M24SR04-YDW6T/2

M24SR04-Y M24SR04-G Dynamic NFC/RFID tag IC with 4-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data • 7 bytes unique identifier (UID) • 128 bits passwords protection Package SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • 8-lead small-outline package (SO8) ECOPACK2® • TSSOP8 ECOPACK2® • UFDFPN8 ECOPACK2® Digital pad • GPO: configurable General Purpose Output Wafer • RF disable: activation/deactivation of RF commands Features Temperature range I2C interface • From - 40 °C up to 85 °C • Two-wire I2C serial interface supports 1 MHz protocol Description • Single supply voltage: – 2.7 V to 5.5 V for grade Y – 2.4 V to 5.5 V for grade G (Limited temperature range -25 to 85 °C) M24SR04 belongs to the ST25 family which includes all STMicroelectronics NFC/RFID tag and reader products. The M24SR04 devices is a dynamic NFC/RFID tag IC with a dual interface. It embeds an EEPROM memory. It can be operated from an I2C interface or by a 13.56 MHz RFID reader or an NFC phone. Contactless interface • NFC Forum Type 4 Tag • ISO/IEC 14443 Type A • 106 Kbps data rate The I2C interface uses a two-wire serial interface, consisting of a bidirectional data line and a clock line. It behaves as a slave in the I2C protocol. • Internal tuning capacitance: 25 pF Memory The RF protocol is compatible with ISO/IEC 14443 Type A and NFC Forum Type 4 Tag. • 512-byte (4-kbit) EEPROM • Support of NDEF data structure • Data retention: 200 years • Write cycle endurance: – 1 million Write cycles at 25 °C – 600k Write cycles at 85 °C • Read up to 246 bytes in a single command • Write up to 246 bytes in a single command September 2017 This is information on a product in full production. DocID024754 Rev 16 1/89 www.st.com Contents M24SR04-Y M24SR04-G Contents 1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.1 2 Functional modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.1.1 I2C mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.1.2 Tag mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.1.3 Dual interface mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1 Serial clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2 Serial data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.3 Antenna coil (AC0, AC1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4 Ground (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.5 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.5.1 3 2.5.3 Device reset in I²C mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5.4 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6 RF disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.7 General purpose output (GPO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.7.1 Session Open configuration (GPO field = 0xX1 or 0x1X) . . . . . . . . . . . 14 2.7.2 WIP Writing in Progress configuration (GPO field = 0xX2 or 0x2X) . . . 15 2.7.3 I2C answer ready configuration (GPO field = 0xX3) . . . . . . . . . . . . . . . 16 2.7.4 MIP NDEF Message writing in Progress configuration (GPO field = 0x3X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.7.5 INT Interrupt configuration (GPO field = 0xX4 or 0x4X) . . . . . . . . . . . . 18 2.7.6 State Control configuration (GPO field = 0xX5 or 0x5X) . . . . . . . . . . . . 19 2.7.7 RF busy configuration (GPO field = 0x6X) . . . . . . . . . . . . . . . . . . . . . . . 20 M24SR04 memory management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.1 3.2 2/89 2.5.2 Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Memory structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.1.1 File identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.1.2 CC file layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.1.3 NDEF file layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.1.4 System file layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Read and write access rights to the memory . . . . . . . . . . . . . . . . . . . . . . 25 DocID024754 Rev 16 M24SR04-Y M24SR04-G Contents 3.2.1 State of the Read and Write access rights . . . . . . . . . . . . . . . . . . . . . . . 25 3.2.2 Changing the read access right to NDEF files . . . . . . . . . . . . . . . . . . . . 26 3.2.3 Changing the write access right to NDEF files . . . . . . . . . . . . . . . . . . . 27 3.3 Access right life time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.4 NDEF file passwords . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.5 I2C password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.5.1 4 5 I²C password and I²C protect field of the System file . . . . . . . . . . . . . . . 28 Communication mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.1 Master and slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.2 M24SR04 session mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.2.1 RF token . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.2.2 I2C token . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 I²C and RF command sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.1 Structure of the command sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.2 I-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.2.1 C-APDU: payload format of a command . . . . . . . . . . . . . . . . . . . . . . . . 32 5.2.2 R-APDU: payload format of a response . . . . . . . . . . . . . . . . . . . . . . . . 33 5.3 R-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.4 S-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.5 CRC of the I2C and RF frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.6 NFC Forum Type 4 Tag protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.7 5.6.1 Commands set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.6.2 Status and error codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.6.3 NDEF Tag Application Select command . . . . . . . . . . . . . . . . . . . . . . . . 38 5.6.4 Capability Container Select command . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.6.5 NDEF Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.6.6 System File Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.6.7 ReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.6.8 UpdateBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 ISO/IEC 7816-4 commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.7.1 Verify command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.7.2 Change Reference Data command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.7.3 Enable Verification Requirement command . . . . . . . . . . . . . . . . . . . . . . 45 5.7.4 Disable Verification Requirement command . . . . . . . . . . . . . . . . . . . . . 46 DocID024754 Rev 16 3/89 5 Contents M24SR04-Y M24SR04-G 5.8 5.9 5.10 6 7 ST Proprietary command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 5.8.1 ExtendedReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 5.8.2 EnablePermanentState command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 5.8.3 DisablePermanentState command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 5.8.4 UpdateFileType command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 5.8.5 SendInterrupt command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 5.8.6 StateControl command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Specific RF command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.9.1 Anticollision command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.9.2 RATS command and ATS response . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.9.3 PPS command & response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Specific I²C command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 5.10.1 GetI2Csession command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 5.10.2 KillRFsession command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 RF device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.1 Anticollision and Device Activation command set for the RF interface . . 56 6.2 Open an RFsession . