M24C08-RMN6TP

M24C08-W M24C08-R M24C08-F 8-Kbit serial I²C bus EEPROM Datasheet - production data Features TSSOP8 (DW) 169 mil width SO8 (MN) 150 mil width   PDIP8 (BN)(1) • Compatible with I2C bus modes: – 400 kHz – 100 kHz • Memory array: – 8 Kbit (1 Kbyte) of EEPROM – Page size: 16 byte • Single supply voltage: – M24C08-W: 2.5 V to 5.5 V – M24C08-R: 1.8 V to 5.5 V – M24C08-F: 1.7 V to 5.5 V (full temperature range) and 1.6 V to 1.7 V (limited temperature range) • Write: – Byte Write within 5 ms – Page Write within 5 ms • Operating temperature range: – from -40 °C up to +85 °C • Random and sequential Read modes • Write protect of the whole memory array UFDFPN8 (MC) DFN8 - 2 x 3 mm • Enhanced ESD/Latch-Up protection • More than 4 million Write cycles • More than 200-years data retention Packages • RoHS compliant and halogen-free (ECOPACK2®) UFDFPN5 (MH) DFN5 - 1.7 x 1.4 mm WLCSP (CT) October 2017 This is information on a product in full production. DocID023924 Rev 6 1/43 www.st.com Contents M24C08-W M24C08-R M24C08-F Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Chip Enable (E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 VSS (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6.1 Operating supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6.2 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6.3 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6.4 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 4.1 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.3 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.4 Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.5 Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 5.2 2/43 Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1.3 Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17 Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.2.1 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.2 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F Contents 6 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9.1 UFDFPN5 (DFN5) package information . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9.2 UFDFPN8 (DFN8) package information . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9.3 TSSOP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9.4 SO8N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 9.5 PDIP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 9.6 WLCSP4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 10 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 DocID023924 Rev 6 3/43 3 List of tables M24C08-W M24C08-R M24C08-F List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. 4/43 Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 WLCSP signals vs. bump position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Operating conditions (voltage range F, for devices identified by process letter T) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Operating conditions (voltage range F, for all other devices) . . . . . . . . . . . . . . . . . . . . . . . 22 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DC characteristics (M24C08-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DC characteristics (M24C08-R device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DC characteristics (M24C08-F device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 400 kHz AC characteristics (I2C Fast-mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 100 kHz AC characteristics (I2C Standard mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 36 WLCSP - 4-bump, 0.703 x 0.713 mm, wafer level chip scale package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 UFDFPN5 (DFN5) package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 WLCSP connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . . 7 Chip enable inputs connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15 Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16 Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 14. Figure 15. