LIS2HH12
MEMS digital output motion sensor:
ultra-low-power high-performance 3-axis "pico" accelerometer
Datasheet - production data
Description
The LIS2HH12 is an ultra-low-power highperformance three-axis linear accelerometer
belonging to the “pico” family.
The LIS2HH12 has full scales of 2g/4g/8g and
is capable of measuring accelerations with output
data rates from 10 Hz to 800 Hz.
LGA-12 (2.0x2.0x1.0 mm)
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
Features
Wide supply voltage, 1.71 V to 3.6 V
Independent IOs supply (1.8 V) and supply
voltage compatible
Ultra-low power consumption
The LIS2HH12 has an integrated first-in, first-out
(FIFO) buffer allowing the user to store data in
order to limit intervention by the host processor.
The LIS2HH12 is available in a small thin plastic
land grid array package (LGA) and it is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C
2g/4g/8g full-scale
I2C/SPI digital output interface
16-bit data output
Embedded temperature sensor
Table 1. Device summary
Embedded self-test
Order codes
Embedded FIFO
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Temperature
Package Packaging
range [C]
LIS2HH12
-40 to +85
LGA-12
Tray
LIS2HH12TR
-40 to +85
LGA-12
Tape and
reel
Applications
Motion-controlled user interfaces
Gaming and virtual reality
Pedometers
Intelligent power saving for handheld devices
Display orientation
Click/double-click recognition
Impact recognition and logging
Vibration monitoring and compensation
December 2015
This is information on a product in full production.
DocID025344 Rev 5
1/47
www.st.com
Contents
LIS2HH12
Contents
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4.1
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4.2
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6
Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6.1
Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6.2
Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6.3
Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.7
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.8
IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1
5
2/47
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1
Activity/Inactivity function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2
Data stabilization time / ODR change . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3
FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3.1
Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3.2
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3.3
Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3.4
Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.3.5
Bypass-to-Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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5.3.6
Bypass-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.3.7
Retrieving data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.3.8
FIFO multiple reads (burst) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1
I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1.1
6.2
I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.2.1
SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.2.2
SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.2.3
SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7
Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.1
TEMP_L (0Bh), TEMP_H (0Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.2
WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.3
ACT_THS (1Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.4
ACT_DUR (1Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.5
CTRL1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.6
CTRL2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.7
CTRL3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.8
CTRL4 (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.9
CTRL5 (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.10
CTRL6 (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.11
CTRL7 (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.12
STATUS (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.13
OUT_X_L (28h) - OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.14
OUT_Y_L (2Ah) - OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.15
OUT_Z_L (2Ch) - OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.16
FIFO_CTRL (2Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.17
FIFO_SRC (2Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.18
IG_CFG1 (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8.19
IG_SRC1 (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8.20
IG_THS_X1 (32h), IG_THS_Y1 (33h), IG_THS_Z1 (34h) . . . . . . . . . . . . 40
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8.21
IG_DUR1 (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.22
IG_CFG2 (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.23
IG_SRC2 (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.24
IG_THS2 (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.25
IG_DUR2 (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.26
XL_REFERENCE (3Ah), XH_REFERENCE (3Bh) . . . . . . . . . . . . . . . . . 42
8.27
YL_REFERENCE (3Ch), YH_REFERENCE (3Dh) . . . . . . . . . . . . . . . . . 42
8.28
ZL_REFERENCE (3Eh), ZH_REFERENCE (3Fh) . . . . . . . . . . . . . . . . . . 42
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
9.1
LGA-12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
9.2
LGA-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DocID025344 Rev 5
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mechanical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted . . . . . . . . . 10
Electrical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted . . . . . . . . . . . 11
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Activity/Inactivity function control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Number of samples to be discarded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
I2C terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SAD+Read/Write patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 25
Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 25
Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
WHO_AM_I register default values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
ACT_THS register default values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
ACT_DUR register default values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Control register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Control register 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
ODR register setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Low-pass cutoff frequency in high resolution mode (HR = 1) . . . . . . . . . . . . . . . . . . . . . . . 32
Control register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Control register 2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Control register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Control register 3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Control register 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Control register 4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Control register 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Control register 5 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Self-test mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Control register 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Control register 6 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Control register 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Control register 7 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Status register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
FIFO control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO control register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO mode selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIFO status register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
IG_CFG1 configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
IG_CFG1 configuration register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
IG1_SRC1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
DocID025344 Rev 5
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List of tables
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
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IG1_SRC1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
IG1_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG1_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG_DUR1 duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG_DUR1 duration description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG_CFG2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG_CFG2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
IG_SRC2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_SRC2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_THS2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_THS2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_DUR2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_DUR2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
LGA-12 2x2x1 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Reel dimensions for carrier tape of LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DocID025344 Rev 5
LIS2HH12
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C slave timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
LIS2HH12 electrical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
FIFO multiple reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
LGA-12 2x2x1 package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Carrier tape information for LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
LGA-12 package orientation in carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Reel information for carrier tape of LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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47
Block diagram and pin description
LIS2HH12
1
Block diagram and pin description
1.1
Block diagram
Figure 1. Block diagram
X+
Y+
a
CS
CHARGE
AMPLIFIER
Z+
CONTROL
LOGIC
SDA/SDI/SDO
A/D
CONVERTER1
MUX
SCL/SPC
I2C
SPI
SDO/SA0
ZYX-
INT1
TEMP. SENSOR
SELF TEST
1.2
REFERENCE
INT2
A/D
CONVERTER2
TRIMMING
CIRCUITS
FIFO
CLOCK
Pin description
11
12
12
11
SDA/SDI/SDO
4 CS
5
5
(BOTTOM VIEW)
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
8/47
4
6
(BOTTOM VIEW)
(TOP VIEW)
DocID025344 Rev 5
SCL/SPC
1 CSSCL/SPC
7
X
Pin 1 indicator
1
SDO/SA0
SDO/SA0
Vdd 8
7
GND
Y
14
INT1
RES
INT2
RES
Vdd
RES
GND
GND
1
10
GND
Vdd_IO
Vdd_IO
RES
INT 1
RES
Z
INT 2
RES
Figure 2. Pin connections
SDA/SDI/SDO
LIS2HH12
Block diagram and pin description
Table 2. Pin description
Pin#
Name
1
SCL
SPC
Function
I2C serial clock (SCL)
SPI serial port clock (SPC)
SPI enable
I2C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I2C disabled)
2
CS
3
SDO
SA0
SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)
4
SDA
SDI
SDO
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
5
RES
Connect to GND
6
GND
0 V supply
7
GND
0 V supply
8
GND
0 V supply
9
Vdd
Power supply
10
Vdd_IO
11
INT2
Interrupt pin 2
12
INT1
Interrupt pin 1
Power supply for I/O pins
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47
Mechanical and electrical specifications
LIS2HH12
2
Mechanical and electrical specifications
2.1
Mechanical characteristics
Table 3. Mechanical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted (1)
Symbol
FS
So
Parameter
Measurement range
Test conditions
Min.
