A6932H1.2
2 A ULDO linear regulator for automotive applications
Datasheet - production data
Description
The A6932H1.2 ultra low drop output linear
regulator operates from 2 V to 14 V and is able to
support output current up to 2 A. Designed with
an internal 50 m N-channel MOSFET, it can be
used for on-board DC-DC conversions saving in
real estate, list of components, low noise
generation and power dissipation.
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HSOP-8
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Features
AEC-Q100 compliant
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200 mRDS(on) max.
200 µA quiescent current at any load
The upper current limit is fixed at 2.5 A to control
the current in short-circuit condition within ± 8%.
The current is sensed in the power MOS in order
to limit the power dissipation.
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Excellent load and line regulation
Adjustable from 1.2 V to 5 V
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1% voltage regulation accuracy
Short-circuit protection
HSOP-8 package
Applications
The device is also provided with a thermal
shutdown that limits the internal temperature at
150 °C with a hysteresis of 20 °C. The A6932H1.2
device provides the enable and the Power Good
functions.
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Thermal shutdown
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The A6932H1.2 device is available as adjustable
version from 1.2 V to 5 V with a voltage regulation
accuracy of 1%.
2 V to 14 V input voltage range
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Dedicated to automotive applications
Figure 1. Typical operating circuit
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Table 1. Device summary
Part number
Package
Packaging
A6932H1.2
HSOP-8
Tube
A6932H1.2TR
HSOP-8
Tape and reel
November 2013
This is information on a product in full production.
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Contents
A6932H1.2
Contents
1
2
Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
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3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5
Typical electrical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7
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6.1
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2
Demonstration board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.3
Component part list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
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Component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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7.1
Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2
Output capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.3
Loop stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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Pin settings
1
Pin settings
1.1
Pin connection
Figure 2. Pin connection (top view)
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Pin description
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Table 2. Pin description
Pin no.
1
EN
Enables the device when connected to Vin and disables it when forced to
GND.
VIN
Supply voltage. This pin is connected to the drain of the internal N-MOS.
Connect this pin to a capacitor larger than 10 µF.
3
FB
Connecting this pin to a voltage divider it is possible to program the output
voltage between 1.2 V and 5 V.
4
VOUT
Regulated output voltage. This pin is connected to the source of the internal
N-MOS. Connect this pin to a capacitor of 10 µF.
5
PGOOD
Power Good output. The pin is open drain and detects the output voltage. It
is forced low if the output voltage is lower than 90% of the programmed
voltage.
6
GND
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Name
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Description
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Ground pin
NC1 - NC2 Internally not connected.
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Maximum ratings
A6932H1.2
2
Maximum ratings
2.1
Absolute maximum ratings
Table 3. Absolute maximum ratings
Symbol
VIN
2.2
Parameter
Value
Unit
VIN and PGOOD
14.5
V
EN, OUT and ADJ
-0.3 to (Vin +0.3)
V
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Thermal data
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Table 4. Thermal data
Symbol
RthJA
Maximum thermal resistance junction ambient
TMAX
Maximum junction temperature
TSTG
Storage temperature range
Block diagram
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Figure 3. Internal block diagram
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1. Package mounted on board.
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Parameter
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Value
Unit
34(1)
C/W
150
C
-65 to 150
C
A6932H1.2
4
Electrical characteristics
Electrical characteristics
Table 5. Electrical characteristics (Ta = -40 °C to 85 °C, VIN = 5 V unless otherwise specified)
Symbol
Parameter
VIN
Operating supply voltage
VO
Output voltage
Test condition
Min.
Typ.
2
Ta = 25 °C
1.188
1.2
RDS(on)
IOCC
5
VIN = 3.3 V ± 10%; IO = 10 mA
5
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Ish
Shutdown current
2.3
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f = 120 Hz, IO = 1 A VIN = 5 V,
VIN = 2 Vpp
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EN input threshold
Pgood threshold
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Pgood hysteresis
Pr
Pgood saturation
2.5
0.2
Vo rise
Ipgood = 1 mA
0.5
0.65
mV
200
m
2.7
0.4
29
75
mV
mV
25
60
mV
15
2.85
bs
Ta = 25 °C
Ripple rejection
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Ta = 25 °C
Quiescent current
Ven
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Drain source ON resistance
Iq
V
VIN = 2.5 V ± 10%; IO = 10 mA
VIN = 3.3 V; 0.1 A < IO < 2 A
Current limiting
14
1.212
VIN = 5 V ± 10%; IO = 10 mA
Load regulation
Unit
1.212
1.175
Line regulation
Max.
