LET9070CB

LET9070CB RF power transistor from the LdmoST family of N-channel enhancement-mode lateral MOSFETs Datasheet - production data Features • Excellent thermal stability • Common source configuration • POUT (@ 28 V)= 70 W with 17 dB gain @ 945 MHz • BeO free package M243 epoxy sealed • In compliance with the 2002/95/EC European directive • Bidirectional ESD Description Figure 1. Pin out 1 3 The LET9070CB is a common source N-channel enhancement mode lateral field-effect RF power transistor designed for broadband commercial and industrial applications at frequencies up to 1.0 GHz. The LET9070CB is designed for high gain and broadband performance operating in common source mode at 28 V. It is ideal for base station applications requiring high linearity. 2 1. Drain 2. Gate 3. Source Table 1. Device summary Order code Package Branding LET9070CB M243 LET9070CB July 2013 This is information on a product in full production. DocID023782 Rev 2 1/14 www.st.com 14 Contents LET9070CB Contents 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 DocID023782 Rev 2 LET9070CB 1 Maximum ratings Maximum ratings Table 2. Absolute maximum ratings (TCASE = 25 °C) Symbol Parameter Value Unit V(BR)DSS Drain-source voltage 80 V VGS Gate-source voltage -10 to +15 V Drain current 12 A Power dissipation (@ TC = 70 °C) 130 W Max. operating junction temperature 200 °C -65 to +150 °C Value Unit 1.0 °C/W ID PDISS TJ TSTG Storage temperature Table 3. Thermal data Symbol Rth(JC) Parameter Junction-case thermal resistance DocID023782 Rev 2 3/14 Electrical characteristics 2 LET9070CB Electrical characteristics (TC = 25 °C) Table 4. Static Symbol Test conditions Min. Typ. Max. Unit V(BR)DSS VGS = 0; IDS = 10 mA IDSS VGS = 0; VDS = 28 V 1 μA IGSS VGS = 5; VDS = 0 1 μA 5.0 V 1.2 V 80 V VGS(Q) VDS = 28; ID = 100 mA 2.0 VDS(ON) VGS = 10 V; ID = 3 A GFS VDS = 10 V; ID = 3 A CISS VGS = 0; VDS = 28 V; f = 1 MHz 78 pF COSS VGS = 0; VDS = 28 V; f = 1 MHz 42 pF CRSS VGS = 0; VDS = 28 V; f = 1 MHz 2.7 pF 0.8 2.5 mho Table 5. Dynamic Symbol POUT VDD = 28 V; IDQ = 400 mA; PIN = 2.5 W; f = 945 MHz GPS VDD = 28 V; IDQ = 400 mA; POUT = 70 W; f = 945 MHz hD Load mismatch 4/14 Test conditions VDD = 28 V; IDQ = 400 mA; PIN = 2.5 W; f = 945 MHz VDD = 35 V; IDQ = 400 mA; POUT = 100 W; f = 945 MHz All phase angles DocID023782 Rev 2 Min. Typ. 70 80 W 17 dB 65 % 20:1 VSWR 60 Max. Unit LET9070CB 3 Impedance data Impedance data Figure 2. Impedance data D ZDL Typical drain load Typical input G Zin S Table 6. Impedance data Frequency ZIN (Ω) ZLOAD (Ω) 100 0.456 -j19.309 3.851 +j0.242 150 0.458 -j12.682 3.791 +j0.353 200 0.464 -j9.320 3.711 +j0.452 250 0.474 -j7.259 3.613 +j0.537 300 