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.3 Close an RFsession . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.4 Applicative command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 I2C device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 7.1 I2C communication protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 7.2 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.3 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.4 I²C token release sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.5 I²C timeout on clock period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.6 Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.7 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.8 I²C device address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.9 I²C frame format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.9.1 4/89 Example of I²C frame commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.10 Open an I²C session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 7.11 Close the I²C session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 DocID024754 Rev 16 M24SR04-Y M24SR04-G 8 Contents Functional procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.1 Selection of an NDEF message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.2 Reading of an NDEF message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.3 Reading a locked NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.4 Locking an NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 8.5 Unlocking an NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 8.6 Reaching the read-only state for an NDEF file . . . . . . . . . . . . . . . . . . . . . 64 8.7 Changing an NDEF password procedure . . . . . . . . . . . . . . . . . . . . . . . . . 64 8.8 Changing a File type Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 8.9 Updating a NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 9 UID: Unique identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 10 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 11 I2C DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 11.1 I2C timing measurement condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 12 GPO parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 13 Write cycle definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 14 RF electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 15 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 15.1 SO8N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 15.2 TSSOP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 15.3 UFDFPN8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 16 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 DocID024754 Rev 16 5/89 5 List of tables M24SR04-Y M24SR04-G List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. 6/89 Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Functional mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 File identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 CC file layout for 1 NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 NDEF file layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Field list. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Details about I2C watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Details about the GPO field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Details about the RF Session field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Details about the ST reserved field. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Details about the RF enable field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Read access right . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Write access right . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 RF and I²C command sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 I-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PCB field of the I-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 C-APDU format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 R-APDU format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 R-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 R-Block detailed format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 S-Block format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 S-Block detailed format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Command set overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Status code of the M24SR04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Error code of the M24SR04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 C-APDU of the NDEF Tag Application Select command . . . . . . . . . . . . . . . . . . . . . . . . . . 38 R-APDU of the NDEF Tag Application Select command . . . . . . . . . . . . . . . . . . . . . . . . . . 38 C-APDU of the Capability Container Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 R-APDU of the Capability Container Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 C-APDU of the NDEF Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 R-APDU of the NDEF Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 C-APDU of the System File Select command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 R-APDU of the System File Select command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 C-APDU of the ReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 R-APDU of the ReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 C-APDU of the UpdateBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 R-APDU of the UpdateBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Verify command format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 R-APDU of the Verify command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Change reference data command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 R-APDU of the Change Reference Data command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Enable Verification Requirement command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 R-APDU of the Enable Verification Requirement command. . . . . . . . . . . . . . . . . . . . . . . . 46 Disable Verification Requirement command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 R-APDU of the Disable Verification Requirement command . . . . . . . . . . . . . . . . . . . . . . . 47 C-APDU of the ExtendedReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 R-APDU of the ExtendedReadBinary command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 EnablePermanentState command format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 DocID024754 Rev 16 M24SR04-Y M24SR04-G Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. Table 75. Table 76. Table 77. Table 78. Table 79. Table 80. Table 81. Table 82. Table 83. Table 84. Table 85. Table 86. Table 87. Table 88. Table 89. List of tables R-APDU table of the EnablePermanentState command . . . . . . . . . . . . . . . . . . . . . . . . . . 