Max.
Unit
±2.0
g
±4.0
g
±8.0
g
@ FS ±2.0 g
0.061
mg/digit
@ FS ±4.0 g
0.122
mg/digit
@ FS ±8.0 g
0.244
mg/digit
(3)
Sensitivity
Typ.(2)
TCSo
Sensitivity change vs.
temperature
0.01
%/°C
TyOff
Typical zero-g level
offset accuracy(4)
±30
mg
TCOff
Zero-g level change
vs. temperature(4)
Delta from 25 °C
±0.25
mg/°C
Ton
Turn-on time
Number of samples to be discarded
from power-down to active mode
CTRL4 (23h) (BW_SCALE_ODR) = 0
ST
Self-test positive
difference(5)
70
1500
mg
Top
Operating
temperature range
-40
+85
°C
# of
samples
1
1. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
2. Typical specifications are not guaranteed.
3. Verified by wafer level test and measurement of initial offset and sensitivity.
4. Offset can be eliminated by enabling the built-in high-pass filter.
5. “Self-test positive difference” is defined as: OUTPUT[mg](CTRL5 ST2, ST1 bits=01) - OUTPUT[mg](CTRL5 ST2, ST1 bits=00).
10/47
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LIS2HH12
2.2
Mechanical and electrical specifications
Electrical characteristics
Table 4. Electrical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted (1)
Symbol
Vdd
Vdd_IO
IddA
IddPdn
Parameter
Test conditions
Supply voltage
I/O pins supply voltage
(3)
Max.
Unit
1.71
2.5
3.6
V
Vdd+0.1
V
ODR 100-800 Hz
180
μA
ODR 50 Hz
110
μA
ODR 10 Hz
50
μA
5
μA
Current consumption in
power-down mode
Digital high-level input voltage
VIL
Digital low-level input voltage
Top
Typ.(2)
1.71
Current consumption
in active mode
VIH
Tboot
Min.
Boot time
0.8*Vdd_IO
V
0.2*Vdd_IO
V
20
ms
+85
°C
(4)
Operating temperature range
-40
1. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
2. Typical specifications are not guaranteed.
3. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the
measurement chain is powered off.
4. Time to complete the entire boot sequence: from Vdd on until all configuration and calibration parameters are correctly
loaded into device registers.
2.3
Temperature sensor characteristics
@ Vdd =2.5 V, T=25 °C unless otherwise noted
Table 5. Temperature sensor characteristics
Symbol
Parameter
Min.
Typ.(1)
Max.
Unit
TSDr
Temperature sensor output change
vs. temperature
8
digit/°C(2)
TODR
Temperature refresh rate
10
Hz
Top
Operating temperature range
-40
+85
°C
1. Typical specifications are not guaranteed.
2. 11-bit resolution.
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47
Mechanical and electrical specifications
LIS2HH12
2.4
Communication interface characteristics
2.4.1
SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6. SPI slave timing values
Value(1)
Symbol
Parameter
Unit
Min
tc(SPC)
SPI clock cycle
fc(SPC)
SPI clock frequency
tsu(CS)
CS setup time
6
th(CS)
CS hold time
8
tsu(SI)
SDI input setup time
5
th(SI)
SDI input hold time
15
tv(SO)
SDO valid output time
th(SO)
SDO output hold time
tdis(SO)
SDO output disable time
Max
100
ns
10
MHz
ns
50
9
50
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3. SPI slave timing diagram
CS
tc(SPC)
tsu(CS)
th(CS)
SPC
tsu(SI)
SDI
th(SI)
LSB IN
M SB IN
tv(SO)
SDO
Note:
12/47
tdis(SO)
th(SO)
M SB OUT
LSB O UT
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.
DocID025344 Rev 5
LIS2HH12
Mechanical and electrical specifications
I2C - inter-IC control interface
2.4.2
Subject to general operating conditions for Vdd and Top.
Table 7. I2C slave timing values
Symbol
f(SCL)
I2C standard mode (1)
Parameter
SCL clock frequency
I2C fast mode (1)
Min
Max
Min
Max
0
100
0
400
tw(SCLL)
SCL clock low time
4.7
1.3
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
th(SDA)
SDA data hold time
0.01
3.45
START condition hold time
4
0.6
tsu(SR)
Repeated START condition
setup time
4.7
0.6
tsu(SP)
STOP condition setup time
4
0.6
4.7
1.3
tw(SP:SR)
Bus free time between STOP
and START condition
kHz
μs
ns
0.01
th(ST)
Unit
0.9
μs
μs
1. Data based on standard I2C protocol requirement, not tested in production
Figure 4. I2C slave timing diagram
REPEATED
START
START
tsu(SR)
START
tw(SP:SR)
SDA
tsu(SDA)
th(SDA)
tsu(SP)
STOP
SCL
th(ST)
Note:
tw(SCLL)
tw(SCLH)
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
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Mechanical and electrical specifications
2.5
LIS2HH12
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8. Absolute maximum ratings
Symbol
Vdd
Vdd_IO
Vin
Note:
Ratings
Maximum value
Unit
Supply voltage
-0.3 to 4.8
V
I/O pins supply voltage
-0.3 to 4.8
V
-0.3 to Vdd_IO +0.3
V
3000 for 0.5 ms
g
10000 for 0.2 ms
g
3000 for 0.5 ms
g
10000 for 0.2 ms
g
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
APOW
Acceleration (any axis, powered, Vdd = 2.5 V)
AUNP
Acceleration (any axis, unpowered)
TOP
Operating temperature range
-40 to +85
°C
TSTG
Storage temperature range
-40 to +125
°C
ESD
Electrostatic discharge protection
2 (HBM)
kV
Supply voltage on any pin should never exceed 4.8 V
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can
cause permanent damage to the part.
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LIS2HH12
2.6
Mechanical and electrical specifications
Terminology and functionality
Terminology
2.6.1
Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the Earth, noting the output value, rotating
the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and time. The sensitivity tolerance describes the
range of sensitivities of a large population of sensors.
2.6.2
Zero-g level
Zero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal
output signal if no acceleration is present. A sensor in a steady state on a horizontal surface
will measure 0 g on the X-axis and 0 g on the Y-axis whereas the Z-axis will measure 1 g.
The output is ideally in the middle of the dynamic range of the sensor (content of OUT
registers 00h, data expressed as two’s complement number). A deviation from ideal value in
this case is called Zero-g offset. Offset is to some extent a result of stress to the MEMS
sensor and therefore the offset can slightly change after mounting the sensor onto a printed
circuit board or exposing it to extensive mechanical stress. Offset changes little over
temperature, see “Zero-g level change vs. temperature”. The Zero-g level tolerance (TyOff)
describes the standard deviation of the range of Zero-g levels of a population of sensors.
