M27C801-80F1

M27C801 8 Mbit (1Mb x 8) UV EPROM and OTP EPROM Features ■ 5 V ± 10% supply voltage in Read operation ■ Access time: 55 ns ■ low Power Consumption: – Active current: 35 mA at 5 MHz – Standby current: 100 µA ) s ( ct 32 1 FDIP32W (F) ■ Programming voltage: 12.75 V ± 0.25 V ■ Programming time: 50 µs/word ■ Electronic signature – Manufacturer code: 20h – Device code: 42h ■ ECOPACK® packages available u d o r P e t e l o ) (s s b O 32 1 PDIP32 (B) t c u d o r P e PLCC32 (K) t e l o s b O September 2007 Rev 6 1/24 www.st.com 1 Contents M27C801 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 Presto IIB programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 ) s ( ct u d o r P e t e l o s b O 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 ) (s t c u d o r 5.1 32-pin ceramic frit-seal DIP, with round window (FDIP32WA) . . . . . . . . . 19 5.2 32-pin plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 20 5.3 32-lead rectangular plastic leaded chip carrier (PLCC32) . . . . . . . . . . . . 21 P e s b O t e l o 6 7 2/24 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 M27C801 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Margin mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 3/24 List of figures M27C801 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PLCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Margin mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Programming and verify modes AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 4/24 s b O M27C801 1 Description Description The M27C801 is an 8 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for applications where fast turn-around and pattern experimentation are important requirements and is organized as 1,048,576 by 8 bits. The FDIP32W (window ceramic frit-seal package) has transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C801 is offered in PDIP32 and PLCC32 packages. ) s ( ct In order to meet environmental requirements, ST offers the M27C801 in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. u d o r P e ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com. t e l o See Figure 1: Logic diagram and Table 1: Signal descriptions for a brief overview of the signals connected to this device. Figure 1. Logic diagram ) (s t c u d o r let P e o s b s b O VCC 20 8 A0-A19 E Q0-Q7 M27C801 GVPP O VSS AI01267 5/24 Description M27C801 Table 1. Signal descriptions Signal Description A0-A19 Address inputs Q0-Q7 Data outputs E Chip Enable GVPP Output enable / program supply VCC Supply voltage VSS Ground Figure 2. DIP connections A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS ) (s od t c u r P e t e l o s b O 6/24 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27C801 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 VCC A18 A17 A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3 t e l o r P e s b O AI01268 u d o ) s ( ct M27C801 Description PLCC connections A12 A15 A16 A19 VCC A18 A17 Figure 3. 1 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 M27C801 9 25 A14 A13 A8 A9 A11 GVPP A10 E Q7 VSS Q3 Q4 Q5 Q6 Q1 Q2 17 ) s ( ct u d o r P e AI01814 t e l o ) (s s b O t c u d o r P e t e l o s b O 7/24 Device description 2 M27C801 Device description The operating modes of the M27C801 are listed in the Operating Modes table. A single power supply is required in Read mode. All inputs are TTL levels except for GVPP and 12V on A9 for Electronic Signature and Margin Mode Set or Reset. Table 2. Operating modes (1) Mode E GVpp A9 Q7-Q0 Read VIL VIL X Data Out Output Disable VIL VIH X Hi-Z VIL Pulse VPP X Program Inhibit VIH VPP X Standby VIH X X Electronic signature VIL VIL Program 1. X = VIH or VIL, VID = 12 V ± 0.5 V. 2.1 Read mode e t e ol Hi-Z du o r P VID ) s ( ct Data In Hi-Z Codes s b O The M27C801 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. ) (s t c u 2.2 d o Standbyrmode P e t e l The M27C801 has a standby mode which reduces the supply current from 35mA to 100µA. so b O 2.3 The M27C801 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the GVPP input. Two-line output control Because EPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: ● the lowest possible memory power dissipation, ● complete assurance that output bus contention will not occur. For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This 8/24 M27C801 Device description ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. 