48 DisablePermanentState command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 R-APDU of the DisablePermanentState command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 UpdateFileType command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 R-APDU of the UpdateFileType command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 SendInterrupt command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 R-APDU of the SendInterrupt command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 StateControl command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 R-APDU of the StateControl command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Commands issues by the RF host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 RATS command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Conversion from FDSI to FSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 ATS response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 PPS command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Ascending and descending data rate coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 PPS response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Specific I²C commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 GetI2Csession command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 KillRFsession command format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 I2C device address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 I2C frame format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 I2C host to M24SR04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 M24SR04 to I2C host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 UID format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 I2C operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 I2C DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 I2C AC characteristics (400 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 I2C AC characteristics (1 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 GPO timings measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Write cycle definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Default operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 SO8N - 8-lead plastic small outline, 150 mils body width, package data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 UFDFPN8 - 8- lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Ordering information scheme for packaged devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 DocID024754 Rev 16 7/89 7 List of figures M24SR04-Y M24SR04-G List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. 8/89 M24SR04 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 GPO configured as Session Open (GPO field = 0xX1 or 0x1X) . . . . . . . . . . . . . . . . . . . . . 14 GPO configured as WIP (GPO field = 0xX2 or 0x2X). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 GPO configured as I2C answer ready (GPO field = 0xX3) . . . . . . . . . . . . . . . . . . . . . . . . . 16 GPO configured as MIP (GPO field = 0x3X). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 GPO configured as INT (GPO field = 0xX4 or 0x4X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 GPO configured as State Control (GPO field = 0xX5 or 0x5X). . . . . . . . . . . . . . . . . . . . . . 19 GPO configured as RF busy (GPO field = 0x6X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Changing the read access right to an NDEF file. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Changing the write access right to an NDEF file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Command and response exchange . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 I²C token release sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 NDEF tag Application Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 I2C AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Maximum Rbus value with fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Rbus value with fC = 1 MHz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 SO8N - 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 79 SO8N - 8-lead plastic small outline, 150 mils bosy width, package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 DocID024754 Rev 16 M24SR04-Y M24SR04-G 1 Functional description Functional description The M24SR04 device is a dynamic NFC/RFID tag that can be accessed either from the I2C or the RF interface. The RF and I2C host can read or write to the same memory, that is why only one host can communicate at a time with the M24SR04. The management of the interface selection is controlled by the M24SR04 device itself. The RF interface is based on the ISO/IEC 14443 Type A standard. The M24SR04 is compatible with the NFC Forum Type 4 Tag specifications and supports all corresponding commands. The I2C interface uses a two-wire serial interface consisting of a bidirectional data line and a clock line. The devices carry a built-in 4-bit device type identifier code in accordance with the I²C bus definition. The device behaves as a slave in the I2C protocol. Figure 1 displays the block diagram of the M24SR04 device. Figure 1. M24SR04 block diagram 6XSSO\YROWDJH IRU,&LQWHUIDFH 5)LQWHUIDFH EDVHGRQ ,62,(& 7\SH$ VWDQGDUG 9&& $& $QDORJ)URQWHQG EDVHGRQ ,62,(& 7\SH$VWDQGDUG $& ,QWHUQDOWXQLQJ FDSDFLWDQFH 5) GLVDEOH 1)&)RUXP 7\SH7DJ SURWRFRO 6&/ 6'$ h/ΘƐLJƐƚĞŵ ĂƌĞĂ hƐĞƌŵĞŵŽƌLJ 'LJLWDOXQLW *32 ,&LQWHUIDFH 9±9 3RZHU PDQDJHPHQW XQLW 1)&B,& LQWHUIDFH *1' 069 DocID024754 Rev 16 9/89 20 Functional description M24SR04-Y M24SR04-G Table 1. Signal names Signal name Function Direction SDA Serial data I/O SCL Serial clock Input AC0, AC1 Antenna coils - VCC Supply voltage - VSS Ground GPO - Interrupt output RF disable (1) Open drain output Disable the RF communication (2) Input 1. An external pull-up > 4.7 kΩ is required. 2. An external pull-down is required when the voltage on Vcc is above its POR level. Figure 2. 8-pin package connections 5)GLVDEOH   9&& $&   *32 $&   6&/ 966   6'$ 069 1. See Package mechanical data section for package dimensions, and how to identify pin 1. 1.1 Functional modes The M24SR04 has two functional modes available. The difference between the modes lies in the power supply source (see Table 2). Table 2. Functional mode Mode 1.1.1 Supply source Comments I2C mode Vcc The I2C interface is available Tag mode RF field only The 2C interface is disconnected Dual interface mode RF field or Vcc Both I2C and RF interfaces are available I2C mode M24SR04 is powered by VCC. The I2C interface is connected to the M24SR04. The I2C host can communicate with the M24SR04 device. 1.1.2 Tag mode The M24SR04 is supplied by the RF field and can communicate with an RF host (RFID reader or an NFC phone). The User memory can only be accessed by the RF commands. 10/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G 1.1.3 Functional description Dual interface mode Both interfaces, RF and I2C, are connected to the M24SR04 and both RF or I2C host can communicate with the M24SR04 device. The power supply and the access management are carried out by the M24SR04 itself. For further details, please refer to the token mechanism chapter. DocID024754 Rev 16 11/89 20 Signal descriptions M24SR04-Y M24SR04-G 2 Signal descriptions 2.1 Serial clock (SCL) This input signal is used to strobe all data in and out of the device. In applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor must be connected from Serial clock (SCL) to VCC. (Figure 17 indicates how the value of the pull-up resistor can be calculated). In most applications, though, this method of synchronization is not employed, and so the pull-up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output. 2.2 Serial data (SDA) This bidirectional signal is used to transfer data in or out of the device. It is an open drain output that may be wire-OR'ed with other open drain or open collector signals on the bus. A pull-up resistor must be connected from Serial data (SDA) to VCC. (Figure 17 indicates how the value of the pull-up resistor can be calculated). 2.3 Antenna coil (AC0, AC1) These inputs are used to connect the device to an external coil exclusively. It is advised not to connect any other DC or AC path to AC0 or AC1. When correctly tuned, the coil is used to access the device using NFC Forum Type 4 commands. 2.4 Ground (VSS) VSS, when connected, is the reference for the VCC supply voltage for all pads, even AC0 and AC1. 2.5 Supply voltage (VCC) This pin can be connected to an external DC supply voltage. Note: An internal voltage regulator allows the external voltage applied on VCC to supply the M24SR04. 