: the same current
information used for voltage positioning is used to define the overcurrent protection and the
current reporting (register 15h in SVI). Having imprecise and temperature-dependant
information leads to a violation of the specifications and misleading information returned to
the SVI master: positive thermal coefficient specific to DCR must be compensated to obtain
stable behavior of the converter as temperature increases. Uncompensated systems show
temperature dependencies on the regulated voltage, overcurrent protection and current
reporting (register 15h).
The temperature information available on the TM pin and used for the thermal monitor may
be used also for this purpose. By comparing the voltage on the TM pin with the voltage
present on the TCOMP pin, the L6758A corrects the IDROOP current used for voltage
positioning (see Section 6.3), therefore recovering the DCR temperature deviation.
Depending on NTC location and distance from the inductors and the available airflow, the
correlation between NTC temperature and DCR temperature may be different: TCOMP
adjustments allow the gain between the sensed temperature and the correction made upon
the IDROOP current to be modified.
Short TCOMP to GND to disable thermal compensation (no correction is given to IDROOP).
The same behavior also applies to the single-phase section (STM/STCOMP pins involved).
8.3
TM and TCOMP design
This procedure applies to both single-phase and multi-phase sections.
1.
Properly choose the resistive network to be connected to the TM pin. The
recommended values/network is reported in Figure 8.
2.
Connect voltage generator to the TCOMP pin (default value 3.3 V).
3.
Power on the converter and load the thermal design current (TDC) with the desired
cooling conditions. Record the output voltage regulated as soon as the load is applied.
4.
Wait for thermal steady-state. Adjust down the voltage generator on the TCOMP pin in
order to get the same output voltage recorded at point #3.
5.
Design the voltage divider connected to TCOMP (between VCC5 and GND) in order to
get the same voltage set to TCOMP at point #4.
6.
Repeat the test with the TCOMP divider designed at point #5 and verify the thermal
drift is acceptable. In the case of positive drift (i.e. output voltage at thermal steadystate is bigger than output voltage immediately after loading TDC current), change the
divider at the TCOMP pin in order to reduce the TCOMP voltage. In the case of
negative drift (i.e. output voltage at thermal steady-state is smaller than output voltage
immediately after loading TDC current), change the divider at the TCOMP pin in order
to increase the TCOMP voltage.
7.
The same procedure can be implemented with a variable resistor in place of one of the
resistors of the divider. In this case, once the compensated configuration is found,
simply replace the variable resistor with a resistor of the same value.
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42
Efficiency optimization
9
L6758A
Efficiency optimization
As per VR12 specifications, the SVI master may define different power states for the VR
controller. This is performed by SetPS commands. The L6758A re-configures itself to
improve overall system efficiency according to Table 14.
Table 14. Efficiency optimization
Feature
9.1
PS00h
PS01h
DPM
According to pinstrapping
Active. 1phase/2phase according to Iout
VFDE
Active when in single-phase and
Active when in single-phase
DPM enabled
GDC
12 V driving
GDC set to 5 V
Dynamic phase management (DPM)
Dynamic phase management allows the number of working phases to be adjusted
according to the delivered current still maintaining the benefits of the multi-phase regulation.
Phase number is reduced by monitoring the voltage level across the IMON pin: the L6758A
reduces the number of working phases according to the strategy defined by the DPM
pinstrapping, see Table 11.
The current at which the transition happens (IDPM) can be estimated as:
Equation 11
V DPM R G
I DPM = ---------------- ⋅ ------------R IMON DCR
where VDPM thresholds are defined in Table 15. A hysteresis (50 mV typ.) is provided for
each threshold in order to avoid multiple DPM actions triggering in steady load conditions.
Table 15. VDPM Thresholds (IMON rising-50 mV Hyst)
Comp/Scomp
DPM threshold set
1/2 phase transition
2/N phase transition
33 k to GND
Set 3
Vimon=200 mV
Vimon=350 mV
17.5 k to GND
Set 2
Vimon=150 mV
Vimon=275 mV
12.5 k to GND
Set 1
n/a
Vimon=150 mV
5.6 k to GND
OFF
n/a
n/a
When DPM is enabled, L6758A starts monitoring the IMON voltage for phase number
modifications after VR_RDY has transition high: the soft-start is then implemented in
interleaving mode with all the available phases enabled.
DPM is reset in case of a Set VID command that affects the CORE section and when LTB
Technology detects a load transient. After being reset, if the voltage across IMON is
compatible, DPM is re-enabled after proper delay.
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Efficiency optimization
Delay in the intervention of DPM can be adjusted by properly sizing the filter across the
IMON pin. Increasing the capacitance results in increased delay in the DPM intervention.
