LIS302SG
MEMS motion sensor
3-axis - ±2g analog output "piccolo" accelerometer
Features
■
Single voltage supply operation
■
~2 mW power consumption
■
±2 g full-scale
■
3 acceleration channels plus multiplexed
analog output
■
Ratiometric output voltage
■
Power-down mode
■
Embedded self-test
■
10000 g high shock survivability
■
ECOPACK® RoHS and “Green” compliant
(see Section 6)
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LGA-14 (3x5x0.9mm)
Description
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maximum bandwidth of 2.0 kHz. The device
bandwidth may be reduced by using external
capacitances. The self-test capability allows the
user to check the functioning of the sensor in the
final application.
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The device has three analog acceleration output
plus an embedded multiplexer that allows to
redirect the analog outputs onto a single pin for
operation with a single channel A/D converter.
The LIS302SG is a miniaturized low-power threeaxis linear accelerometer belonging to the
“piccolo” family of ST motion sensors. It includes
a sensing element and an IC interface to provide
an analog signal to the external world.
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The LIS302SG is available in plastic Thin Land
Grid Array package (TLGA) and it is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.
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The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
process developed by ST to produce motion
sensors and actuators in silicon.
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The LIS302SG belongs to a family of products
suitable for a variety of applications, including:
– Mobile terminals
– Gaming and virtual reality input devices
– Free-fall detection for data protection
– Antitheft systems and inertial navigation
– Appliance and robotics.
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The IC interface is manufactured using a CMOS
process that allows to design a dedicated circuit
which is trimmed to better match the sensing
element characteristics.
The LIS302SG has a full scale of ±2 g and it is
capable of measuring accelerations over a
Table 1.
Device summary
Order codes
Temperature range [°C]
Package
Packing
LIS302SG
-40 to +85
LGA-14
Tray
LIS302SGTR
-40 to +85
LGA-14
Tape and reel (16mm, pitch 8mm)
March 2008
Rev 1
1/19
www.st.com
19
Contents
LIS302SG
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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3.1
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2
IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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5
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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4.1
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2
Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1
Mechanical characteristics at 25°C
5.2
Mechanical characteristics derived from measurement in the -40 °C to +85
°C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.3
Electro-mechanical characteristics at 25 °C . . . . . . . . . . . . . . . . . . . . . . . 17
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/19
LIS302SG
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
LIS302SG electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
X axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
X axis sensitivity-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Y axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Y axis sensitivity-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Z axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Z axis sensitivity-g level at 3.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
X axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
X axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Y axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Y axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Z axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Z axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Current consumption in normal mode at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Current consumption in Power-down mode at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
LGA-14: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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3/19
List of tables
LIS302SG
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mechanical characteristics @ Vdd =3.3 V, T = 25 °C unless otherwise noted . . . . . . . . . . . 7
Electrical characteristics @ Vdd =3.3 V, T=25 °C unless otherwise noted. . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Filter capacitor selection, Cload (x,y,z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Mux I/O table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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4/19
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LIS302SG
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
X+
CHARGE
AMPLIFIER
Y+
Z+
a
MUX
DEMUX
REFERENCE
Voutz
Vout
MUX
CLOCK
Aux_in S1 S0
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X
Reserved
Pin connection
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Pin description
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Vouty
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TRIMMING CIRCUIT
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Figure 2.
Routy
Routz
S/H
1.1
Voutx
S/H
ZYX-
SELF-TEST
Routx
S/H
Z
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Y
1 Reserved
Reserved
S0
S1
ST
6 PD
Voutx
(TOP VIEW)
DIRECTIONS OF
DETECTABLE
ACCELERATIONS
Vdd 13
Aux_in
Vout
GND
Voutz
Vouty 8
(BOTTOM VIEW)
5/19
Block diagram and pin description
Table 2.
LIS302SG
Pin description
Pin #
Pin name
Function
1
Reserved
Connect to Vdd
2
Reserved
Connect to Vdd
3
S0
Mux selector 0 (connect to Vdd or to GND)
4
S1
Mux selector 1 (connect to Vdd or to GND)
5
ST
Self-test (logic 0: normal mode; logic 1: Self-test)
6
PD
Power-down (logic 0: normal mode; logic 1: power-down mode)
7
Voutx
Output Voltage X channel
8
Vouty
Output Voltage Y channel
9
Voutz
Output Voltage Z channel
10
GND
0V supply
11
Vout
Multiplexer output
12
Aux_In
Auxiliary input
13
Vdd
Power supply
14
Reserved
Connect to Vdd
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6/19
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LIS302SG
Mechanical and electrical specifications
2
Mechanical and electrical specifications
2.1
Mechanical characteristics
Table 3.
