LED8102SXTTR

LED8102S Datasheet 8-channel LED driver with direct switch control Features HTSSOP16 (Exposed pad) • • • • • • • • • 8 constant current output channels controlled by switch inputs Output enable input for global dimming Output current: from 5 mA to 100 mA Current programmable through external resistor Supply voltage: 3 V to 5.5 V Thermal shutdown 19 V current generators rated voltage Available in high thermal efficiency TSSOP exposed pad package ESD protection 2.0 kV HBM, 100 V MM Applications • White and RGB lighting and Backlight – Appliance display and human interface – Industrial display and function indicator – Architectural Lighting Description Maturity status link LED8102S Device summary Order code LED8102SXTTR Package HTSSOP16 Packing 2500 parts per reel The LED8102S is a monolithic, low voltage, 8 low-side-channel LED driver. The LED8102S guarantees up to 19 V output driving capability allowing users to connect several LEDs in series. In the output stage, 8 regulated current sources provide from 5 mA to 100 mA constant current to drive the LEDs. Current is programmed through a single external resistor. LED8102S is equipped with a thermal management that protects the device forcing it in shutdown (typically: power-off at 170 °C with 15 °C hysteresis to restart). The thermal protection switches OFF only the output channels. The operative supply voltage range is between 3 V and 5.5 V. The output control is provided by four switch inputs, providing an on/off toggle action suitable also for local dimming. Moreover, on all active output LEDs brightness can be adjusted with a global PWM signal applied to the output enable pin (OE). Outputs can be connected in parallel, or left unconnected if not used, as required by the application. DS12963 - Rev 3 - February 2021 For further information contact your local STMicroelectronics sales office. www.st.com LED8102S Pin description 1 Pin description Figure 1. Pinout for HTSSOP16 GND VDD SW1 R-EXT SW2 OE SW3 SW4 OUT0 OUT7 OUT1 OUT6 OUT2 OUT5 OUT3 OUT4 Table 1. Pin description DS12963 - Rev 3 HTSSOP16 Symbol 1 GND Ground terminal 2 SW1 Switch input 1 to enable OUT0 and OUT1 simultaneously 3 SW2 Switch input 2 to enable OUT2 and OUT3 simultaneously 4 SW3 Switch input 3 to enable OUT4 and OUT5 simultaneously 5-12 OUT0-OUT7 13 SW4 14 OE 15 R-EXT 16 VDD Name and function Output terminals Switch input 4 to enable OUT6 and OUT7 simultaneously Global PWM brightness control input terminal (it must be connected to GND if not used) Terminal for external resistor for constant current programming Supply voltage terminal page 2/20 LED8102S Simplified internal block diagram 2 Simplified internal block diagram Figure 2. LED8102S simplified block diagram SWx DS12963 - Rev 3 page 3/20 LED8102S Absolute maximum ratings 3 Absolute maximum ratings Stressing the device above the ratings listed in the table below may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Table 2. Absolute maximum ratings Symbol VDD Parameter Value Unit 0 to 7 V - 0.4 to 5.5 V - 0.5 to 20 V GND terminal current 800 mA Electrostatic discharge protection HBM human body model ±2 kV Electrostatic discharge protection CDM machine model 500 V Value Unit Supply voltage VSW1- VSW4, VOE Input pins voltage VOUT0 - OUT7 IGND ESD 3.1 Output pins voltage Thermal characteristics Table 3. Thermal characteristics Symbol TJ TSTG Rthj-amb Parameter Operative junction temperature range -40 to +150 Storage ambient temperature range -55 to +150 Thermal resistance junction-ambient (HTSSOP16) (1) 37.5 °C °C/W 1. The exposed pad should be soldered directly to the PCB to realize the thermal benefits DS12963 - Rev 3 page 4/20 LED8102S Electrical characteristics 4 Electrical characteristics VDD = 5 V, Tj = 25 °C, REXT = 980 Ω, VO = 0.85 V unless otherwise specified. Table 4. Electrical characteristics