9.2
Variable frequency diode emulation (VFDE)
As the current required by the load is reduced, the L6758A progressively reduces the
number of switching phases according to DPM settings on the multi-phase section. If singlephase operation is configured, when the delivered current approaches the CCM/DCM
boundary, the controller enters VFDE operation. The single-phase section, being a singlephase, enters VFDE operation always when the delivered current approaches the
CCM/DCM boundary.
In a common single-phase DC-DC converter, the boundary between CCM and DCM is
when the delivered current is perfectly equal to 1/2 of the peak-to-peak ripple in the inductor
(Iout = Ipp/2). Further decreasing the load in this condition maintaining CCM operation
would cause the current in the inductor to reverse, therefore sinking current from the output
for a part of the OFF-time. This results in a poorly efficient system.
The L6758A is able (via CSPx/CSNx pins) to detect the sign of the current across the
inductor (zero cross detection, ZCD) so it is able to recognize when the delivered current
approaches the CCM/DCM boundary. In VFDE operation, the controller fires the high-side
MOSFET for a TON and the low side MOSFET for a TOFF (the same as when the controller
works in CCM mode) and waits the necessary time until next firing in high-impedance (HiZ).
The consequence of this behavior is a linear reduction of the “apparent” switching frequency
that, in turn, results in an improvement of the efficiency of the converter when in very light
load conditions.
To prevent entering the audible range, “apparent” switching frequency is reduced until
30 kHz.
Figure 9. Output current vs. switching frequency in PSK mode
Iout = Ipp/2
Iout < Ipp/2
t
t
Tsw
Tsw
Tvfde
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Main oscillator
10
L6758A
Main oscillator
The internal oscillator generates the triangular waveform for the PWM, charging and
discharging with a constant current an internal capacitor. The switching frequency for each
channel, FSW, FSSW, is internally fixed at 200 kHz: the resulting switching frequency at the
load side for the multi-phase section results in being multiplied by N (number of configured
phases).
The current delivered to the oscillator is typically 20 μA (corresponding to the freerunning
frequency FSW=200 kHz) and it may be varied using an external resistor (ROSC, RSOSC)
typically connected between the OSC, SOSC pins and GND. Since the OSC/SOSC pins are
fixed at 1 V, the frequency is varied proportionally to the current sunk from the pin
considering the internal gain of 10 KHz/μA for FSW or 11 KHz/μA for FSSW (see Figure 10).
Connecting ROSC to SGND the frequency is increased (current is sunk from the pin),
according to the following relationships:
Equation 12
1.000V
kHz
FSW = 200kHz + ---------------------------- ⋅ 10 ----------R OSC ( kΩ )
μA
Figure 10. ROSC [kΩ] vs. switching frequency [kHz] per phase.
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System control loop compensation
The control system can be modeled with an equivalent single-phase converter whose only
difference is the equivalent inductor L/N (where each phase has an L inductor and N is the
number of the configured phases), see Figure 11.
Figure 11. Equivalent control loop.
d VCOMP
PWM
L/N
VOUT
ESR
VID
RF
CF
RGND
FB
COMP
VSEN
VCOMP
Ref
RO
CO
IDROOP
11
System control loop compensation
ZF(s)
ZFB(s)
RFB
AM11144v1
The control loop gain results (obtained opening the loop after the COMP pin):
Equation 13
PWM ⋅ ZF ( s ) ⋅ ( R LL + ZP ( s ) )
G LOOP ( s ) = – ------------------------------------------------------------------------------------------------------------------ZF ( s )
1
[ ZP ( s ) + Z L ( s ) ] ⋅ -------------- + 1 + ------------ ⋅ R FB
A( s)
A ( s )
where:
•
•
•
RLL is the equivalent output resistance determined by the droop function (voltage
positioning)
ZP(s) is the impedance resulting from the parallel of the output capacitor (and its ESR)
and the applied load RO
ZF(s) is the compensation network impedance
•
ZL(s) is the equivalent inductor impedance
•
A(s) is the error amplifier gain
•
V IN
9
PWM = ------ ⋅ ------------------10 ΔVOSC
is the PWM transfer function.
The control loop gain is designed in order to obtain a high DC gain to minimize static error
and to cross the 0 dB axes with a constant -20 dB/dec slope with the desired crossover
frequency ωT. Neglecting the effect of ZF(s), the transfer function has one zero and two
poles; both poles are fixed once the output filter is designed (LC filter resonance ωLC) and
the zero (ωESR) is fixed by ESR and the droop resistance.