Functionality
2.6.3
Self-test
The self-test allows checking the sensor functionality without moving it. The self-test
function is off when the self-test bits (ST) are programmed to ‘00‘. When the self-test bits are
changed, an actuation force is applied to the sensor, simulating a definite input acceleration.
In this case the sensor outputs will exhibit a change in their DC levels which are related to
the selected full scale through the device sensitivity. When the self-test is activated, the
device output level is given by the algebraic sum of the signals produced by the acceleration
acting on the sensor and by the electrostatic test-force. If the output signals change within
the amplitude specified in Table 3, then the sensor is working properly and the parameters
of the interface chip are within the defined specifications.
2.7
Sensing element
A proprietary process is used to create a surface micromachined accelerometer. The
technology allows processing suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. In order to be compatible with the traditional packaging techniques, a cap is
placed on top of the sensing element to avoid blocking the moving parts during the molding
phase of the plastic encapsulation.
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Factory calibration
LIS2HH12
When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the capacitor.
At steady-state the nominal value of the capacitors are a few pF and when an acceleration
is applied, the maximum variation of the capacitive load is in the fF range.
2.8
IC interface
The complete measurement chain is composed of a low-noise capacitive amplifier which
converts the capacitive unbalancing of the MEMS sensor into an analog voltage using an
analog-to-digital converter.
The acceleration data may be accessed through an I2C/SPI interface thus making the
device particularly suitable for direct interfacing with a microcontroller.
The LIS2HH12 features a data-ready signal which indicates when a new set of measured
acceleration data is available, thus simplifying data synchronization in the digital system that
uses the device.
3
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (TyOff).
The trim values are stored inside the device in nonvolatile memory. Any time the device is
turned on, the trimming parameters are downloaded into the registers to be used during the
active operation. This allows using the device without further calibration.
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LIS2HH12
4
Application hints
Application hints
Figure 5. LIS2HH12 electrical connections
Vdd_IO
100nF
SCL/SPC
1
INT 1
INT 2
Vdd
11
10μF
12
10
CS
Vdd_IO
Vdd
SDO/SA0
GND
4
RES
5
6
7
GND
GND
SDA/SDI/SDO
100nF
GND
Digital signal from/to signal controller.Signal levels are defined by proper selection of Vdd_IO
The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should
be placed as near as possible to pin 9 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd while maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data are selectable and
accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high (i.e.
connected to Vdd_IO).
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be
completely programmed by the user through the I2C/SPI interface.
4.1
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
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Digital main blocks
LIS2HH12
5
Digital main blocks
5.1
Activity/Inactivity function
The Activity/Inactivity recognition function allows reducing the power consumption of the
system in order to develop new smart applications.
When the Activity/Inactivity recognition function is activated, the LIS2HH12 is able to
automatically go to 10Hz sampling rate and to wake up as soon as the interrupt event has
been detected, increasing the output data rate and bandwidth.
With this feature the system may be efficiently switched from low-power mode to full
performance depending on user-selectable positioning and acceleration events, thus
ensuring power saving and flexibility.
The Activity/Inactivity recognition function is activated by writing the desired threshold in the
ACT_THS (1Eh) register. The high-pass filter is automatically enabled.
Table 9. Activity/Inactivity function control registers
Register
LSB value
ACT_THS
Full scale / 128 [mg]
ACT_DUR
8/ODR [s]
When the acceleration falls below the threshold for a duration of at least (8 ACT_DUR
+1)/ODR, the CTRL1 (20h) (ODR [2:0]) bits of CTRL1 are bypassed (Inactivity) and
internally set to 10Hz (ODR [2:0] = 001), but the content of the CTRL1 (20h) (ODR [2:0]) bits
are left untouched.
When the acceleration exceeds the threshold (ACT_THS (1Eh)), the ODR setting in CTRL1
(20h) is restored immediately (Activity).
Once the Activity/Inactivity detection function is enabled, the status can be brought out on
INT1 by setting the CTRL3 (22h) (INT1_INACT) bit to 1.
To disable the Activity/Inactivity detection function, set the content of the ACT_THS (1Eh)
register to 00h.
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LIS2HH12
5.2
Digital main blocks
Data stabilization time / ODR change
The data stabilization time required when an ODR change is applied in order to have valid
usable data depends on the BW and ODR selected.
The table below provides the number of samples to be discarded in order to obtain valid
usable data.
Table 10. Number of samples to be discarded
ODR [Hz]
5.3
BW = 400 Hz
BW = 200 Hz
BW = 100 Hz
BW = 50 Hz
10
1
-
-
-
50
1
-
-
-
100
1
1
1
1
200
1
1
1
4
400
1
1
4
7
800
1
4
7
14
FIFO
The LIS2HH12 embeds an acceleration data FIFO for each of the three output channels, X,
Y and Z. This allows consistent power saving for the system, since the host processor does
not need to continuously poll data from the sensor, but it can wake up only when needed
and burst the significant data out from the FIFO. This buffer can work according to the
following different modes: Bypass mode, FIFO-mode, Stream mode, Stream-to-FIFO mode,
Bypass-to-Stream, Bypass-to-FIFO. Each mode is selected by the FIFO_MODE bits in the
FIFO_CTRL (2Eh) register. Programmable FIFO threshold level, FIFO empty or FIFO
overrun events are available in the FIFO_CTRL (2Eh) register and can be set to generate
dedicated interrupts on the INT1 or INT2 pin.
FIFO_SRC (2Fh) (EMPTY) is equal to '1' when no samples are available.
FIFO_SRC (2Fh)(FTH) goes to '1' if new data arrives and FIFO_SRC (2Fh)(FSS [4:0]) is
greater than or equal to FIFO_CTRL (2Eh) (FTH [4:0]). FIFO_SRC (2Fh) (FTH) goes to '0' if
reading X, Y, Z data slot from FIFO and FIFO_SRC (2Fh) (FSS [4:0]) is less than or equal to
FIFO_CTRL (2Eh) (FTH [4:0]).
FIFO_SRC (2Fh) (OVR) is equal to '1' if a FIFO slot is overwritten.
The FIFO feature is enabled by writing the CTRL3 (22h) (FIFO_EN) bit to '1' in control
register 3.
In order to guarantee the correct acquisition of data during the switching into and out of
FIFO mode, the first sample acquired must be discarded.
5.3.1
Bypass mode
In Bypass mode (FIFO_CTRL (2Eh) (FMODE [2:0])= 000), the FIFO is not operational and it
remains empty.
Bypass mode is also used to reset the FIFO when in FIFO mode.