Symbol Parameter VDD Supply voltage Conditions Min. Typ. Max. 3.0 - 5.5 2.7 2.9 UVLO threshold (rising) VUVLO UVLO threshold (falling) HyUVLO 2.1 UVLO hysteresis VO Output voltage VIH 2.3 0.4 (1) (2) OUT0 – OUT7 SWx / OE input voltage VIL V 0.85 - 19 0.8VDD - VDD GND - 0.2VDD RUP Pull-up resistor for OE pin - 300 - RDW Pull-down resistor for SWx pins - 310 - REXT External current set-up resistance 0.19 - 3.9 - 7 8 - 14 16 IDD(OFF1) OUT0 to 7 = OFF Supply current (OFF) IDD(OFF2) REXT = 190 Ω OUT0 to 7 = OFF Supply current (ON) - 14 16 VO from 1 V to 3 V; - 0.1 - VO = 1.4 V KΩ mA REXT = 190 Ω IDD(ON) Unit OUT0 to 7 = ON %/dVO Output current vs. outputvoltage regulation %/dVDD Output current vs. supply voltage regulation (1) (4) VDD from 3 V to 5.5 V - 1 - ∆IOL Output current precision: device to device (1) VO = 0.3 V; REXT = 3.9 kΩ - - ±6 VO = 0.7 V - ±1.5 ±4 VO = 1.4 V; REXT = 190 Ω - ±1.2 ±4 VO = 19 V OUTn = OFF - 0.5 2 ∆IOL1 ∆IOL2 (1) (3) Output current precision: channel to channel (1) (5) |%/V| % % IOleak Single output leakage current Tsd Thermal shutdown (6) 170 °C Tsd_hys Thermal shutdown hysteresis (6) 15 °C µA 1. Test with just one output ON. 2. Minimum regulation voltage @ IO = 50 mA. 3. 4. Δ % /V = Δ % /V = Ion@Von3.0V − Ion@Von1.0V × 3100 −1 Ion@Von = 1.0V Ion@VDD = 5.5V − Ion@VDD = 3.0V × 100 5.5 − 3.0 Ion@VDD = 3.0V 5. ((IOn – IOavg0-7)/ IOavg0-7) x 100. 6. Not tested in production. DS12963 - Rev 3 page 5/20 LED8102S Switching characteristics 5 Switching characteristics VDD = 5 V, Tj = 25 °C, IO = 50 mA, RL = 60 Ω, CL = 10 pF, VL = 5 V, unless otherwise specified. Table 5. Switching characteristics Symbol tPLH1 tPLH2 tPHL1 tPHL2 tON tOFF Parameter Conditions Min. Typ. Max. SWx – OUTn Propagation delay time VDD = 3.3 V - 220 500 (OE just “0”) (“L” to “H”) VDD = 5 V - 200 500 OE - OUTn Propagation delay time VDD = 3.3 V - 90 250 (SWx just “1”) (“L” to “H”) VDD = 5 V - 100 250 SWx – OUTn Propagation delay time VDD = 3.3 V - 100 250 (OE just “0”) (“H” to “L”) VDD = 5 V - 100 250 OE - OUTn Propagation delay time VDD = 3.3 V - 220 500 (SWx just “1”) (“H” to “L”) VDD = 5 V - 220 500 OUTn Current rise time. VDD = 3.3 V - 430 600 Evaluated as OUTn falling time VDD = 5 V - 400 600 OUTn current fall time. VDD = 3.3 V - 430 600 Evaluated as OUTn rising time VDD = 5 V - 400 600 Unit ns Figure 3. tON - tOFF time evaluation 90% OUTn 90% 10% tON IOUTn DS12963 - Rev 3 10% tOFF ON OFF page 6/20 LED8102S Switching characteristics Figure 4. tPLH - tPHL time evaluation 50% 50% SWn tPHL1 tPLH1 90% OUTn 10% tPHL2 OE DS12963 - Rev 3 tPLH2 50% 50% page 7/20 LED8102S Internal block diagram 6 Internal block diagram Inputs OE and SWx terminals have pull-up and pull-down connection respectively: Figure 5. OE Terminal VDD 300 KW OE 1 KW GND Figure 6. SWx Terminals VDD 1 KW SWx 300 KW GND DS12963 - Rev 3 page 8/20 LED8102S The switch output control 7 The switch output control All switch inputs (SWx) are pulled down by a 300 kΩ. If the generic SWx pin is left floating or connected to GND or polarized at low logic level, the corresponding outputs will be in OFF condition. If SWx pin is connected to VDD or polarized at high logic level, the corresponding outputs will be in ON condition. See below the complete truth table: Table 6. Switches output control Switch inputs Outputs controlled (ON/OFF) SW1 OUT0 and OUT1 simultaneously SW2 OUT2 and OUT3 simultaneously SW3 OUT4 and OUT5 simultaneously SW4 OUT6 and OUT7 simultaneously Table 7. Switches versus output truth table DS12963 - Rev 3 SW4 SW3 SW2 SW1 OE Out0 Out1 Out2 Out3 Out4 Out5 Out6 Out7 0 0 0 0 x off off off off off off off off 0 0 0 1 0 on on off off off off off off 0 0 1 0 0 off off on on off off off off 0 0 1 1 0 on on on on off off off off 0 1 0 0 0 off off off off on on off off 0 1 0 1 0 on on off off on on off off 0 1 1 0 0 off off on on on on off