0.484 -j5.859 3500 +j0.605 350 0.492 -j4.832 3.376 +j0.655 400 0.500 -j4.038 3.243 +j0.687 450 0.507 -j3.401 3.106 +j0.700 500 0.515 -j2.873 2.966 +j0.697 550 0.525 -j2.423 2.826 +j0.676 600 0.534 -j2.035 2.688 +j0.640 650 0.542 -j1.692 2.553 +j0.591 700 0.549 -j1.394 2.422 +j0.529 750 0.556 -j1.117 2.297 +j0.456 800 0.563 -j0.864 2.178 +j0.373 850 0.570 -j0.629 2.065 +j0.282 900 0.577 -j0.410 1.958 +j0.184 950 0.585 -j0.204 1.857 +j0.079 1000 0.592 -j0.009 1.762 -j0.03 1050 0.613 +j0.172 1.673 -j0.145 1100 0.621 +j0.347 1.590 -j0.264 1150 0.628 +j0.516 1.513 -j0.386 DocID023782 Rev 2 5/14 Impedance data LET9070CB Table 6. Impedance data (continued) 6/14 Frequency ZIN (Ω) ZLOAD (Ω) 1200 0.633 +j0.680 1.440 -j0.510 1250 0.639 +j0.839 1.373 -j0.637 1300 0.644 +j0.995 1.309 -j0.766 1350 0.648 +j1.148 1.250 -j0.897 1400 0.653 +j1.299 1.195 -j1.030 1450 0.657 +j1.448 1.144 -j1.164 1500 0.660 +j1.597 1.096 -j1.299 1550 0.664 +j1.744 1.051 -j1.436 1600 0.667 +j1.891 1.010 -j1.574 1650 0.670 +j2.038 0.971 -j1.712 1700 0.673 +j2.184 0.934 -j1.852 1750 0.677 +j2.331 0.900 -j1.993 1800 0.680 +j2.478 0.868 -j2.136 1850 0.684 +j2.625 0.838 -j2.279 1900 0.688 +j2.773 0.810 -j2.423 1950 0.692 +j2.921 0.784 -j2.569 2000 0.696 +j3.070 0.759 -j2.716 DocID023782 Rev 2 LET9070CB 4 Typical performance Typical performance Figure 3. DC output characteristics gipd080720131041FSR ID (A) 10V gipd080720131148FSR C (pF) 8V 9V 12 Figure 4. Capacitance variation 10 7V 100 Ciss Coss 8 6 6V 10 4 Crss 2 0 0 VGS= 5V 4 2 6 8 10 12 14 16 Figure 5. Gain vs output power, freq = 945 MHz, Vdd = 28 V gipd080720131127FSR Gain (dB) 1 0 VDS(V) 20 10 Figure 6. Gain and efficiency vs output power, freq = 945 MHz, Vdd = 28 V, Idq= 0.4 A gipd080720131136FSR Gain (dB) Efficiency 22 22 Idq = 0.2A Idq = 0.4A VDS(V) 30 70 Idq = 0.6A 20 20 18 16 16 14 14 12 12 50 10 0 20 40 60 80 Output power(W) 10 0 DocID023782 Rev 2 40 Efficiency (%) 18 60 Gain 30 20 40 60 80 20 Output power(W) 7/14 Typical performance LET9070CB Figure 7. Gain vs output power, freq = 945 MHz, Idq = 0.4 A gipd080720131155FSR Gain (dB) 22 Vdd = 24V Vdd = 26V Vdd = 28V Vdd = 30V Figure 8. Gain and efficiency vs output power, freq = 945 MHz, Vdd = 32 V, Idq= 0.4 A gipd080720131208FSR Gain (dB) Vdd = 32V 20 Efficiency 22 80 70 20 60 18 18 50 16 16 40 14 14 30 12 12 20 10 0 20 40 60 80 100 Output power(W) Figure 9. Output power vs supply voltage, freq = 945 MHz, Idq = 0.4 A gipd080720131447FSR Pout (W) Pin = 1W Pin = 1.3W Pin = 1.6W Pin = 2W Pin = 3W 120 110 100 90 80 70 60 50 40 22 8/14 24 26 28 30 32 VDD(V) DocID023782 Rev 2 10 0 20 40 60 80 Efficiency (%) Gain 10 100 Output power(W) LET9070CB 5 Test circuit Test