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Digital main blocks
5.3.2
LIS2HH12
FIFO mode
In FIFO mode (FIFO_CTRL (2Eh) (FMODE [2:0])= 001) data from the X, Y and Z channels
are stored in the FIFO until it is full. An overrun interrupt can be enabled, CTRL3 (22h)
(INT1_OVR)= '1', in order to be raised when the FIFO stops collecting data. When the
overrun interrupt occurs, the first set of data has been overwritten and the FIFO stops
collecting data from the input channels. To reset the FIFO content, Bypass mode should be
written in the FIFO_CTRL (2Eh) register, setting the FMODE [2:0] bits to '000'. After this
reset command, it is possible to restart FIFO mode, writing the value '001' in FIFO_CTRL
(2Eh) (FMODE [2:0]).
The FIFO buffer can memorize 32 slots of X, Y and Z data, but the depth of the FIFO can be
reduced using the CTRL3 (22h) (STOP_ FTH) bit. Setting the STOP_FTH bit to '1', FIFO
depth is limited to FIFO_CTRL (2Eh) (FTH [4:0]) - 1.
5.3.3
Stream mode
Stream mode (FIFO_CTRL (2Eh) (FMODE [2:0]) = 010) provides a continuous FIFO
update: as new data arrives, the older data is discarded.
An overrun interrupt can be enabled, CTRL3 (22h) (INT1_OVR) = '1', in order to read the
entire content of the FIFO at once. If in the application no data can be lost and it is not
possible to read at least one sample for each axis within one ODR period, a watermark
interrupt can be enabled in order to read partially the FIFO and leave free memory slots for
incoming data. Setting the FIFO_CTRL (2Eh) (FTH [4:0]) to value N, the number of X, Y and
Z data samples that should be read at the rise of the watermark interrupt is up to (N+1).
In the latter case, reading all FIFO content before an overrun interrupt has occurred, the first
data read is equal to the last data already read in previous burst, so the number of new data
available in the FIFO depends on the previous reading (see FIFO_SRC (2Fh)behavior
depicted in the following figures).
Figure 6. Stream mode
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Digital main blocks
A watermark interrupt CTRL3 (22h) (INT1_FTH), CTRL6 (25h)(INT2_FTH) can be enabled
in order to read data from the FIFO and leave free memory slots for incoming data. Setting
the FIFO_CTRL (2Eh) (FTH [4:0]) to value N, the number of X, Y and Z data samples that
should be read at the rise of the watermark interrupt, in order to read the entire FIFO
content, is N + 1.
5.3.4
Stream-to-FIFO mode
In Stream-to-FIFO mode (FIFO_CTRL (2Eh)(FMODE2:0) = 011), FIFO behavior changes
according to the IG_SRC1 (31h) (IA) bit. When the IG_SRC1 (31h) (IA) bit is equal to '1'
FIFO operates in FIFO mode, when the IG_SRC1 (31h) (IA) bit is equal to '0', FIFO
operates in Stream mode.
Interrupt generator 1 should be set to the desired configuration using IG_CFG1 (30h),
IG_THS_X1 (32h), IG_THS_Y1 (33h), IG_THS_Z1 (34h).
The CTRL7 (26h) (LIR1) bit should be set to '1' in order to have latched interrupt.
5.3.5
Bypass-to-Stream mode
In Bypass-to-Stream mode (FIFO_CTRL (2Eh) (FMODE [2:0]) = '100'), X, Y and Z
measurement storage inside FIFO operates in Stream mode when IG_SRC1 (31h) (IA) is
equal to '1', otherwise FIFO content is reset (Bypass mode).
Interrupt generator 1 should be set to the desired configuration using IG_CFG1 (30h),
IG_THS_X1 (32h), IG_THS_Y1 (33h), IG_THS_Z1 (34h).
The CTRL7 (26h) (LIR1) bit should be set to '1' in order to have latched interrupt.
5.3.6
Bypass-to-FIFO mode
In Bypass-to-FIFO mode (FIFO_CTRL (2Eh) (FMODE [2:0]) = '111', FIFO behavior changes
according to the IG_SRC1 (31h) (IA) bit. When the IG_SRC1 (31h)(IA) bit is equal to '1',
FIFO operates in FIFO mode, when the IG_SRC1 (31h) (IA) bit is equal to '0', FIFO
operates in Bypass mode (FIFO content reset). If a latched interrupt is generated, FIFO
starts collecting data until the first data in the FIFO buffer is overwritten. Interrupt generator
1 should be set to the desired configuration using IG_CFG1 (30h), IG_THS_X1 (32h),
IG_THS_Y1 (33h), IG_THS_Z1 (34h).
The CTRL7 (26h) (LIR1) bit should be set to '1' in order to have latched interrupt.
5.3.7
Retrieving data from FIFO
FIFO data is read through the OUT_X_L (28h) - OUT_X_H (29h), OUT_Y_L (2Ah) OUT_Y_H (2Bh), OUT_Z_L (2Ch) - OUT_Z_H (2Dh) registers. A read operation by means
of serial interface of OUT_X, OUT_Y or OUT_Z output registers provides the data stored
into the FIFO. Each time data is read from the FIFO, the oldest X, Y and Z data are placed
into the OUT_X, OUT_Y and OUT_Z registers and both single read and read_burst
operations can be used.
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Digital main blocks
5.3.8
LIS2HH12
FIFO multiple reads (burst)
Starting from Addr 28h multiple reads can be performed. Once the read reaches Addr 2Dh
the system automatically restarts from Addr 28h.
Figure 7. FIFO multiple reads
Read #1
Read #n
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x,y,z
OUT_X
(28-29)
OUT_Y
(2A-2B)
OUT_Z
(2C-2D)
OUT_X
(28-29)
OUT_Y
(2A-2B)
OUT_Z
(2C-2D)
x,y,z
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6
Digital interfaces
Digital interfaces
The registers embedded inside the LIS2HH12 may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped to the same pins. To select/exploit the I2C interface, the
CS line must be tied high (i.e. connected to Vdd_IO).
Table 11. Serial interface pin description
6.1
Pin name
Pin description
CS
SPI enable
I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled; 0: SPI
communication mode / I2C disabled)
SCL
SPC
I2C serial clock (SCL)
SPI serial port clock (SPC)
SDA
SDI
SDO
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SA0
SDO
I2C address selection (SA0)
SPI serial data output (SDO)
I2C serial interface
The LIS2HH12 I2C is a bus slave. The I2C is employed to write data into registers whose
content can also be read back.
The relevant I2C terminology is given in the table below.
Table 12. I2C terminology
Term
Transmitter
Receiver
Description
The device which sends data to the bus
The device which receives data from the bus
Master
The device which initiates a transfer, generates clock signals and terminates a
transfer
Slave
The device addressed by the master
There are two signals associated with the I2C bus: the serial clock line (SCL) and the Serial
DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface. Both the lines must be connected to Vdd_IO through an external pullup resistor. When the bus is free, both the lines are high.
The I2C interface is compliant with fast mode (400 kHz) I2C standards as well as with
normal mode.
In order to disable the I2C block, CTRL4 (23h) (I2C_DISABLE) = 1 must be set.