2.5.1 Operating supply voltage VCC Prior to selecting the M24SR04 and issuing instructions to it, a valid and stable VCC voltage within the specified [VCC(min), VCC(max)] range must be applied. To maintain a stable DC supply voltage, it is recommended to decouple the VCC line with suitable capacitors (usually of the order of 10 nF and 100 pF) close to the VCC/VSS package pins. This voltage must remain stable and valid until the end of the transmission of the instruction and, for a writing instruction (UpdateBinary, ChangeReferenceData, 12/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G Signal descriptions EnableVerificationRequirement, DisableVerificationRequirement, EnablePermanentState, DisablePermanentState, until the completion of the internal I²C write cycle (tW). 2.5.2 Power-up conditions When the power supply is turned on, VCC rises from VSS to VCC. The VCC rise time must not vary faster than 1V/µs. 2.5.3 Device reset in I²C mode In order to prevent inadvertent write operations during power-up, a power-on reset (POR) circuit is included. At power-up (continuous rise of VCC), the M24SR04 does not respond to any I²C instruction until VCC has reached the power-on reset threshold voltage (this threshold is lower than the minimum VCC operating voltage defined). When VCC passes over the POR threshold, the device is reset and enters the Standby power mode. However, the device must not be accessed until VCC has reached a valid and stable VCC voltage within the specified [VCC(min), VCC(max)] range. In a similar way, during power-down (continuous decrease in VCC), as soon as VCC drops below the power-on reset threshold voltage, the M24SR04 stops responding to any instruction sent to it. 2.5.4 Power-down conditions During power-down (continuous decay of VCC), the M24SR04 must be in Standby power mode (mode reached after decoding a Stop condition, assuming that there is no internal operation in progress). 2.6 RF disable This input signal is used to disable the RF communication. When the voltage on the VCC pin is below the POR level or not connected, an internal pull-down resistor is connected on this pad. Thus, the RF disable pad is maintained to the low level and the RF analog front end is activated. When the voltage on the VCC pin is higher than the POR level, the I²C host shall set this pin to enable or disable the RF communication. In Dual interface mode, RF disable must not be left floating. 2.7 General purpose output (GPO) The GPO pad is an open drain pad and a external pull-up resistor shall be connected to it. This pad is a configurable output signal. On delivery, GPO is configured as Session opened. Its behavior is consistent with the I2C or RF session activated and with the mode chosen by the user. The GPO pad is enable when an RF or an I2C session is open. When neither an RF nor an I2C session is open, the GPO is high impedance. DocID024754 Rev 16 13/89 20 Signal descriptions M24SR04-Y M24SR04-G The user can select one of these configurations(1): 2.7.1 • SessionOpen: an RF or I2C session is ongoing. • MIP (NDEF Message updating In Progress): the RF host is writing an NDEF length different from 0x0000. This mode can be used to detect when the RF host changes the NDEF message as defined by the NFC Forum. • WIP (Writing In Progress): the M24SR04 is executing a writing operation. • INT (interrupt): the I2C or RF host can force the M24SR04 to send a negative pulse on the GPO pin. • I2C ready response: an I2C response is ready to be read by the I²C host. • State mode: the I2C or RF host can control the state of the GPO pad during the RF session. • RF busy: an RF host is communicating with the M24SR04. Session Open configuration (GPO field = 0xX1 or 0x1X) When the GPO is configured as "Session Open", it goes to the Low state when an RF or I2C session is ongoing (see Figure 3). An RF session is taken when M24SR04 receives a valid Select Application. The session is released after M24SR04 has received a valid Deselect command, if M24SR04 has received a Kill RF session command in I2C or when the RF field became OFF. An I2C session is taken when M24SR04 receives a valid Get session command or a valid Kill RF session command. The session is released after M24SR04 has received I2C token release sequence or after a Power Off. GPO is driven low after a delay (1) or (3) when the session is open. GPO is released after a delay (2) or (4) when the session is released. Z&^ĞƐƐŝŽŶ 'WKĂƐ^ĞƐƐŝŽŶKƉĞŶ ;ϭͿ ĞƐĞůĞĐƚ The response is available as soon as the M24SR04 sends an ACK ( host read will a '0'). DocID024754 Rev 16 57/89 78 I2C device operation 7.2 M24SR04-Y M24SR04-G Start condition A Start condition is identified by a falling edge of serial data (SDA) while the serial clock (SCL) is stable in the high state. A Start condition must precede any data transfer command. The device continuously monitors (except during an instruction processing) the SDA and the SCL for a Start condition, and does not respond unless one is given. 7.3 Stop condition A Stop condition is identified by a rising edge of serial data (SDA) while the serial clock (SCL) is stable and driven high. A Stop condition terminates a command between the device and the bus master. 7.4 I²C token release sequence As explained in the M24SR04-Y M24SR04-G session mechanism, the I²C communication is reserved to the I²C host when the session token has the I²C value. The following sequence explains how to release the I²C value of the session token. I²C communication with the M24SR04 starts with a valid Start condition, followed by a device select code. If the delay between the Start condition and the following rising edge of the Serial Clock (SCL) that samples the most significant of the Device Select exceeds the tSTART_OUT_MAX time (see Table 78), the I²C logic block is reset and further incoming data transfer is ignored until the next valid Start condition. Figure 13. I²C token release sequence !W67$57B287BPD[ 6&/ 6'$ 065'HYLFH 6HOHFWFRGH 6WDUW FRQGLWLRQ 6WRS FRQGLWLRQ 06Y9 Note: 58/89 If the above delay is below tSTART_OUT_min (see Table 78), I2C session token stays unmodified. If the delay is between tSTART_OUT_min and tSTART_OUT_max, I2C session token might or not be released. This range of delay is not authorized for safe operation. DocID024754 Rev 16 M24SR04-Y M24SR04-G 7.5 I2C device operation I²C timeout on clock period During a data transfer on the I2C bus, if the serial clock high pulse or serial clock low pulse exceeds tCL_RESET value that is the maximum value specified in Table 78, the I2C logic block is reset and any further incoming data transfer is ignored until the next valid Start condition. If the serial clock high pulse is under the maximum value of tCHCL and the serial clock low pulse is under the maximum value of tCLCH in Table 78, the I2C logic block is not reset. For proper operation, the serial clock high pulse should not be higher than tCHCL and lesser than tCL_RESET, and the serial clock low pulse should not be higher than tCHCH and lesser tCL_RESET. 7.6 Acknowledge bit (ACK) The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether a bus master or a slave device, releases the serial data (SDA) after sending eight bits of data. During the 9th clock pulse period, the receiver pulls the SDA low to acknowledge the receipt of the eight data bits. 7.7 Data input During data input, the device samples serial data (SDA) on the rising edge of the serial clock (SCL). For a correct device operation, the SDA must be stable during the rising edge of the SCL, and the SDA signal must change only when the SCL is driven low. 7.8 I²C device address The device address is the concatenation of the group number coded on 4 bits and the I2C address coded on 3 bits, as shown in Table 68. Table 68. I2C device address format b7-b4 b3 b2 b1 b0 0b1010 1 1 0 0bx Group number E2 bit E1 bit E0 bit 0 = Request 1 = Answer DocID024754 Rev 16 59/89 78 I2C device operation 7.9 M24SR04-Y M24SR04-G I²C frame format The I2C frame is composed of three fields: 1. SOD field: contains the device select and the PCB. The PCB field is detailed in Section 5.2. 