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LIS302DLH

LIS302DLH

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    VFLGA14

  • 描述:

    ACCELEROMETER 2-8G I2C/SPI 14LGA

  • 数据手册
  • 价格&库存
LIS302DLH 数据手册
LIS302DLH MEMS digital output motion sensor ultra low-power high performance 3-axes “piccolo” accelerometer Features ■ Wide supply voltage, 2.16 V to 3.6 V ■ Low voltage compatible IOs, 1.8 V ■ Ultra thickness 0.8 mm ■ Ultra low-power mode consumption down to 10 µA ■ ±2g/±4g/±8g dynamically selectable full-scale ■ I2C/SPI digital output interface ■ 16 bit data output ■ 2 independent programmable interrupt generators for free-fall and motion detection ■ Sleep to wake-up function ■ 6D orientation detection ■ Embedded self-test ■ 10000 g high shock survivability ■ ECOPACK® RoHS and “Green” compliant (see Section 8) LGA-14 (3x5x0.8mm) Description The device features ultra low-power operational modes that allow advanced power saving and smart sleep to wake-up functions. Applications The LIS302DLH has dynamically user selectable full scales of ±2g/±4g/±8g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz. The self-test capability allows the user to check the functioning of the sensor in the final application. ■ Motion activated functions ■ Free-fall detection ■ Intelligent power saving for handheld devices ■ Pedometer ■ Display orientation ■ Gaming and virtual reality input devices ■ Impact recognition and logging ■ Vibration monitoring and compensation Table 1. The LIS302DLH is an ultra low-power high performance three axes linear accelerometer belonging to the “piccolo” family, with digital I2C/SPI serial interface standard output. The device may be configured to generate interrupt signal by inertial wake-up/free-fall events as well as by the position of the device itself. Thresholds and timing of interrupt generators are programmable by the end user on the fly. The LIS302DLH is available in small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Device summary Order codes Temperature range [° C] Package Packaging LIS302DLH -40 to +85 LGA-14 Tray LIS302DLHTR -40 to +85 LGA-14 Tape and reel June 2009 Doc ID 15797 Rev 1 1/37 www.st.com 37 Contents LIS302DLH Contents 1 2 3 4 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.3.2 I2C - Inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.3 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.4 Sleep to wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1 5 2.3.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.1.1 5.2 2/37 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.3 SPI read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Doc ID 15797 Rev 1 LIS302DLH Contents 6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.1 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.2 CTRL_REG1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.3 CTRL_REG2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 CTRL_REG3 [Interrupt CTRL register] (22h) . . . . . . . . . . . . . . . . . . . . . . 27 7.5 CTRL_REG4 (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.6 CTRL_REG5 (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.7 HP_FILTER_RESET (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.8 REFERENCE (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.9 STATUS_REG (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.10 OUT_X_L (28h), OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.11 OUT_Y_L (2Ah), OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.12 OUT_Z_L (2Ch), OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.13 INT1_CFG (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.14 INT1_SRC (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.15 INT1_THS (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.16 INT1_DURATION (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.17 INT2_CFG (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.18 INT2_SRC (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.19 INT2_THS (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.20 INT2_DURATION (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Doc ID 15797 Rev 1 3/37 List of tables LIS302DLH List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 48. Table 47. 4/37 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mechanical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted . . . . . . . . . . 6 Electrical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted . . . . . . . . . . . . 7 SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 I2C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 SAD+Read/Write patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Transfer when master is writing multiple bytes to slave:. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Transfer when master is receiving (reading) one byte of data from slave: . . . . . . . . . . . . . 16 Transfer when Master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 16 Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 WHO_AM_I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 CTRL_REG1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 CTRL_REG1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power mode and low-power output data rate configurations . . . . . . . . . . . . . . . . . . . . . . . 22 Normal-mode output data rate configurations and low-pass cut-off frequencies . . . . . . . . 