A
mA
µA
dB
0.8
V
90
%Vo
10
%Vo
0.2
0.4
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Typical electrical performance
5
A6932H1.2
Typical electrical performance
Figure 4. Output voltage vs. junction
temperature
Figure 5. Quiescent current vs. junction
temperature
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Figure 6. Shutdown current vs. junction temperature
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Application information
6
Application information
6.1
Application circuit
Figure 7. Demonstration board application circuit
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Equation 1
V OUT
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1.2
= -------- R 1 + R 2
R2
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6.2
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Demonstration board)layout
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Figure 8. Demonstration board layout
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Application information
6.3
A6932H1.2
Component part list
Table 6. Component part list
Reference
Part number
Description
Manufacturer
C1
GRM32ER6C226KE20B
22 F, 16 V
Murata
C2
GRM32ER6C226KE20B
22 F, 16 V
Murata
R1
N. M.
R2
0
R3
100 K
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A6932H1.2
Component selection
7
Component selection
7.1
Input capacitor
The input capacitor value depends on a lot of factors such as load transient requirements,
input source (battery or DC/DC converter) and its distance from the input cap. Usually
a 47 µF is enough for any application but a much lower value can be sufficient in many
cases.
7.2
Output capacitor
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The output capacitor choice depends basically on the load transient requirements.
Tantalum, Special Polymer, POSCAP and aluminum capacitors are good and offer very low
ESR values. Multilayer ceramic caps have the lowest ESR and can be required for particular
applications. Nevertheless in several applications they are OK, the loop stability issue has to
be considered (see loop stability section).
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In Table 7 is a list of some suggested capacitor manufacturers.
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Table 7. Suggested capacitor
Manufacturer
Type
Murata
Ceramic
Panasonic
Ceramic
Rated voltage (V)
1 to 47
4 to 16
1 to 47
4 to 16
1 to 47
4 to 16
Ceramic
1 to 47
4 to 16
Ceramic
1 to 47
4 to 16
SANYO
POSCAP
1 to 47
4 to 16
Panasonic
SP
1 to 47
4 to 16
KEMET
Tantalum
1 to 47
4 to 16
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TAIYO YUDEN
TDK
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TOKIN
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Cap value (µF)
Pr
Ceramic
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Loop stability
The stability of the loop is affected by the zero introduced by the output capacitor. The time
constant of the zero is given by:
Equation 2
T = ESR C OUT
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Component selection
A6932H1.2
Equation 3
1
F ZERP = ----------------------------------------------2 ESR C OUT
This zero helps to increase the phase margin of the loop until the time constant is higher
than some hundreds of ns, depending also on the output voltage and current.
So, using very low ESR ceramic capacitors could produce oscillations at the output, in
particular when regulating high output voltages (adjustable version).
To solve this issue is sufficient to add a small capacitor (e.g. 1 nF to 10 nF) in parallel to the
high side resistor of the external divider, as shown in Figure 9.
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Figure 9. Compensation network
Vin=2V to 14V
Vin
2
EN
1
4
A6932H1.2
L6932H1.2
PGOOD
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GND
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NC1
NC2
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C3
R1
FB
6
R3
5
C1
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Vout=1.2V to 5V
Vout
C2
R2
The thermal resistance junction to ambient of the demonstration board is approximately
34 °C/W.
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This mean that, considering an ambient temperature of 60 °C and, a maximum junction
temperature of 150 °C, the maximum power that the device can handle is 2.7 W.
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This means that the device is able to deliver a DC output current of 2 A only with a very low
dropout.
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Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 10. HSOP-8 package outline
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Package information
A6932H1.2
Table 8. HSOP-8 package mechanical data
Dimensions (mm)
Symbol
Note
Min.
Typ.
Max.
A
1.43
1.55
1.68
A1
0.03
0.08
0.13
A2
1.40
1.47
1.55
b
0.35
0.41
0.49
c
0.19
0.20
0.25
D
4.80
4.93
4.98
D1
uc
According to pad size
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E
5.84
5.99
6.20
E1
3.81
3.94
3.99
E2
According to pad size
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0.25
L
0.41
k
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(1)
(2)
(3)
(2)
0.41
0.89
8
Degrees
0.10
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
2. The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1”
and “E2” dimensions for each device application.
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3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
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Revision history
Revision history
Table 9. Document revision history
Date
Revision
29-Nov-2013
1
Changes
Initial release.
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Please Read Carefully:
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