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Digital interfaces
6.1.1
LIS2HH12
I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a high-to-low transition on the data line while the SCL line is held high. After this
has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its address. If they match, the device considers itself addressed
by the master.
The Slave Address (SAD) associated to the LIS2HH12 is 00111xxb where the xx bits are
modified by the SA0/SDO pin in order to modify the device address. If the SA0/SDO pin is
connected to the supply voltage, the address is 0011101b, otherwise if the SA0/SDO pin is
connected to ground, the address is 0011110b. This solution permits to connect and
address two different accelerometers to the same I2C lines.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line low so that it
remains stable low during the high period of the acknowledge clock pulse. A receiver which
has been addressed is obliged to generate an acknowledge after each byte of data
received.
The I2C embedded inside the LIS2HH12 behaves like a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent. Once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) is transmitted: the
7 LSb represents the actual register address while the CTRL4 (23h) (IF_ADD_INC) bit
defines the address increment.
The slave address is completed with a Read/Write bit. If the bit is ‘1’ (Read), a repeated
START (SR) condition must be issued after the two sub-address bytes. If the bit is ‘0’ (Write)
the master will transmit to the slave with direction unchanged. Table 13 explains how the
SAD+Read/Write bit pattern is composed, listing all the possible configurations.
Table 13. SAD+Read/Write patterns
Command
SAD[6:2]
SAD[1] = SA0
SAD[0] = SA0
R/W
SAD+R/W
Read
00111
1
0
1
00111101
Write
00111
1
0
0
00111100
Read
00111
0
1
1
00111011
Write
00111
0
1
0
00111010
Table 14. Transfer when master is writing one byte to slave
Master
Slave
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ST
SAD + W
SUB
SAK
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DATA
SAK
SP
SAK
LIS2HH12
Digital interfaces
Table 15. Transfer when master is writing multiple bytes to slave
Master
ST
SAD + W
SUB
Slave
SAK
DATA
DATA
SAK
SP
SAK
SAK
Table 16. Transfer when master is receiving (reading) one byte of data from slave
Master
ST
SAD + W
Slave
SUB
SAK
SR
SAD + R
SAK
NMAK
SAK
SP
DATA
Table 17. Transfer when master is receiving (reading) multiple bytes of data from slave
Master
Slave
ST
SAD+W
SUB
SAK
SR SAD+R
SAK
MAK
SAK
DATA
MAK
DAT
A
NMAK
SP
DATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL low to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left high by
the slave. The master can then abort the transfer. A low-to-high transition on the SDA line
while the SCL line is high is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.
6.2
SPI bus interface
The LIS2HH12 SPI is a bus slave. The SPI allows to write and read the registers of the
device.
The serial interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO.
Figure 8. Read and write protocol
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
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Digital interfaces
LIS2HH12
CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are respectively the serial port data input and output. Those lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiple of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In latter case, the chip will drive SDO at the start of bit 8.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands additional blocks of 8 clock periods will be added. When
the CTRL4 (23h) (IF_ADD_INC) bit is ‘0’, the address used to read/write data remains the
same for every block. When the CTRL4 (23h) (IF_ADD_INC) bit is ‘1’, the address used to
read/write data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.
6.2.1
SPI read
Figure 9. SPI read protocol
CS
SPC
SDI
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI read command is performed with 16 clock pulses. A multiple byte read command is
performed by adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
bit 16-... : data DO(...-8). Additional data in multiple byte reads.
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Digital interfaces
Figure 10. Multiple byte SPI read protocol (2-byte example)
CS
SPC
SDI
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
6.2.2
DO15DO14DO13DO12DO11DO10DO9 DO8
SPI write
Figure 11. SPI write protocol
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
The SPI write command is performed with 16 clock pulses. A multiple byte write command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1 -7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb
first).
bit 16-... : data DI(...-8). Additional data in multiple byte writes.
Figure 12. Multiple byte SPI write protocol (2-byte example)
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
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Digital interfaces
6.2.3
LIS2HH12
SPI read in 3-wire mode
3-wire mode is entered by setting the CTRL4 (23h) (SIM) bit equal to ‘1’ (SPI serial interface
mode selection).
Figure 13. SPI read protocol in 3-wire mode
CS
SPC
SDI/O
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0
The SPI read command is performed with 16 clock pulses:
bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
A multiple read command is also available in 3-wire mode.
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LIS2HH12
7
Register mapping
Register mapping
The table given below provides a list of the 8/16 bit registers embedded in the device and
the corresponding addresses.
Table 18. Register map
Register address
Name
Type
Hex
Default
Comment
-
RESERVED
Binary
RESERVED
r
00-0A
TEMP_L
r
0B
00001011
output
TEMP_H
r
0C
00001100
output
RESERVED
r
0E
WHO_AM_I
r
0F
ACT_THS
r/w
ACT_DUR
-
RESERVED
00001111
01000001
Who I am ID
1E
00011110
00000000
r/w
1F
00011111
00000000
CTRL1
r/w
20
00100000
00000111
CTRL2
r/w
21
00100001
00000000
CTRL3
r/w
22
00100010
00000000
CTRL4
r/w
23
00100011
00000100
CTRL5
r/w
24
00100100
00000000
CTRL6
r/w
25
00100101
00000000
CTRL7
r/w
26
00100110
00000000
STATUS
r
27
00100111
output
Status data register
OUT_X_L
r
28
00101000
OUT_X_H
r
29
00101001
OUT_Y_L
r
2A
00101010
OUT_Y_H
r
2B
00101011
output
Output registers
OUT_Z_L
r
2C
00101100
OUT_Z_H
r
2D
00101101
FIFO_CTRL
r/w
2E
00101110
00000000
FIFO_SRC
r
2F
00101111
output
IG_CFG1
r/w
30
00110000
00000000
Interrupt generator 1
configuration
IG_SRC1
r
31
00110001
output
Interrupt generator 1
status register
IG_THS_X1
r/w
32
00110010
00000000
Interrupt generator 1
threshold X
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FIFO registers
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Register mapping
LIS2HH12
Table 18. Register map (continued)
Register address
Name
Type
Hex
Binary
Default
Comment
IG_THS_Y1
r/w
33
00110011
00000000
Interrupt generator 1
threshold Y
IG_THS_Z1
r/w
34
00110100
00000000
Interrupt generator 1
threshold Z
IG_DUR1
r/w
35
00110101
00000000
Interrupt generator 1
duration
IG_CFG2
r/w
36
00110110
00000000
Interrupt generator 2
configuration
IG_SRC2
r
37
00110111
output
Interrupt generator 2
status register
IG_THS2
r/w
38
00111000
00000000
Interrupt generator 2
threshold
IG_DUR2
r/w
39
00111001
00000000
Interrupt generator 2
duration
XL_
REFERENCE
r/w
3A
00111010
00000000
Reference X low
XH_
REFERENCE
r/w
3B
00111011
00000000
Reference X high
YL_
REFERENCE
r/w
3C
00111100
00000000
Reference Y low
YH_
REFERENCE
r/w
3D
00111101
00000000
Reference Y high
ZL_
REFERENCE
r/w
3E
00111110
00000000
Reference Z low
ZH_
REFERENCE
r/w
3F
00111111
00000000
Reference Z high
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
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Register description
8
Register description
8.1
TEMP_L (0Bh), TEMP_H (0Ch)
Temperature output register (r). The value is expressed in two’s complement.