2. Payload field: contains the command and its parameter, as defined in the I2C command set. 3. EOD field: contains the two CRC bytes computed on the SOD but excluding the device select byte field. Table 69 shows the format of an I2C frame. Table 69. I2C frame format I2C frame SOD 0xAC or 0xAD 1 byte Payload EOD 1 to 251 bytes 2 bytes Device select 0xAC: to send a request to the M24SR04 0xAD: to read a response of the M24SR04 PCB field I2C command or I2C answer 2 CRC bytes 7.9.1 Example of I²C frame commands NDEF Tag Application command This example presents the I2C frame of an NDEF Tag Application Select command. The I2C frame is detailed in Table 70. Table 70. I2C host to M24SR04 Field SOD Value 0xAC 0x02 or 0x03 Payload EOD Command field 35 C0 or DF BE Device select PCB field 0x00 A4 04 00 07 D2 76 00 00 85 01 01 00 2 CRC bytes Before sending a new command, the I2C host can send an I2C frame to read the M24SR04 answer to the NDEF tag Application Select command. 60/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G I2C device operation Table 71. M24SR04 to I2C host Field SOD Payload I2C host to M24SR04 Value EOD M24SR04 to I2C host 0xAD 0x02 or 0x03 0x90 00 F1 09 or 2D 53 Device select PCB field I2C command 2 CRC bytes Figure 14 shows the I2C frame of the NDEF tag Application Select command. Figure 14. NDEF tag Application Select command 6WDUWRIWKH WUDQVPLVVLRQ RIWKHUHTXHVW ,ð&EXV 6 $&. $&. $&. $&. $&. $&. $&. $&. $&. $&. $&. $&. $&. $&. Ϭdž Ϭ ϬdžϬϮ ϬdžϬϬ Ϭdžϰ ϬdžϬϰ ϬdžϬϬ ϬdžϬϳ ϬdžϮ Ϭdžϳϲ ϬdžϬϬ ϬdžϬϬ Ϭdžϴϱ ϬdžϬϭ ϬdžϬϭ ͘͘͘ (QGRIWKH WUDQVPLVVLRQ RIWKHUHTXHVW ,ð&EXV $&. $&. $&. ͘͘͘ [  [ [& W 6WDUWRIWKH WUDQVPLVVLRQ RIWKHDQVZHU ,ð&EXV ^ < < < < < EŽ< ŶĚŽĨƚŚĞ ƚƌĂŶƐŵŝƐƐŝŽŶ ŽĨƚŚĞĂŶƐǁĞƌ ͘͘͘ Ϭdž ϬdžϬϮ ϬdžϵϬ ϬdžϬϬ Ϭdž&ϭ ϬdžϬϵ W /HJHQG $&. $&. [ %\WHVHQWE\WKH,ð&KRVW 1R$&. $FNQRZOHGJHE\WKH,ð&KRVW $FNQRZOHGJHE\065[[< 1R$FNQRZOHGJHE\WKH,ð&KRVW [ %\WHVHQWE\WKH065[[< [ %\WHVHQWE\WKH065[[< 6 6WDUWVHQWE\WKH,ð&KRVW 6WRSVHQWE\WKH,ð&KRVW 3 DocID024754 Rev 16 6WRSVHQWE\WKH,ð&KRVW 3 06Y9 61/89 78 I2C device operation 7.10 M24SR04-Y M24SR04-G Open an I²C session To open an I²C session, the I²C host shall send either the GetSession command or the KillRFsession command. The GetSession Command opens an I²C session if an RF session in not currently opened. A KillRFsession command closes the current RF session if it exist and opens an I²C session. When an I²C session is opened, the RF host cannot communicate with the M24SR04 and cannot close the I²C session. 7.11 Close the I²C session There are three ways to close an I²C session: 62/89 • turn off the Vcc power supply • send the I2C token release sequence • wait for the I²C watchdog when it is enabled • wait for the I²C timeout on clock period DocID024754 Rev 16 M24SR04-Y M24SR04-G 8 Functional procedures Functional procedures This section describes some procedure to access the memory or manage its protection. 8.1 Selection of an NDEF message The RF or I²C host shall use this procedure to detect the NDEF message inside an M24SR04. The NDEF detection procedure is as follows: 8.2 1. Open an RF or an I²C session 2. Send the SelectNDEFTagApplication command 3. Select the CC file 4. Read the CC file 5. Select the NDEF file. Reading of an NDEF message The RF or I²C host executes the NDEF read procedure to read the NDEF file. 1. Detect successfully the NDEF file using the NDEF detection procedure 2. Check that the read access without any security is granted for the NDEF file from the information provided by the CC file 3. Select the NDEF file 4. Read the NDEF file. Note: Reading the NDEF file should not go beyond the NDEF Length field (NLEN), which indicates the size of the NDEF message stored in the NDEF file. 8.3 Reading a locked NDEF file The RF or I²C host executes this procedure to read an NDEF file which has been locked previously. 1. Select the NDEF Tag Application 2. Select the NDEF file 3. Verify the Read password by using the Verify command 4. Read the data in the NDEF file. DocID024754 Rev 16 63/89 78 Functional procedures 8.4 M24SR04-Y M24SR04-G Locking an NDEF file The RF or I²C host executes this procedure to protect an NDEF file. 1. 8.5 Select the NDEF Tag Application 2. Check the right access provided by the CC file 3. Select the NDEF file 4. Transmit the NDEF file Write password by using the Verify command 5. Lock the NDEF file by sending the Enable verification command. Unlocking an NDEF file The RF or I²C host executes this procedure to unlock an NDEF file which has been locked previously. 8.6 1. Select the NDEF Tag Application 2. Select the NDEF file 3. Verify the NDEF file Write password or the I²C password by using the Verify command 4. Unlock the NDEF file by sending the Disable verification command. Reaching the read-only state for an NDEF file The RF or I²C host executes this procedure to reach the read-only state for an NDEF file. 8.7 1. Select the NDEF Tag Application 2. Select the NDEF file 3. Transmit the NDEF file Write password or the I²C password by using the Verify command 4. Send an EnablePermanentState command as the Write access right of the previous Select NDEF file. Changing an NDEF password procedure The RF or I²C host could use this procedure to change one NDEF password. it can be a Read or Write password. 1. 64/89 Select the NDEF Tag Application 2. Select the NDEF file 3. Transmit the NDEF file Write password or the I²C password by using the Verify command 4. Change the password by sending a ChangeReferenceData command. DocID024754 Rev 16 M24SR04-Y M24SR04-G 8.8 Functional procedures Changing a File type Procedure The RF or I²C host executes this procedure to change the File Type of a file for which all access rights were previously granted. 1. 8.9 Select the NDEF Tag Application 2. Select the File to be modified 3. Set the File Length to 0x00 using the UpdateBinary command 4. Send an UpdateFileType command with the New file Type as data. Updating a NDEF file When there's enough space in the file to update it with new content, the following steps should be followed to update the NDEF message: 1. Select the NDEF Tag Application 2. Select the NDEF file 3. Unlock the NDEF file if necessary 4. Write the NDEF length to 0x0000 with the Update Binary command. 5. Write the NDEF message in the NDEF message field using one or more Update Binary commands. 6. Write the NDEF length of the NDEF message using the Update Update command. It is recommended the NDEF length is read back and checked against the desired value to ensure the Update sequence has been correctly performed. DocID024754 Rev 16 65/89 78 UID: Unique identifier 9 M24SR04-Y M24SR04-G UID: Unique identifier The M24SR04 is uniquely identified by a 7 bytes unique identifier (UID). The UID is a readonly code and comprises: • The IC manufacturer code on 1 byte (0x02 for STMicroelectronics). • The Product code on 1 byte. • A device number on 5 bytes. Table 72 describes the UID format. Table 72. UID format 0x02 IC manufacturer code M24SR04 product code Device number 66/89 DocID024754 Rev 16 0x86 5 bytes M24SR04-Y M24SR04-G 10 Maximum ratings Maximum ratings Stressing the device above the ratings listed in Table 73 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. Table 73. Absolute maximum ratings Symbol TA Parameter Min. Max. Ambient operating temperature for grade 6 - 40 85 Ambient operating temperature for grade 5 - 25 85 - 65 150 °C 15 25 °C - 9 months Storage temperature TSTG Storage temperature Storage time TLEAD VIO Lead temperature during soldering UFDFPN8, SO8, TSSOP8 Sawn Bumped Wafer (kept in its antistatic bag) °C UFDFPN8, SO8, TSSOP8 I2C input or output range and GPO Unit see note (1) °C - 0.50 6.5 V RF supply current AC0 - AC1 - 100 mA VMAX_1 (2) RF input voltage amplitude between AC0 and AC1, GND pad left floating VAC0-VAC1 - 10 V VMAX_2 (2) AC voltage between AC0 and GND, or AC1 and GND VAC0-GND or VAC1-GND - 0.5 4.5 V VESD Electrostatic discharge voltage (human body model) (3) AC0-AC1 - 1000 V Electrostatic discharge voltage (human body model) (3) Other pads - 3500 V ICC (2) VESD 1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (ROHS directive 2011/65/EU, July 2011). 