22 CTRL_REG2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 CTRL_REG2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 High-pass filter mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 High-pass filter cut-off frequency configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 CTRL_REG3 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 CTRL_REG3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Data signal on INT 1 and INT 2 pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 CTRL_REG4 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 CTRL_REG4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 CTRL_REG5 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 CTRL_REG5 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Sleep to wake configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 REFERENCE register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 REFERENCE description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 STATUS_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 STATUS_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 INT1_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 INT1_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Interrupt 1 source configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 INT1_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 INT1_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 INT1_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 INT1_THS description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 INT1_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 INT1_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 INT2_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Interrupt mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 INT2_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Doc ID 15797 Rev 1 LIS302DLH Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. List of tables INT2_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 INT2_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 INT2_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 INT2_THS description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 INT2_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 INT2_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Doc ID 15797 Rev 1 5/37 List of figures LIS302DLH List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. 6/37 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 I2C Slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 LIS302DLH electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Multiple bytes SPI read protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Multiple bytes SPI write protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI read protocol in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 LGA-14: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Doc ID 15797 Rev 1 LIS302DLH Block diagram and pin description 1 Block diagram and pin description 1.1 Block diagram Figure 1. Block diagram X+ CHARGE AMPLIFIER Y+ Z+ a CS A/D CONVERTER MUX SCL/SPC I2C CONTROL LOGIC SDA/SDO/SDI SPI Z- SDO/SA0 YX- SELF TEST 1.2 TRIMMING CIRCUITS REFERENCE CLOCK CONTROL LOGIC & INTERRUPT GEN. INT 1 INT 2 Pin description Figure 2. Pin connection Z 1 1 6 13 8 X Y 13 6 8 BOTTOM VIEW TOP VIEW Doc ID 15797 Rev 1 7/37 Block diagram and pin description Table 2. 8/37 LIS302DLH Pin description Pin# Name Function 1 Vdd_IO 2 GND 3 Reserved 4 GND 0V supply 5 GND 0V supply 6 Vdd Power supply 7 CS SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) 8 INT1 Inertial interrupt 1 9 INT2 Inertial interrupt 2 10 GND 0V supply 11 Reserved 12 SDO SPI serial data output I2C less significant bit of the device address 13 SDA SDI SDO I2C serial data (SDA) SPI serial data input (SDI) 3-wire interface serial data output (SDO) 14 SCL SPC I2C serial clock (SCL) SPI serial port clock (SPC) Power supply for I/O pins 0V supply Connect to Vdd Connect to Gnd Doc ID 15797 Rev 1 LIS302DLH Mechanical and electrical specifications 2 Mechanical and electrical specifications 2.1 Mechanical characteristics Table 3. Mechanical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted (1) Symbol FS So Parameter Measurement range(3) Sensitivity Test conditions Min. Typ.(2) FS bit set to 00 ±2.0 FS bit set to 01 ±4.0 FS bit set to 11 ±8.0 Max. Unit g FS bit set to 00 12 bit representation 0.9 1 1.1 FS bit set to 01 12 bit representation 1.8 2 2.2 FS bit set to 11 12 bit representation 3.5 3.9 4.3 mg/digit TCSo Sensitivity change vs temperature FS bit set to 00 ±0.01 %/°C TyOff Typical zero-g level offset accuracy(4),(5) FS bit set to 00 ±20 mg TCOff Zero-g level change vs temperature Max delta from 25 °C ±0.1 mg/°C Acceleration noise density FS bit set to 00 218 µg/ Hz An Vst Self-test output change(6),(7),(8) Top Operating temperature range Wh Product weight FS bit set to 00 X axis 120 300 550 LSb FS bit set to 00 Y axis 120 300 550 LSb FS bit set to 00 Z axis 140 350 750 LSb +85 °C -40 20 mgram 1. The product is factory calibrated at 2.5 V. The operational power supply range is from 2.16 V to 3.6 V. 2. Typical specifications are not guaranteed 3. Verified by wafer level test and measurement of initial offset and sensitivity 4. Typical zero-g level offset value after MSL3 preconditioning 5. Offset can be eliminated by enabling the built-in high pass filter 6. The sign of “Self-test output change” is defined by CTRL_REG4 STsign bit (Table 28), for all axes. 7. Self-test output changes with the power supply. “Self-test output change” is defined as OUTPUT[LSb](CTRL_REG4 ST bit=1) - OUTPUT[LSb](CTRL_REG4 ST bit=0). 1LSb=4g/4096 at 12bit representation, ±2 g Full-scale 8. Output data reach 99% of final value after 3/ODR when enabling self-test mode, due to device filtering Doc ID 15797 Rev 1 9/37 Mechanical and electrical specifications LIS302DLH 2.2 Electrical characteristics Table 4. Electrical characteristics @ Vdd = 2.5 V, T = 25 °C unless otherwise noted (1) Symbol Vdd Vdd_IO Parameter Test conditions Supply voltage (3) I/O pins supply voltage Min. Typ.(2) Max. Unit 2.16 2.5 3.6 V Vdd+0.1 V 1.71 Idd Current consumption in normal mode 250 µA IddLP Current consumption in low-power mode 10 µA IddPdn Current consumption in power-down mode 1 µA VIH Digital high level input voltage VIL Digital low level input voltage VOH High level output voltage VOL Low level output voltage ODR ODRLP BW Output data rate in normal mode Output data rate in low-power mode 0.8*Vdd_IO 0.2*Vdd_IO 0.9*Vdd_IO Ton Turn-on Top Operating temperature range DR bit set to 00 50 DR bit set to 01 100 DR bit set to 10 400 DR bit set to 11 1000 V Hz PM bit set to 010 0.5 PM bit set to 011 1 PM bit set to 100 2 PM bit set to 101 5 PM bit set to 110 10 ODR = 100 Hz Hz ODR/2 Hz 3/ODR s -40 +85 1. The product is factory calibrated at 2.5 V. The operational power supply range is from 2.16 V to 3.6 V. 2. Typical specification are not guaranteed 3. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the measurement chain is powered off. 4. Refer to Table 20 for filter cut-off frequency 5. Time to obtain valid data after exiting power-down mode 10/37 V V 0.1*Vdd_IO System bandwidth(4) time(5) V Doc ID 15797 Rev 1 °C LIS302DLH Mechanical and electrical specifications 2.3 Communication interface characteristics 2.3.1 SPI - serial peripheral interface Subject to general operating conditions for Vdd and Top. Table 5. SPI slave timing values Value (1) Symbol Parameter Unit Min. tc(SPC) SPI clock cycle fc(SPC) SPI clock frequency tsu(CS) CS setup time 5 th(CS) CS hold time 8 tsu(SI) SDI input setup time 5 th(SI) SDI input hold time 15 tv(SO) SDO valid output time th(SO) SDO output hold time tdis(SO) Max. 100 ns 10 MHz ns 50 6 SDO output disable time 50 1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production Figure 3. CS SPI slave timing diagram (a) (3) (3) tc(SPC) tsu(CS) SPC (3) (3) tsu(SI) SDI (3) th(SI) LSB IN MSB IN tv(SO) SDO th(CS) (3) MSB OUT (3) tdis(SO) th(SO) LSB OUT (3) 3. When no communication is on-going, data on CS, SPC, SDI and SDO are driven by internal pull-up resistors a. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output port Doc ID 15797 Rev 1 11/37 Mechanical and electrical specifications 2.3.2 LIS302DLH I2C - Inter IC control interface Subject to general operating conditions for Vdd and top. Table 6. I2C slave timing values I2C standard mode (1) Symbol I2C fast mode (1) Parameter f(SCL) Unit SCL clock frequency Min. Max. Min. Max. 0 100 0 400 tw(SCLL) SCL clock low time 4.7 1.3 tw(SCLH) SCL clock high time 4.0 0.6 tsu(SDA) SDA setup time 250 100 th(SDA) SDA data hold time 0.01 KHz µs ns 3.45 0.01 0.9 tr(SDA) tr(SCL) SDA and SCL rise time 1000 20 + 0.1Cb (2) 300 tf(SDA) tf(SCL) SDA and SCL fall time 300 20 + 0.1Cb (2) 300 th(ST) START condition hold time 4 0.6 tsu(SR) Repeated START condition setup time 4.7 0.6 tsu(SP) STOP condition setup time 4 0.6 4.7 1.3 µs ns µs tw(SP:SR) Bus free time between STOP and START condition 1. Data based on standard I2C protocol requirement, not tested in production 2. Cb = total capacitance of one bus line, in pF Figure 4. I2C Slave timing diagram (b) REPEATED START START tsu(SR) tw(SP:SR) SDA tf(SDA) tsu(SDA) tr(SDA) th(SDA) tsu(SP) SCL th(ST) tw(SCLL) tw(SCLH) tr(SCL) tf(SCL) b. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both port 12/37 START Doc ID 15797 Rev 1 STOP LIS302DLH 2.4 Mechanical and electrical specifications Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7. Absolute maximum ratings Symbol Vdd Vdd_IO Vin Ratings Maximum value Unit Supply voltage -0.3 to 6 V I/O pins Supply voltage -0.3 to 6 V -0.3 to Vdd_IO +0.3 V Input voltage on any control pin (CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0) 3000 g for 0.5 ms APOW Acceleration (any axis, powered, Vdd = 2.5 V) AUNP Acceleration (any axis, unpowered) TOP Operating temperature range -40 to +85 °C TSTG Storage temperature range -40 to +125 °C 4 (HBM) kV 1.5 (CDM) kV 200 (MM) V 10000 g for 0.1 ms 3000 g for 0.5 ms ESD Note: Electrostatic discharge protection 10000 g for 0.1 ms Supply voltage on any pin should never exceed 6.0 V This is a mechanical shock sensitive device, improper handling can cause permanent damages to the part This is an ESD sensitive device, improper handling can cause permanent damages to the part Doc ID 15797 Rev 1 13/37 Mechanical and electrical specifications 2.5 Terminology 2.5.1 Sensitivity LIS302DLH Sensitivity describes the gain of the sensor and can be determined e.g. by applying 1 g acceleration to it. As the sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center of the earth, noting the output value, rotating the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value changes very little over temperature and also time. The sensitivity tolerance describes the range of Sensitivities of a large population of sensors. 2.5.2 Zero-g level Zero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal output signal if no acceleration is present. A sensor in a steady state on a horizontal surface will measure 0 g in X axis and 0 g in Y axis whereas the Z axis will measure 1 g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT registers 00h, data expressed as 2’s complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress to MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over temperature, see “Zero-g level change vs. temperature”. The Zero-g level tolerance (TyOff) describes the standard deviation of the range of Zero-g levels of a population of sensors. 2.5.3 Self-test Self-test allows to check the sensor functionality without moving it. The self-test function is off when the self-test bit (ST) of CTRL_REG4 (control register 4) is programmed to ‘0‘. When the self-test bit of CTRL_REG4 is programmed to ‘1‘ an actuation force is applied to the sensor, simulating a definite input acceleration. In this case the sensor outputs will exhibit a change in their DC levels which are related to the selected full scale through the device sensitivity. When self-test is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force. If the output signals change within the amplitude specified inside Table 3, then the sensor is working properly and the parameters of the interface chip are within the defined specifications. 2.5.4 Sleep to wake-up The “sleep to wake-up” function, in conjunction with low-power mode, allows to further reduce the system power consumption and develop new smart applications. LIS302DLH may be set in a low-power operating mode, characterized by lower date rates refreshments. In this way the device, even if sleeping, keep on sensing acceleration and generating interrupt requests. When the “sleep to wake-up” function is activated, LIS302DLH is able to automatically wake-up as soon as the interrupt event has been detected, increasing the output data rate and bandwidth. With this feature the system may be efficiently switched from low-power mode to fullperformance depending on user-selectable positioning and acceleration events, thus ensuring power saving and flexibility. 