Mechanical characteristics @ Vdd =3.3 V, T = 25 °C unless otherwise noted(1)
Symbol
Parameter
Test condition
Ar
Acceleration range(3)
So
Sensitivity(4)
0.145*Vdd
–5%
Sensitivity change vs.
temperature
Delta from +25 °C
Voff
Zero-g level(4)
T = 25 °C
Zero-g level change
vs temperature
Delta from +25 °C
Non linearity(5)
Best fit straight line
NL
CrossAx Cross-axis
Vt
Self-test output
voltage change(7),(8)
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Sensing element
resonant frequency(9)
ro
V
mg/°C
% FS
±2
%
200
µg/ Hz
+95
+200
mV
+95
+200
mV
T = 25 °C
Vdd=3.3 V
Z axis
+95
+200
mV
all axes
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T = 25 °C
Vdd=3.3 V
Y axis
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Fres
Top
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Vdd/2+6%
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%/°C
Vdd/2
±0.5
V/g
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±0.5
Vdd=3.3 V
T = 25 °C
Vdd=3.3 V
X axis
0.145*Vdd
+ 5%
0.145*Vdd
Vdd/2-6%
Unit
g
±0.01
(6)
Acceleration noise
density
An
Max.
±2.0
SoDr
OffDr
Typ.(2)
Min.
Operating
temperature range
kHz
-40
Product weight
+85
30
°C
mgram
1. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 4. Since the device is
ratiometric Voff, So and Vt parameters will vary with supply voltage.
2. Typical specifications are not guaranteed
3. Guaranteed by wafer level test and measurement of initial offset and sensitivity
4. Zero-g level and sensitivity are ratiometric to supply voltage
5. Guaranteed by design
6. Contribution to the measuring output of an inclination/acceleration along any perpendicular axis
7. “Self-test output voltage change” is defined as Vout(Vst=logic 1)-Vout(Vst=logic 0)
8. “Self-test output voltage change” varies cubically with supply voltage
9. Minimum resonance frequency Fres=2.0 kHz. Sensor bandwidth=1/(2*π*32kΩ*Cload), with Cload>2.5 nF
7/19
Mechanical and electrical specifications
LIS302SG
2.2
Electrical characteristics
Table 4.
Electrical characteristics @ Vdd =3.3 V, T=25 °C unless otherwise noted(1)
Symbol
Parameter
Test condition
Min.
Typ.(2)
Max.
Unit
3.0
3.3
3.6
V
Vdd
Supply voltage
Idd
Supply current
Mean value
PD pin connected to GND
0.65
mA
Supply current in
power-down mode
PD pin connected to Vdd
1
µA
IddPdn
Vst
Logic 0 level at Vdd=3.3 V
0
0.2*Vdd
Logic 1 level at Vdd=3.3 V
0.8*Vdd
Vdd
Self-test input
Rout
Output impedance of
Voutx, Vouty, Voutz
Cload
Capacitive load drive
for Voutx, Vouty,
Voutz(3)
Logic 0 level at Vdd=3.3 V
Vs0
S1 input
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Logic 1 level at Vdd=3.3 V
Cloadmux
Ton
Series resistance of
multiplexer input vs.
Vout
Capacitive load drive
for multiplexed output
Vout
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V
0
0.2*Vdd
V
0.8*Vdd
Vdd
V
Cload in µF
1
kΩ
10
pF
160*Cload+0.3
ms
-40
1. The product is factory calibrated at 3.3 V.
2. Typical specifications are not guaranteed
3. Minimum resonance frequency Fres=2.0 kHz. Device bandwidth=1/(2*π*32kΩ*Cload), with Cload>2.5 nF
8/19
nF
Vdd
let
0.8*Vdd
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Operating
temperature range
kΩ
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Turn-on time
at exit from
power-down mode
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Top
)-
V
0.2*Vdd
so
Logic 0 level at Vdd=3.3 V
Rmux
0
S0 Input
Logic 1 level at Vdd=3.3 V
Vs1
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2.5
V
+85
°C
LIS302SG
2.3
Mechanical and electrical specifications
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 5.