2. Based on characterization, not tested in production. Maximum absorbed power = 100 mW @ 7.5 A/m 3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω) DocID024754 Rev 16 67/89 78 I2C DC and AC parameters 11 M24SR04-Y M24SR04-G I2C DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device in I2C mode. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 74. I2C operating conditions Symbol VCC TA Parameter Min. Max. Supply voltage range Y 2.7 5.5 Supply voltage range G 2.4 5.5 Ambient operating temperature for grade 6 –40 85 Ambient operating temperature for grade 5 -25 85 Unit V °C Table 75. AC test measurement conditions Symbol Parameter CL Load capacitance tr, tf Input rise and fall times Min. Max. Unit 100 - pF 50 ns Vhi-lo Input levels 0.2 VCC to 0.8 VCC V Vref(t) Input and output timing reference levels 0.3 VCC to 0.7 VCC V Figure 15. AC test measurement I/O waveform ,QSXWOHYHOV ,QSXWDQGRXWSXW WLPLQJUHIHUHQFHOHYHOV 9FF 9FF 9FF 6CC 069 Table 76. Input parameters Symbol 68/89 Parameter Min. Max. Unit CIN Input capacitance (SDA) - 8 pF CIN Input capacitance (other pins) - 6 pF tNS Pulse width ignored (Input filter on SCL and SDA) - 80 ns DocID024754 Rev 16 M24SR04-Y M24SR04-G I2C DC and AC parameters Table 77. I2C DC characteristics Symbol Parameter ILI Input leakage current (SCL, SDA) ILO Output leakage current ICC0 ICC1 Standby power mode supply current Supply current (I2C Session open) Test condition Min. Max. Unit VIN = VSS or VCC device in Standby mode - ±2 µA SDA in Hi-Z, external voltage applied on SDA: VSS or VCC - ±2 µA VCC = 3.3 V, with RF ON - 30 VCC = 3.3 V, with RF OFF - 5 (1) VCC = 5.5 V, with RF ON - 30 VCC = 5.5 V, with RF OFF - 5 VCC = 3.3 V, with RF ON - 150 VCC = 3.3 V, with RF OFF - 150 VCC = 5.5 V, with RF ON - 150 VCC = 5.5 V, with RF OFF ICC2 Supply current (2) (Read binary) - 150 VCC = 3.3 V (fC = 1 MHz), with RF ON (3) - 250 VCC = 3.3 V (fC = 1 MHz), with RF OFF (3) - 200 (3) - 250 VCC = 5.5 V (fC = 1 MHz),with RF OFF (3) - 200 (3) VCC = 5.5 V (fC = 1 MHz),with RF ON VCC = 3.3 V (fC = 1 MHz),with RF ON ICC3 Supply current (2) (Update binary) - 550 VCC = 3.3 V (fC = 1 MHz),with RF OFF (3) - 500 VCC = 5.5 V (fC = 1 MHz), with RF ON (3) - 550 VCC = 5.5 V (fC = 1 MHz), with RF OFF (3) - 500 µA µA µA µA VIL Input low voltage (SDA, SCL) VCC = 2.7 V (grade Y) VCC = 2.4 V (grade G) VCC = 5.5 V -0.45 0.3 VCC V VIH Input high voltage (SDA, SCL) VCC = 2.7 V (grade Y) VCC = 2.4 V (grade G) VCC = 5.5 V 0.7 VCC 6.5 V VIL Input low voltage (RF disable) VCC = 2.7 V (grade Y) VCC = 2.4 V (grade G) VCC = 5.5 V 0.45 V VIH Input high voltage (RF disable) VCC = 2.7 V (grade Y) VCC = 2.4 V (grade G) VCC = 5.5 V 1.4 - V Output low voltage (SDA) IOL = 3 mA, VCC = 5.5 V - 0.4 V Output low voltage (GPO) IOL = 1 mA, VCC = 2.7 V (grade Y) or 2.4 V (grade G) to VCC = 5.5 V - 0.4 V VOL - 1. When an RF session is Opened, Icc corresponds to the standby power mode. 2. Characterized only. 3. Input levels as defined in Figure 15. DocID024754 Rev 16 69/89 78 I2C DC and AC parameters M24SR04-Y M24SR04-G Table 78. I2C AC characteristics (400 kHz) Test conditions specified in Table 74 (preliminary data based on design simulations) Symbol Alt. fC Parameter Min. Max. Unit fSCL Clock frequency 0.05 400 kHz tCHCL (1) tHIGH Clock pulse width high 0.6 20000 µs tCLCH (2) tLOW Clock pulse width low 1.3 20000 µs 40000 - µs Input signal rise time (3) (3) ns (3) ns tCL_reset tXH1XH2 tR Clock reset tXL1XL2 tF Input signal fall time (3) tDL1DL2 tF SDA (out) fall time 20 300 ns tDXCX tSU:DAT Data in set up time 100 - ns tCLDX tHD:DAT Data in hold time 0 - ns tCLQX(4) tDH Data out hold time 100 - ns (5) tAA Clock low to next data valid (access time) - 900 ns tCLQV tCHDX (6) tSU:STA Start condition set up time 600 - ns tDLCL tHD:STA Start condition hold time 600 - ns tCHDH tSU:STO Stop condition set up time 600 - ns tDHDL tBUF Time between Stop condition and next Start condition 1300 - ns tW tWR I²C write time in one page - 5 ms I²C write time up to 246 bytes - 90 ms - Pulse width ignored (input filter on SCL and SDA) - 80 ns - Delay for I²C token release 20 40 ms tNS (7) tSTART_OUT 1. tCHCL timeout. 2. tCLCH timeout. 3. There is no min. or max. value for the input signal rise and fall times. It is however recommended by the I²C specification that the input signal rise and fall times be more than 20 ns and less than 300 ns when fC < 400 kHz. 4. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 5. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC in a compatible way with the I2C specification (which specifies tSU:DAT (min) = 100 ns), assuming that the Rbus × Cbus time constant is less than 500 ns (as specified in Figure 17). 6. For a restart condition, or following a write cycle. 7. Characterized only, not tested in production. 70/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G I2C DC and AC parameters Table 79. I2C AC characteristics (1 MHz) Test conditions specified in Table 74 (preliminary data based on design simulations) Symbol Alt. fC Parameter Min. Max. Unit fSCL Clock frequency 0.05 1000 kHz tCHCL (1) tHIGH Clock pulse width high 260 - ns tCLCH (2) tLOW Clock pulse width low 500 - ns tR Input signal rise time (3) (3) ns (3) ns tXH1XH2 tXL1XL2 tF Input signal fall time (3) tDL1DL2 tF SDA (out) fall time 20 120 ns tDXCX tSU:DAT Data in set up time 50 - ns tCLDX tHD:DAT Data in hold time 0 - ns 100 - ns - 450 ns tSU:STA Start condition set up time 250 - ns tDLCL tHD:STA Start condition hold time 250 - ns tCHDH tSU:STO Stop condition set up time 250 - ns 500 - ns I²C write time in one page - 5 ms I²C write time up to 246 bytes - 150 ms Pulse width ignored (input filter on SCL and SDA) - 80 ns tCLQX tCLQV (4)(5) tCHDX (6) tDH Data out hold time tAA Clock low to next data valid (access time) tDHDL tBUF tW tWR tNS (7) - Time between Stop condition and next Start condition 1. tCHCL timeout. 2. tCLCH timeout. 3. There is no min. or max. value for the input signal rise and fall times. It is however recommended by the I²C specification that the input signal rise and fall times be less than 120 ns when fC < 1 MHz. 4. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 5. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC in a compatible way with the I2C specification (which specifies tSU:DAT (min) = 100 ns), assuming that the Rbus × Cbus time constant is less than 500 ns (as specified in Figure 17). 6. For a reStart condition, or following a write cycle. 7. Characterized only, not tested in production. DocID024754 Rev 16 71/89 78 I2C DC and AC parameters M24SR04-Y M24SR04-G Figure 16. I2C AC waveforms W;/;/ W;+;+ W&+&/ W&/&+ 6&/ W'/&/ W;/;/ 6'$,Q W&+'/ W&/'; W;+;+ 6WDUW FRQGLWLRQ 6'$ ,QSXW 6'$ W';&+ &KDQJH W&+'+ W'+'/ 6WDUW 6WRS FRQGLWLRQ FRQGLWLRQ 6&/ 6'$,Q W: W&+'+ 6WRS FRQGLWLRQ W&+'/ :ULWHF\FOH 6WDUW FRQGLWLRQ W&+&/ 6&/ W&/49 6'$2XW W&/4; 'DWDYDOLG W4/4/ 'DWDYDOLG 069 72/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G I2C timing measurement condition Figure 17 represents the Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 400 kHz. "USLINEPULL UPRESISTOR K Figure 17. Maximum Rbus value with fC = 400 kHz  2 BU S §  (ERE2BUS §#BUSNS 4HE2X#TIMECONSTANT BUS BUS MUSTBEBELOWTHENS TIMECONSTANTLINEREPRESENTED ONTHELEFT 6## # BU S  2BUS  N K½ S )£#BUS MASTER 3#, -XXX 3$!  P&   "USLINECAPACITORP& #BUS  AIB Figure 18 represents the Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 1 MHz. Figure 18. Maximum Rbus value with fC = 1 MHz   "USLINEPULL UPRESISTORK 11.1 I2C DC and AC parameters 6## 4HE2BUS§#BUSTIMECONSTANT MUSTBEBELOWTHENS TIMECONSTANTLINEREPRESENTED ONTHELEFT 2 BUS § # BUS    NS  2BUS )£#BUS MASTER 3#, -XXX 3$! (ERE 2 BUS § #BUSNS #BUS     "USLINECAPACITORP& -36 DocID024754 Rev 16 73/89 78 I2C DC and AC parameters M24SR04-Y M24SR04-G Figure 19. I2C bus protocol 6&/ 6'$ 6'$ ,QSXW 6WDUW FRQGLWLRQ 6'$ &KDQJH 6WRS FRQGLWLRQ 6&/       6'$ $&. 06% 6WDUW FRQGLWLRQ 6&/       6'$ 06% $&. 