14/37 Doc ID 15797 Rev 1 LIS302DLH 3 Functionality Functionality The LIS302DLH is a nano, low-power, digital output 3-axis linear accelerometer packaged in a LGA package. The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface. 3.1 Sensing element A proprietary process is used to create a surface micro-machined accelerometer. The technology allows to carry out suspended silicon structures which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. To be compatible with the traditional packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts during the moulding phase of the plastic encapsulation. When an acceleration is applied to the sensor the proof mass displaces from its nominal position, causing an imbalance in the capacitive half-bridge. This imbalance is measured using charge integration in response to a voltage pulse applied to the capacitor. At steady state the nominal value of the capacitors are few pF and when an acceleration is applied the maximum variation of the capacitive load is in the fF range. 3.2 IC interface The complete measurement chain is composed by a low-noise capacitive amplifier which converts the capacitive unbalancing of the MEMS sensor into an analog voltage that is finally available to the user by an analog-to-digital converter. The acceleration data may be accessed through an I2C/SPI interface thus making the device particularly suitable for direct interfacing with a microcontroller. The LIS302DLH features a Data-Ready signal (RDY) which indicates when a new set of measured acceleration data is available thus simplifying data synchronization in the digital system that uses the device. The LIS302DLH may also be configured to generate an inertial Wake-Up and Free-Fall interrupt signal accordingly to a programmed acceleration event along the enabled axes. Both Free-Fall and Wake-Up can be available simultaneously on two different pins. 3.3 Factory calibration The IC interface is factory calibrated for sensitivity (So) and Zero-g level (TyOff). The trimming values are stored inside the device in a non volatile memory. Any time the device is turned on, the trimming parameters are downloaded into the registers to be used during the active operation. This allows to use the device without further calibration. Doc ID 15797 Rev 1 15/37 Application hints 4 LIS302DLH Application hints Figure 5. LIS302DLH electrical connection Vdd Vdd_IO 1 6 Z 1 X Y 10uF 13 6 Top VIEW 8 8 DIRECTIONS OF THE DETECTABLE ACCELERATIONS SCL/SPC SDO INT 2 INT 1 CS TOP VIEW 13 SDA/SDI/SDO 100nF GND Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO The device core is supplied through Vdd line while the I/O pads are supplied through Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Aluminum) should be placed as near as possible to the pin 6 of the device (common design practice). All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO without blocking the communication bus, in this condition the measurement chain is powered off. The functionality of the device and the measured acceleration data is selectable and accessible through the I2C/SPI interface.When using the I2C, CS must be tied high. The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be completely programmed by the user through the I2C/SPI interface. 4.1 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020C. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com. 16/37 Doc ID 15797 Rev 1 LIS302DLH 5 Digital interfaces Digital interfaces The registers embedded inside the LIS302DLH may be accessed through both the I2C and SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire interface mode. The serial interfaces are mapped onto the same pads. To select/exploit the I2C interface, CS line must be tied high (i.e. connected to Vdd_IO). Table 8. Serial interface pin description Pin name SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) CS 5.1 Pin description SCL SPC I2C serial clock (SCL) SPI serial port clock (SPC) SDA SDI SDO I2C serial data (SDA) SPI serial data input (SDI) 3-wire interface serial data output (SDO) SA0 SDO I2C less significant bit of the device address (SA0) SPI serial data output (SDO) I2C serial interface The LIS302DLH I2C is a bus slave. The I2C is employed to write data into registers whose content can also be read back. The relevant I2C terminology is given in the table below. Table 9. Serial interface pin description Term Transmitter Receiver Description The device which sends data to the bus The device which receives data from the bus Master The device which initiates a transfer, generates clock signals and terminates a transfer Slave The device addressed by the master There are two signals associated with the I2C bus: the serial clock line (SCL) and the Serial DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data to/from the interface. Both the lines are connected to Vdd_IO through a pull-up resistor embedded inside the LIS302DLH. When the bus is free both the lines are high. The I2C interface is compliant with fast mode (400 kHz) I2C standards as well as with the normal mode. Doc ID 15797 Rev 1 17/37 Digital interfaces 5.1.1 LIS302DLH I2C operation The transaction on the bus is started through a START (ST) signal. A START condition is defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After this has been transmitted by the Master, the bus is considered busy. The next byte of data transmitted after the start condition contains the address of the slave in the first 7 bits and the eighth bit tells whether the Master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system compares the first seven bits after a start condition with its address. If they match, the device considers itself addressed by the Master. The Slave ADdress (SAD) associated to the LIS302DLH is 001100xb. SDO/SA0 pad can be used to modify less significant bit of the device address. If SA0 pad is connected to voltage supply, LSb is ‘1’ (address 0011001b) else if SA0 pad is connected to ground, LSb value is ‘0’ (address 0011000b). This solution permits to connect and address two different accelerometers to the same I2C lines. Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge pulse. The receiver must then pull the data line LOW so that it remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each byte of data received. The I2C embedded inside the LIS302DLH behaves like a slave device and the following protocol must be adhered to. After the start condition (ST) a slave address is sent, once a slave acknowledge (SAK) has been returned, a 8-bit sub-address (SUB) is transmitted: the 7 LSb represent the actual register address while the MSB enables address auto increment. If the MSb of the SUB field is ‘1’, the SUB (register address) is automatically increased to allow multiple data read/write. The slave address is completed with a Read/Write bit. If the bit was ‘1’ (Read), a repeated START (SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (Write) the Master will transmit to the slave with direction unchanged. Table 10 explains how the SAD+Read/Write bit pattern is composed, listing all the possible configurations. Table 10. Command SAD[6:1] SAD[0] = SA0 R/W Read 001100 0 1 00110001 (31h) Write 001100 0 0 00110000 (30h) Read 001100 1 1 00110011 (33h) Write 001100 1 0 00110010 (32h) Table 11. Master Slave 18/37 SAD+Read/Write patterns SAD+R/W Transfer when master is writing one byte to slave ST SAD + W SUB SAK Doc ID 15797 Rev 1 DATA SAK SP SAK LIS302DLH Digital interfaces Table 12. Master Transfer when master is writing multiple bytes to slave: ST SAD + W Slave SAK Table 13. Master Master Slave DATA DATA SAK SAK SP SAK Transfer when master is receiving (reading) one byte of data from slave: ST SAD + W Slave Table 14. SUB SUB SAK SR SAD + R SAK NMAK SAK SP DATA Transfer when Master is receiving (reading) multiple bytes of data from slave ST SAD+W SUB SAK SR SAD+R SAK MAK SAK DATA MAK DATA NMAK SP DATA Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit (MSb) first. If a receiver can’t receive another complete byte of data until it has performed some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait state. Data transfer only continues when the receiver is ready for another byte and releases the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to receive because it is performing some real time function) the data line must be left HIGH by the slave. The Master can then abort the transfer. A LOW to HIGH transition on the SDA line while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be terminated by the generation of a STOP (SP) condition. In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the address of first register to be read. In the presented communication format MAK is Master acknowledge and NMAK is No Master Acknowledge. 5.2 SPI bus interface The LIS302DLH SPI is a bus slave. The SPI allows to write and read the registers of the device. The Serial Interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO. Doc ID 15797 Rev 1 19/37 Digital interfaces LIS302DLH Figure 6. Read and write protocol CS SPC SDI DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 RW MS AD5 AD4 AD3 AD2 AD1 AD0 SDO DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of the transmission and goes back high at the end. SPC is the serial port clock and it is controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are respectively the serial port data input and output. Those lines are driven at the falling edge of SPC and should be captured at the rising edge of SPC. Both the read register and write register commands are completed in 16 clock pulses or in multiple of 8 in case of multiple bytes read/write. Bit duration is the time between two falling edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the rising edge of CS. bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0) from the device is read. In latter case, the chip will drive SDO at the start of bit 8. bit 1: MS bit. When 0, the address will remain unchanged in multiple read/write commands. When 1, the address is auto incremented in multiple read/write commands. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first). bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first). In multiple read/write commands further blocks of 8 clock periods will be added. When MS bit is ‘0’ the address used to read/write data remains the same for every block. When MS bit is ‘1’ the address used to read/write data is increased at every block. The function and the behavior of SDI and SDO remain unchanged. 5.2.1 SPI read Figure 7. SPI read protocol CS SPC SDI RW MS AD5 AD4 AD3 AD2 AD1 AD0 SDO DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 20/37 Doc ID 15797 Rev 1 LIS302DLH Digital interfaces The SPI Read command is performed with 16 clock pulses. Multiple byte read command is performed adding blocks of 8 clock pulses at the previous one. bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first). bit 16-... : data DO(...-8). Further data in multiple byte reading. Figure 8. Multiple bytes SPI read protocol (2 bytes example) CS SPC SDI RW MS AD5 AD4 AD3 AD2 AD1 AD0 SDO DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DO15DO14DO13DO12DO11DO10DO9 DO8 5.2.2 SPI write Figure 9. SPI write protocol CS SPC SDI DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 RW MS AD5 AD4 AD3 AD2 AD1 AD0 The SPI Write command is performed with 16 clock pulses. Multiple byte write command is performed adding blocks of 8 clock pulses at the previous one. bit 0: WRITE bit. The value is 0. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple writing. bit 2 -7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb first). bit 16-... : data DI(...