M41T56
Serial real-time clock (RTC) with 56 bytes NVRAM
Features
■
Counters for seconds, minutes, hours, day,
date, month, years, and century
■
32 KHz crystal oscillator integrating load
capacitance (12.5 pF) providing exceptional
oscillator stability and high crystal series
resistance operation
■
Serial interface supports I2C bus (100 kHz
protocol)
■
Ultra-low battery supply current of 450 nA
(typ at 3 V)
■
5 V ±10% supply voltage
■
Timekeeping down to 2.5 V
■
Automatic power-fail detect and switch circuitry
■
56 bytes of general purpose RAM
■
Software clock calibration to compensate
crystal deviation due to temperature
■
Automatic leap year compensation
■
Operating temperature of –40 °C to 85 °C
■
Available in an 8-lead, 150-mil, plastic SOIC
(SO8)
■
RoHS compliant
– Lead-free second level interconnect
December 2011
8
1
SO8
150-mil width
Doc ID 6104 Rev 9
1/27
www.st.com
1
Contents
M41T56
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
3
2-wire bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.1
Bus not busy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.2
Start data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.3
Stop data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1.4
Data valid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1.5
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3
Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4
Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1
Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2
Output driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3
Initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2/27
Doc ID 6104 Rev 9
M41T56
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Crystal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Power down/up mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SO8 – 8-pin plastic small outline, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 21
Carrier tape dimensions for SO8 package (150-mil body width) . . . . . . . . . . . . . . . . . . . . 22
Reel dimensions for 12 mm carrier tape - SO8 package (150-mil body width). . . . . . . . . . 23
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 6104 Rev 9
3/27
List of figures
M41T56
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
4/27
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
M41T56 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial bus data transfer sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Acknowledge sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bus timing requirements sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Slave address location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Alternative read mode sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Crystal accuracy across temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SO8 – 8-pin plastic small package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Carrier tape for SO8 package (150-mil body width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Reel schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Doc ID 6104 Rev 9
M41T56
1
Description
Description
The M41T56 is a low-power, serial real-time clock (RTC) with 56 bytes of NVRAM. A built-in
32,768 Hz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used
for the clock/calendar function and are configured in binary coded decimal (BCD) format.
Addresses and data are transferred serially via a two-line, bidirectional bus. The built-in
address register is incremented automatically after each WRITE or READ data byte.
The M41T56 clock has a built-in power sense circuit which detects power failures and
automatically switches to the battery supply during power failures. The energy needed to
sustain the RAM and clock operations can be supplied from a small lithium coin cell.
Typical data retention time is in excess of 10 years with a 50 mAh, 3 V lithium cell. The
M41T56 is supplied in an 8-lead plastic SOIC package.
Figure 1.
Logic diagram
VCC
VBAT
OSCO
OSCI
SCL
M41T56
SDA
FT/OUT
VSS
AI02304B
Doc ID 6104 Rev 9
5/27
Description
M41T56
Table 1.
Signal names
OSCI
Oscillator input
OCSO
Oscillator output
FT/OUT
Frequency test / output driver (open drain)
SDA
Serial data address input / output
SCL
Serial clock
VBAT
Battery supply voltage
VCC
Supply voltage
VSS
Ground
Figure 2.
8-pin SOIC connections
OSCI
OSCO
VBAT
VSS
M41T56
8
1
2
7
3
6
4
5
VCC
FT/OUT
SCL
SDA
AI02306B
Figure 3.
M41T56 block diagram
1 Hz
OSCI
OSCILLATOR
32.768 kHz
DIVIDER
SECONDS
MINUTES
OSCO
CENTURY/HOURS
FT/OUT
DATE
DAY
VCC
VSS
VBAT
SCL
MONTH
VOLTAGE
SENSE
and
SWITCH
CIRCUITRY
CONTROL
LOGIC
YEAR
CONTROL
RAM
(56 x 8)
SERIAL
BUS
INTERFACE
ADDRESS
REGISTER
SDA
AI02566
6/27
Doc ID 6104 Rev 9
M41T56
2
Operation
Operation
The M41T56 clock operates as a slave device on the serial bus. Access is obtained by
implementing a start condition followed by the correct slave address (D0h). The 64 bytes
contained in the device can then be accessed sequentially in the following order:
1.
