M27W801-100K6

M27W801 8 Mbit (1Mb x8) low voltage UV EPROM and OTP EPROM Feature summary ■ 2.7V to 3.6V supply voltage in READ operation ■ Access time: – 80ns at VCC = 3.0V to 3.6V – 100ns at VCC = 2.7V to 3.6V ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O ■ Pin compatible with M27C801 ■ Low power consumption: – 30µA max Standby Current – 15mA max Active Current at 5MHz ■ Programming time 50µs/Byte ■ High reliability CMOS technology – 2,000V ESD Protection – 200mA Latchup Protection Immunity ■ ■ 32 1 FDIP32W (F) 32 Electronic signature – Manufacturer Code: 20h – Device Code: 42h 1 PDIP32 (B) ECOPACK® packages available PLCC32 (K) TSOP32 (N) 8 x 20 mm May 2006 Rev 2 1/24 www.st.com 1 Contents M27W801 Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 PRESTO IIB programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/24 M27W801 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Margin mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"), package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PDIP32 – 32 pin Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package mechanical data . . . . 21 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Table 13. Table 14. Table 15. Table 16. Table 17. 3/24 List of figures M27W801 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PLCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Margin mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify modes AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline . . . . . . . . . . . . . . 18 PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline . . . . . . . . . . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline . . . . . . . . . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline . . . . . . . . . . . . 21 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 4/24 M27W801 1 Summary description Summary description The M27W801 is a low voltage 8 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage and is organized as 1,048,576 by 8 bits. The M27W801 operates in the read mode with a supply voltage as low as 2.7V at –40 to 85°C temperature range. The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O For applications where the content is programmed only one time and erasure is not required, the M27W801 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. In order to meet environmental requirements, ST offers the M27W801 in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. Logic diagram VCC 20 8 A0-A19 E Q0-Q7 M27W801 GVPP VSS AI02363 Table 1. Signal names A0-A19 Address Inputs Q0-Q7 Data Outputs E Chip Enable GVPP Output Enable / Program Supply VCC Supply Voltage VSS Ground 5/24 Summary description Figure 2. M27W801 DIP connections A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27W801 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 VCC A18 A17 A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O AI02671 PLCC connections A12 A15 A16 A19 VCC A18 A17 Figure 3. 1 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 9 M27W801 25 A14 A13 A8 A9 A11 GVPP A10 E Q7 VSS Q3 Q4 Q5 Q6 Q1 Q2 17 AI02365 6/24 M27W801 Summary description Figure 4. TSOP connections A11 A9 A8 A13 A14 A17 A18 VCC A19 A16 A15 A12 A7 A6 A5 A4 1 8 9 32 M27W801 (Normal) 25 24 GVPP A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 A3 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 16 17 AI02366 7/24 Device operation 2 M27W801 Device operation The operating modes of the M27W801 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for GVPP and 12V on A9 for Electronic Signature and Margin Mode Set or Reset. 2.1 Read mode The M27W801 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. ) s ( t c u d o ) r s 2.2 Standby mode ( P t c e t u e d l o o r s P b e O t e l ) o s 2.3 Two Line Output Control ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O The M27W801 has a standby mode which reduces the supply current from 15mA to 20µA with low voltage operation VCC ≤3.6V, see Read Mode DC Characteristics table for details. The M27W801 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the GVPP input. Because EPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: ● the lowest possible memory power dissipation ● complete assurance that output bus contention will not occur For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. 