-8). Further data in multiple byte writing. Doc ID 15797 Rev 1 21/37 Digital interfaces LIS302DLH Figure 10. Multiple bytes SPI write protocol (2 bytes example) CS SPC SDI DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8 RW MS AD5 AD4 AD3 AD2 AD1 AD0 5.2.3 SPI read in 3-wires mode 3-wires mode is entered by setting to ‘1’ bit SIM (SPI serial interface mode selection) in CTRL_REG4. Figure 11. SPI read protocol in 3-wires mode CS SPC SDI/O DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 RW MS AD5 AD4 AD3 AD2 AD1 AD0 The SPI read command is performed with 16 clock pulses: bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first). Multiple read command is also available in 3-wires mode. 22/37 Doc ID 15797 Rev 1 LIS302DLH 6 Register mapping Register mapping The table given below provides a listing of the 8 bit registers embedded in the device and the related addresses: Table 15. Register address map Register address Name Type Default Hex Reserved (do not modify) WHO_AM_I 00 - 0E r Reserved (do not modify) 0F Reserved 000 1111 00110010 Dummy register 10 - 1F Reserved CTRL_REG1 rw 20 010 0000 00000111 CTRL_REG2 rw 21 010 0001 00000000 CTRL_REG3 rw 22 010 0010 00000000 CTRL_REG4 rw 23 010 0011 00000000 CTRL_REG5 rw 24 010 0100 00000000 r 25 010 0101 REFERENCE rw 26 010 0110 00000000 STATUS_REG r 27 010 0111 00000000 OUT_X_L r 28 010 1000 output OUT_X_H r 29 010 1001 output OUT_Y_L r 2A 010 1010 output OUT_Y_H r 2B 010 1011 output OUT_Z_L r 2C 010 1100 output OUT_Z_H r 2D 010 1101 output HP_FILTER_RESET Reserved (do not modify) INT1_CFG Dummy register 2E - 2F Reserved rw 30 011 0000 00000000 r 31 011 0001 00000000 INT1_THS rw 32 011 0010 00000000 INT1_DURATION rw 33 011 0011 00000000 INT2_CFG rw 34 011 0100 00000000 r 35 011 0101 00000000 INT2_THS rw 36 011 0110 00000000 INT2_DURATION rw 37 011 0111 00000000 INT1_SOURCE INT2_SOURCE Reserved (do not modify) 38 - 3F Comment Binary Reserved Registers marked as Reserved must not be changed. The writing to those registers may cause permanent damages to the device. Doc ID 15797 Rev 1 23/37 Register description LIS302DLH The content of the registers that are loaded at boot should not be changed. They contain the factory calibration values. Their content is automatically restored when the device is powered-up. 7 Register description The device contains a set of registers which are used to control its behavior and to retrieve acceleration data. The registers address, made of 7 bits, is used to identify them and to write the data through serial interface. 7.1 WHO_AM_I (0Fh) Table 16. 0 WHO_AM_I register 0 1 1 0 0 1 0 Device identification register. This register contains the device identifier that for LIS302DLH is set to 32h. 7.2 CTRL_REG1 (20h) Table 17. PM2 Table 18. CTRL_REG1 register PM1 PM0 DR1 DR0 Zen Yen Xen CTRL_REG1 description PM2 - PM0 Power mode selection. Default value: 000 (000: Power-down; Others: refer to Table 19) DR1, DR0 Data rate selection. Default value: 00 (00:50 Hz; Others: refer to Table 20) Zen Z axis enable. Default value: 1 (0: Z axis disabled; 1: Z axis enabled) Yen Y axis enable. Default value: 1 (0: Y axis disabled; 1: Y axis enabled) Xen X axis enable. Default value: 1 (0: X axis disabled; 1: X axis enabled) PM bits allow to select between power-down and two operating active modes. The device is in power-down mode when PD bits are set to “000” (default value after boot). Table 19 shows all the possible power mode configurations and respective output data rates. Output 24/37 Doc ID 15797 Rev 1 LIS302DLH Register description data in the low-power modes are computed with low-pass filter cut-off frequency defined by DR1, DR0 bits. DR bits, in the normal-mode operation, select the data rate at which acceleration samples are produced. In low-power mode they define the output data resolution. Table 20 shows all the possible configuration for DR1 and DR0 bits. Table 19. PM2 PM1 PM0 Power mode selection Output data rate [Hz] ODRLP 0 0 0 Power-down -- 0 0 1 Normal mode ODR 0 1 0 Low-power 0.5 0 1 1 Low-power 1 1 0 0 Low-power 2 1 0 1 Low-power 5 1 1 0 Low-power 10 Table 20. 7.3 Power mode and low-power output data rate configurations Normal-mode output data rate configurations and low-pass cut-off frequencies DR1 DR0 Output Data Rate [Hz] ODR Low-pass filter cut-off frequency [Hz] 0 0 50 37 0 1 100 74 1 0 400 292 1 1 1000 780 CTRL_REG2 (21h) Table 21. CTRL_REG2 register BOOT Table 22. HPM1 FDS HPen2 HPen1 HPCF1 HPCF0 CTRL_REG2 description BOOT HPM1, HPM0 FDS HPM0 Reboot memory content. Default value: 0 (0: normal mode; 1: reboot memory content) High pass filter mode selection. Default value: 00 (00: normal mode; Others: refer to Table 23) Filtered data selection. Default value: 0 (0: internal filter bypassed; 1: data from internal filter sent to output register) Doc ID 15797 Rev 1 25/37 Register description Table 22. LIS302DLH CTRL_REG2 description (continued) HPen2 High pass filter enabled for interrupt 2 source. Default value: 0 (0: filter bypassed; 1: filter enabled) HPen1 High pass filter enabled for interrupt 1 source. Default value: 0 (0: filter bypassed; 1: filter enabled) HPCF1, HPCF0 High pass filter cut-off frequency configuration. Default value: 00 (00: HPc=8; 01: HPc=16; 10: HPc=32; 11: HPc=64) BOOT bit is used to refresh the content of internal registers stored in the flash memory block. At the device power up the content of the flash memory block is transferred to the internal registers related to trimming functions to permit a good behavior of the device itself. If for any reason the content of trimming registers was changed it is sufficient to use this bit to restore correct values. When BOOT bit is set to ‘1’ the content of internal flash is copied inside corresponding internal registers and it is used to calibrate the device. These values are factory trimmed and they are different for every accelerometer. They permit a good behavior of the device and normally they have not to be changed. At the end of the boot process the BOOT bit is set again to ‘0’. Table 