Seconds register
2.
Minutes register
3.
Century/hours register
4.
Day register
5.
Date register
6.
Month register
7.
Years register
8.
Control register
9.
RAM
The clock continually monitors VCC for an out of tolerance condition. Should VCC fall below
VPFD, the device terminates an access in progress and resets the device address counter.
Inputs to the device will not be recognized at this time to prevent erroneous data from being
written to the device from an out of tolerance system. When VCC falls below VBAT, the device
automatically switches over to the battery and powers down into an ultra low current mode
of operation to conserve battery life. Upon power-up, the device switches from battery to
VCC at VBAT and recognizes inputs when VCC goes above VPFD volts.
2.1
2-wire bus characteristics
This bus is intended for communication between different ICs. It consists of two lines: one
bidirectional for data signals (SDA) and one for clock signals (SCL). Both the SDA and the
SCL lines must be connected to a positive supply voltage via a pull-up resistor.
The following protocol has been defined:
●
Data transfer may be initiated only when the bus is not busy.
●
During data transfer, the data line must remain stable whenever the clock line is high.
●
Changes in the data line while the clock line is high will be interpreted as control
signals.
Accordingly, the following bus conditions have been defined:
2.1.1
Bus not busy
Both data and clock lines remain high.
2.1.2
Start data transfer
A change in the state of the data line, from high to low, while the clock is high, defines the
START condition.
Doc ID 6104 Rev 9
7/27
Operation
2.1.3
M41T56
Stop data transfer
A change in the state of the data line, from low to high, while the clock is high, defines the
STOP condition.
2.1.4
Data valid
The state of the data line represents valid data when after a start condition, the data line is
stable for the duration of the high period of the clock signal. The data on the line may be
changed during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a start condition and terminated with a stop condition.
The number of data bytes transferred between the start and stop conditions is not limited.
The information is transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition, a device that gives out a message is called “transmitter,” the receiving device
that gets the message is called “receiver.” The device that controls the message is called
“master.” The devices that are controlled by the master are called “slaves.”
2.1.5
Acknowledge
Each byte of eight bits is followed by one acknowledge bit. This acknowledge bit is a low
level put on the bus by the receiver, whereas the master generates an extra acknowledge
related clock pulse.
A slave receiver which is addressed is obliged to generate an acknowledge after the
reception of each byte. Also, a master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges has to pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is a stable low during the high period of the
acknowledge related clock pulse. Of course, setup and hold times must be taken into
account. A master receiver must signal an end-of-data to the slave transmitter by not
generating an acknowledge on the last byte that has been clocked out of the slave. In this
case, the transmitter must leave the data line high to enable the master to generate the
STOP condition.
Figure 4.
Serial bus data transfer sequence
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
START
CONDITION
CHANGE OF
DATA ALLOWED
STOP
CONDITION
AI00587
8/27
Doc ID 6104 Rev 9
M41T56
Operation
Figure 5.
Acknowledge sequence
CLOCK PULSE FOR
ACKNOWLEDGEMENT
START
SCLK FROM
MASTER
1
DATA OUTPUT
BY TRANSMITTER
2
MSB
8
9
LSB
DATA OUTPUT
BY RECEIVER
AI00601
Figure 6.
Bus timing requirements sequence
SDA
tBUF
tHD:STA
tR
tHD:STA
tF
SCL
tHIGH
P
S
tLOW
tSU:DAT
tHD:DAT
tSU:STA
SR
tSU:STO
P
AI00589
Doc ID 6104 Rev 9
9/27
Operation
M41T56
Table 2.
AC characteristics
Parameter(1)
Symbol
Min
Max
Unit
0
100
kHz
fSCL
SCL clock frequency
tLOW
Clock low period
4.7
µs
tHIGH
Clock high period
4
µs
tR
SDA and SCL rise time
1
µs
tF
SDA and SCL fall time
300
ns
tHD:STA
START condition hold time
(after this period the first clock pulse is generated)
tSU:STA
tSU:DAT
tHD:DAT
(2)
tSU:STO
tBUF
4
µs
START condition setup time
(only relevant for a repeated start condition)
4.7
µs
Data setup time
250
ns
Data hold time
0
µs
STOP condition setup time
4.7
µs
Time the bus must be free before a new
transmission can start
4.7
µs
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
2. Transmitter must internally provide a hold time to bridge the undefined region (300 ns max.) of the falling
edge of SCL.