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 34 SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 36 WLCSP 4-bump, 0.703 x 0.713 mm, wafer level chip scale package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 WLCSP- 4-bump, 0.703 x 0.713 mm, wafer level chip scale package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 DocID023924 Rev 6 5/43 5 Description 1 M24C08-W M24C08-R M24C08-F Description The M24C08 is an 8-Kbit I2C-compatible EEPROM (Electrically Erasable PROgrammable Memory) organized as 1 K × 8 bits. The M24C08-W can be accessed with a supply voltage from 2.5 V to 5.5 V, the M24C08-R can be accessed with a supply voltage from 1.8 V to 5.5 V, and the M24C08-F can be accessed either with a supply voltage from 1.7 V to 5.5 V (over the full temperature range) or with an extended supply voltage from 1.6 V to 1.7 V. All these devices operate with a clock frequency of 400 kHz. Figure 1. Logic diagram 6## % 3#, 3$! -XXX 7# 633 -36 Table 1. Signal names Signal name Function Chip Enable Input SDA Serial Data I/O SCL Serial Clock Input Write Control Input VCC Supply voltage - VSS Ground - WC (2) 1. Signal not connected in the WLCSP and DFN5 packages. 2. Signal not connected in the WLCSP package. 6/43 Direction E2(1) DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F Description Figure 2. 8-pin package connections, top view E ϭ ϴ s E Ϯ ϳ t Ϯ ϯ ϲ ^> s^^ ϰ ϱ ^ 069 1. NC: not connected. 2. See Section 9: Package information for package dimensions, and how to identify pin 1 Figure 3. UFDFPN5 (DFN5) package connections 6 ##  6 33  !"#$ 89:7 3$!   7#   6 33     3#,   4OPVIEW MARKINGSIDE "OTTOMVIEW PADSSIDE -36 1. Inputs E2 is not connected, therefore read as (0). Please refer to Section 2.3 for further explanations. Figure 4. WLCSP connections (top view, marking side, with balls on the underside) ϭ ϭ Ϯ Ϯ  s s ^^ s ^^ s   ^> ^ ^ ^>  3,1$ ͻ 0DUNLQJVLGH WRSYLHZ %XPSVLGH ERWWRPYLHZ 069 1. The E2 and WC inputs are not connected to a ball, therefore E2 input is decoded as “0” (see also Section 2.3: Chip Enable (E2)) and the device remains always accessible in Write mode (see also Section 2.4: Write Control (WC)). Table 2. WLCSP signals vs. bump position Position A B 1 VCC SCL 2 VSS SDA DocID023924 Rev 6 7/43 42 Signal description M24C08-W M24C08-R M24C08-F 2 Signal description 2.1 Serial Clock (SCL) The signal applied on the SCL input is used to strobe the data available on SDA(in) and to output the data on SDA(out). 2.2 Serial Data (SDA) SDA is an input/output used to transfer data in or data out of the device. SDA(out) is an open drain output that may be wire-OR’ed with other open drain or open collector signals on the bus. A pull-up resistor must be connected from Serial Data (SDA) to VCC (Figure 13 indicates how to calculate the value of the pull-up resistor). 2.3 Chip Enable (E2) This input signal is used to set the value that is to be looked for on the bit b3 of the device select code. This input must be tied to VCC or VSS, to establish the device select code as shown in Figure 4. When not connected (left floating), this input is read as low (0). Figure 5. Chip enable inputs connection 9&& 9&& 0[[[ 0[[[ (L (L 966 966 $L For the UFDFPN5 package, the E2 input is not connected, therefore read as 0. 2.4 Write Control (WC) This input signal is useful for protecting the entire contents of the memory from inadvertent write operations. Write operations are disabled to the entire memory array when Write Control (WC) is driven high. Write operations are enabled when Write Control (WC) is either driven low or left floating. When Write Control (WC) is driven high, device select and address bytes are acknowledged, Data bytes are not acknowledged. 2.5 VSS (ground) VSS is the reference for the VCC supply voltage. 8/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F Signal description 2.6 Supply voltage (VCC) 2.6.1 Operating supply voltage (VCC) Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage within the specified [VCC(min), VCC(max)] range must be applied (see Operating conditions in Section 8: DC and AC parameters). In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package pins. This voltage must remain stable and valid until the end of the transmission of the instruction and, for a write instruction, until the completion of the internal write cycle (tW). 2.6.2 Power-up conditions The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage (see Operating conditions in Section 8: DC and AC parameters). 