2.4 System considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. ) s ( ct u d o 2.5 r P e t e l o Programming s b O When delivered (and after each erasure for UV EPROM), all bits of the M27C801 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0' will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C801 is in the programming mode when VPP input is at 12.75V and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. ) (s t c u d o r 2.6 Presto IIB programming algorithm P e Presto IIB Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. This can be achieved with STMicroelectronics M27C801 due to several design innovations to improve programming efficiency and to provide adequate margin for reliability. Before starting the programming the internal Margin Mode circuit is set in order to guarantee that each cell is programmed with enough margin. Then a sequence of 50 µs program pulses are applied to each byte until a correct Verify occurs (see Figure 4). No overprogram pulses are applied since the Verify in Margin Mode provides the necessary margin. s b O t e l o 9/24 Device description Figure 4. M27C801 Programming flowchart VCC = 6.25V, VPP = 12.75V SET MARGIN MODE n=0 E = 50µs Pulse NO NO ++n = 25 ++ Addr VERIFY ) s ( ct YES YES Last Addr FAIL u d o NO r P e YES RESET MARGIN MODE t e l o CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4.2V )- s b O AI01271B s ( t c 2.7 Program Inhibit u d o Programming of multiple M27C801s in parallel with different data is also easily accomplished. Except for E, all like inputs including GVPP of the parallel M27C801 may be common. A TTL low level pulse applied to a M27C801's E input, with VPP at 12.75V, will program that M27C801. A high level E input inhibits the other M27C801s from being programmed. r P e s b O t e l o 2.8 2.9 Program Verify A Verify (Read) should be performed on the programmed bits to determine that they were correctly programmed. The Verify is accomplished with G at VIL. Data should be verified with tELQV after the falling edge of E. Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C801. To activate 10/24 M27C801 Device description the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C801. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27C801, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. Table 3. Electronic signature Identifier 2.10 A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer code VIL 0 0 1 0 0 0 0 0 20h Device code VIH 0 1 0 0 0 0 1 0 42h Erasure operation (applies to UV EPROM) ) s ( ct u d o The erasure characteristics of the M27C801 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C801 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C801 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C801 window to prevent unintentional erasure. The recommended erasure procedure for the M27C801 is exposure to short wave ultraviolet light which has wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm2. The erasure time with this dosage is approximately 30 to 40 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C801 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 11/24 Maximum ratings 3 M27C801 Maximum ratings Stressing the device outside the ratings listed in Table 4 may cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the Operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Absolute maximum ratings Symbol TA Parameter Ambient operating temperature TBIAS Temperature under bias TSTG Storage temperature VIO (2) VCC VA9 (2) VPP Value (1) uc od Input or output voltage (except A9) Supply voltage e t e l A9 voltage o s b Program supply voltage 1. Depends on range. ) s ( t –40 to 125 –50 to 125 Pr Unit °C °C –65 to 150 °C –2 to 7 V –2 to 7 V –2 to 13.5 V –2 to 14 V 2. Minimum DC voltage on Input or Output is –0.5 V with possible undershoot to –2.0 V for a period less than 20 ns. Maximum DC voltage on Output is VCC +0.5 V with possible overshoot to VCC +2 V for a period less than 20 ns. O ) s ( t c u d o r P e t e l o s b O 12/24 M27C801 4 DC and AC characteristics DC and AC characteristics