2.2
Read mode
In this mode, the master reads the M41T56 slave after setting the slave address (see
Figure 7 on page 11 and Figure 8 on page 11). Following the WRITE mode control bit
(R/W = 0) and the acknowledge bit, the word address An is written to the on-chip address
pointer. Next the START condition and slave address are repeated, followed by the READ
mode control bit (R/W = 1). At this point, the master transmitter becomes the master
receiver. The data byte which was addressed will be transmitted and the master receiver will
send an acknowledge bit to the slave transmitter. The address pointer is only incremented
on reception of an acknowledge bit. The M41T56 slave transmitter will now place the data
byte at address An + 1 on the bus. The master receiver reads and acknowledges the new
byte and the address pointer is incremented to An + 2. This cycle of reading consecutive
addresses will continue until the master receiver sends a STOP condition to the slave
transmitter.
An alternate READ mode may also be implemented, whereby the master reads the M41T56
slave without first writing to the (volatile) address pointer. The first address that is read is the
last one stored in the pointer, see Figure 9 on page 11.
10/27
Doc ID 6104 Rev 9
M41T56
Operation
Figure 7.
Slave address location
R/W
START
A
LSB
MSB
SLAVE ADDRESS
1
1
0
1
0
0
0
AI00602
R/W
SLAVE
ADDRESS
DATA n+1
ACK
DATA n
ACK
ACK
BUS ACTIVITY:
S
ACK
WORD
ADDRESS (n)
S
ACK
SDA LINE
R/W
BUS ACTIVITY:
MASTER
START
Read mode sequence
START
Figure 8.
STOP
SLAVE
ADDRESS
P
NO ACK
DATA n+X
SLAVE
ADDRESS
DATA n+X
ACK
BUS ACTIVITY:
DATA n+1
ACK
DATA n
P
NO ACK
R/W
S
ACK
SDA LINE
ACK
BUS ACTIVITY:
MASTER
STOP
Alternative read mode sequence
START
Figure 9.
AI00899
AI00895
Doc ID 6104 Rev 9
11/27
Operation
2.3
M41T56
Write mode
In this mode the master transmitter transmits to the M41T56 slave receiver. Bus protocol is
shown in Figure 10 on page 12. Following the START condition and slave address, a logic '0'
(R/W = 0) is placed on the bus and indicates to the addressed device that word address An
will follow and is to be written to the on-chip address pointer. The data word to be written to
the memory is strobed in next and the internal address pointer is incremented to the next
memory location within the RAM on the reception of an acknowledge clock. The M41T56
slave receiver will send an acknowledge clock to the master transmitter after it has received
the slave address and again after it has received the word address and each data byte (see
Figure 7 on page 11).
2.4
Data retention mode
With valid VCC applied, the M41T56 can be accessed as described above with READ or
WRITE cycles. Should the supply voltage decay, the M41T56 will automatically deselect,
write protecting itself when VCC falls between VPFD (max) and VPFD (min). This is
accomplished by internally inhibiting access to the clock registers and SRAM. When VCC
falls below the battery backup switchover voltage (VSO), power input is switched from the
VCC pin to the battery and the clock registers and SRAM are maintained from the attached
battery supply.
All outputs become high impedance. On power up, when VCC returns to a nominal value,
write protection continues for tREC.
For a further more detailed review of battery lifetime calculations, please see application
note AN1012.