8/24 M27W801 2.4 Device operation System considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. ) s ( t c u 2.5 Programming d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d - algorithm 2.6 PRESTO o IIB programming ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O The M27W801 has been designed to be fully compatible with the M27C801 and has the same electronic signature. As a result the M27W801 can be programmed as the M27C801 on the same programming equipment applying 12.75V on VPP and 6.25V on VCC by the use of the same PRESTO IIB algorithm. When delivered (and after each ‘1’s erasure for UV EPROM), all bits of the M27W801 are in the "1" state. Data is introduced by selectively programming "0"s into the desired bit locations.Although only '0' will be programmed, both "1" and "0" can be present in the data word. The only way to change a ‘0’ to a ‘1’ is by die exposure to ultraviolet light (UV EPROM). The M27W801 is in the programming mode when VPP input is at 12.75V and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. PRESTO IIB Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. This can be achieved with STMicroelectronics M27W801 due to several design innovations to improve programming efficiency and to provide adequate margin for reliability. Before starting the programming the internal MARGIN MODE circuit must be set in order to guarantee that each cell is programmed with enough margin. Then a sequence of 50µs program pulses are applied to each byte until a correct verify occurs (see Figure 5). No overprogram pulses are applied since the verify in MARGIN MODE at VCC much higher than 3.6V, provides the necessary margin. 9/24 Device operation Figure 5. M27W801 Programming flowchart VCC = 6.25V, VPP = 12.75V SET MARGIN MODE n=0 E = 50µs Pulse NO ++n = 25 NO ++ Addr VERIFY ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s 2.7 Program Inhibit t b c u O d o ) r s P ( t c e t u e l d o o 2.8s ProgramrVerify P b O e t e l o s b O YES FAIL YES Last Addr NO YES RESET MARGIN MODE CHECK ALL BYTES 1st: VCC = 5V 2nd: VCC = 2.7V AI01271C Programming of multiple M27W801s in parallel with different data is also easily accomplished. Except for E, all like inputs including GVPP of the parallel M27W801 may be common. A TTL low level pulse applied to a M27W801's E input, with VPP at 12.75V, will program that M27W801. A high level E input inhibits the other M27W801s from being programmed. A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL. Data should be verified with tELQV after the falling edge of E. 10/24 M27W801 2.9 Device operation Electronic signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27W801. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27W801. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27W801, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. ) s ( t c u d 2.10 Erasure operation (applies to UV EPROM) ro ) s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Note that the M27W801 and M27C801 have the same identifier byte. The erasure characteristics of the M27W801 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27W801 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27W801 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27W801 window to prevent unintentional erasure. The recommended erasure procedure for the M27W801 is exposure to short wave ultraviolet light which has wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm2. The erasure time with this dosage is approximately 30 to 40 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27W801 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. Table 2. Operating modes(1) Mode E GVPP A9 Q7-Q0 Read VIL VIL X Data Out Output Disable VIL VIH X Hi-Z VIL Pulse VPP X Data In Program Inhibit VIH VPP X Hi-Z Standby VIH X X Hi-Z Electronic Signature VIL VIL VID Codes Program 1. X = VIH or VIL, VID = 12V ± 0.5V. 11/24 Maximum rating M27W801 Table 3. Electronic signature Identifier 3 A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 0 1 0 0 0 0 1 0 42h Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Table 4. Absolute maximum ratings Symbol TA Parameter Ambient Operating Temperature(1) Value Unit –40 to 125 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C VIO(2) Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V –2 to 13.5 V –2 to 14 V VCC VA9(2) VPP A9 Voltage Program Supply Voltage 1. Depends on range. 