M27W256B-80F6

M27W256 256 Kbit (32Kb x 8) Low Voltage UV EPROM and OTP EPROM Features ■ 2.7V to 3.6V Supply Voltage in Read Operation ■ Access Time: – 70 ns at VCC = 3.0V to 3.6V – 80 ns at VCC = 2.7V to 3.6V ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O ■ Pin Compatible with M27C256B ■ Low Power Consumption: – 15 µA Max. Standby Current – 15 mA Max. Active Current at 5 MHz ■ Programming Time 100 µs/byte ■ High Reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Protection Immunity ■ Electronic Signature – Manufacturer Code: 20h – Device Code: 3dh ■ ECOPACK® packages available April 2006 28 28 1 1 FDIP28W (F) PLCC32 (K) Rev 3 PDIP28 (B) TSOP28 (N) 8 x 13.4 mm 1/23 www.st.com 1 Contents M27W256 Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 Erasure operation (applies for UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.1 28-pin Ceramic Frit-seal DIP, with window (FDIP28WB) . . . . . . . . . . . . . 17 5.2 28-pin Plastic DIP, 600 mils width (PDIP28) . . . . . . . . . . . . . . . . . . . . . . . 18 5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 19 5.4 28-lead Plastic Thin Small Outline, 8 x 13.4 mm (TSOP28) . . . . . . . . . . 20 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2/23 M27W256 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 FDIP28WB package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PDIP28 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 TSOP28 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 3/23 List of figures M27W256 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 FDIP28WB package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PDIP28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 TSOP28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 4/23 M27W256 1 Summary description Summary description The M27W256 is a low voltage 256 Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems and is organized as 32,768 by 8 bits. The M27W256 operates in the read mode with a supply voltage as low as 3V. The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP28W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O For applications where the content is programmed only one time and erasure is not required, the M27W256 is offered in PDIP28, PLCC32 and TSOP28 (8 x 13.4 mm) packages. In order to meet environmental requirements, ST offers the M27W256 in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com. See Figure 1: Logic Diagram and Table 1: Signal descriptions for a brief overview of the signals connected to this device. Figure 1. Logic Diagram VCC VPP 15 8 A0-A14 E Q0-Q7 M27W256 G VSS AI03629 5/23 Summary description Table 1. M27W256 Signal descriptions Signal Description A0-A14 Address Inputs Q0-Q7 Data Outputs E Chip Enable G Output Enable VPP Program Supply VCC Supply Voltage VSS Ground NC Not Connected Internally DU Don’t Use ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Figure 2. DIP Connections VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 28 1 27 2 26 3 25 4 24 5 23 6 22 7 M27W256 8 21 20 9 19 10 11 18 12 17 16 13 15 14 AI03627 6/23 VCC A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3 M27W256 Summary description LCC Connections A7 A12 VPP DU VCC A14 A13 Figure 3. 1 32 A6 A5 A4 A3 A2 A1 A0 NC Q0 M27W256 9 25 A8 A9 A11 NC G A10 E Q7 Q6 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O VSS DU Q3 Q4 Q5 Q1 Q2 17 AI03626 Figure 4. TSOP Connections G A11 A9 A8 A13 A14 VCC VPP A12 A7 A6 A5 A4 A3 22 28 1 7 21 M27W256 15 14 8 A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 AI03628 7/23 Device description 2 M27W256 Device description Table 2 lists M27W256 operating modes. A single power supply is required in Read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature. Table 2. Operating modes Mode E G A9 VPP Q7-Q0 Read VIL VIL X VCC Data Out Output Disable VIL VIH X VCC Hi-Z VIL Pulse VIH X VPP Data In Verify VIH VIL X VPP Data Out Program Inhibit VIH VIH X VPP Hi-Z Standby VIH X X VCC Hi-Z Electronic Signature VIL VIL VID VCC Codes Program ) s ( t c u d o ) r s ( P t c e t u e d l 2.1 Read mode o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P 2.2 Standby mode t( c e t u e l d o o r s P b O e t e l o 2.3 s Two-line output control