2.6.3 Device reset In order to prevent inadvertent write operations during power-up, a power-on-reset (POR) circuit is included. At power-up, the device does not respond to any instruction until VCC has reached the internal reset threshold voltage. This threshold is lower than the minimum VCC operating voltage (see Operating conditions in Section 8: DC and AC parameters). When VCC passes over the POR threshold, the device is reset and enters the Standby Power mode; however, the device must not be accessed until VCC reaches a valid and stable DC voltage within the specified [VCC(min), VCC(max)] range (see Operating conditions in Section 8: DC and AC parameters). In a similar way, during power-down (continuous decrease in VCC), the device must not be accessed when VCC drops below VCC(min). When VCC drops below the threshold voltage, the device stops responding to any instruction sent to it. 2.6.4 Power-down conditions During power-down (continuous decrease in VCC), the device must be in the Standby Power mode (mode reached after decoding a Stop condition, assuming that there is no internal write cycle in progress). DocID023924 Rev 6 9/43 42 Memory organization 3 M24C08-W M24C08-R M24C08-F Memory organization The memory is organized as shown below. Figure 6. Block diagram 7# % (IGHVOLTAGE GENERATOR #ONTROLLOGIC 3#, 3$! )/SHIFTREGISTER $ATA REGISTER 9DECODER !DDRESSREGISTER ANDCOUNTER PAGE 8DECODER -36 10/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 4 Device operation Device operation The device supports the I2C protocol. This is summarized in Figure 7. Any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization. The device is always a slave in all communications. Figure 7. I2C bus protocol DocID023924 Rev 6 11/43 42 Device operation 4.1 M24C08-W M24C08-R M24C08-F Start condition Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in the high state. A Start condition must precede any data transfer instruction. The device continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock (SCL) for a Start condition. 4.2 Stop condition Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable and driven high. A Stop condition terminates communication between the device and the bus master. A Read instruction that is followed by NoAck can be followed by a Stop condition to force the device into the Standby mode. A Stop condition at the end of a Write instruction triggers the internal Write cycle. 4.3 Data input During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock (SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock (SCL) is driven low. 4.4 Acknowledge bit (ACK) The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to acknowledge the receipt of the eight data bits. 12/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 4.5 Device operation Device addressing To start communication between the bus master and the slave device, the bus master must initiate a Start condition. Following this, the bus master sends the device select code, shown in Table 3 (most significant bit first). When using the DFN5 and WLCSP packages, the E2 pin is not accessible. This input is read as low (0). As a result, to properly communicate with the device in DFN5 and WLCSP packages, the E2 bit must always be set to logic 0 for any operation. See Table 3. Table 3. Device select code Device type identifier(1) Chip Enable address R/W Package b7 b6 b5 b4 b3 b2 b1 b0 TSSOP8,SO8,PDIP8, UFDFPN8 1 0 1 0 E2 A9 A8 R/W DFN5, WLCSP 1 0 1 0 0 A9 A8 R/W 1. The MSB b7 is sent first. The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations. If a match occurs on the device select code, the corresponding device gives an acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match the device select code, it deselects itself from the bus, and goes into Standby mode. DocID023924 Rev 6 13/43 42 Instructions M24C08-W M24C08-R M24C08-F 5 Instructions 5.1 Write operations Following a Start condition the bus master sends a device select code with the R/W bit (RW) reset to 0. The device acknowledges this, as shown in Figure 8, and waits for the address byte. The device responds to each address byte with an acknowledge bit, and then waits for the data byte. Table 4. Address byte A7 A6 A5 A4 A3 A2 A1 A0 When the bus master generates a Stop condition immediately after a data byte Ack bit (in the “10th bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write cycle tW is triggered. A Stop condition at any other time slot does not trigger the internal Write cycle. After the Stop condition and the successful completion of an internal Write cycle (tW), the device internal address counter is automatically incremented to point to the next byte after the last modified byte. During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does not respond to any requests. If the Write Control input (WC) is driven High, the Write instruction is not executed and the accompanying data bytes are not acknowledged, as shown in Figure 9. 