8.2
WHO_AM_I (0Fh)
Who_AM_I register (r). This register is a read-only register. Its value is fixed at 41h.
Table 19. WHO_AM_I register default values
0
8.3
1
0
0
0
0
0
1
ACT_THS (1Eh)
Activity threshold register (r/w). Its value is fixed at 0x00. Inactivity threshold.
Table 20. ACT_THS register default values
0(1)
THS6
THS5
THS4
THS3
THS2
THS1
THS0
1. This bit must be set to ‘0’ for the correct operation of the device.
8.4
ACT_DUR (1Fh)
Activity duration register (r/w). Its value is fixed at 0x00. Activity duration.
Table 21. ACT_DUR register default values
DUR7
8.5
DUR6
DUR5
DUR4
DUR3
DUR2
DUR1
DUR0
YEN
XEN
CTRL1 (20h)
Control register 1(r/w)
Table 22. Control register 1
HR
ODR2
ODR1
ODR0
BDU
ZEN
Table 23. Control register 1 description
HR
High resolution bit. Default value: 0
0: normal mode, 1: high resolution (see Table )
ODR [2:0]
Output data rate & power mode selection. Default value: 000 (see Table )
BDU
Block data update. Default value: 0
0: continuous update; 1:output registers not updated until MSB and LSB read)
ZEN
Z-axis enable. Default value: 1 (0: Z-axis disabled; 1: Z-axis enabled)
YEN
Y-axis enable. Default value: 1 (0: Y-axis disabled; 1: Y-axis enabled)
XEN
X-axis enable. Default value: 1 (0: X-axis disabled; 1: X-axis enabled)
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Register description
LIS2HH12
ODR [2:0] is used to set the power mode and ODR selection. The following table lists the bit
settings for power-down mode and each available frequency.
Table 24. ODR register setting
ODR2
ODR1
Power-down and ODR
selection
ODR0
0
0
0
Power-down
0
0
1
10 Hz
0
1
0
50 Hz
0
1
1
100 Hz
1
0
0
200 Hz
1
0
1
400 Hz
1
1
0
800 Hz
1
1
1
N.A.
The BDU bit is used to inhibit the update of the output registers until both upper and lower
register parts are read. In default mode (BDU = ‘0’) the output register values are updated
continuously. When the BDU is activated (BDU = ‘1’), the content of the output registers is
not updated until both MSB and LSB are read which avoids reading values related to
different sample times.
Table 25. Low-pass cutoff frequency in high resolution mode (HR = 1)
HR
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CTRL2 (DFC [1:0])
LP cutoff freq. [Hz]
1
00
ODR/50
1
01
ODR/100
1
10
ODR/9
1
11
ODR/400
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8.6
Register description
CTRL2 (21h)
Control register 2 (r/w)
Table 26. Control register 2
(1)
0
DFC1
DFC0
HPM1
HPM0
FDS
HPIS1
HPIS2
1. This bit must be set to ‘0’ for the correct operation of the device.
Table 27. Control register 2 description
DFC1 [1:0]
High-pass filter cutoff frequency selection: the bandwidth of the high-pass filter
depends on the selected ODR and on the settings of the DFC [1:0] bits
HPM [1:0]
High-pass filter mode selection. Default value: 00
“00” or “10” = Normal mode;
“01” = Reference signal for filtering;
“11” = Not available
FDS
High-pass filter data selection. Default value: 0
(0: internal filter bypassed; 1: data from internal filter sent to output register and FIFO)
HPIS1
HPIS2
High-pass filter enabled for interrupt generator function on Interrupt 1. Default value: 0
(0: filter bypassed; 1: filter enabled)
High-pass filter enabled for interrupt generator function on Interrupt 2. Default value: 0
(0: filter bypassed; 1: filter enabled)
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Register description
8.7
LIS2HH12
CTRL3 (22h)
Control register 3 (r/w). INT1 control register.
Table 28. Control register 3
FIFO_EN
STOP_FTH
INT1
_INACT
INT1
_IG2
INT1
_IG1
INT1
_OVR
INT1
_FTH
INT1
_DRDY
Table 29. Control register 3 description
FIFO_EN
FIFO enable. Default value 0. (0: disable; 1: enable)
STOP_FTH
Enable FIFO threshold level use. Default value 0. (0: disable; 1: enable)
INT1_INACT Inactivity interrupt on INT1. Default value 0. (0: disable; 1: enable)
8.8
INT1_IG2
Interrupt generator 2 on INT1. Default value 0. (0: disable; 1: enable)
INT1_IG1
Interrupt generator 1 on INT1. Default value 0. (0: disable; 1: enable)
INT1_OVR
FIFO overrun signal on INT1.
INT1_FTH
FIFO threshold signal on INT1.
INT1_DRDY
Data Ready signal on INT1.
CTRL4 (23h)
Control register 4 (r/w)
Table 30. Control register 4
BW2
BW1
FS1
FS0
BW_SCALE_ODR
IF_ADD_INC
I2C_DISABLE
SIM
Table 31. Control register 4 description
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BW [2:1]
Anti-aliasing filter bandwidth. Default value: 00
(00: 400 Hz; 01: 200 Hz; 10: 100 Hz; 11: 50 Hz)
FS [1:0]
Full-scale selection. Default value: 00
(00: ±2 g; 01: Not available; 10: ±4 g; 11: ±8 g)
BW_SCALE_ODR
If '0', bandwidth is automatically selected as follows:
BW = 400 Hz when ODR = 800 Hz, 50 Hz, 10 Hz;
BW = 200 Hz when ODR = 400 Hz;
BW = 100 Hz when ODR = 200 Hz;
BW = 50 Hz when ODR = 100 Hz;
If '1', bandwidth is selected according to BW [2:1]
excluding ODR = 50 Hz, 10 Hz, BW = 400 Hz
IF_ADD_INC
Register address automatically incremented during multiple byte access with a
serial interface (I2C or SPI). (0: disabled; 1: enabled)
I2C_DISABLE
Disable I2C interface. Default value: 0 (0: I2C enabled; 1: I2C disabled)
SIM
SPI serial interface mode selection. Default value: 0
0: 4-wire interface; 1: 3-wire interface
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LIS2HH12
8.9
Register description
CTRL5 (24h)
Control register 5 (r/w)
Table 32. Control register 5
DEBUG
SOFT_RESET
DEC1
DEC0
ST2
ST1
H_LACTIVE
PP_OD
Table 33. Control register 5 description
DEBUG
Debug stepping action selected. Default value: 0 (0: disabled; 1: enabled)
SOFT_RESET
Soft reset, it acts as POR when 1, then goes to 0
DEC [1:0]
Decimation of acceleration data on OUT REG and FIFO
00 -> no decimation
01 -> update every 2 samples
10 -> update every 4 samples
11 -> update every 8 samples
ST [2:1]
Self-test enable. Default value: 00
(00: Self-test disabled; Other: see table below)
H_LACTIVE
Interrupt active high, low. Default value: 0
(0: active high; 1: active low)
PP_OD
Push-pull/Open-drain selection on interrupt pad. Default value: 0
(0: push-pull; 1: open-drain)
Table 34. Self-test mode selection
ST2
ST1
Self-test mode
0
0
Normal mode
0
1
Positive sign self-test
1
0
Negative sign self-test
1
1
Not allowed
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Register description
8.10
LIS2HH12
CTRL6 (25h)
Control register 6 (r/w)
Table 35. Control register 6
INT2
_BOOT
0(1)
