M35101

D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 s 1 1 1 1 DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Modul e D10 D15 D20 D22 C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355 ST14C02, ST1305B, ST1335, ST1336, ST1355 ST14C02, M14C04, M14C16, M14C32 M14C64, M14128, M14256 M35101, M35102 M35101, M35102 December 1999 1/13 MICROMODULES Table 2. Memory Card Products Type ST14C02C M14C04 M14C16 M14C32 M14C64 M14128 M14256 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336 M35101 M35102 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM Contactless Memory Chip with 64-bit Unique ID, 13.56 MHz, 2048 bit EEPROM Memory Card IC, 272 bit High Endurance EEPROM with Advanced Security Mechanisms Description (please see the individual product data sheets for full specifications) Memory Card IC, 2 Kbit (256 x 8) Serial I2C Bus EEPROM Memory Card IC, 4 Kbit Serial I2C Bus EEPROM Memory Card IC, 16 Kbit Serial I2C Bus EEPROM Memory Card IC, 32 Kbit Serial I2C Bus EEPROM Memory Card IC, 64 Kbit Serial I2C Bus EEPROM Memory Card IC, 128 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 bit OTP EPROM with Lock-Out Memory Card IC, 192 bit High Endurance EEPROM with Secure Logic Access Control Process 1.2 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 3.5 µm 1.5 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm 0.6 µm 0.6 µm Technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS NMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Module Style D15, D20 D20 D20 D20 D22 D22 D22 D10 D10, D15 D10 D10 D10, D15 D10, D15 C20, C30 C20, C30 The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending on product) The range of products and types of Micromodule are summarized in Table 1 and Table 2. For large volumes, ST is able to offer customized module tape. DELIVERY The Super 35mm metallized epoxy tape is delivered on reels, as shown in Figure 1. These contain all of the chips from a number of wafers, including those chips that were found to be nonfunctioning during testing. Traceability is ensured by a label fixed on the reel. The typical quantity is 10,000 modules per reel, with priority given to lot integrity on the reel. The maximum quantity is 15,000 per reel. Parts which are faulty (mechanically or electrically defective) are identified by punch holes. The specification for the reject punch holes is shown in Figure 4 for the D10 micromodule, in Figure 5 for the D15 micromodule, in Figure 6 for the D20 micromodule, and in Figure 7 for the D22 micromodule. Tape joins (tape splicing) are never more than 10 per 10 metre length, as shown in Figure 2 and Figure 3. At least 2.1 m of leader, and 2.1 m of trailer is included on each reel. Each is made of PVC Super 35 mm tape, without metalisation, and is opaque to infrared and white light. A “failure” marking of reject holes is included at the beginning and end of the tape of a minimum of 5 consecutive module pitches (double positions). Modules should be stored within the temperature range -40 °C to + 85 °C, for no more than 1 year. Each reel is packed in an antistatic bag, along with a desiccant bag, and a humidity indicator card. This card indicates the level of humidity as follows: 30 - Blue: protection assured 40 - Pink: renew the desiccant bag 50 - Pink: protection no longer ensured Three self adhesive plastic identification labels are attached: one to the reel, one to the antistatic bag, 2/13 M ICROMODULES Table 3. Manufacturing Flow and Manufacturing Facility Locations Operation Rousset, France. 6” wafer fab. Wafer Diffusion Agrate, Italy. 