14/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F Byte Write After the device select code and the address byte, the bus master sends one data byte. If the addressed location is Write-protected, by Write Control (WC) being driven high, the device replies with NoAck, and the location is not modified. If, instead, the addressed location is not Write-protected, the device replies with Ack. The bus master terminates the transfer by generating a Stop condition, as shown in Figure 8. Figure 8. Write mode sequences with WC = 0 (data write enabled) 7# !#+ !#+ "YTEADDRESS !#+ $ATAIN 3TOP $EV3ELECT 3TART "YTE7RITE 27 7# !#+ 0AGE7RITE $EV3ELECT 3TART !#+ "YTEADDRESS !#+ $ATAIN !#+ $ATAIN $ATAIN 27 7#CONTgD !#+ 0AGE7RITE CONTgD !#+ $ATAIN. 3TOP 5.1.1 Instructions DocID023924 Rev 6 !)C 15/43 42 Instructions 5.1.2 M24C08-W M24C08-R M24C08-F Page Write The Page Write mode allows up to 16 byte to be written in a single Write cycle, provided that they are all located in the same page in the memory: that is, the most significant memory address bits, A9/A4, are the same. If more bytes are sent than will fit up to the end of the page, a “roll-over” occurs, i.e. the bytes exceeding the page end are written on the same page, from location 0. The bus master sends from 1 to 16 byte of data, each of which is acknowledged by the device if Write Control (WC) is low. If Write Control (WC) is high, the contents of the addressed memory location are not modified, and each data byte is followed by a NoAck, as shown in Figure 9. After each transferred byte, the internal page address counter is incremented. The transfer is terminated by the bus master generating a Stop condition. Figure 9. Write mode sequences with WC = 1 (data write inhibited) 7# !#+ "YTEADDRESS ./!#+ $ATAIN 3TOP $EVSELECT 3TART "YTE7RITE !#+ 27 7# !#+ $EVSELECT 3TART 0AGE7RITE !#+ "YTEADDRESS ./!#+ $ATAIN ./!#+ $ATAIN $ATAIN 27 7#CONTgD ./!#+ $ATAIN. 3TOP 0AGE7RITE CONTgD ./!#+ !)D 16/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 5.1.3 Instructions Minimizing Write delays by polling on ACK The maximum Write time (tw) is shown in AC characteristics tables in Section 8: DC and AC parameters, but the typical time is shorter. To make use of this, a polling sequence can be used by the bus master. The sequence, as shown in Figure 10, is: • Initial condition: a Write cycle is in progress. • Step 1: the bus master issues a Start condition followed by a device select code (the first byte of the new instruction). • Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and the bus master goes back to Step 1. If the device has terminated the internal Write cycle, it responds with an Ack, indicating that the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during Step 1). Figure 10. Write cycle polling flowchart using ACK :ULWHF\FOH LQSURJUHVV 6WDUWFRQGLWLRQ 'HYLFHVHOHFW ZLWK5:  12 $&. UHWXUQHG ϭ >ϯ WŝŶϭ  Ϯ < >  Ϯ ĞĞĞ ϭ =:B0(H9 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating (not connected) in the end application. Table 20. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data inches(1) millimeters Symbol Min Typ Max Min Typ Max A 0.450 0.550 0.600 0.0177 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 1.900 2.000 2.100 0.0748 0.0787 0.0827 D2 1.200 - 1.600 0.0472 - 0.0630 E 2.900 3.000 3.100 0.1142 0.1181 0.1220 E2 1.200 - 1.600 0.0472 - 0.0630 e - 0.500 - - 0.0197 - K 0.300 - - 0.0118 - - L 0.300 - 0.500 0.0118 - 0.0197 L1 - - 0.150 - - 0.0059 L3 0.300 - - 0.0118 - - eee(2) 0.080 - - 0.0031 - - 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from measuring. 32/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 9.3 Package information TSSOP8 package information Figure 18.