off 0 1 1 1 0 on on on on on on off off 1 0 0 0 0 off off off off off off on on 1 0 0 1 0 on on off off off off on on 1 0 1 0 0 off off on on off off on on 1 0 1 1 0 on on on on off off on on 1 1 0 0 0 off off off off on on on on 1 1 0 1 0 on on off off on on on on 1 1 1 0 0 off off on on on on on on 1 1 1 1 0 on on on on on on on on x x x x 1 off off off off off off off off page 9/20 LED8102S LED current settings 8 LED current settings The current drawn each OUTn channel is set by RSET resistor value according to the following formula: IOUT = 1.2/Rext * 16 Driver headroom voltage In order to correctly regulate the channel current, a minimum output voltage (VHEADROOM) across each current generator must be guaranteed. Figure 7, shows the minimum VHEADROOM slightly less than the target value (output MOS transistor in triode region). If the VHEADROOM is lower than the minimum recommended, the regulation of a current is lower than the expected one. However an excess of VHEADROOM increases the power dissipation. Figure 7. Minimum Vheadroom vs. IOUT (TJ = 25 °C) 120 Iout [mA] 100 80 60 40 20 0 0 200 400 600 800 1000 1200 Vheadroom min. [mV] DS12963 - Rev 3 page 10/20 LED8102S Typical application 9 Typical application Figure 8. Typical application circuit Typical application circuit The figure above shows a typical application schematic for ALED8102S, Cled value depends on common rail voltage connection length and driver total output current, typically it is around 47 µF; Cin is about 1 µF; current setting resistor depends on outputs current set (ex. with REXT = 386 Ω → IO ≈ 50 mA). The external programming resistor between R-EXT and GND should be connected as close as possible to the device. To have proper device functionality it is strongly suggested to follow a correct power-up sequence: VDD and VLED power supplies must be provided simultaneously or at least, VDD must be connected before VLED to activate all internal digital control blocks earlier than LEDs power supply. If VLED anticipates driver VDD, this could result in a visible flash on connected LEDs (output stage undesired activation). Device thermal management The aim of this section is just to provide some recommendation that can be useful in designing the application PCB for a better power dissipation: • To decrease the device working temperature it is necessary solder the package exposed pad to the board. • For better thermal performances at least a 4 layers (e.g. 2S2P) PCB should be used. • The copper area below the package thermal pad should be enlarged as much as possible also outside the package perimeter (using the package sides without pins) • A reasonable number of vias must connect the copper area below the package to all available PCB layers especially just below the device package (e.g. 3x3 or 4x3 vias array) but also outside package perimeter. Smaller and closely spaced vias is a good solution. Best implementation is represented by copper filled vias. • On each inner layers a copper area must be provided for dissipation (wider it's better, if possible at least 4 times or more the package dimensions). A good condition is to have at least a power layer as an entire copper area (e.g. GND layer) • Traces for pins connection must be enlarged as much as layout constrains allow • Several devices in power dissipation on the same board must be adequately spaced. Figure 3 shows, once the maximum power dissipation is fixed, which ambient temperature range can be covered according to maximum junction temperature and package thermal resistance: 37.5 °C/W for HTSSOP16 on Jedec PCB (2S2P) and conditions. With same thermal resistance, figure 4 shows the junction temperature as a function of ambient temperature considering 1 W of power dissipation. DS12963 - Rev 3 page 11/20 LED8102S Typical application Figure 9. Power dissipation