Absolute maximum ratings
Symbol
Ratings
Maximum value
Unit
-0.3 to 6
V
V
Vdd
Supply voltage
Vin
Input voltage on any control pin (PD, ST, S0, S1)
-0.3 to Vdd +0.3
VAux_in
Aux_in input voltage
-0.3 to Vdd +0.3
APOW
Acceleration (any axis, powered, Vdd=3.3 V)
AUNP
Acceleration (any axis, not powered)
TSTG
Storage temperature range
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3000 g for 0.5 ms
10000 g for 0.1 ms
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3000 g for 0.5 ms
ESD
10000 g for 0.1 ms
Electrostatic discharge protection
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-40 to +150
°C
2 (HBM)
KV
1.5 (CDM)
KV
200 (MM)
V
This is a Mechanical Shock sensitive device, improper handling can cause
permanent damages to the part
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This is an ESD sensitive device, improper handling can cause permanent damages to
the part
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9/19
Mechanical and electrical specifications
2.4
LIS302SG
Terminology
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the Earth, note the output value, rotate the
sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1 g
acceleration to the sensor. Subtracting the larger output value from the smaller one, and
dividing the result by 2, will give the actual sensitivity of the sensor. This value changes very
little over temperature (see sensitivity change vs. temperature) and also very little over time.
The Sensitivity tolerance describes the range of Sensitivities of a large population of
sensors.
Zero-g level describes the actual output signal if there is no acceleration present. A sensor
in a steady state on a horizontal surface will measure 0 g in X axis and 0 g in Y axis whereas
the Z axis will measure 1 g. The output is ideally for a 3.3 V powered sensor Vdd/2 =
1650 mV. A deviation from ideal 0-g level (1650 mV in this case) is called Zero-g offset.
Offset of precise MEMS sensors is to some extend a result of stress to the sensor and
therefore the offset can slightly change after mounting the sensor onto a printed circuit
board or exposing it to extensive mechanical stress. Offset changes little over temperature see “Zero-g level change vs. temperature” - the Zero-g level of an individual sensor is very
stable over lifetime. The Zero-g level tolerance describes the range of Zero-g levels of a
population of sensors.
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Self-test allows to check the sensor functionality without moving it. The Self-test function is
off when the ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force
is applied to the sensor, simulating a definite input acceleration. In this case the sensor
outputs will exhibit a voltage change in their DC levels. When ST is activated, the device
output level is given by the algebraic sum of the signals produced by the acceleration acting
on the sensor and by the electrostatic test-force. If the output signals change within the
amplitude specified inside Table 3, then the sensor is working properly and the parameters
of the interface chip are within the defined specification.
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Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 2.5 nF and the internal
resistor. Due to the resistor level, only small inexpensive external capacitors are needed to
generate low corner frequencies. When interfacing with an ADC it is important to use high
input impedance input circuitries to avoid measurement errors. Note that the minimum load
capacitance forms a corner frequency close to the resonance frequency of the sensor. In
general the smallest possible bandwidth for a particular application should be chosen to get
the best results.
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10/19
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LIS302SG
3
Functionality
Functionality
The LIS302SG is a “piccolo” low-power, analog output three-axis linear accelerometer
packaged in a LGA package. The complete device includes a sensing element and an IC
interface able to take the information from the sensing element and to provide an analog
signal to the external world. The sensor provides the three accelerations and one
multiplexed analog output.
3.1
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. To be compatible with the traditional packaging techniques a cap is placed on
top of the sensing element to avoid blocking the moving parts during the moulding phase of
the plastic encapsulation.
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When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the sense capacitor.
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At steady state the nominal value of the capacitors are few pF and when an acceleration is
applied the maximum variation of the capacitive load is in the fF range.
3.2
IC interface
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The complete signal processing uses a fully differential structure, while the final stage
converts the differential signal into a single-ended one to be compatible with the external
world.
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The first stage is a low-noise capacitive amplifier that implements a Correlated Double
Sampling (CDS) at its output to cancel the offset and the 1/f noise. The produced signal is
then sent to three different S&Hs, one for each channel, and made available to the outside.
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3.3
The device provides an embedded multiplexer to allow the redirection of either the analog
output signals Voutx, Vouty, and Voutz or of an auxiliary input signal onto a single pin for
operation with a single channel A/D converter.
All the analog parameters (output offset voltage and sensitivity) are ratiometric to the
voltage supply. Increasing or decreasing the voltage supply, the sensitivity and the offset will
increase or decrease linearly. The feature provides the cancellation of the error related to
the voltage supply along an analog to digital conversion chain.
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).
The trimming values are stored inside the device in a non volatile structure. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be
employed during the normal operation. This allows the user to employ the device without
further calibration.
11/19
Application hints
4
LIS302SG
Application hints
Figure 3.