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package outline  ϴ ϱ Đ ϭ ϭ  ϰ ɲ > ϭ W Ϯ  >ϭ ď Ğ 76623$0B9 1. Drawing is not to scale. Table 21. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package mechanical data inches(1) millimeters Symbol Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 CP - - 0.100 - - 0.0039 D 2.900 3.000 3.100 0.1142 0.1181 0.1220 e - 0.650 - - 0.0256 - E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1 4.300 4.400 4.500 0.1693 0.1732 0.1772 L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - α 0° - 8° 0° - 8° 1. Values in inches are converted from mm and rounded to four decimal digits. DocID023924 Rev 6 33/43 42 Package information 9.4 M24C08-W M24C08-R M24C08-F SO8N package information Figure 19. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline HXƒ ! ! C CCC B E PP *$8*(3/$1( $ K  % %  ! , , 62$B9 1. Drawing is not to scale. Table 22. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package mechanical data Symbol inches(1) millimeters Min. Typ. Max. Min. Typ. Max. A - - 1.750 - - 0.0689 A1 0.100 - 0.250 0.0039 - 0.0098 A2 1.250 - - 0.0492 - - b 0.280 - 0.480 0.0110 - 0.0189 c 0.170 - 0.230 0.0067 - 0.0091 D 4.800 4.900 5.000 0.1890 0.1929 0.1969 E 5.800 6.000 6.200 0.2283 0.2362 0.2441 E1 3.800 3.900 4.000 0.1496 0.1535 0.1575 e - 1.270 - - 0.0500 - h 0.250 - 0.500 0.0098 - 0.0197 k 0° - 8° 0° - 8° L 0.400 - 1.270 0.0157 - 0.0500 L1 - 1.040 - - 0.0409 - ccc - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 34/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F Package information Figure 20. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package recommended footprint   [  2B621B)3B9 1. Dimensions are expressed in millimeters. DocID023924 Rev 6 35/43 42 Package information 9.5 M24C08-W M24C08-R M24C08-F PDIP8 package information Figure 21. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline % B ! ! B ! , C E E! E" $  %  0$)0 " 1. Drawing is not to scale. 2. Not recommended for new designs. Table 23. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data inches(1) millimeters Symbol Min. Typ. Max. Min. Typ. Max. A - - 5.33 - - 0.2098 A1 0.38 - - 0.0150 - - A2 2.92 3.30 4.95 0.1150 0.1299 0.1949 b 0.36 0.46 0.56 0.0142 0.0181 0.0220 b2 1.14 1.52 1.78 0.0449 0.0598 0.0701 c 0.20 0.25 0.36 0.0079 0.0098 0.0142 D 9.02 9.27 10.16 0.3551 0.3650 0.4000 E 7.62 7.87 8.26 0.3000 0.3098 0.3252 E1 6.10 6.35 7.11 0.2402 0.2500 0.2799 e - 2.54 - - 0.1000 - eA - 7.62 - - 0.3000 - eB - - 10.92 - - 0.4299 L 2.92 3.30 3.81 0.1150 0.1299 0.1500 1. Values in inches are converted from mm and rounded to four decimal digits. 36/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 9.6 Package information WLCSP4 package information Figure 22. WLCSP 4-bump, 0.703 x 0.713 mm, wafer level chip scale package outline EEE = ' ; H 'HWDLO$ < * ( H * 2ULHQWDWLRQUHIHUHQFH DDD ; $ + ) 2ULHQWDWLRQUHIHUHQFH $ :DIHUEDFNVLGH 6LGHYLHZ %XPSVLGH %XPS $ HHH = = E; T FFF0 = ; < TGGG0 = 6HDWLQJSODQH 'HWDLO$ 5RWDWHGƒ :/&63B9&B0(B9 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 24. WLCSP - 4-bump, 0.703 x 0.713 mm, wafer level chip scale package mechanical data Inches(1) millimeter Symbol TYP MIN MAX TYP MIN MAX A 0.295 0.270 0.330 0.0116 0.0106 0.0130 A1 0.095 - - 0.0037 - 0.0043 A2 0.200 - - 0.0079 - 0.0083 Øb 0.185 - - 0.0073 - 0.0085 D 0.703 - 0.723 0.0277 - 0.0285 E 0.713 - 0.733 0.0281 - 0.0289 e 0.400 - - 0.0157 - - F 0.142 - - 0.0056 - - G 0.148 - - 0.0058 - - H 0.143 - - 0.0056 - - aaa 0.110 - - 0.0043 - - DocID023924 Rev 6 37/43 42 Package information M24C08-W M24C08-R M24C08-F Table 24. WLCSP - 4-bump, 0.703 x 0.713 mm, wafer level chip scale package mechanical data (continued) Inches(1) millimeter Symbol TYP MIN MAX TYP MIN MAX bbb 0.110 - - 0.0043 - - ccc 0.110 - - 0.0043 - - ddd 0.060 - - 0.0024 - - eee 0.060 - - 0.0024 - - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 23. WLCSP- 4-bump, 0.703 x 0.713 mm, wafer level chip scale package recommended footprint EXPSV[‘PP H H 9&B)3B9 1. Dimensions are expressed in millimeters. 