STOP
DATA n+X
ACK
DATA n+1
ACK
BUS ACTIVITY:
DATA n
P
ACK
R/W
WORD
ADDRESS (n)
S
ACK
SDA LINE
ACK
BUS ACTIVITY:
MASTER
START
Figure 10. Write mode sequence
SLAVE
ADDRESS
AI00591
12/27
Doc ID 6104 Rev 9
M41T56
3
Clock operation
Clock operation
The eight byte clock register (see Table 3) is used to both set the clock and to read the date
and time from the clock, in a binary coded decimal format. Seconds, minutes, and hours are
contained within the first three registers. Bits D6 and D7 of clock register 2 (hours register)
contain the century enable bit (CEB) and the century bit (CB). Setting CEB to a '1' will cause
CB to toggle, either from '0' to '1' or from '1' to '0' at the turn of the century (depending upon
its initial state). If CEB is set to a '0,' CB will not toggle. Bits D0 through D2 of register 3
contain the day (day of week). Registers 4, 5, and 6 contain the date (day of month), month,
and years. The final register is the control register (this is described in the clock calibration
section). Bit D7 of register 0 contains the stop bit (ST). Setting this bit to a '1' will cause the
oscillator to stop.
If the device is expected to spend a significant amount of time on the shelf, the oscillator
may be stopped to reduce current drain. When reset to a '0' the oscillator restarts within one
second.
The seven clock registers may be read one byte at a time, or in a sequential block. The
control register (address location 7) may be accessed independently. Provision has been
made to assure that a clock update does not occur while any of the seven clock addresses
are being read. If a clock address is being read, an update of the clock registers will be
delayed by 250 ms to allow the READ to be completed before the update occurs. This will
prevent a transition of data during the READ.
Note:
This 250 ms delay affects only the clock register update and does not alter the actual clock
time.
Table 3.
Register map(1)
Data
Function/range
Address
D7
D6
D5
D4
D3
D2
D1
D0
BCD format
0
ST
10 Seconds
Seconds
Seconds
00-59
1
X
10 Minutes
Minutes
Minutes
00-59
2
CEB(2)
CB
3
X
X
4
X
X
5
X
X
6
7
10 hours
X
X
Hours
X
Day
10 date
X
10 M.
10 years
OUT
FT
S
Century/hours 0-1/00-23
Day
01-07
Date
Date
01-31
Month
Month
01-12
Years
Year
00-99
Calibration
Control
1. Keys:
S = Sign bit
FT = Frequency test bit
ST = Stop bit
OUT = Output level
X = Don't care
CEB = Century enable bit
CB = Century bit
2. When CEB is set to '1,' CB toggles from '0' to '1' or from '1' to '0' every 100 years (dependent upon the
initial value set). When CEB is set to '0,' CB does not toggle.
Doc ID 6104 Rev 9
13/27
Clock operation
3.1
M41T56
Clock calibration
The M41T56 is driven by a quartz-controlled oscillator with a nominal frequency of
32,768 Hz. The devices are tested not to exceed 35 ppm (parts per million) oscillator
frequency error at 25 °C, which equates to about ±1.53 minutes per month. With the
calibration bits properly set, the accuracy of each M41T56 improves to better than ±2 ppm
at 25 °C.
The oscillation rate of any crystal changes with temperature (see Figure 11 on page 15).
Most clock chips compensate for crystal frequency and temperature shift error with
cumbersome “trim” capacitors. The M41T56 design, however, employs periodic counter
correction. The calibration circuit adds or subtracts counts from the oscillator divider circuit
at the divide by 256 stage, as shown in Figure 11 on page 15. The number of times pulses
are blanked (subtracted, negative calibration) or split (added, positive calibration) depends
upon the value loaded into the five-bit calibration byte found in the control register. Adding
counts speeds the clock up, subtracting counts slows the clock down.
The calibration byte occupies the five lower order bits (D4-D0) in the control register (addr
7). This byte can be set to represent any value between 0 and 31 in binary form. Bit D5 is
the sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration
occurs within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have
one second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is
loaded into the register, only the first 2 minutes in the 64 minutes cycle will be modified; if a
binary 6 is loaded, the first 12 will be affected, and so on.
Therefore, each calibration step has the effect of adding 512 or subtracting 256 oscillator
cycles for every 125,829,120 actual oscillator cycles, that is +4.068 or –2.034 ppm of
adjustment per calibration step in the calibration register. Assuming that the oscillator is in
fact running at exactly 32,768Hz, each of the 31 increments in the calibration byte would
represent +10.7 or –5.35 seconds per month which corresponds to a total range of +5.5 or –
2.75 minutes per month.