b O Note: X = VIH or VIL, VID = 12V ± 0.5V. The M27W256 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. The M27W256 has a standby mode which reduces the supply current from 10mA to 10µA with low voltage operation VCC ≤ 3.6V, see Read Mode DC Characteristics table for details. The M27W256 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. Because EPROMs are usually used in larger memory arrays, this product features a 2-line control function which accommodates the use of multiple memory connection. The two line control function allows: ● the lowest possible memory power dissipation, ● complete assurance that output bus contention will not occur. For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all 8/23 M27W256 Device description devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and hat the output pins are only active when data is desired from a particular memory device. 2.4 System considerations The power switching characteristics of Advance CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. ) s ( t c u d o ) r s ( P t c e t u e 2.5 Programming d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d 2.6 o Presto II programming algorithm o r s P b O e t e l o s b O The M27W256 has been designed to be fully compatible with the M27C256B and has the same electronic signature. As a result the M27W256 can be programmed as the M27C256B on the same programming equipments applying 12.75V on VPP and 6.25V on VCC by the use of the same PRESTO II algorithm. When delivered (and after each erasure for UV EPROM), all bits of the M27W256 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27W256 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25 V ± 0.25 V. Presto II programming algorithm allows to program the whole array with a guaranteed margin, in a typical time of 3.5 seconds. Programming with Presto II involves the application of a sequence of 100µs program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify operation, a Margin mode circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in Margin mode at VCC much higher than 3.6V provides necessary margin to each programmed cell. 9/23 Device description Figure 5. M27W256 Programming flowchart VCC = 6.25V, VPP = 12.75V n=0 P = 100µs Pulse NO ++n = 25 YES NO ++ Addr VERIFY YES ) s ( t c u d o ) r s ( P t c e t u e d l o o r s 2.7 Program Inhibit P b e O t e l ) o s ( s t b c u O d o ) r s 2.8 Program Verify P ( t c e t u e l d o o r s P b O2.9 Electronic e Signature t e l o s b O FAIL Last Addr NO YES CHECK ALL WORDS 1st: VCC = 5V 2nd: VCC = 2.7V AI00707D Programming of multiple M27W256s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27W256 may be common. A TTL low level pulse applied to a M27W256's E input, with VPP at 12.75 V, will program that M27W256. A high level E input inhibits the other M27W256s from being programmed. A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and VCC at 6.25V. The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27W256. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27W256, with VCC = VPP = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27W256, 10/23 M27W256 Device description these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. Note that the M27W256 and M27C256B have the same identifier bytes. Table 3. 2.10 Electronic Signature Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 1 0 0 0 1 1 0 1 8Dh Erasure operation (applies for UV EPROM) ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O The erasure characteristics of the M27W256 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27W256 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27W256 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27W256 window to prevent unintentional erasure. The recommended erasure procedure for the M27W256 is exposure to short wave ultraviolet light which has wavelength 2537Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27W256 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. 