38/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 10 Ordering information Ordering information Table 25. Ordering information scheme Example: M24C08 W MC 6 T P /S Device type M24 = I2C serial access EEPROM Device function C08 = 8 Kbit (1 K x 8 bit) Operating voltage W = VCC = 2.5 V to 5.5 V R = VCC = 1.8 V to 5.5 V F = VCC = 1.6 V or 1.7 V to 5.5 V Package BN = PDIP8(1) MN = SO8 (150 mil width)(2) DW = TSSOP8 (169 mil width)(2) MC = UFDFPN8 (DFN8)(2) MH = UFDFPN5 (DFN5)(2) CT = Thin WLCSP (chip scale package)(2) Device grade 6 = Industrial: device tested with standard test flow over –40 to 85 °C Option T = Tape and reel packing blank = tube packing Plating technology P or G = ECOPACK® (RoHS compliant) Process /T = Manufacturing technology code(3) 1. Not recommended for new designs. 2. ECOPACK2® (RoHS compliant and free of brominated, chlorinated and antimony oxide flame retardants) 3. The process letter is used only when ordering WLCSP packages. DocID023924 Rev 6 39/43 42 Ordering information M24C08-W M24C08-R M24C08-F Engineering samples Parts marked as ES or E are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences deriving from such use. In no event, will ST be liable for the customer using of these engineering samples in production. ST’s quality department must be contacted prior to any decision to use these engineering samples to run qualification activity. 40/43 DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F 11 Revision history Revision history Table 26. Document revision history Date Revision 17-Dec-2012 1 New single product M24C08 datasheet resulting from splitting the previous datasheet M24C08-x M24C04-x M24C02-x M24C01-x (revision 18) into separate datasheets. 2 Added: – Table 10: Cycling performance – Table 6: Operating conditions (voltage range F, for devices identified by process letter T) and Table 7: Operating conditions (voltage range F, for all other devices). Updated: – Features: supply voltage, write cycles and data retention – Section 1: Description – Table 3: Absolute maximum ratings, Table 12: Memory cell data retention, Table 12: DC characteristics (M24128-W, device grade 6), Table 13: DC characteristics (M24128-R device grade 6), Table 14: DC characteristics (M24C32-F device), Table 84: Ordering information scheme – Figure 49: AC waveforms Renamed Figure 52 and Table 59. Replaced “5 bump” by “M24C08-FCT5TP/S” in WLCSP package description. 3 Added Figure 4: This input signal is used to set the value that is to be looked for on the bit b3 of the device select code. This input must be tied to VCC or VSS, to establish the device select code as shown in Figure 4. When not connected (left floating), this input is read as low (0Chip enable inputs connection Updated: – Table 12: DC characteristics (M24128-W, device grade 6) – Table 13: DC characteristics (M24128-R device grade 6) – Table 14: DC characteristics (M24C32-F device) – Figure 49: AC waveforms – Table 84: Ordering information scheme 4 Updated: Package on cover page added note (1) on Table 1: Signal names. Updated note (1) and picture, deleted Caution note on Figure 3. Updated note (4) on Table 3. Corrected wrong Symbol name tDXCX in tDXCH in Table 15. Updated Figure 18: M24C08-FCT6TP/T package outline and Table 20: M24C08-FCT6TP/T package data. Added “Process” row specification in Table 84: Ordering information scheme. Added Figure 19 25-Sep-2013 17-Dec-2013 04-Jun-2014 Changes DocID023924 Rev 6 41/43 42 Revision history M24C08-W M24C08-R M24C08-F Table 26. Document revision history (continued) Date 04-May-2017 12-Oct-2017 42/43 Revision Changes 5 Added: – UFDFPN5 in cover page and in Section 9: Package information, Figure 3: UFDFPN5 (DFN5) package connections, Engineering samples reference, Table 2: WLCSP signals vs. bump position Updated: – Section 2.3: Chip Enable (E2), Section 4.5: Device addressing, Section 5.2.3: Sequential Read. – note 1 on Table 1: Signal names, – Table 3: Device select code, Table 25: Ordering information scheme. 6 Added reference to DFN8 and DFN5 in: Figure 3: UFDFPN5 (DFN5) package connections, Section 9.1: UFDFPN5 (DFN5) package information, Section 9.2: UFDFPN8 (DFN8) package information, Table 25: Ordering information scheme Updated Figure 11: Read mode sequences DocID023924 Rev 6 M24C08-W M24C08-R M24C08-F IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID023924 Rev 6 43/43 43 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics: M24C08-WBN6P M24C08-WMN6P M24C08-WDW6TP M24C08-RDW6TP M24C08-FMC5TG M24C08-RMC6TG M24C08-RMN6P M24C08-RMN6TP M24C08-WMN6TP M24C08-FMC6TG M24C08-FMN6TP M24C08-FDW6TP M24C08-FCT6TP/T M24C08-FMH6TG