Two methods are available for ascertaining how much calibration a given M41T56 may
require. The first involves simply setting the clock, letting it run for a month and comparing it
to a known accurate reference (like WWV broadcasts). While that may seem crude, it allows
the designer to give the end user the ability to calibrate his clock as his environment may
require, even after the final product is packaged in a non-user serviceable enclosure. All the
designer has to do is provide a simple utility that accessed the calibration byte.
The second approach is better suited to a manufacturing environment, and involves the use
of some test equipment. When the frequency test (FT) bit, the seventh-most significant bit in
the control register, is set to a '1,' and the oscillator is running at 32,768 Hz, the FT/OUT pin
of the device will toggle at 512 Hz. Any deviation from 512 Hz indicates the degree and
direction of oscillator frequency shift at the test temperature.
For example, a reading of 512.01024 Hz would indicate a +20 ppm oscillator frequency
error, requiring a –10(XX001010) to be loaded into the calibration byte for correction.
Note:
14/27
Setting or changing the calibration byte does not affect the frequency test output frequency.
Doc ID 6104 Rev 9
M41T56
Clock operation
Figure 11. Crystal accuracy across temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
ΔF = K x (T –T )2
O
F
–100
K = –0.036 ppm/°C2 ± 0.006 ppm/°C2
–120
TO = 25°C ± 5°C
–140
–160
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
Temperature °C
AI00999b
Figure 12. Clock calibration
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
AI00594B
3.2
Output driver pin
When the FT bit is not set, the FT/OUT pin becomes an output driver that reflects the
contents of D7 of the control register. In other words, when D6 of location 7 is a '0' and D7 of
location 7 is a '0' and then the FT/OUT pin will be driven low.
Note:
The FT/OUT pin is open drain which requires an external pull-up resistor.
3.3
Initial power-on defaults
Upon initial application of power to the device, the FT bit will be set to a '0' and the OUT bit
will be set to a '1.' All other register bits will initially power-on in a random state.
Doc ID 6104 Rev 9
15/27
Maximum ratings
4
M41T56
Maximum ratings
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4.
Absolute maximum ratings
Symbol
TA
TSTG
TSLD
(1)
Parameter
Value
Unit
Ambient operating temperature
–40 to 85
°C
Storage temperature (VCC off, oscillator off)
–55 to 125
°C
260
°C
Lead solder temperature for 10 seconds
VIO
Input or output voltages
–0.3 to 7
V
VCC
Supply voltage
–0.3 to 7
V
IO
Output current
20
mA
PD
Power dissipation
0.25
W
1. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260 °C. The time above
255 °C must not exceed 30 seconds.
Caution:
16/27
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Doc ID 6104 Rev 9
M41T56
5
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristics
tables are derived from tests performed under the measurement conditions listed in Table 5:
Operating and AC measurement conditions. Designers should check that the operating
conditions in their projects match the measurement conditions when using the quoted
parameters.
Table 5.
Operating and AC measurement conditions(1)
Parameter
Value
Unit
Supply voltage (VCC)
4.5 to 5.5
V
Ambient operating temperature (TA)
–40 to 85
°C
Load capacitance (CL)
100
pF
Input rise and fall times
≤5
ns
0 to 3
V
1.5
V
Input pulse voltages
Input and output timing ref. voltages
1. Output Hi-Z is defined as the point where data is no longer driven.
Figure 13. AC measurement I/O waveform
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI02568
Table 6.
Capacitance
Parameter(1)(2)
Symbol
CIN
COUT(3)
tLP
Max
Unit
Input capacitance (SCL)
7
pF
Output capacitance (SDA, FT/OUT)
10
pF
1
µs
Low-pass filter input time constant (SDA and SCL)
Min
0.25
1. Effective capacitance measured with power supply at 5V; sampled, not 100% tested.
2. At 25 °C, f = 1 MHz.
3. Outputs deselected.
Doc ID 6104 Rev 9
17/27
DC and AC parameters
Table 7.