23. High-pass filter mode configuration HPM1 HPM0 High-pass filter mode 0 0 Normal mode (reset reading HP_RESET_FILTER) 0 1 Reference signal for filtering 1 0 Normal mode (reset reading HP_RESET_FILTER) HPCF[1:0]. These bits are used to configure high-pass filter cut-off frequency ft which is given by: fs 1 -⎞ ⋅ -----f t = ln ⎛ 1 – ----------⎝ ⎠ 2π HPc The equation can be simplified to the following approximated equation: fs f t = --------------------6 ⋅ HPc Table 24. ft [Hz] ft [Hz] Data rate = 50 Hz Data rate = 100 Hz 00 1 2 8 20 01 0.5 1 4 10 10 0.25 0.5 2 5 11 0.125 0.25 1 2.5 HPcoeff2,1 26/37 High-pass filter cut-off frequency configuration Doc ID 15797 Rev 1 ft [Hz] ft [Hz] Data rate = 400 Hz Data rate = 1000 Hz LIS302DLH 7.4 Register description CTRL_REG3 [Interrupt CTRL register] (22h) Table 25. CTRL_REG3 register IHL PP_OD Table 26. I2_CFG1 I2_CFG0 LIR1 I1_CFG1 I1_CFG0 CTRL_REG3 description IHL Interrupt active high, low. Default value: 0 (0: active high; 1:active low) PP_OD Push-pull/Open drain selection on interrupt pad. Default value 0. (0: push-pull; 1: open drain) LIR2 Latch interrupt request on INT2_SRC register, with INT2_SRC register cleared by reading INT2_SRC itself. Default value: 0. (0: interrupt request not latched; 1: interrupt request latched) I2_CFG1, I2_CFG0 Data signal on INT 2 pad control bits. Default value: 00. (see table below) LIR1 Latch interrupt request on INT1_SRC register, with INT1_SRC register cleared by reading INT1_SRC register. Default value: 0. (0: interrupt request not latched; 1: interrupt request latched) I1_CFG1, I1_CFG0 Data signal on INT 1 pad control bits. Default value: 00. (see table below) Table 27. 7.5 LIR2 Data signal on INT 1 and INT 2 pad I1(2)_CFG1 I1(2)_CFG0 INT 1(2) Pad 0 0 Interrupt 1 (2) source 0 1 Interrupt 1 source OR interrupt 2 source 1 0 Data ready 1 1 Boot running CTRL_REG4 (23h) Table 28. BDU CTRL_REG4 register BLE FS1 FS0 STsign Doc ID 15797 Rev 1 0 ST SIM 27/37 Register description Table 29. LIS302DLH CTRL_REG4 description BDU Block data update. Default value: 0 (0: continuos update; 1: output registers not updated between MSB and LSB reading) BLE Big/little endian data selection. Default value 0. (0: data LSB @ lower address; 1: data MSB @ lower address) FS1, FS0 Full-scale selection. Default value: 00. (00: ±2 g; 01: ±4 g; 11: ±8 g) STsign Self-test sign. Default value: 00. (0: self-test plus; 1 self-test minus) ST Self-test enable. Default value: 0. (0: self-test disabled; 1: self-test enabled) SIM SPI serial interface mode selection. Default value: 0. (0: 4-wire interface; 1: 3-wire interface) BDU bit is used to inhibit output registers update between the reading of upper and lower register parts. In default mode (BDU = ‘0’) the lower and upper register parts are updated continuously. If it is not sure to read faster than output data rate, it is recommended to set BDU bit to ‘1’. In this way, after the reading of the lower (upper) register part, the content of that output registers is not updated until the upper (lower) part is read too. This feature avoids reading LSB and MSB related to different samples. 7.6 CTRL_REG5 (24h) Table 30. 0 CTRL_REG5 register 0 Table 31. TurnOn1, TurnOn0 0 0 0 0 TurnOn1 TurnOn0 CTRL_REG5 description Turn-on mode selection for sleep to wake function. Default value: 00. TurnOn bits are used for turning on the sleep to wake function. Table 32. Sleep to wake configuration TurnOn1 TurnOn0 Sleep to wake status 0 0 Sleep to wake function is disabled 1 1 Turned on: The device is in low power mode (ODR is defined in CTRL_REG1) Setting TurnOn[1:0] bits to 11 the “sleep to wake” function is enabled. When an interrupt event occurs the device is turned to normal mode increasing the ODR to the value defined in 28/37 Doc ID 15797 Rev 1 LIS302DLH Register description CTRL_REG1. Although the device is in normal mode, CTRL_REG1 content is not automatically changed to “normal mode” configuration. 7.7 HP_FILTER_RESET (25h) Dummy register. Reading at this address zeroes instantaneously the content of the internal high pass-filter. If the high pass filter is enabled all three axes are instantaneously set to 0g. This allows to overcome the settling time of the high pass filter. 7.8 REFERENCE (26h) Table 33. Ref7 Table 34. Ref7 - Ref0 REFERENCE register Ref6 Ref5 Ref4 Ref3 Ref2 Ref1 Ref0 REFERENCE description Reference value for high-pass filter. Default value: 00h. This register sets the acceleration value taken as a reference for the high-pass filter output. When filter is turned on (at least one of FDS, HPen2, or HPen1 bit is equal to ‘1’) and HPM bits are set to “01”, filter out is generated taking this value as a reference. 7.9 STATUS_REG (27h) Table 35. ZYXOR Table 36. STATUS_REG register ZOR YOR XOR ZYXDA ZDA YDA XDA STATUS_REG description ZYXOR X, Y and Z axis data overrun. Default value: 0 (0: no overrun has occurred; 1: new data has overwritten the previous one before it was read) ZOR Z axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the Z-axis has overwritten the previous one) YOR Y axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the Y-axis has overwritten the previous one) XOR X axis data overrun. Default value: 0 (0: no overrun has occurred; 1: a new data for the X-axis has overwritten the previous one) Doc ID 15797 Rev 1 29/37 Register description Table 36. 7.10 LIS302DLH STATUS_REG description (continued) ZYXDA X, Y and Z axis new data available. Default value: 0 (0: a new set of data is not yet available; 1: a new set of data is available) ZDA Z axis new data available. Default value: 0 (0: a new data for the Z-axis is not yet available; 1: a new data for the Z-axis is available) YDA Y axis new data available. Default value: 0 (0: a new data for the Y-axis is not yet available; 1: a new data for the Y-axis is available) XDA X axis new data available. Default value: 0 (0: a new data for the X-axis is not yet available; 1: a new data for the X-axis is available) OUT_X_L (28h), OUT_X_H (29h) X-axis acceleration data. The value is expressed as two’s complement. 