11/23 Maximum ratings 3 M27W256 Maximum ratings Table 4. Absolute Maximum Ratings (1) Symbol Value Unit Ambient Operating Temperature (2) –40 to 125 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C VIO (3) Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V –2 to 13.5 V –2 to 14 V TA VCC Parameter ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O VA9 (3) VPP A9 Voltage Program Supply Voltage 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2. Depends on range. 3. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 12/23 M27W256 4 DC and AC parameters DC and AC parameters TA = –40 to 85°C; VCC = 2.7V to 3.6V; VPP = VCC Table 5. Symbol Read Mode DC Characteristics (1) Parameter ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS IPP Program Current VIL Input Low Voltage VIH (2) Input High Voltage VOL Output Low Voltage VOH Output High Voltage TTL Test Condition Min. Max. Unit 0V ≤ VIN ≤ VCC ±10 µA 0V ≤ VOUT ≤ VCC ±10 µA E = VIL, G = VIL, IOUT = 0mA, f = 5MHz, VCC ≤ 3.6V 15 mA E = VIH 1 mA E > VCC – 0.2V, VCC ≤ 3.6V 15 µA VPP = VCC 100 µA 0.2VCC V ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O –0.6 0.7VCC VCC + 0.5 IOL = 2.1mA 0.4 IOH = –400µA 2.4 V V V 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Maximum DC voltage on Output is VCC +0.5V. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V Table 6. Symbol Programming Mode DC Characteristics (1) Parameter Test Condition Min 0 ≤ VIN ≤ VCC Max Unit ±10 µA 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current VIL Input Low Voltage –0.3 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V VOH Output High Voltage TTL IOH = –1 mA VID A9 Voltage E = VIL 3.6 11.5 V 12.5 V 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 13/23 DC and AC parameters Table 7. M27W256 AC Measurement Conditions Parameter High Speed Standard Input Rise and Fall Times ≤ 10ns ≤ 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V Input and Output Timing Ref. Voltages TA = 25 °C, f = 1 MHz Table 8. Capacitance (1) ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Symbol CIN COUT Parameter Test Condition Max. Unit VIN = 0V 6 pF VOUT = 0V 12 pF Input Capacitance Output Capacitance 1. Sampled only, not 100% tested. Figure 6. AC Testing Input Output Waveform High Speed 3V 1.5V 0V Standard 2.4V 2.0V 0.8V 0.4V AI01822 Figure 7. AC Testing Load Circuit 1.3V 1N914 3.3kΩ DEVICE UNDER TEST OUT CL CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance 14/23 AI01823B Min. M27W256 DC and AC parameters TA = –40 to 85 °C; VCC = 2.7V to 3.6V; VPP = VCC Read Mode AC Characteristics (1) Table 9. -100 (-120/-150/-200) -80 (2) Symbol Alt Parameter Test Condition VCC = 3.0V to 3.6V Min. Max. VCC = 2.7V to 3.6V Min. Max. VCC = 2.7V to 3.6V Min. Unit Max. tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 70 80 100 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 70 80 100 ns tGLQV tOE Output Enable Low to Output Valid E = VIL 40 50 60 ns tEHQZ (3) tDF Chip Enable High to Output Hi-Z G = VIL 0 40 0 50 0 60 ns tGHQZ (3) tDF Output Enable High to Output Hi-Z E = VIL 0 40 0 50 0 60 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 0 0 ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Speed obtained with High Speed AC measurement conditions. 3. Sampled only, not 100% tested. Figure 8. Read Mode AC Waveforms A0-A14 VALID tAVQV VALID tAXQX E tGLQV tEHQZ G tELQV Q0-Q7 tGHQZ Hi-Z AI00758B 15/23 DC and AC parameters M27W256 TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V Programming Mode AC Characteristics (1) Table 10. Symbol Alt Parameter Test Condition Min. Max. tAVPL tAS Address Valid to Program Low 2 µs tQVPL tDS Input Valid to Program Low 2 µs tVPHPL tVPS VPP High to Program Low 2 µs tVCHPL tVCS VCC High to Program Low 2 µs tELPL tCES Chip Enable Low to Program Low 2 µs tPLPH tPW Program Pulse Width 95 tPHQX tDH Program High to Input Transition 2 µs tQXGL tOES Input Transition to Output Enable Low 2 µs tGLQV tOE Output Enable Low to Output Valid tGHQZ (2) tDFP Output Enable High to Output Hi-Z 0 tGHAX tAH Output Enable High to Address Transition 0 105 Unit µs ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 2. Sampled only, not 100% tested. Programming and Verify Modes AC Waveforms VALID A0-A14 tAVEL Q0-Q7 DATA IN tQVEL DATA OUT tEHQX VPP tVPHEL tGLQV tGHQZ VCC tVCHEL tGHAX E tELEH tQXGL G PROGRAM VERIFY AI00759 16/23 ns 130 ns ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. Figure 9. 