Symbol
M41T56
DC characteristics
Test condition(1)
Parameter
Min
Typ
Max
Unit
0V ≤ VIN ≤ VCC
±1
µA
0V ≤ VOUT ≤ VCC
±1
µA
Switch frequency = 100 kHz
300
µA
ILI
Input leakage current
ILO
Output leakage current
ICC1
Supply current
ICC2
Supply current (standby)
VIL
Input low voltage
–0.3
1.5
V
VIH
Input high voltage
3
VCC + 0.8
V
VOL
Output low voltage
0.4
V
3
3.5
V
450
550
nA
VBAT(2)
Battery supply voltage
IBAT
Battery supply current
SCL, SDA = VCC – 0.3 V
100
µA
IOL = 5mA, VCC = 4.5 V
2.5
TA = 25 °C, VCC = 0 V,
oscillator ON, VBAT = 3 V
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
2. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply.
Table 8.
Crystal electrical characteristics
Parameter(1)(2)
Symbol
fO
Resonant frequency
RS
Series resistance
CL
Load capacitance
Min
Typ
Max
32.768
Unit
kHz
60
12.5
kΩ
pF
1. These values are externally supplied for the SO8 package. STMicroelectronics recommends the KDS DT38: 1TA/1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S: 1TJS125FH2A212, (SMD) quartz
crystal for industrial temperature operations. For contact information on this crystal type, see Section 8:
References on page 25.
2. Load capacitors are integrated within the M41T56. Circuit board layout considerations for the 32.768 kHz
crystal of minimum trace lengths and isolation from RF generating signals should be taken into account.
Figure 14. Power down/up mode AC waveforms
VCC
VPFD
VSO
SDA
SCL
tPD
tFB
tRB
tREC
IBAT
DATA RETENTION TIME
AI00595
18/27
Doc ID 6104 Rev 9
M41T56
DC and AC parameters
Table 9.
Power down/up mode AC characteristics
Parameter(1)
Symbol
tPD
SCL and SDA at VIH before power-down
tFB
Min
Max
Unit
0
ns
VPFD (min) to VSS VCC fall time
300
µs
tRB
VSS to VPFD (min) VCC rise time
100
µs
tREC
SCL and SDA at VIH after power-up
10
µs
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
Table 10.
Symbol
Power down/up trip points DC characteristics
Parameter(1)(2)
VPFD
Power-fail deselect voltage
VSO
Battery back-up switchover voltage
Min
Typ
Max
Unit
1.2 VBAT
1.25 VBAT
1.285 VBAT
V
VBAT
V
1. All voltages referenced to VSS.
2. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
Doc ID 6104 Rev 9
19/27
Package mechanical data
6
M41T56
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
20/27
Doc ID 6104 Rev 9
M41T56
Package mechanical data
Figure 15. SO8 – 8-pin plastic small package outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
GAUGE PLANE
D
k
8
E1
E
1
A1
L
L1
SO-A
1. Drawing is not to scale.
Table 11.
SO8 – 8-pin plastic small outline, package mechanical data
millimetres
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.75
Max
0.069
A1
0.10
A2
1.25
b
0.28
0.48
0.011
0.019
c
0.17
0.23
0.007
0.009
ccc
0.25
0.004
0.010
0.049
0.10
0.004
D
4.90
4.80
5.00
0.193
0.189
0.197
E
6.00
5.80
6.20
0.236
0.228
0.244
E1
3.90
3.80
4.00
0.154
0.150
0.157
e
1.27
–
–
0.050
–
–
h
0.25
0.50
0.010
0.020
k
0°
8°
0°
8°
L
0.40
1.27
0.016
0.050
L1
1.04
0.041
1. Drawing is not to scale.
Doc ID 6104 Rev 9
21/27
Package mechanical data
M41T56
Figure 16. Carrier tape for SO8 package (150-mil body width)
P0
E
P2
D
T
A0
F
TOP COVER
TAPE
W
B0
P1
CENTER LINES
OF CAVITY
K0
USER DIRECTION OF FEED
AM03073v1
Table 12.