circuit Figure 10. Test circuit schematic R2 FB1 VGG FB4 VDD C1 FB2 R1 FB3 R3 L2 C10 C2 TL1 C3 L1 C6 TL6 TL2 C11 TL3 TL4 C4 TL5 TL7 DUT TL8 TL9 TL10 C7 C9 TL11 C8 C5 GIPD080720131400FSR Table 7. Test circuit component part list Item Qty Part number Vendor Description R1, R2 2 CR1206-8W-112JB VENKEL 1.5 K OHM, 1/8W surface mount chip resistor R3 1 CR1206-8W-100JB VENKEL 0 OHM, 1/8W surface mount chip resistor Coil (L1&L2) 2 1812SMS-33NJ Coilcraft 33 nH coil B1,B2,B3,B4 5 2743021447 FAIR-RITE CORP C1 1 C2, C3, C9, C10 4 C4, C8 2 C5 1 ATC100B3R6 ATC 3.6pF Chip Capacitor C6 1 ATC100B100 ATC 10pF Chip Capacitor C7 1 C11 1 Surface Mount EMI Sheild Bead 100uF, 63V Electrolytic Capacitor ATC100B470 ATC JOHANSON JOHANSON 47 pF Chip Capacitor 0.8-8pF Giga Trim Variable Capacitor 0.6-4.5pF Giga Trim Variable Capacitor 330μF, 50V Electrolytic Capacitor TL1 L= 1.350in W=0.082in TL2 L= 0.234in W=0.082in TL3 L= 0.234in W=0.082in TL4 L= 0.277in W=0.323in DocID023782 Rev 2 9/14 Test circuit LET9070CB Table 7. Test circuit component part list (continued) Item Qty Part number Vendor Description TL5 L=0.207 in W=0.506in TL6 L= 0.208in W=0.506in TL7 L= 0.137in W=0.324in TL8 L= 0.137in W=0.324in TL9 L= 0.150in W=0.082in TL10 L= 0.320in W=0.082in TL11 L= 1.350in W=0.082in Board 3X5 1 Er=2.55 t=2 Oz H=0.030in Rogers Corp Figure 11. Test circuit B1 + C1 R1 B2 R2 B4 R3 + B5 C11 C10 C6 C2 C3 TL2 TL1 TL8 TL7 L1 TL3 TL4 TL5 L2 TL9 TL6 C9 TL10 TL11 C4 C5 C STMicroelectronics, Inc. LET9070CB LOG xxxx REV INPUT C7 C8 C STMicroelectronics, Inc. LET9070CB LOG xxxx REV OUTPUT GIPD080720131328FSR 10/14 DocID023782 Rev 2 LET9070CB 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID023782 Rev 2 11/14 Package mechanical data LET9070CB Table 8. M243 (.230 x .360 2L N/HERM W/FLG) mechanical data Dim. mm. Min. Inch Typ. Max. Min. Typ. Max. A 5.21 5.72 0.205 0.225 B 5.46 6.48 0.215 0.255 C 5.59 6.10 0.220 0.240 D 14.27 0.562 E 20.07 20.57 0.790 0.810 F 8.89 9.40 0.350 0.370 G 0.10 0.15 0.004 0.006 H 3.18 4.45 0.125 0.175 I 1.83 2.24 0.072 0.088 J 1.27 1.78 0.050 0.070 Figure 12. M243 (.230 x .360 2L N/HERM W/FLG) package dimensions(a) 2xA .107/2.72x45° 1 2xA (2x).130/3.30 DIA 4x45° C 2x.045/1.14 Max optional 3 2 D E F 2xG J 2xI H 1022142_Rev_E a. Controlled dimensions are in inches. 12/14 DocID023782 Rev 2 LET9070CB 7 Revision history Revision history Table 9. Document revision history Date Revision Changes 12-Oct-2012 1 Initial release. 08-Jul-2013 2 Updated features in cover page and Table 5: Dynamic. Added Section 4: Typical performance and Section 5: Test circuit. DocID023782 Rev 2 13/14 LET9070CB Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 DocID023782 Rev 2