100 M27W256 Package mechanical data 5 Package mechanical data 5.1 28-pin Ceramic Frit-seal DIP, with window (FDIP28WB) Figure 10. FDIP28WB package outline A2 A3 A1 B1 B A L α e eA C ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O D2 eB D S N ∅ E1 E 1 FDIPW-a Table 11. FDIP28WB package mechanical data millimeters inches Symbol Min Typ A Max Min Typ 5.72 Max 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177 B 0.41 0.56 0.016 0.022 B1 1.45 0.057 C 0.23 0.30 0.009 0.012 D 36.50 37.34 1.437 1.470 D2 33.02 1.300 E 15.24 0.600 E1 13.06 13.36 0.514 0.526 e 2.54 0.100 eA 14.99 0.590 eB 16.18 18.03 0.637 0.710 L 3.18 4.10 0.125 0.161 α 4° 11° 4° 11° S 1.52 2.49 0.060 0.098 Ø 7.11 0.280 N 28 28 17/23 Package mechanical data 5.2 M27W256 28-pin Plastic DIP, 600 mils width (PDIP28) Figure 11. PDIP28 package outline A2 A1 B1 B A L α e1 eA D2 C eB D S ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O N E1 E 1 PDIP Table 12. PDIP28 package mechanical data millimeters inches Symbol Min Max Min Typ A 4.445 0.1750 A1 0.630 0.0248 A2 3.050 3.810 4.570 0.1201 0.1500 B 0.450 0.0177 B1 1.270 0.0500 C 0.230 D 36.580 36.830 0.310 0.0091 37.080 1.4402 1.4500 33.020 1.3000 E 15.240 0.6000 12.700 e1 13.720 14.480 0.5000 2.540 eA 14.800 eB 15.200 L 15.000 Max 0.1799 0.0122 D2 E1 0.5402 1.4598 0.5701 0.1000 15.200 0.5827 16.680 0.5984 3.300 0.5906 0.5984 0.6567 0.1299 S 1.78 2.08 0.070 0.082 α 0° 10° 0° 10° N 18/23 Typ 28 28 M27W256 5.3 Package mechanical data 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) Figure 12. PLCC32 package outline D D1 A1 A2 1 N B1 E2 e E1 E E3 F B 0.51 (.020) E2 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 1.14 (.045) A D3 R D2 CP D2 PLCC-A Table 13. PLCC32 package mechanical data millimeters inches Symbol Min Typ Max Min Typ Max A 3.18 3.56 0.125 0.140 A1 1.53 2.41 0.060 0.095 A2 0.38 – 0.015 – B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 CP 0.10 0.004 D 12.32 12.57 0.485 0.495 D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 D3 7.62 0.300 E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 E3 10.16 0.400 e 1.27 0.050 F 0.00 0.13 0.000 0.005 R 0.89 0.035 N 32 32 19/23 Package mechanical data 5.4 M27W256 28-lead Plastic Thin Small Outline, 8 x 13.4 mm (TSOP28) Figure 13. TSOP28 package outline A2 22 21 e 28 1 E B 7 8 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O A D1 CP D DIE C A1 TSOP-C Table 14. α L TSOP28 package mechanical data millimeters inches Symbol Min Typ Min Typ Max A 1.250 0.0492 A1 0.200 0.0079 A2 0.950 1.150 0.0374 0.0453 B 0.170 0.270 0.0067 0.0106 C 0.100 0.210 0.0039 0.0083 CP 0.100 0.0039 D 13.200 13.600 0.5197 0.5354 D1 11.700 11.900 0.4606 0.4685 e – – – E 7.900 8.100 0.3110 0.3189 L 0.500 0.700 0.0197 0.0276 α 0° 5° 0° 5° N 20/23 Max 0.550 28 0.0217 28 – M27W256 6 Part numbering Part numbering Table 15. Ordering Information Scheme Example: M27W256 -80 K 6 TR Device Type M27 Supply Voltage W = 2.7V to 3.6V ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Device Function 256 = 256 Kbit (32Kb x 8) Speed -80 (1) (2) = 80 ns -100 = 100 ns Not For New Design (3) -120 = 120 ns -150 = 150 ns -200 = 200 ns Package F = FDIP28W (4) B = PDIP28 K = PLCC32 N = TSOP28: 8 x 13.4 mm (4) Temperature Range 6 = –40 to 85 °C Options TR = ECOPACK® package, Tape & Reel Packing 1. High Speed, see AC Characteristics section for further information. 2. This speed also guarantees 70ns access time at VCC = 3.0V to 3.6V. 3. These speeds are replaced by the 100 ns. 4. Packages option available on request. Please contact STMicroelectronics local Sales Office. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 21/23 Revision history 7 M27W256 Revision history Table 16. Document revision history Date Revision Changes May 1998 1.1 New STMicroelectronics Logo July 1999 1.2 Programming Flowchart clarified (Figure 5) March 2000 2.0 Document Template changed 30-Aug-2002 2.1 Package mechanical data clarified for PDIP28 (Table 12), PLCC32 (Table 13 ,Figure 12) and TSOP28 (Table 14, Figure 13) ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 12-Apr-2006 22/23 3 Converted to new template. Added ECOPACK® information. M27W256 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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