Carrier tape dimensions for SO8 package (150-mil body width)
Package
W
D
SO8
12.00
±0.30
1.50
+0.10/
–0.00
22/27
E
P0
P2
F
1.75
4.00
2.00
5.50
±0.10 ±0.10 ±0.10 ±0.05
A0
B0
K0
P1
T
6.50
±0.10
5.30
±0.10
2.20
±0.10
8.00
±0.10
0.30
±0.05
Doc ID 6104 Rev 9
Unit
Bulk
Qty
mm 2500
M41T56
Package mechanical data
Figure 17. Reel schematic
T
40mm min.
Access hole
At slot location
B
D
C
N
A
G measured
Tape slot
In core for
Full radius
Tape start
2.5mm min.width
At hub
AM04928v1
Table 13.
Reel dimensions for 12 mm carrier tape - SO8 package (150-mil body width)
A
B
(max)
(min)
330 mm
(13-inch)
1.5 mm
Note:
C
13 mm
± 0.2 mm
D
N
(min)
(min)
20.2 mm
60 mm
G
12.4 mm
+ 2/–0 mm
T
(max)
18.4 mm
The dimensions given in Table 13 incorporate tolerances that cover all variations on critical
parameters.
Doc ID 6104 Rev 9
23/27
Part numbering
7
M41T56
Part numbering
Table 14.
Ordering information scheme
Example:
M41T
56
M
Device type
M41T
Supply voltage and write protect voltage
56 = VCC = 4.5 to 5.5 V
Package
M = SO8
Temperature range
6 = –40 °C to 85 °C
Shipping method
E = Lead-free package (ECOPACK®), tubes(1)
F = Lead-free package (ECOPACK®), tape & reel
1. Not recommended for new design. Contact local ST sales office for availability.
24/27
Doc ID 6104 Rev 9
6
E
M41T56
8
References
References
●
The crystal component supplier KDS as cited in Table 8: Crystal electrical
characteristics on page 18 can be contacted at http://www.kds.info/index_en.htm
Doc ID 6104 Rev 9
25/27
Revision history
M41T56
9
Revision history
Table 15.
Document revision history
Date
Revision
Changes
Mar-1999
1.0
First issue
23-Dec-1999
1.1
SOH28 package added
21-Mar-2000
1.2
Series resistance max value changed (Table 8)
30-Nov-2000
1.3
Added PSDIP8 package
25-Jan-2001
1.4
Corrected graphic, measurements of PSDIP8 (Figure 18, Table 14)
16-Feb-2001
2.0
Reformatted, table added (Table 16).
06-Apr-2001
2.1
Add temp./voltage information to characteristics (Table 7, Table 2); correct series
resistance (Table 8)
17-Jul-2001
2.2
Basic formatting changes
02-Aug-2002
2.3
Modify reflow time and temperature footnote (Table 4); modify crystal electrical
characteristics table footnotes (Table 8); removed PSDIP8 package
07-Nov-2002
2.4
Correct figure name (Features on page 1)
15-Jun-2004
3.0
Reformatted; add lead-free information; update characteristics (Figure 11; Table 4,
Table 14)
11-Sep-2006
4
Changed document to new template; amalgamated diagrams in Features on page 1;
amended footnotes in Table 3: Register map; updated Package mechanical data in
Section 6: Package mechanical data; small text changes for entire document, removed
lead packages from Table 14, ECOPACK compliant
09-Oct-2006
5
Updated package mechanical data in Figure 15: SO8 – 8-pin plastic small package
outline.
10-Apr-2007
6
Updated package information references that only SO8 available (cover page, Section 1,
Section 4, Table 4, Table 8, and Table 14).
06-Nov-2007
7
Added lead-free second level interconnect information to cover page and Section 6:
Package mechanical data; updated Table 4, footnote 1 in Table 8; addition of Section 8:
References.
13-Dec-2007
8
Updated cover page and Section 8: References.
9
Updated footnote 1 of Table 4: Absolute maximum ratings; updated ECOPACK® text in
Section 6: Package mechanical data; added footnote 1 to Table 14: Ordering information
scheme; added Figure 16, 17, Table 12, 13; updated title; minor textual updates.
06-Dec-2011
26/27
Doc ID 6104 Rev 9
M41T56
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 6104 Rev 9
27/27
工商网监
湘ICP备2023018690号