LIS302SG electrical connection
LIS302SG
(top view)
Vdd
Vdd
GND
1
100nF
13
Z
GND
10µF
1
X
Pin 1 indicator
Aux In
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Optional
S0
Vout
Cloadmux
S1
Y
GND
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Optional
ST
Vout Z
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Cload z
PD
8
6
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DIRECTIONS OF
DETECTABLE
ACCELERATIONS
Optional
Cload y
O
)
Vout Y
Optional
Analog signals
s
(
t
c
Digital signals
Cload x
Vout X
u
d
o
Power supply decoupling capacitors (100 nF ceramic or polyester + 10 µF Aluminum)
should be placed as near as possible to the device (common design practice).
r
P
e
The LIS302SG allows to band limit Voutx, Vouty and Voutz through the use of external
capacitors. The recommended frequency range spans from DC up to 2.0 kHz. Capacitors
must be added at output pins to implement low-pass filtering for antialiasing and noise
reduction, even if the only multiplexed output (Vout) is used. The equation for the cut-off
frequency ( ft ) of the external filters is:
t
e
l
o
s
b
O
1
f t = ------------------------------------------------------------------------2π ⋅ R out ⋅ C load ( x, y, z )
Taking into account that the internal filtering resistor (Rout) has a nominal value equal to
32 kΩ, the equation for the external filter cut-off frequency may be simplified as follows:
5µF
f t = --------------------------------------- [ Hz ]
C load ( x, y, z )
The tolerance of the internal resistor can vary typically of ±20% within its nominal value of
32 kΩ; thus the cut-off frequency will vary accordingly. A minimum capacitance of 2.5 nF for
Cload(x, y, z) is required in any case.
An external capacitor can be added to the Vout pin. Values below 10 pF are recommended.
12/19
LIS302SG
Application hints
Filter capacitor selection, Cload (x,y,z)
Table 6.
Table 7.
Cut-off frequency
Capacitor value
1 Hz
5 µF
10 Hz
0.5 µF
20 Hz
250 nF
50 Hz
100 nF
100 Hz
50 nF
200 Hz
25 nF
500 Hz
10 nF
Mux I/O table
S1 pin
S0 pin
0
0
0
1
1
0
1
1
)
(s
4.1
Soldering information
)
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ct
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Mux status
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Vout = Voutx
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Vout = Vouty
Vout = Voutz
Vout = Aux_in
The LGA package is compliant with the ECOPACK®, RoHs and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020C.
t
c
u
Leave “Pin 1 Indicator” unconnected during soldering.
d
o
r
Land pattern and soldering recommendations are available at www.st.com/mems.
P
e
Output
response vs. orientation
t
e
ol
4.2
bs
Figure 4.
Output response vs. orientation
O
X=1.17V (-1g)
Y=1.65V (0g)
Z=1.65V (0g)
Bottom
X=1.65V (0g)
Y=2.13V (+1g)
Z=1.65V (0g)
X=1.65V (0g)
Y=1.17V (-1g)
Z=1.65V (0g)
X=2.13V (+1g)
Y=1.65V (0g)
Z=1.65V (0g)
Top
Top
X=1.65V (0g)
Y=1.65V (0g)
Z=1.17V (-1g)
X=1.65V (0g)
Y=1.65V (0g)
Bottom Z=2.13V (+1g)
Earth’s Surface
Figure 4 refers to LIS302SG powered at 3.3 V.
13/19
Typical performance characteristics
LIS302SG
5
Typical performance characteristics
5.1
Mechanical characteristics at 25°C
X axis zero-g level at 3.3 V
Figure 6.
25
25
20
20
Percent of parts [%]
Percent of parts [%]
Figure 5.
15
10
5
−200
Figure 7.
−150
−100
−50
0
50
100
Zero−g Level Offset [mg]
)
(s
Percent of parts [%]
25
u
d
o
15
r
P
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10
5
o
s
b
O
200
10
−200
Figure 9.
−150
−100
−50
0
50
100
Zero−g Level Offset [mg]
0
0.43
250
0.44
0.45
e
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ol
Figure 8.