6” wafer fab.: standard EEPROM only Rousset, France. Electrical Wafer Test Agrate, Italy: standard EEPROM only Assembly Final Test Casablanca, Morocco. Casablanca, Morocco. Rousset, France. Location and Facility Table 4. Material Specification Material Tape Basic material Adhesive Laminated copper foil Adhesive strength Tape Surface Surface roughness Contact surface Nickel thickness Gold thickness Total tape thickness Control, Palmer MCTS T2 or IBIDEN rough, typical thickness 120 µm Modified epoxy, typical thickness 18 µm Typical thickness 35 µm > 0.8 N/mm at room temperature. Monitored by the tape manufacturer using appropriate test methods The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning compounds and parting compounds Typically Rz: 3-12 µm at first accepted delivery Nickel-gold, galvanised treatment 2 µm (min.) contact side, 0.1 µm (min.) 160 ± 30 µm “Special flat” diameter 3 mm, F = 1.5 N Chip Interconnect Dice bonding Bonding wire Ring (D22 only) Silver epoxy Gold 25 µm Bronze Protective coating Material Assembly UV epoxy, Black epoxy Casablanca, Morocco. Description 3/13 MICROMODULES and one to the reel box. Each label carries the following information: – PRODUCT: sales type – LOT NUMBER: reel number – POS: total number of positions – GOOD: number of good positions – FAIL: number of fail positions – DATE: date of sealing In addition, the antistatic bag and the delivery box carry a self adhesive plastic “ESD” warning label, 85 x 38 mm in size, indicating “Electrostatic sensitive devices”. Each reel is packed in a reel box, made of recycled cardboard. The size of the reel box depends on its origin. Several reel boxes are packed in a delivery box, which is also made of recycled cardboard. A delivery note is provided, listing the following information: – Date of sealing – Reel numbers – Total number of positions, with the details of positions per reel – Order number and customer name – Sales type – Tape type RECOMMENDED ACCEPTANCE CRITERIA The product identity should be checked against the delivery documentation, and the quantity of good positions on the reel recorded. The product may be tested in accordance with the appropriate data sheet, the conditions depending on the product type, and the ISSUER or USER mode (for ST13xx products). For delivery acceptance, ST recommends sampling the Micromodules from the beginning of the reel. The sampling AQL should be applied, to the ISO 2859 standard (test level II, normal test). Table 5. Size of the Reel Box Manufacturing Location Rousset Casablanca Size of Reel Box 370 x 390 x 80 mm 373 x 370 x 78 mm Table 6. AQL Levels Defect Total defects - mechanical and electrical Mechanical defects Electrical defects AQL 0.65 0.65 0.65 Any observed discrepancies should be reported in writing to the ST quality department. Table 6 shows the recommended AQL levels. The visual and mechanical test specification and test conditions are described in Table 7. Defect Acceptance Rate Each reel contains the stated number of defective devices, distributed so that no more than 20% of them are found in a contiguous block on the tape. ST’s own quality acceptance standard guarantees that the customer will be informed when the electrical yield is less than 90%. The part numbers and re-ordering information will be set according to ST’s current product coding policy, as shown on the individual product data sheets, or as agreed with the customer. Reels that do not pass inspection should be returned to ST within 15 working days after delivery. Table 7. Visual and Mechanical Specification and Test Conditions Test 1 Description and Method Contact area Reject Criteria Glue or particles, scratches print, sever defects on contact area damaging the gold layer. Visual test distance 30 cm, naked eye. Thickness and external dimension measurement exceeding total thickness, or other dimensions not complying to the drawings Die shear force < 10 N Wire lift or broken at pull test with < 4 g 2 31 41 Chip covering Die bond strength Wire bonding Note: 1. Test 3 and 4 are conducted in accordance with MIL-STD-833. 