This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC measurement conditions Parameter High Speed Standard Input rise and fall times ≤10ns ≤20ns (10% to 90%) Input pulse voltages 0 to 3V 0.4 to 2.4V 1.5V 0.8 and 2V Input and output timing ref. voltages Figure 5. AC testing input output waveform 0V t e l o ) (s Standard 2.4V ct du e t e ol o r P 0.4V s b O u d o r P e High Speed 3V ) s ( ct 1.5V 2.0V 0.8V AI01822 s b O 13/24 DC and AC characteristics Figure 6. M27C801 AC testing load circuit 1.3V 1N914 3.3kΩ DEVICE UNDER TEST OUT CL ) s ( ct CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance Capacitance(1) (2) Table 6. Symbol t e l o Parameter CIN Test condition Input capacitance Output capacitance COUT Table 7. ILO e t e l o s b O Max. Unit VIN = 0 V 6 pF VOUT = 0 V 12 pF bs s ( t c Read mode DC characteristics(1) (2) u d o Symbol ILI Min. O ) 1. TA = 25 °C, f = 1 MHz. 2. Sampled only, not 100% tested. u d o r P e AI01823B Parameter Pr Test condition Max. Unit 0V ≤VIN ≤VCC ±10 µA 0V ≤VOUT ≤VCC ±10 µA E = VIL, GVPP = VIL, IOUT = 0 mA, f = 5 MHz 35 mA E = VIH 1 mA E > VCC – 0.2V 100 µA VPP = VCC 10 µA Input leakage current Output leakage current Min. ICC Supply current ICC1 Supply current (Standby) TTL ICC2 Supply current (Standby) CMOS IPP Program current VIL Input low voltage –0.3 0.8 V VIH (3) Input high voltage 2 VCC + 1 V VOL Output low voltage IOL = 2.1 mA 0.4 V Output high voltage TTL IOH = –1 mA 3.6 V IOH = –100 µA VCC – 0.7 V VOH Output high voltage CMOS 1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5 V ± 10%. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Maximum DC voltage on Output is VCC +0.5V. 14/24 M27C801 DC and AC characteristics Programming mode DC characteristics(1) (2) Table 8. Symbol Parameter Test condition Min. VIL ≤VIN ≤VIH Max. Unit ±10 µA 50 mA 50 mA ILI Input leakage current ICC Supply current IPP Program current VIL Input low voltage –0.3 0.8 V VIH Input high voltage 2 VCC + 0.5 V VOL Output low voltage IOL = 2.1mA 0.4 V VOH Output high voltage TTL IOH = –1mA VID A9 voltage E = VIL 3.6 11.5 V ) s ( t 12.5 V c u d 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. e t e ol ) (s o r P s b O t c u d o r P e t e l o s b O 15/24 DC and AC characteristics M27C801 Read mode AC characteristics(1) (2) Table 9. Symbol Alt Test condition Parameter -55 (3) -80/-90 -100 Unit Min. Max. Min. Max. Min Max. tAVQV tACC Address valid to output valid E = VIL, GVPP = VIL 55 80 100 ns tELQV tCE Chip Enable low to output valid GVPP = VIL 55 80 100 ns tGLQV tOE Output Enable low to output valid E = VIL 30 40 50 ns tEHQZ(4) tDF Chip Enable high to output Hi-Z tGHQZ(4) tAXQX GVPP = VIL 0 25 0 35 0 40 ns tDF Output Enable high to output Hi-Z E = VIL 0 25 0 35 0 40 ns Address transition to output transition E = VIL, GVPP = VIL 0 tOH 0 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested. Figure 7. VALID A0-A19 tAVQV ) (s E G Q0-Q7 e t e ol s b O 16/24 e t e ol Read mode AC waveforms Pr od t c u tGLQV tELQV s b O ns c u d 1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5 V ± 10%. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. ) s ( t 0 o r P VALID tAXQX tEHQZ tGHQZ Hi-Z AI01583B M27C801 DC and AC characteristics Margin mode AC characteristics(1) (2) Table 10. Symbol Alt Parameter Test condition Min Max tA9HVPH tAS9 VA9 high to VPP high 2 µs tVPHEL tVPS VPP high to Chip Enable low 2 µs tA10HEH tAS10 VA10 high to Chip Enable high (Set) 1 µs tA10LEH tAS10 VA10 low to Chip Enable high (Reset) 1 µs tEXA10X tAH10 Chip Enable transition to VA10 transition 1 µs tEXVPX tVPH Chip Enable transition to VPP transition 2 µs tVPXA9X tAH9 VPP transition to VA9 transition 2 µs ) s ( ct 1. TA = 25 °C; VCC = 6.25 V ± 0.25 V; VPP = 12.75 V ± 0.25 V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. Figure 8. Unit u d o Margin mode AC waveforms r P e VCC t e l o A8 A9 ) (s tA9HVPH GVPP ct u d o E r P e A10 Set t e l o s b O tVPHEL tVPXA9X tEXVPX tA10HEH tEXA10X A10 Reset O bs tA10LEH AI00736B 17/24 DC and AC characteristics Table 11. M27C801 Programming mode AC characteristics (1) Symbol Alt tAVEL tAS Address valid to Chip Enable low 2 µs tQVEL tDS Input valid to Chip Enable low 2 µs tVCHEL tVCS VCC high to Chip Enable low 2 µs tVPHEL tOES VPP high to Chip