s
b
O
u
d
o
Pr
0.46
0.47
0.48
Sensitivity [V/g]
0.49
0.5
0.51
0.52
Y axis sensitivity-g level at
3.3 V
25
20
ct
20
0
−250
150
Y axis zero-g level at 3.3 V
30
let
)
s
(
ct
15
5
Percent of parts [%]
0
−250
X axis sensitivity-g level at
3.3 V
15
10
5
150
200
0
0.43
250
Z axis zero-g level at 3.3 V
0.44
0.45
0.46
0.47
0.48
Sensitivity [V/g]
0.49
0.5
0.51
0.52
Figure 10. Z axis sensitivity-g level
at 3.3 V
25
30
25
Percent of parts [%]
Percent of parts [%]
20
15
10
20
15
10
5
5
0
−250
14/19
−200
−150
−100
−50
0
50
100
Zero−g Level Offset [mg]
150
200
250
0
0.43
0.44
0.45
0.46
0.47
0.48
Sensitivity [V/g]
0.49
0.5
0.51
0.52
LIS302SG
5.2
Typical performance characteristics
Mechanical characteristics derived from measurement in the
-40 °C to +85 °C temperature range
Figure 11. X axis zero-g level change vs. Figure 12. X axis sensitivity-g change
temperature at 3.3 V
vs. temperature at 3.3 V
50
30
45
25
40
35
Percent of parts (%)
Percent of parts (%)
20
30
25
20
)
s
(
ct
15
10
15
u
d
o
10
5
5
0
−6
−4
−2
0
2
4
0
−0.05
6
−0.04
r
P
e
−0.03
o
0−g level drift (mg/ C)
−0.02
−0.01
0
0.01
0.02
0.03
0.04
0.05
o
Sensitivity drift (%/ C)
t
e
l
o
Figure 13. Y axis zero-g level change vs. Figure 14. Y axis sensitivity-g change
temperature at 3.3 V
vs. temperature at 3.3 V
)
(s
50
Percent of parts (%)
40
od
20
e
t
e
ol
0
−6
−4
−2
30
20
15
10
5
0
2
4
0
−0.05
6
−0.04
−0.03
−0.02
0−g level drift (mg/oC)
−0.01
0
0.01
0.02
0.03
0.04
0.05
Sensitivity drift (%/oC)
Figure 15. Z axis zero-g level change vs. Figure 16. Z axis sensitivity-g change
temperature at 3.3 V
vs. temperature at 3.3 V
50
40
45
35
40
30
Percent of parts (%)
35
Percent of parts (%)
O
bs
Pr
35
25
t
c
u
30
10
s
b
O
Percent of parts (%)
60
30
25
20
25
20
15
15
10
10
5
5
0
−6
−4
−2
0
0−g level drift (mg/oC)
2
4
6
0
−0.05
−0.04
−0.03
−0.02
−0.01
0
0.01
0.02
0.03
0.04
0.05
Sensitivity drift (%/oC)
15/19
Typical performance characteristics
5.3
LIS302SG
Electro-mechanical characteristics at 25 °C
Figure 18. Current consumption in
Power-down mode at 3.3 V
25
25
20
20
Percent of parts [%]
Percent of parts [%]
Figure 17. Current consumption in
normal mode at 3.3 V
15
10
5
0
500
15
10
550
600
650
700
750
Current consumption [uA]
800
850
0
0
900
0.1
0.2
e
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)
(s
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b
O
16/19
)
s
(
ct
5
s
b
O
0.3
du
0.4
0.5
0.6
0.7
Current consumption [uA]
o
r
P
0.8
0.9
1
LIS302SG
6
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK® is an ST trademark.
ECOPACK® specifications are available at: www.st.com.
Figure 19. LGA-14: mechanical data and package dimensions
mm
MIN.
A1
TYP.
MAX.
0.920
1.000
0.0362 0.0394
0.700
0.0275
A2
MIN.
TYP.
0.180
0.220
0.260 0.0071 0.0087 0.0102
D1
2.850
3.000
3.150 0.1122 0.1181 0.1240
E1
4.850
5.000
5.150 0.1909 0.1968 0.2027
0.800
0.0315
0.0118
d
0.300
L1
4.000
0.1575
N
1.360
0.0535
N1
1.200
0.965
0.975
0.985 0.0380 0.0384 0.0386
P2
0.640
0.650
0.660 0.0252 0.0256 0.0260
T1
0.750
0.800
0.850 0.0295 0.0315 0.0335
T2
0.450
0.500
0.550 0.0177 0.0197 0.0217
R
1.200
k
d
o
r
i
s
1.600 0.0472
t
c
u
h
0.150
0.050
u
d
o
r
P
e
t
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l
o
s
b
O
0.0472
P1
)
(s
OUTLINE AND
MECHANICAL DATA
MAX.
A3
e
)
s
(
ct
inch
DIM.
0.0630
0.0059
0.0020
0.100
0.0039
0.100
0.0039
LGA-14 (3x5x0.92mm) Pitch 0.8mm
Land Grid Array Package
P
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7773587 C
17/19
Revision history
7
LIS302SG
Revision history
Table 8.
Document revision history
Date
Revision
05-Mar-2008
1
Changes
Initial release
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18/19
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LIS302SG
)
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Please Read Carefully:
u
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
t
e
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o
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
)
(s
s
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UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
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WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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u
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
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d
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
s
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ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
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19/19