LM272M

L 272 DUAL POWER OPERATIONAL AMPLIFIERS . . . . . . . OUTPUT CURRENT TO 1 A OPERATES AT LOW VOLTAGES SINGLE OR SPLIT SUPPLY LARGE COMMON-MODE AND DIFFERENTIAL MODE RANGE GROUND COMPATIBLE INPUTS LOW SATURATION VOLTAGE THERMAL SHUTDOWN Powerdip (8 + 8) DESCRIPTION The L272 is a monolithic integrated circuits in Powerdip, Minidip and SO packages intended for use as power operational amplifiers in a wide range of applications including servo amplifiers and power supplies, compacts disc, VCR, etc. The high gain and high output power capability provide superior performance whatever an operational amplifier/power booster combination is required. PIN CONNECTIONS (top view) Minidip SO16 (Narrow) ORDERING NUMBERS : L272 (Powerdip) L272M (Minidip) L272D (SO16 Narrow) L272M L272D January 1995 1/10 L272 BLOCK DIAGRAMS L272 L272D L272M SCHEMATIC DIAGRAM (one only) 2/10 L272 ABSOLUTE MAXIMUM RATINGS Symbol Vs Vi Vi Io Ip Ptot Supply Voltage Input Voltage Differential Input Voltage DC Output Current Peak Output Current (non repetitive) Power Dissipation at: Tamb = 80°C (L272), Tamb = 50°C (L272M), Tcase = 90 °C (L272D) Tcase = 75 °C (L272) Operating Temperature Range (L272D) Storage and Junction Temperature Parameter Value 28 Vs ± Vs 1 1.5 1.2 5 – 40 to 85 – 40 to 150 A A W W °C °C Unit V Top Tstg, Tj THERMAL DATA Symbol Rth j-case Rth j-amb Rth j-alumina Parameter Thermal Resistance Junction-pins Thermal Resistance Junction-ambient Thermal Resistance Junction-alumina Max. Max. Max. Powerdip 15 70 – SO16 – – ** 50 Minidip * 70 100 – Unit o o o C/W C/W C/W * Thermal resistance junction-pin 4 ** Thermal resistance junctions-pins with the chip soldered on the middle of an alumina supporting substrate measuring 15x 20mm; 0.65mm thickness and infinite heatsink. ELECTRICAL CHARACTERISTICS (VS = 24V, T amb = 25oC unless otherwise specified) Symbol Vs Is Ib Vos Ios SR B Ri Gv eN IN CRR SVR Parameter Supply Voltage Quiescent Drain Current Input Bias Current Input Offset Voltage Input Offset Current Slew Rate Gain-bandwidth Product Input Resistance O. L. Voltage Gain Input Noise Voltage Input Noise Current Common Mode Rejection Supply Voltage Rejection f = 100Hz f = 1kHz B = 20kHz B = 20kHz f = 1kHz f = 100Hz, RG = 10kΩ, VR = 0.5V Vs = 24V Vs = ± 12V Vs = ± 6V Ip = 0.1A Ip = 0.5A f = 1 kHz; RL =10Ω, Gv = 30dB Vs = 24V Vs = ± 6V f = 1kHz, Gv = 3 dB, Vs = 24V, RL = ∞ 60 500 60 70 50 10 200 75 70 62 56 23 22.5 60 60 0.5 145 % °C V V dB VO = VS 2 Vs = 24V Vs = 12V Test Conditions Min. 4 8 7.5 0.3 15 50 1 350 Typ. Max. 28 12 11 2.5 60 250 Unit V mA mA µA mV nA V/µs kHz kΩ dB dB µV pA dB dB 54 Vo Cs Output Voltage Swing Channel Separation 21 d Tsd Distortion Thermal Shutdown Junction Temperature 3/10 L272 Figure 1 : Quiescent Current versus Supply Voltage Figure 2 : Quiescent Drain Current versus Temperature Figure 3 : Open Loop Voltage Gain Figure 4 : Output Voltage Swing versus Load Current Figure 5 : Output Voltage Swing versus Load Current Figure 6 : Supply Voltage Rejection versus Frequency 4/10 L272 Figure 7 : Channel Separation versus Frequency Figure 8 : Common Mode Rejection versus Frequency APPLICATION SUGGESTION NOTE In order to avoid possible instability occuring into final stage the usual suggestions for the linear power stages are useful, as for instance : - layout accuracy ; - a 100nF capacitor corrected between supply pins and ground ; - boucherotcell (0.1 to 0.2 µF + 1 Ω series) between outputs and ground or across the load. Figure 9 : Bidirectional DC Motor Control with µP Compatible Inputs Figure 10 : Servocontrol for Compact-disc Figure 11 : Capstan Motor Control in Video Recorders 5/10 L272 Figure 12 : Motor Current Control Circuit. Note : The input voltage level is compatible with L291 (5-BIT D/A converter). Figure 13 : Bidirectional Speed Control of DC Motors. 2R3 ° R1 where RM = internal resistance of motor. For circuit stability ensure that RX > RM Vs 2R ° R1 ) + Ro ⋅ ΙM where Ro = The voltage available at the terminals of the motor is VM = 2 (Vi ⋅ 2 RX and IM is the motor current. 6/10 L272 POWERDIP 16 PACKAGE MECHANICAL DATA DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX. 7/10 L272 MINIDIP PACKAGE MECHANICAL DATA DIM. MIN. A a1 B b b1 D E e e3 e4 F I L Z 3.18 7.95 2.54 7.62 7.62 6.6 5.08 3.81 1.52 0.125 0.51 1.15 0.356 0.204 1.65 0.55 0.304 10.92 9.75 0.313 0.100 0.300 0.300 0.260 0.200 0.150 0.060 mm TYP. 3.32 0.020 0.045 0.014 0.008 0.065 0.022 0.012 0.430 0.384 MAX. MIN. inch TYP. 0.131 MAX. 8/10 L272 SO16 NARROW PACKAGE MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F L M S 3.8 0.4 9.8 5.8 1.27 8.89 4.0 1.27 0.62 8 ° (max.) 0.150 0.150 10 6.2 0.35 0.19 0.5 45° (typ.) 0.386 0.228 0.050 0.350 0.157 0.050 0.024 0.394 0.244 0.1 mm TYP. MAX. 1.75 0.25 1.6 0.46 0.25 0.014 0.007 0.020 0.004 MIN. inch TYP. MAX. 0.069 0.009 0.063 0.018 0.010 9/10 L272 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. 10/10