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System control loop compensation
L6758A
Figure 12. Control loop bode diagram and fine tuning.
dB
dB
CF
GLOOP(s)
GLOOP(s)
K
K
ZF(s)
RF[dB]
ZF(s)
RF[dB]
RF
ωLC = ωF
ωESR
ωT
ω
ωLC = ωF
ωESR
ω
ωT
AM11145v1
To obtain the desired shape, an RF-CF series network is considered for the ZF(s)
implementation. A zero at ωF=1/RFCF is then introduced together with an integrator. This
integrator minimizes the static error while placing the zero ωF in correspondence with the LC resonance, assuring a simple -20 dB/dec shape of the gain.
In fact, considering the usual value for the output filter, the LC resonance results at a
frequency lower than the above reported zero.
The compensation network can be designed as follows:
Equation 14
F SW ⋅ L
R FB ⋅ ΔVOSC 10
R F = ---------------------------------- ⋅ ------ ⋅ ---------------------------------9 ( RLL + ESR )
V IN
Equation 15
CO ⋅ L
C F = -------------------RF
11.1
Compensation network guidelines
The compensation network design assures that the system responds according to the
crossover frequency selected and to the output filter considered: it is anyway possible to
further fine-tune the compensation network modifying the bandwidth in order to get the best
response of the system, as follows (see Figure 12):
–
Increase RF to increase the system bandwidth accordingly
–
Decrease RF to decrease the system bandwidth accordingly
–
Increase CF to move ωF to low frequencies increasing, as a consequence, the
system phase margin.
Even though a fastest compensation network helps to satisfy the requirement of the load,
the inductor still limits the maximum dI/dt that the system can afford. In fact, when a load
transient is applied, the best that the controller can do is to “saturate” the duty cycle to its
maximum (dMAX) or minimum (0) value. The output voltage dV/dt is then limited by the
inductor charge/discharge time and by the output capacitance. In particular, the most
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System control loop compensation
limiting transition corresponds to the load-removal since the inductor results as being
discharged only by VOUT (while it is charged by VIN-VOUT during a load appliance).
Note:
The introduction of a capacitor (CI) in parallel to RFB significantly speeds up the transient
response by coupling the output voltage dV/dt on the FB pin, therefore using the error
amplifier as a comparator. The COMP pin suddenly reacts and, also thanks to the LTB
Technology control scheme, all the phases can be turned on together to immediately give
the required energy to the output. Typical design considers starting from values in the range
of 100 pF and validating the effect by bench testing. An additional series resistor (RI) can
also be used.
11.2
LTB technology
LTB technology further enhances the performance of the controller by reducing the system
latencies and immediately turning ON all the phases to provide the correct amount of energy
to the load optimizing the output capacitor count.
LTB technology monitors the output voltage through a dedicated pin detecting loadtransients with selected dV/dt, it cancels the interleaved phase-shift, simultaneously turning
on all phases.
The LTB detector is able to detect output load transients by coupling the output voltage
through an RLTB - CLTB network. After detecting a load transient, all the phases are turned
on together and the EA latencies result as bypassed as well.
Sensitivity of the load transient detector can be programmed in order to control precisely
both the undershoot and the ring-back.
LTB technology design tips.
–
Decrease RLTB to increase the system sensitivity making the system sensitive to
smaller dVOUT.
–
Increase CLTB to increase the system sensitivity making the system sensitive to
higher dV/dt.
–
Increase Ri to increase the width of the LTB pulse.
–
Increase Ci to increase the LTB sensitivity over frequency.
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In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at www.st.com.
ECOPACK is an ST trademark.
Table 16. VFQFPN48 6x6x1.0 mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.80
0.90
1.00
A1
0
0.02
0.05
b
0.15
0.20
0.25
D
5.90
6.00
6.10
E
5.90
6.00
6.10
D2
4.25
4.40
4.50
E2
4.25
4.40
4.50
e
L
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0.40
0.35
0.45
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Package mechanical data
Figure 13. VFQFPN48 6x6x1.0 drawing
BOTTOM VIEW
Pin#1 ID
e
b
13
24
25
1
36
E2
12
48
37
L
A
A1
D2
SEATING
PLANE
SIDE VIEW
D
E
TOP VIEW
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Figure 14. FQFPN48 6x6x1.0 footprint
13
24
12
25
1
36
48
37
8205966_A
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Revision history
Revision history
Table 17. Document revision history
Date
Revision
Changes
03-Sep-2012
1
Initial release.
10-Jul-2013
2
Updated Table 16: VFQFPN48 6x6x1.0 mechanical data.
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