6WRS FRQGLWLRQ -36 Table 80. Device select code Device type identifier (1) b7 Device select code 1 b6 0 Chip Enable address b5 1 b4 0 1. The most significant bit, b7, is sent first. 74/89 DocID024754 Rev 16 b3 1 b2 1 b1 0 RW b0 RW M24SR04-Y M24SR04-G 12 GPO parameters GPO parameters This section lists the timing of the GPO according to its configuration. Table 81. GPO timings measurement(1) GPO field I/F Condition I2C GPO low when session active I2C GPO return HZ RF RF 0xX1 Session Open 0x1X I2C 0xX2 WIP Message In Progress Kill session CmdSTPtoGPlow *add 100 µs for boot after POR 15* µs 15* µs I2C token release sequence AnswerlbLBtoGPHZ 105 ns GPO low when session active NDEF select CmdEOFtoGPlow 170 µs GPO return HZ Deselect CmdEOFtoGPHZ 370 µs CmdSTPtoGPlow 45 µs Writing time duration (No time extension) 5 ms CmdEOFtoGPlow 75 µs Writing time duration (No time extension) 5 ms 55 or 5 µs ms Get session Update Binary GPO low when a command is computed ReadBinary or UpdateBinary CmdSTPtoGPlow I2C GPO return HZ on new command All commands After NewCmdlbFB or AnswerlbFB 105 ns RF GPO low when modifying NDEF UpdateBinary (Msg Length #0) CmdEOFtoGPlow 75 µs RF GPO low when modifying NDEF UpdateBinary Writing time duration (No time extension) 5 ms I2C GPO low after receiving an Interrupt command SendInterrupt CmdSTPtoGPlow 50 µs I2C GPO return HZ All commands After NewCmdlbFB or AnswerlbFB 105 ns RF GPO low after receiving an Interrupt command CmdEOFtoGPlow 75 µs SendInterrupt Pulse duration 540 µs RF 0x3X 0xX4 0x4X Unit GPO low when programming 0xX3 Interrupt Typ. Update Binary I2C I2C Answer Ready Symbol GPO low when programming RF 0x2X Command RF DocID024754 Rev 16 75/89 78 GPO parameters M24SR04-Y M24SR04-G Table 81. GPO timings measurement(1) (continued) GPO field I/F Condition Command Symbol Typ. Unit I2C GPO low when reset Reset GPO CmdSTPtoGPlow 40 µs I2C GPO return HZ when set Set GPO CmdSTPtoGPHZ 40 µs RF GPO low when reset Reset GPO CmdEOFtoGPlow 60 µs RF GPO return HZ when set Set GPO CmdEOFtoGPHZ 60 µs RF GPO low after receiving an RF command Anticollision command or start of RF disturb (command using another RF protocol) CmdSOFtoGPlow 6 µs RF GPO return HZ after deselection or RF command in another protocol Deselect or end of RF disturb (command using another RF protocol) CmdEOFtoGPHZ 460 µs 0xX5 State Control 0x5X RF Busy 0x6X 1. Characterized only. 76/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G 13 Write cycle definition Write cycle definition Table 82. Write cycle definition(1) Symbol Parameter Test Conditions Min Max Ncycle Write cycle endurance(2) TA ≤ 25 °C, VCC(min) < VCC < VCC(max) - 1,000,000 TA ≤ 85 °C, VCC(min) < VCC < VCC(max) - 600,000 Units Write cycle 1. A write cycle is calculated per byte, and corresponds to a write to this byte. 2. Write cycle endurance is defined by characterization and qualification. DocID024754 Rev 16 77/89 78 RF electrical parameters 14 M24SR04-Y M24SR04-G RF electrical parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device in RF mode. The parameters in the DC and AC characteristics tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 83. Default operating conditions Symbol TA Parameter Min. Max. Ambient operating temperature for grade 6 –40 85 Ambient operating temperature for grade 5 -25 85 Unit °C Table 84. RF characteristics (1) Symbol fC H_ISO H_Extended MICARRIER Parameter Condition Min Typ Max Unit 13.553 13.56 13.567 MHz TA = 0 °C to 50 °C 1500 - 7500 mA/m TA = -40 °C to 85 °C 500 - 7500 mA/m MI=(A-B)/(A+B) 90 - 100 % External RF signal frequency Operating field according to ISO Operating field in extended temperature range 100% carrier modulation index t1 Pause A length - 28/fC - 40.5/fC µs t2 Pause A low time - 7/fC - t1 µs t3 Pause A rise time - 1.5xt4 - 16/fC µs t4 Pause A rise time section - 0 - 6/fC µs tMIN CD Minimum time from carrier generation to first data From H-field min - - 5 ms - - 6 - ms fC = 13.56 MHz 22.5 25 27.5 pF Chip reset - - 5 ms Wt CTUN tRF_OFF RF write time (including internal Verify) for one page Internal tuning capacitor in SO8 (2) RF OFF time 1. All timing characterizations were performed on a reference antenna with the following characteristics: External size: 75 mm x 48 mm Number of turns: 6 Width of conductor: 0.6 mm Space between two conductors: 0.6 mm Value of the tuning capacitor in SO8: 25 pF (M24SR04) Value of the coil: 5 µH Tuning frequency: 14.2 MHz. 2. Characterized only, at room temperature only, measured at VAC0-VAC1 = 2 V peak to peak at 13.56 MHz. 78/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G 15 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 15.1 SO8N package information Figure 20. SO8N - 8-lead plastic small outline, 150 mils body width, package outline HXƒ ! ! C CCC B E PP *$8*(3/$1( $ K  % %  ! , , 62$B9 1. Drawing is not to scale. Table 85. SO8N - 8-lead plastic small outline, 150 mils body width, package data inches (1) millimeters Symbol Min Typ Max Min Typ Max A - - 1.750 - - 0.0689 A1 0.100 - 0.250 0.0039 - 0.0098 A2 1.250 - 0.0492 - - b 0.280 - 0.480 0.0110 - 0.0189 c 0.170 - 0.230 0.0067 - 0.0091 D 4.800 4.900 5.000 0.1890 0.1929 0.1969 E 5.800 6.000 6.200 0.2283 0.2362 0.2441 E1 3.800 3.900 4.000 0.1496 0.1535 0.1575 e - 1.270 - - 0.0500 - h 0.250 - 0.500 0.0098 - 0.0197 k 0° - 8° 0° - 8° L 0.400 - 1.270 0.0157 - 0.0500 DocID024754 Rev 16 79/89 84 Package information M24SR04-Y M24SR04-G Table 85. SO8N - 8-lead plastic small outline, 150 mils body width, package data (continued) inches (1) millimeters Symbol Min Typ Max Min Typ Max L1 - 1.040 - - 0.0409 - ccc - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 21. SO8N - 8-lead plastic small outline, 150 mils bosy width, package recommended footprint   [  2B621B)3B9 80/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G 15.2 Package information TSSOP8 package information Figure 22. TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package outline  ϴ ϱ Đ ϭ ϭ  ϰ ɲ ϭ W > Ϯ  >ϭ ď Ğ 76623$0B9 1. Drawing is not to scale. / Table 86. TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package mechanical data inches (1) millimeters Symbol Typ Min Max Typ Min Max A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 CP - - 0.100 - - 0.0039 D 2.900 3.000 3.100 0.1142 0.1181 0.1220 e - 0.650 - - 0.0256 - E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1 4.300 4.400 4.500 0.1693 0.1732 0.1772 L 0.450 0.600 0.750 0.0177 0.02636 0.0295 L1 - 1.000 - - 0.0394 - α 0° 8° 0° - 8° 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID024754 Rev 16 81/89 84 Package information 15.3 M24SR04-Y M24SR04-G UFDFPN8 package information Figure 23. UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline ' 1 $ % $ FFF  3LQ ,'PDUNLQJ ( $ & HHH & 6HDWLQJSODQH $ 6LGHYLHZ [ DDD &  DDD & [  7RSYLHZ ' H  'DWXP$ E  / / / / 3LQ ,'PDUNLQJ ( . / H / H 7HUPLQDOWLS 'HWDLO³$´ (YHQWHUPLQDO 1'[ H %RWWRPYLHZ 6HH'HWDLO³$´ =:EB0(B9 1. Max package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. 4. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating (not connected) in the end application. 