rating vs ambient temperature (Rth = 37.5 °C/W; Tj = 125 °C) 5.00 4.50 4.00 Tj=125 °C Rth=37.5 °C/W Pd [ W ] 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 -40 -20 0 20 40 60 80 100 120 140 Ta [ °C ] Figure 10. Junction temperature vs ambient temperature (Rth = 37.5°C/W; Pd = 1 W) 140 120 Tj [ °C/W ] 100 80 Pd=1W Rth=37.5 °C/W 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 Ta [ °C ] DS12963 - Rev 3 page 12/20 LED8102S Package information 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS12963 - Rev 3 page 13/20 LED8102S HTSSOP16 package information 10.1 HTSSOP16 package information Figure 11. HTSSOP16 exposed pad package outline 7419276_B Table 8. HTSSOP16 exposed pad mechanical data Dim. mm. Min. Max A 1.20 A1 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 4.90 5.00 5.10 D1 2.80 3.00 3.20 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 E2 2.80 3.00 3.20 e L k aaa 1.00 1.05 0.65 0.45 L1 DS12963 - Rev 3 Typ. 0.60 0.75 1.00 0.00 8.00 0.10 page 14/20 LED8102S HTSSOP16 packing information 10.2 HTSSOP16 packing information Figure 12. HTSSOP16 tape and reel outline Table 9. HTSSOP16 tape and reel mechanical data Dim. mm. Min. A Max. 330 C 12.8 D 20.2 N 60 T DS12963 - Rev 3 Typ. 13.2 22.4 Ao 6.7 6.9 Bo 5.3 5.5 Ko 1.6 1.8 Po 3.9 4.1 P 7.9 8.1 page 15/20 LED8102S Revision history Table 10. Document revision history Date Revision 29-Apr-2019 1 06-Apr-2020 2 Changes First release. Minor text changed in description on the cover page. Updated footnote (4). Updated: 26-Feb-2021 3 - Features and description on the cover page. - Figure 1 and Figure 7. - Table 2, Table 3, Switching characteristics and Section 8 . DS12963 - Rev 3 page 16/20 LED8102S Contents Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Simplified internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 LED current settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9 Typical application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 10 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 10.1 HTSSOP16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 10.2 HTSSOP16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 DS12963 - Rev 3 page 17/20 LED8102S List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Pin description. . . . . . . . . . . . . . . . . . . . Absolute maximum ratings . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . Electrical characteristics . . . . . . . . . . . . . Switching characteristics. . . . . . . . . . . . . Switches output control. . . . . . . . . . . . . . Switches versus output truth table . . . . . . HTSSOP16 exposed pad mechanical data HTSSOP16 tape and reel mechanical data Document revision history . . . . . . . . . . . . DS12963 - Rev 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 4 . 4 . 5 . 6 . 9 . 9 14 15 16 page 18/20 LED8102S List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. DS12963 - Rev 3 Pinout for HTSSOP16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LED8102S simplified block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tON - tOFF time evaluation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPLH - tPHL time evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OE Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SWx Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Minimum Vheadroom vs. IOUT (TJ = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power dissipation rating vs ambient temperature (Rth = 37.5 °C/W; Tj = 125 °C) Junction temperature vs ambient temperature (Rth = 37.5°C/W; Pd = 1 W) . . . . . HTSSOP16 exposed pad package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . HTSSOP16 tape and reel outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 3 . 6 . 7 . 8 . 8 10 11 12 12 14 15 page 19/20 LED8102S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS12963 - Rev 3 page 20/20