Enable low 2 µs tVPLVPH tPRT VPP rise time 50 ns tELEH tPW Chip Enable program pulse width (initial) 45 tEHQX tDH Chip Enable high to Input transition 2 tEHVPX tOEH Chip Enable high to VPP transition 2 tVPLEL tVR VPP low to Chip Enable low 2 tELQV tDV Chip Enable low to output valid tDFP Chip Enable high to output Hi-Z tAH Chip Enable high to address transition tEHQZ (2) tEHAX Parameter Test condition Min. Max. 55 c u d 130 0 Figure 9. t e l o s b O Programming and verify modes AC waveforms VALID A0-A19 ) (s tAVEL t c u Q0-Q7 tEHAX DATA IN tQVEL d o r VCC P e tVCHEL DATA OUT tEHQZ tEHQX tEHVPX tELQV GVPP t e l o bs O tVPHEL tVPLEL E tELEH PROGRAM VERIFY AI01270 18/24 µs µs ns ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested. ) s ( t µs ro P e µs µs 1 0 Unit M27C801 Package mechanical data 5 Package mechanical data 5.1 32-pin ceramic frit-seal DIP, with round window (FDIP32WA) Figure 10. FDIP32WA package outline A2 A3 A1 B1 B A L α e eA D2 C ) s ( ct eB D S u d o N ∅ E1 E r P e 1 Table 12. bs millimeters Min Typ (s) A 0.51 A2 3.91 e t e l C O o s b D Pr Max inches Min Typ 5.72 0.225 0.020 0.055 4.57 0.154 0.180 3.89 4.50 0.153 0.177 0.41 0.56 0.016 0.022 1.45 0.057 0.23 0.30 0.009 0.012 41.73 42.04 1.643 1.655 D2 38.10 1.500 e 2.54 0.100 E 15.24 0.600 E1 Max 1.40 od A3 -O t c u A1 B1 t e l o FDIP32WA package mechanical data Symbol B FDIPW-a 13.06 eA 13.36 0.514 14.99 0.526 0.590 eB 16.18 18.03 0.637 0.710 L 3.18 4.10 0.125 0.161 N S 32 1.52 Ø α 32 2.49 0.060 7.11 4° 0.098 0.280 11° 4° 11° 19/24 Package mechanical data 5.2 M27C801 32-pin plastic DIP, 600 mils width (PDIP32) Figure 11. PDIP32 package outline A2 A1 b1 b A L α e eA c D2 D S ) s ( ct N E1 E u d o 1 PDIP-C Table 13. t e l o millimeters Symbol Min Typ Max bs A 4.83 A1 b 0.41 b1 1.14 ro P e 41.78 inches Typ Max 0.190 0.015 0.150 0.53 0.016 0.021 1.65 0.045 0.065 0.38 0.009 0.015 42.29 1.645 1.665 38.10 1.500 eA 15.24 0.600 e 2.54 0.100 E 15.24 15.88 0.600 0.625 E1 13.46 13.97 0.530 0.550 S 1.65 2.21 0.065 0.087 L 3.05 3.56 0.120 0.140 α 0° 15° 0° 15° N 20/24 t(s c u d 0.23 D s b O Min 3.81 c t e l o O ) 0.38 A2 D2 r P e PDIP32 package mechanical data 32 32 M27C801 5.3 Package mechanical data 32-lead rectangular plastic leaded chip carrier (PLCC32) Figure 12. PLCC32 package outline D D1 A1 A2 1 N B1 E2 E3 e E1 E F B 0.51 (.020) E2 ) s ( ct 1.14 (.045) A D3 u d o R D2 Table 14. r P e D2 bs Max Min 3.56 0.125 0.140 2.41 0.060 0.095 – 0.015 – 0.33 0.53 0.013 0.021 0.66 0.81 0.026 0.032 millimeters Min A 3.18 A1 1.53 A2 0.38 e t e l D O o s b Typ (s) -O t c u od B Pr CP t e l o PLCC-A PLCC32 package mechanical data Symbol B1 CP inches Typ 0.10 Max 0.004 12.32 12.57 0.485 0.495 D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 D3 7.62 0.300 E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 E3 10.16 0.400 e 1.27 0.050 F 0.00 0.13 0.000 0.005 R 0.89 0.035 N 32 32 21/24 Part numbering 6 M27C801 Part numbering Table 15. Ordering information scheme Example: M27C801 -55 K 1 Device type M27 Supply voltage ) s ( ct C = 5 V ±10% u d o Device function 801 = 8 Mbit (1Mb x 8) r P e Speed t e l o -55 (1) = 55 ns -80 = 80 ns -90 = 90 ns -100 = 100 ns Package ) (s F = FDIP32W s b O t c u B = PDIP32 K = PLCC32 d o r Temperature range P e 1 = 0 to 70 °C t e l o 6 = –40 to 85 °C 1. High Speed, see DC and AC characteristics section for further information. bs O 22/24 For a list of available options (speed, package, etc...) or for further information on any aspect of this device, please contact the nearest STMicroelectronics sales office. M27C801 7 Revision history Revision history Table 16. Document revision history Date Revision Changes 10-Sept-1998 1 First Issue 21-Mar-2000 2 FDIP32W Package changed 25-Sep-2000 3 AN620 Reference removed 12-Jul-2002 4 55ns speed class added PLCC32 Package mechanical drawing and data clarified 12-Apr-2006 5 Converted to new template. Added ECOPACK® information. Removed Tape & Reel Packing option. 24-Sep-2007 6 TSOP32 (N) package removed. 45 ns, 60 ns, 70 ns, 120 ns and 150 ns speed classes removed, 90 ns speed class added. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 23/24 M27C801 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. 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