BOOT
INT2
_IG2
INT2
_IG1
INT2
_EMPTY
INT2
_FTH
INT2
_DRDY
1. This bit must be set to ‘0’ for the correct operation of the device.
Table 36. Control register 6 description
8.11
BOOT
Force reboot, cleared as soon as the reboot is finished. Active high.
Default value 0.
INT2_BOOT
BOOT interrupt on INT2. Default value: 0
(0: disable; 1: enable)
INT2_IG2
Interrupt generator 2 on INT2. Default value: 0
(0: disable; 1: enable)
INT2_IG1
Interrupt generator 1 on INT2. Default value: 0
(0: disable; 1: enable)
INT2_EMPTY
FIFO empty flag on INT2. Default value: 0
INT2_FTH
FIFO threshold signal on INT2. Default value: 0
INT2_DRDY
Data Ready signal on INT2. Default value: 0
CTRL7 (26h)
Control Register 7 (r/w)
Table 37. Control register 7
0(1)
0(1)
DCRM2
DCRM1
LIR2
LIR1
4D_IG2
4D_IG1
1. This bit must be set to ‘0’ for the correct operation of the device.
Table 38. Control register 7 description
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DCRM [2:1]
DCRM is used to select the reset mode of the duration counter. Default value: 0
If DCRM = ‘0’, the counter is reset when the interrupt is no longer active, else if
DCRM = ‘1’ the duration counter is decremented. 1LSB
LIR [2:1]
Latched Interrupt [2:1] Default value: 00
(0: interrupt request not latched; 1: interrupt request latched)
Cleared by reading the IG_SRC1 (31h) and IG_SRC2 (37h) registers.
4D_IG [2:1]
Interrupt [2:1] 4D option enabled. Default value: 00
When set, IG_CFG1 (30h) and IG_CFG2 (36h) use 4D for position recognition.
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8.12
Register description
STATUS (27h)
Status register (r/w)
Table 39. Status register
ZYXOR
ZOR
YOR
XOR
ZYXDA
ZDA
YDA
XDA
Table 40. Status register description
8.13
ZYXOR
X-, Y- and Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new set of data has overwritten the previous set)
ZOR
Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Z-axis has overwritten the previous data)
YOR
Y-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Y-axis has overwritten the
previous data)
XOR
X-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the X-axis has overwritten the
previous data)
ZYXDA
X-, Y- and Z-axis new data available. Default value: 0
(0: a new set of data is not yet available; 1: a new set of data is available)
ZDA
Z-axis new data available. Default value: 0
(0: new data for the Z-axis is not yet available; 1: new data for the Z-axis is
available)
YDA
Y-axis new data available. Default value: 0
(0: new data for the Y-axis is not yet available; 1: new data for the Y-axis is available)
XDA
X-axis new data available. Default value: 0
(0: new data for the X-axis is not yet available; 1: new data for the X-axis is available)
OUT_X_L (28h) - OUT_X_H (29h)
X-axis output register (r)
8.14
OUT_Y_L (2Ah) - OUT_Y_H (2Bh)
Y-axis output register (r)
8.15
OUT_Z_L (2Ch) - OUT_Z_H (2Dh)
Z-axis output register (r)
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Register description
8.16
LIS2HH12
FIFO_CTRL (2Eh)
FIFO control register (r/w)
Table 41. FIFO control register
FMODE2
FMODE1
FMODE0
FTH4
FTH3
FTH2
FTH1
FTH0
Table 42. FIFO control register description
FMODE [2:0]
FIFO mode selection bits. Default: 000. For further details refer to table below
FTH [4:0]
FIFO threshold. Default: 00000. It is the FIFO depth if the STOP_FTH bit in the
CTRL3 (22h) register is set to ‘1’.
Table 43. FIFO mode selection
FMODE2
FMODE1
FMODE0
Mode
0
0
0
Bypass mode. FIFO turned off
0
0
1
FIFO mode. Stops collecting data when FIFO is full.
0
1
0
Stream mode. If the FIFO is full, the new sample overwrites
the older one
0
1
1
Stream mode until trigger is deasserted, then FIFO mode
1
0
0
Bypass mode until trigger is deasserted, then Stream mode
1
0
1
Not used
1
1
0
Not used
1
1
1
Bypass mode until trigger is deasserted, then FIFO mode
The FIFO trigger is the IG_SRC1 (31h) event. (Refer to IG_SRC1 (31h)).
8.17
FIFO_SRC (2Fh)
FIFO status control register (r)
Table 44. FIFO status register
FTH
OVR
EMPTY
FSS4
FSS3
FSS2
FSS1
FSS0
Table 45. FIFO status register description
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FTH
FIFO threshold status.
0: FIFO filling is lower than FTH level; 1: FIFO filling is equal to or higher than
threshold level
OVR
Overrun bit status. 0: FIFO is not completely filled; 1: FIFO is completely filled
EMPTY
FIFO empty bit.