7.11 OUT_Y_L (2Ah), OUT_Y_H (2Bh) Y-axis acceleration data. The value is expressed as two’s complement. 7.12 OUT_Z_L (2Ch), OUT_Z_H (2Dh) Z-axis acceleration data. The value is expressed as two’s complement. 7.13 INT1_CFG (30h) Table 37. AOI Table 38. 30/37 INT1_CFG register 6D ZHIE ZLIE YHIE YLIE XHIE XLIE INT1_CFG description AOI AND/OR combination of Interrupt events. Default value: 0. (See Table 39) 6D 6 direction detection function enable. Default value: 0. (See Table 39) ZHIE Enable interrupt generation on Z high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) ZLIE Enable interrupt generation on Z low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Doc ID 15797 Rev 1 LIS302DLH Register description Table 38. INT1_CFG description YHIE Enable interrupt generation on Y high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) YLIE Enable interrupt generation on Y low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) XHIE Enable interrupt generation on X high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) XLIE Enable interrupt generation on X low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Configuration register for Interrupt 1 source. Table 39. 7.14 Interrupt 1 source configurations AOI 6D Interrupt mode 0 0 OR combination of interrupt events 0 1 6 direction movement recognition 1 0 AND combination of interrupt events 1 1 6 direction position recognition INT1_SRC (31h) Table 40. 0 Table 41. INT1_SRC register IA ZH ZL YH YL XH XL INT1_SRC description IA Interrupt active. Default value: 0 (0: no interrupt has been generated; 1: one or more interrupts have been generated) ZH Z high. Default value: 0 (0: no interrupt, 1: Z High event has occurred) ZL Z low. Default value: 0 (0: no interrupt; 1: Z Low event has occurred) YH Y high. Default value: 0 (0: no interrupt, 1: Y High event has occurred) YL Y low. Default value: 0 (0: no interrupt, 1: Y Low event has occurred) Doc ID 15797 Rev 1 31/37 Register description Table 41. LIS302DLH INT1_SRC description XH X high. Default value: 0 (0: no interrupt, 1: X High event has occurred) XL X low. Default value: 0 (0: no interrupt, 1: X Low event has occurred) Interrupt 1 source register. Read only register. Reading at this address clears INT1_SRC IA bit (and the interrupt signal on INT 1 pin) and allows the refreshment of data in the INT1_SRC register if the latched option was chosen. 7.15 INT1_THS (32h) Table 42. INT1_THS register 0 Table 43. THS6 THS4 THS3 THS2 THS1 THS0 D2 D1 D0 INT1_THS description THS6 - THS0 7.16 THS5 Interrupt 1 threshold. Default value: 000 0000 INT1_DURATION (33h) Table 44. 0 Table 45. D6 - D0 INT1_DURATION register D6 D5 D4 D3 INT1_DURATION description Duration value. Default value: 000 0000 D6 - D0 bits set the minimum duration of the Interrupt 1 event to be recognized. Duration steps and maximum values depend on the ODR chosen. 7.17 INT2_CFG (34h) Table 46. AOI 32/37 INT2_CFG register 6D ZHIE ZLIE Doc ID 15797 Rev 1 YHIE YLIE XHIE XLIE LIS302DLH Register description Table 47. INT2_CFG description AOI AND/OR combination of interrupt events. Default value: 0. (See table below) 6D 6 direction detection function enable. Default value: 0. (See table below) ZHIE Enable interrupt generation on Z high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) ZLIE Enable interrupt generation on Z low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) YHIE Enable interrupt generation on Y high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) YLIE Enable interrupt generation on Y low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) XHIE Enable interrupt generation on X high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) XLIE Enable interrupt generation on X low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Configuration register for Interrupt 2 source. Table 48. 7.18 Interrupt mode configuration AOI 6D Interrupt mode 0 0 OR combination of interrupt events 0 1 6 direction movement recognition 1 0 AND combination of interrupt events 1 1 6 direction position recognition INT2_SRC (35h) Table 49. 0 INT2_SRC register IA ZH ZL Doc ID 15797 Rev 1 YH YL XH XL 33/37 Register description Table 50. LIS302DLH INT2_SRC description IA Interrupt active. Default value: 0 (0: no interrupt has been generated; 1: one or more interrupts have been generated) ZH Z high. Default value: 0 (0: no interrupt, 1: Z high event has occurred) ZL Z low. Default value: 0 (0: no interrupt; 1: Z low event has occurred) YH Y high. Default value: 0 (0: no interrupt, 1: Y high event has occurred) YL Y low. Default value: 0 (0: no interrupt, 1: Y low event has occurred) XH X high. Default value: 0 (0: no interrupt, 1: X high event has occurred) XL X Low. Default value: 0 (0: no interrupt, 1: X low event has occurred) Interrupt 2 source register. Read only register. Reading at this address clears INT2_SRC IA bit (and the interrupt signal on INT 2 pin) and allows the refreshment of data in the INT2_SRC register if the latched option was chosen. 7.19 INT2_THS (36h) Table 51. INT2_THS register 0 Table 52. THS6 THS4 THS3 THS2 THS1 THS0 D2 D1 D0 INT2_THS description THS6 - THS0 7.20 THS5 Interrupt 2 threshold. Default value: 000 0000 INT2_DURATION (37h) Table 53. 0 Table 54. D6 - D0 INT2_DURATION register D6 D5 D4 D3 INT2_DURATION description Duration value. Default value: 000 0000 D6 - D0 bits set the minimum duration of the Interrupt 2 event to be recognized. Duration time steps and maximum values depend on the ODR chosen. 34/37 Doc ID 15797 Rev 1 LIS302DLH 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 12. LGA-14: mechanical data and package dimensions OUTLINE AND MECHANICAL DATA LGA-14 (3x5x0.8mm) Doc ID 15797 Rev 1 35/37 Revision history 9 LIS302DLH Revision history Table 55. 36/37 Document revision history Date Revision 04-Jun-2009 1 Changes Initial release Doc ID 15797 Rev 1 LIS302DLH Please Read Carefully: Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 15797 Rev 1 37/37
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