82/89 DocID024754 Rev 16 M24SR04-Y M24SR04-G Package information Table 87. UFDFPN8 - 8- lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data inches (1) millimeters Symbol Min Typ Max Min Typ Max A 0.450 0.550 0.600 0.0177 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b(2) 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 1.900 2.000 2.100 0.0748 0.0787 0.0827 D2 (rev MC) 1.200 - 1.600 0.0472 - 0.0630 E 2.900 3.000 3.100 0.1142 0.1181 0.1220 E2 (rev MC) 1.200 - 1.600 0.0472 - 0.0630 e - 0.500 - - 0.0197 - K (rev MC) 0.300 - - 0.0118 - - L 0.300 - 0.500 0.0118 - 0.0197 L1 - - 0.150 - - 0.0059 L3 0.300 - - 0.0118 - - aaa - - 0.150 - - 0.0059 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 - - 0.080 - - 0.0031 eee (3) 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 3. Applied for exposed die paddle and terminals. Exclude embedded part of exposed die paddle from measuring. DocID024754 Rev 16 83/89 84 Ordering information 16 M24SR04-Y M24SR04-G Ordering information Table 88. Ordering information scheme for packaged devices Example: M24 SR 04- Y MN 6 T /2 Device type M24 = I2C interface device Device feature SR = Short range Memory size 04 = memory size in Kbits Voltage range Y = 2.7 to 5.5 V G = 2.4 to 5.5 V, only available in grade 5 (-25 to 85 °C) Package MN = SO8N DW = TSSOP8 MC = UFDFPN8 SG12I = 120 µm ± 15 µm bumped and sawn inkless wafer on 8-inch frame(1) Device grade 5 = industrial: device tested with standard test flow over -25 to 85 °C 6 = industrial: device tested with standard test flow over –40 to 85 °C (No parameter for SG12I) Option T = Tape and reel packing (No parameter for SG12I) Capacitance /2 = 25 pF 1. SG12I is only available for voltage range “G”. Note: 84/89 Parts marked as ES or E are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. DocID024754 Rev 16 M24SR04-Y M24SR04-G 17 Revision history Revision history Table 89. Document revision history Date Revision 13-Jun-2013 1 Initial release. 2 Added UFDFPN8 drawing on page 1. Edited Section 2.6: RF disable. Updated ICC0 parameter in Table 77: I2C DC characteristics and added a note. Added Section 15.3: UFDFPN8 package information and UFDFPN8 package. 28-Oct-2013 3 Updated the Capacitance value to 25 pF. Removed all “Battery assisted” and “Wire power management” information (conditioned for a future use). Moved GetI2Csession command before Section 5.10.2: KillRFsession command. Added 2 new sections: Section 7.4: I²C token release sequence and Section 7.5: I²C timeout on clock period. Removed “DID field” information from Section 7.9: I²C frame format and from Table 69 to Table 71 Updated different values in Table 73: Absolute maximum ratings, Table 74: I2C operating conditions, Table 77: I2C DC characteristics, Table 78: I2C AC characteristics (400 kHz), Table 79: I2C AC characteristics (1 MHz), and Table 84: RF characteristics, and removed all “(forecast data)” from the table titles. Moved RF characteristics table before Table 84: RF characteristics, deleted footnote (1) and updated footnote (2). Fully edited. 08-Nov-2013 4 Added a note to Section 7.1: I2C communication protocol below Figure 12: Command and response exchange. 5 Changed the datasheet status from “Preliminary data” to “Production data”. Restored the whole content of Table 77: I2C DC characteristics. Updated the capacitor values in Section 2.5.1: Operating supply voltage VCC. Removed bullet (4) from Section 8.6: Reaching the read-only state for an NDEF file. Updated VESD value in Table 73: Absolute maximum ratings, ICC values in Table 77: I2C DC characteristics, and H_Extended value in Table 84: RF characteristics. Added details to “S(WTX)” bullet in Section 5.4: S-Block format. Added sentences to Section 5.6.8: UpdateBinary command and to Section 5.8.3: DisablePermanentState command. Changed ‘0x001E’ value into ‘0x001F’ in Table 56: StateControl command format. Updated values in Table 61: ATS response. Added Note (4) to Figure 10: Changing the read access right to an NDEF file and Figure 11: Changing the write access right to an NDEF file. 29-Aug-2013 18-Dec-2013 Changes DocID024754 Rev 16 85/89 88 Revision history M24SR04-Y M24SR04-G Table 89. Document revision history (continued) Date 26-Feb-2014 11-Jun-2014 20-Nov-2014 20-Aug-2015 86/89 Revision Changes 6 Updated Figure 5: GPO configured as I2C answer ready (GPO field = 0xX3) and Figure 8: GPO configured as State Control (GPO field = 0xX5 or 0x5X). Added I2C text to the Note below Table 22: S-Block detailed format. Edited the third paragraph of Section 5.8.1: ExtendedReadBinary command. Added Section 5.8.4: UpdateFileType command and Section 8.8: Changing a File type Procedure. Updated bullet 3 in Section 7.9: I²C frame format, and the Payload row of Table 70: I2C host to M24SR04. Updated bullet 2 in Section 7.11: Close the I²C session. Edited VIO row and removed VESD (machine model) row from Table 73: Absolute maximum ratings. Updated ICC rows and added a Note to Table 77: I2C DC characteristics. Updated Figure 20: SO8N - 8-lead plastic small outline, 150 mils body width, package outline. Fixed a typo in Figure 23: UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline title: UFDPFN8 changed into UFDFPN8. 7 Added data for automotive grade in Table 6: Field list and Table 72: UID format Added WFDFPN8 package for automotive grade under qualification Added Figure 24: WFDFPN8 (MLP8) 8-lead, 2 x 3 mm, 0.5 mm pitch very thin fine pitch dual flat package outline Added WFDFPN8 package for automotive grade under qualification Added Table 88: WFDFPN8 8-lead thin fine pitch dual flat package no lead mechanical data Added MF = WFDFPN8 inside Table 88: Ordering information scheme for packaged devices Inserted byte between A4 and 00 inside Figure 14: NDEF tag Application Select command 8 Added: – New Root Part Number on cover page – single supply voltage for I2C for grade G and note (1) Updated: – Figure 14 – Figure 73,Figure 74, Figure 77, Figure 78, Figure 83, Figure 88 9 Added – Figure 21: SO8N - 8-lead plastic small outline, 150 mils bosy width, package recommended footprint Updated – Section 15: Package information – Table 73: Absolute maximum ratings – Table 74: I2C operating conditions – Table 78: I2C AC characteristics (400 kHz) – Table 88: Ordering information scheme for packaged devices DocID024754 Rev 16 M24SR04-Y M24SR04-G Revision history Table 89. Document revision history (continued) Date 04-Mar-2016 27-Apr-2016 14-Oct-2016 18-Nov-2016 07-Feb-2017 Revision Changes 10 Updated: – Features – Section 2.7.6: State Control configuration (GPO field = 0xX5 or 0x5X) Added: – Table 7: Details about I2C watchdog – Table 82: Write cycle definition 11 Updated: – Features – Table 73: Absolute maximum ratings – Table 82: Write cycle definition Added: – Section 13: Write cycle definition 12 Updated: – Section 3.2.2: Changing the read access right to NDEF files – Section 3.2.3: Changing the write access right to NDEF files – Section 5.6.5: NDEF Select command – Section 5.8.4: UpdateFileType command – Section 5.8.5: SendInterrupt command – Section 8.2: Reading of an NDEF message – Section 8.5: Unlocking an NDEF file – Section 8.6: Reaching the read-only state for an NDEF file – Section 16: Ordering information Added: – Section 8.9: Updating a NDEF file 13 Updated: – Table 35: R-APDU of the ReadBinary command – Table 47: R-APDU of the ExtendedReadBinary command – Table 88: Ordering information scheme for packaged devices 14 Added: – Note 4. on Figure 23.: UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline Updated: – Table 88: Ordering information scheme for packaged devices DocID024754 Rev 16 87/89 88 Revision history M24SR04-Y M24SR04-G Table 89. Document revision history (continued) Date 08-Feb-2017 12-Sep-2017 88/89 Revision Changes 15 Package SB12I replaced with SG12I. Updated: – Table 73: Absolute maximum ratings – Table 88: Ordering information scheme for packaged devices 16 Updated: – Features – Table 6: Field list – Table 20: R-Block detailed format – Table 72: UID format – Table 74: I2C operating conditions – Table 78: I2C AC characteristics (400 kHz) – Table 86: TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package mechanical data – Table 88: Ordering information scheme for packaged devices – Figure 10: Changing the read access right to an NDEF file – Figure 11: Changing the write access right to an NDEF file – Figure 15: AC test measurement I/O waveform – Figure 16: I2C AC waveforms – Figure 19: I2C bus protocol – Figure 22: TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch, package outline – Section 16: Ordering information Deleted: – Section 15.4: WFDFPN8 package information – Figure 24: WFDFPN8 (MLP8) 8-lead, 2 x 3 mm, 0.5 mm pitch very thin fine pitch dual flat package outline – Table 88: WFDFPN8 8-lead thin fine pitch dual flat package no lead mechanical data DocID024754 Rev 16 M24SR04-Y M24SR04-G IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID024754 Rev 16 89/89 89