2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 12/24 M27W801 4 DC and AC parameters DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC measurement conditions High Speed Standard Input Rise and Fall Times ≤10ns ≤20ns (10% to 90%) Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Input and Output Timing Ref. Voltages Figure 6. AC testing input output waveform High Speed 3V 1.5V 0V Standard 2.4V 2.0V 0.8V 0.4V AI01822 Figure 7. AC testing load circuit 1.3V 1N914 3.3kΩ DEVICE UNDER TEST OUT CL CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance AI01823B 13/24 DC and AC parameters M27W801 Capacitance(1) (2) Table 6. Symbol Parameter CIN Test Condition Input Capacitance Output Capacitance COUT Min Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF 1. TA = 25 °C, f = 1 MHz 2. Sampled only, not 100% tested. Table 7. Read mode DC characteristics(1) (2) Symbol Parameter Test Condition ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS IPP Program Current VIL Input Low Voltage VIH(3) Input High Voltage VOL Output Low Voltage VOH Output High Voltage TTL Min Max Unit 0V ≤VIN ≤VCC ±10 µA 0V ≤VOUT ≤VCC ±10 µA ) s ( t c u d E = VIL, GVPP = VIL, IOUT = 0mA, f = 5MHz, VCC ≤3.6V E = VIH E > VCC – 0.2V, VCC ≤3.6V ete ol VPP = VCC O ) t(s c u d bs e t le 15 o r P Pr ) s t( 1 mA uc 30 µA 10 µA 0.2 VCC V od –0.6 mA 0.7 VCC VCC + 0.5 IOL = 2.1mA V 0.4 so IOH = –1mA V 2.4 V b O - 1. TA = –40 to 85 °C; VCC = 2.7V to 3.6V; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. o r P 3. Maximum DC voltage on Output is VCC +0.5V. Table 8. ete Symbol ol bs O ICC u d o Test Condition Parameter Supply Current IPP Program Current E = VIL VIL Input Low Voltage –0.3 0.8 V VIH Input High Voltage 2 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1mA 0.4 V VOH Output High Voltage TTL IOH = –1mA VID A9 Voltage ILI Input Leakage Current r P e t e l o s b O ) s ( ct Programming mode DC characteristics(1) (2) Min VIL ≤VIN ≤VIH Max Unit ±10 µA 50 mA 50 mA 3.6 11.5 V 12.5 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 14/24 V M27W801 DC and AC parameters Figure 8. Read mode AC waveforms VALID A0-A19 VALID tAVQV tAXQX E tEHQZ tGLQV G tGHQZ tELQV Hi-Z Q0-Q7 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O AI01583B Table 9. Read mode AC characteristics(1) (2) M27W801 Symbol Alt Parameter -100 (3) -120 (-150/-200) Test Unit Condition VCC = 3.0V VCC = 2.7V VCC = 2.7V to to 3.6V to 3.6V 3.6V Min Max Min Max Min Max tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 80 100 120 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 80 100 120 ns tGLQV tOE Output Enable Low to Output Valid E = VIL 50 60 70 ns tEHQZ(4) tDF Chip Enable High to Output Hi-Z G = VIL 0 50 0 60 0 70 ns (4) tDF Output Enable High to Output Hi-Z E = VIL 0 50 0 60 0 70 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 tGHQZ 0 0 ns 1. TA = –40 to 85 °C; VCC = 2.7V to 3.6V; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested. 15/24 DC and AC parameters M27W801 Figure 9. Margin mode AC waveforms VCC A8 A9 tA9HVPH tVPXA9X GVPP ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O tVPHEL tEXVPX E tA10HEH tEXA10X A10 Set A10 Reset tA10LEH AI00736B 1. A8 High level = 5V; A9 High level = 12V. Table 10. Margin mode AC characteristics(1) (2) Parameter Test Condition Symbol Alt Min Max tA9HVPH tAS9 VA9 High to VPP High 2 µs tVPHEL tVPS VPP High to Chip Enable Low 2 µs tA10HEH tAS10 VA10 High to Chip Enable High (Set) 1 µs tA10LEH tAS10 VA10 Low to Chip Enable High (Reset) 1 µs tEXA10X tAH10 Chip Enable Transition to VA10 Transition 1 µs tEXVPX tVPH Chip Enable Transition to VPP Transition 2 µs tVPXA9X tAH9 VPP Transition to VA9 Transition 2 µs 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 16/24 Unit M27W801 DC and AC parameters Figure 10. Programming and Verify modes AC waveforms VALID A0-A19 tAVEL Q0-Q7 tEHAX DATA IN DATA OUT tQVEL tEHQX tEHQZ VCC tVCHEL tEHVPX tELQV GVPP ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O tVPHEL tVPLEL E tELEH PROGRAM VERIFY AI01270 Table 11. Programming mode AC characteristics(1) (2) Parameter Test Condition Symbol Alt Min Max tAVEL tAS Address Valid to Chip Enable Low 2 µs tQVEL tDS Input Valid to Chip Enable Low 2 µs tVCHEL tVCS VCC High to Chip Enable Low 2 µs tVPHEL tOES VPP High to Chip Enable Low 2 µs tVPLVPH tPRT VPP Rise Time 50 ns tELEH tPW Chip Enable Program Pulse Width (Initial) 45 tEHQX tDH Chip Enable High to Input Transition 2 µs tEHVPX tOEH Chip Enable High to VPP Transition 2 µs tVPLEL tVR VPP Low to Chip Enable Low 2 µs tELQV tDV Chip Enable Low to Output Valid tEHQZ(3) tDFP Chip Enable High to Output Hi-Z 0 tEHAX tAH Chip Enable High to Address Transition 0 55 Unit µs 1 µs 130 ns ns 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested. 17/24 Package mechanical 5 M27W801 Package mechanical Figure 11. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline A2 A3 A1 B1 B A L α e1 eA D2 C eB D S ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O N K E1 E K1 1 FDIPW-b 1. Drawing is not to scale. Table 12. FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"), package mechanical data millimeters inches Symbol Typ Min A Typ Min 5.72 Max 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177 B 0.41 0.56 0.016 0.022 – – – – C 0.23 0.30 0.009 0.012 D 41.73 42.04 1.643 1.655 B1 1.45 0.057 D2 38.10 – – 1.500 – – e 2.54 – – 0.100 – – eA 14.99 – – 0.590 – – 16.18 18.03 0.637 0.710 – – – – 13.06 13.36 0.514 0.526 eB E 15.24 E1 18/24 Max 0.600 K 6.60 – – 0.260 – – K1 10.67 – – 0.420 – – L 3.18 4.10 0.125 0.161 S 1.52 2.49 0.060 0.098 α 4° 11° 4° 11° N 32 32 M27W801 Package mechanical Figure 12. PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline A2 A1 b1 b A L α e eA c D2 D S N E1 E ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 1 PDIP-C 1. Drawing is not to scale. Table 13. PDIP32 – 32 pin Plastic DIP, 600 mils width, package mechanical data millimeters inches Symbol Typ Min A Typ Min 4.83 A1 A2 Max Max 0.190 0.38 0.015 3.81 0.150 b 0.41 0.53 0.016 0.021 b1 1.14 1.65 0.045 0.065 c 0.23 0.38 0.009 0.015 D 41.78 42.29 1.645 1.665 D2 38.10 – – 1.500 – – eA 15.24 – – 0.600 – – e 2.54 – – 0.100 – – E 15.24 15.88 0.600 0.625 E1 13.46 13.97 0.530 0.550 S 1.65 2.21 0.065 0.087 L 3.05 3.56 0.120 0.140 α 0° 15° 0° 15° N 32 32 19/24 Package mechanical M27W801 Figure 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline D D1 A1 A2 1 N B1 E2 e E1 E E3 F B 0.51 (.020) E2 1.14 (.045) ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O A D3 R D2 CP D2 PLCC-A 1. Drawing is not to scale. Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data millimeters inches Symbol Typ Min Max A 3.17 A1 Min Max 3.56 0.125 0.140 1.53 2.41 0.060 0.095 A2 0.38 – 0.015 – B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 CP 0.10 0.004 D 12.32 12.57 0.485 0.495 D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 – – – – E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 D3 7.62 0.300 E3 10.16 – – 0.400 – – e 1.27 – – 0.050 – – 0.00 0.13 0.000 0.005 – – – – F R N 20/24 Typ 0.89 32 0.035 32 M27W801 Package mechanical Figure 14. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline A2 N 1 e E B N/2 A D1 CP D ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O DIE C A1 TSOP-a α L 1. Drawing is not to scale. Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package mechanical data millimeters inches Symbol Typ Min A Max Typ Min 1.200 Max 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 0.950 1.050 0.0374 0.0413 B 0.170 0.250 0.0067 0.0098 C 0.100 0.210 0.0039 0.0083 CP 0.100 0.0039 D 19.800 20.200 0.7795 0.7953 D1 18.300 18.500 0.7205 0.7283 – – – – E 7.900 8.100 0.3110 0.3189 L 0.500 0.700 0.0197 0.0276 N 32 α 0° e 0.500 0.0197 32 5° 0° 5° 21/24 Part numbering 6 M27W801 Part numbering Table 16. Ordering information scheme Example: M27W801 -100 K 6 TR Device Type M27 Supply Voltage ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O W = 2.7V to 3.6V Device Function 801 = 8 Mbit (1Mb x8) Speed -100 (1),(2) = 100 ns -120 = 120 ns Not For New Design(3) -150 = 150 ns -200 = 200 ns Package F = FDIP32W(4) B = PDIP32 K = PLCC32 N = TSOP32: 8 x 20 mm(4) Temperature Range 6 = –40 to 85 °C Options TR = Tape & Reel Packing 1. High Speed, see AC Characteristics section for further information. 2. This speed also guarantees 80ns access time at VCC = 3.0V to 3.6V. 3. These speeds are replaced by the 120ns. 4. Packages option available on request. Please contact STMicroelectronics local Sales Office. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 22/24 M27W801 7 Revision history Revision history Table 17. Date July 1999 15-Mar-2000 Document revision history Version Revision Details 1.0 First Issue 1.1 FDIP32W Package Dimension, L Max added (Table 12.) TSOP32 Package Dimension changed (Table 15) 0 to 70°C Temperature Range removed Programming Time changed ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O 21-Apr-2000 1.2 Read Mode AC Characteristics: tAVQV, tELQV, tGLQV, tEHQZ, tGHQZ changed (Table 9) 20-Feb-2002 1.3 PDIP32 Mechanical data and drawing changed (Table 13) PLCC32 Mechanical data: A2 clarified (Table 14) Read Mode DC Characteristics: VOH clarified (Table 7) 06-May-2002 1.4 PLCC32 Mechanical data and drawing clarified (Table 14, Figure 13) ICC Standby value clarified 21-Mar-2003 1.5 Ordering Information Scheme clarified (Table 16) TSOP32 Package Mechanical Data clarified (Table 15) 22-May-2006 2 Document converted to new template (sections added, information moved). Packages are ECOPACK® compliant. Package specifications updated (see Section 5: Package mechanical). 23/24 M27W801 ) s ( t c u d o ) r s ( P t c e t u e d l o o r s P b e O t e l ) o s ( s t b c u O d o ) r s P ( t c e t u e l d o o r s P b O e t e l o s b O Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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