0: FIFO not empty; 1: FIFO empty)
FSS [4:0]
FIFO stored data level
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8.18
Register description
IG_CFG1 (30h)
Interrupt generator 1 configuration register (r/w)
Table 46. IG_CFG1 configuration register
AOI
6D
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Table 47. IG_CFG1 configuration register description
8.19
AOI
And/Or combination of Interrupt events. Default value: 0
6D
6-direction detection function enabled. Default value: 0
ZHIE
Enable interrupt generation on Z high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
ZLIE
Enable interrupt generation on Z low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
YHIE
Enable interrupt generation on Y high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
YLIE
Enable interrupt generation on Y low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
XHIE
Enable interrupt generation on X high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
XLIE
Enable interrupt generation on X low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
IG_SRC1 (31h)
Interrupt generator 1 status register (r)
Table 48. IG1_SRC1 register
-
IA
ZH
ZL
YH
YL
XH
XL
Table 49. IG1_SRC1 register description
IA
Interrupt Active. Default value: 0 (0: no interrupt has been generated; 1: one or
more interrupt event has been generated)
ZH
Z High. Default value: 0 (0: no interrupt; 1: ZH event has occurred)
ZL
Z Low. Default value: 0 (0: no interrupt; 1: ZL event has occurred)
YH
Y High. Default value: 0 (0: no interrupt; 1: YH event has occurred)
YL
Y Low. Default value: 0 (0: no interrupt; 1: YL event has occurred)
XH
X High. Default value: 0 (0: no interrupt; 1: XH event has occurred)
XL
X Low. Default value: 0 (0: no interrupt; 1: XL event has occurred)
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Register description
8.20
LIS2HH12
IG_THS_X1 (32h), IG_THS_Y1 (33h), IG_THS_Z1 (34h)
Interrupt generator 1 threshold registers (r/w)
Table 50. IG1_THS register
THS7
THS6
THS5
THS4
THS3
THS2
THS1
THS0
DUR1_1
DUR1_0
XHIE
XLIE
Table 51. IG1_THS description
THS [7:0]
8.21
Interrupt 1 thresholds. Default: 00000000
IG_DUR1 (35h)
Interrupt generator 1 duration register (r/w)
Table 52. IG_DUR1 duration
WAIT1
DUR1_6
DUR1_5
DUR1_4
DUR1_3
DUR1_2
Table 53. IG_DUR1 duration description
8.22
WAIT1
Wait function enable on duration counter. Default value: 0
(0: Wait function off; 1: Wait function on)
DUR1_[6:0]
Duration value Default: 0000000
IG_CFG2 (36h)
Interrupt generator 2 configuration register (r/w)
Table 54. IG_CFG2 register
AOI
6D
ZHIE
ZLIE
YHIE
YLIE
Table 55. IG_CFG2 register description
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AOI
And/Or combination of Interrupt events. Default value: 0
6D
6-direction detection function enabled. Default value: 0
ZHIE
Enable interrupt generation on Z high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
ZLIE
Enable interrupt generation on Z low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
YHIE
Enable interrupt generation on Y high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
YLIE
Enable interrupt generation on Y low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
XHIE
Enable interrupt generation on X high event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
XLIE
Enable interrupt generation on X low event or on direction recognition.
Default value: 0 (0: disable interrupt request; 1: enable interrupt request)
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8.23
Register description
IG_SRC2 (37h)
Interrupt generator 2 status register (r)
Table 56. IG_SRC2 register
-
IA
ZH
ZL
YH
YL
XH
XL
Table 57. IG_SRC2 register description
8.24
IA
Interrupt Active. Default value: 0 (0: no interrupt has been generated; 1: one or
more interrupt events has been generated)
ZH
Z High. Default value: 0 (0: no interrupt; 1: ZH event has occurred)
ZL
Z Low. Default value: 0 (0: no interrupt; 1: ZL event has occurred)
YH
Y High. Default value: 0 (0: no interrupt; 1: YH event has occurred)
YL
Y Low. Default value: 0 (0: no interrupt; 1: YL event has occurred)
XH
X High. Default value: 0 (0: no interrupt; 1: XH event has occurred)
XL
X Low. Default value: 0 (0: no interrupt; 1: XL event has occurred)
IG_THS2 (38h)
Interrupt generator 2 threshold register (r/w)
Table 58. IG_THS2 register
THS7
THS6
THS5
THS4
THS3
THS2
THS1
THS0
DUR2_1
DUR2_0
Table 59. IG_THS2 register description
THS [7:0]
8.25
Interrupt generator 2 thresholds. Default 00000000
IG_DUR2 (39h)
Interrupt generator 2 duration register (r/w)
Table 60. IG_DUR2 register
WAIT2
DUR2_6
DUR2_5
DUR2_4
DUR2_3
DUR2_2
Table 61. IG_DUR2 register description
WAIT2
Wait function enable on duration counter. Default value: 0
(0: Wait function off; 1: Wait function on)
DUR2_[6:0]
Duration value. Default: 0000000
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Register description
8.26
LIS2HH12
XL_REFERENCE (3Ah), XH_REFERENCE (3Bh)
In normal mode (HPM [1:0] = ‘00’ or ‘10’) when one of these registers (XL_REFERENCE or
XH_REFERENCE) is read, the x output of the hp filter is set to ‘0’.
In reference mode (HPM [1:0] =”01”) the reference value is subtracted from the X output of
the hp filter.
8.27
YL_REFERENCE (3Ch), YH_REFERENCE (3Dh)
See previous section concerning the X Reference (r/w) registers.
8.28
ZL_REFERENCE (3Eh), ZH_REFERENCE (3Fh)
See previous section concerning the X Reference (r/w) registers.
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9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
9.1
LGA-12 package information
Table 62. LGA-12 2x2x1 package mechanical data
Ref.
Min.
Typ.
A1
Max.
1
A2
0.785
A3
0.200
D1
1.850
2.000
2.150
E1
1.850
2.000
2.150
L1
1.500
N1
0.500
T1
0.275
T2
0.250
P2
0.075
r
45°
M
0.100
K
0.050
Figure 14. LGA-12 2x2x1 package outline
8365767_A
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Package information
9.2
LIS2HH12
LGA-12 packing information
Figure 15. Carrier tape information for LGA-12 package
Figure 16. LGA-12 package orientation in carrier tape
44/47
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Package information
Figure 17. Reel information for carrier tape of LGA-12 package
7
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$FFHVVKROHDW
VORWORFDWLRQ
%
&
$
1
'
)XOOUDGLXV
*PHDVXUHGDWKXE
7DSHVORW
LQFRUHIRU
WDSHVWDUW
PPPLQZLGWK
Table 63. Reel dimensions for carrier tape of LGA-12 package
Reel dimensions (mm)
A (max)
330
B (min)
1.5
C
13 ±0.25
D (min)
20.2
N (min)
60
G
12.4 +2/-0
T (max)
18.4
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Revision history
10
LIS2HH12
Revision history
Table 64. Document revision history
46/47
Date
Revision
Changes
26-Nov-2013
1
Initial release
27-Nov-2013
2
General document review
24-Sep-2014
3
Document status promoted from preliminary to production data
Updated Figure 2: Pin connections and Figure 5: LIS2HH12 electrical
connections
Added Table 9: Activity/Inactivity function control registers
09-Nov-2015
4
Added Section 9.2: LGA-12 packing information
14-Dec-2015
5
Updated HPIS1 and HPIS2 bits in CTRL2 (21h)
Updated Table 8: Absolute maximum ratings
Updated Figure 17: Reel information for carrier tape of LGA-12 package
DocID025344 Rev 5
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
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