4/13 M ICROMODULES RELIABILITY Product qualification and on-going reliability monitoring is performed by ST. The principal steps are listed in Table 8 and Table 9. Table 8. Package Related Tests Test 1 2 3 4 5 Description Geometry Visual inspection Temperature cycling Salt atmosphere corrosion of contacts Moisture resistance Vibration with electrical measurement Method ST Specification Condit ion Monitoring/Lot 5 AQL= 0.040 5 15 7 LPTD Criteria (note 1) 0/45 0/315 0/45 0/15 0/32 ST Specification Outgoing/Lot MIL-STD-883 Method 1010 MIL-STD-883 Method 1009 MIL-STD-883 Method 1004 ISO/IEC 10373 -40 °C to 150 °C, 100 cycles 35 °C, 5% NaCl, 24 hour 85 °C, 85% HR Biased 5.5 V, 168 hour 6 1 octave/minute, acceleration up to 10 G (repeated 20 times) 20 measurement memory check at 25 °C Long side: deflection 2 cm Short side: deflection 1 cm 30 bendings per minute Maximum displacement 15° ± 1° 1000 torsions, 30 torsions per minute applied on long side only 20 0/11 7 Bending properties ISO/IEC 7816-1 0/11 8 Torsion properties ISO/IEC 7816-1 20 0/11 Note: 1. The notation m/n means: reject the whole lot if more than m devices fail from a sample of n devices. For instance, 0/45 means a sample of 45 devices taken from a lot, with the whole lot only accepted if every one of the 45 sample devices passed the test. Table 9. Product Related Tests Test 1 2 Description Life test Electrostatic discharge Electrostatic discharge 3 4 Data retention, Temperature storage Write/Erase cycles Method MIL-STD-883 Method 1005 MIL-STD-883 Method 3015 MIL-STD-883 Method 3015 MIL-STD-883 Method 1005 ST Specification Condit ion 140 °C, 6 V, 504 hours measurement memory check at 25 °C Human body model: 1.5 kΩ, 100 pF, ± 5000 V 3 n/a LPTD Criteria 0/76 0/9 0/9 0/45 0/32 Machine model: 0 Ω, 200 pF, ± 200 V n/a measurement memory check at 25 °C 150 °C, 1000 hours, no bias 5 measurement memory check at 25 °C 100,000 Cycles 200 ppm/ 1024 byte/ 1000 cycle 15 15 15 5 6 7 Magnetic field, memory check X-rays, memory check UV light, memory check ISO IEC 10373 ISO IEC 10373 ISO IEC 10373 79,500 A/m 70 kV, 0.1 Grey 15 W.s/cm2, 30 minutes maximum 1/25 1/25 1/25 5/13 MICROMODULES Figure 1. Reel and Winding Direction 6/13 M ICROMODULES Figure 2. D10, D20, D22 Tape Join Specification 7/13 I 12 I 11 10 9 8 7 6 5 4 3 2 1 H H G G Figure 3. D15 Tape Join Specification F F E E D D 0.2/16 ( Sproket holes axis straightness) C C Copyright SGS-THOMSON Microelectronics. Unauthorized reproduction and communication is stricly proh B B NOTES: -Total thickness in splice area is 0.300 Typical -Reject hole and sproket holes are punched free in splice area -Assy reject holes (M) may be punched in splice area ( see (M) in POA for location ) -Joint is on contact side only GRAPHIC TITLE: SUPER 35 6 CONTACTS MICROMODULE: JOIN SCALE DATUM 06/1998 DRAWN BY: A DIMENSIONS ARE IN MILIMETERS Z.I. de Rousset B.P. 2 - 13106 ROUSSET CEDEX Tel. (33) 42.25.88.00 Fax (33) 42.53.22.88 7 6 5 4 3 A ROYER.G GRAPHICS REV. CONTROLED BY: * Measurements are subject to change without notice. 9 8 A 2 STEFFEN.F 1 12 11 10 MICROMODULES 8/13 M ICROMODULES Figure 4. D10 Micromodule Outline CONTACT SIDE 1 1 1 1 1 1 X 1 1 POTTING SIDE CROSS SECTION 9/13 O Y Figure 5. D15 Micromodule Outline DIE SIDE CROSS SECTION CONTACT SIDE 9.5 8.12 0.58 max 1 R0. 51.422 1.422 3 7 max 10.8 R1. 7.62 2.6min 0.16 2.54 2.2min 0.1 NOTE: - (P) is reject identification hole ø2.2 - (M) may be punched with (P): center positioning ±0.2 - Sproket holes may be with or without metalisation - Recommended punching contour for the customer: 8.32*11 - Minimal contact area according to ISO 7816-1 .5 4.75 )ø1 (M 5.2±0.2 Copyright SGS-THOMSON Microelectronics. Unauthorized reproduction and communication is stricly GRAPHIC TITLE: R1.4 POA FOR MICROMODULE D15 SCALE DATUM 3±0.2 8.815 12.8±0.2 23.015 27±0.2 31.83 35 )ø2.2 (P MICROMODULES none GENERAL TOLERANCE IS ±0.1 mm ALL DIMENSIONS ARE IN MILLIMETERS Measurements are subject to change without notice Z.I. de Rousset B.P. 2 - 13106 ROUSSET CEDEX Tel. (33) 42.25.88.00 Fax (33) 42.53.22.88 06/1998 DRAWN BY: ROYER.G PACKAGE CODE FU GRAPHICS REV. CONTROLED BY: A STEFFEN.F 10/13 M ICROMODULES Figure 6. D20 Micromodule Outline CONTACT SIDE 1 1 1 1 1 1 X 1 1 POTTING SIDE CROSS SECTION 11/13 O Y MICROMODULES Figure 7. D22 Micromodule Outline POTTING SIDE CROSS SECTION O CONTACT SIDE O 12/13 M ICROMODULES Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express writt en approval of STMicroelectronics. © 1999 STMicroelectronics - All Rights Reserved The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - U.S.A. http:// www.st.com 13/13