M41T94
Serial real-time clock with 44 bytes NVRAM and reset
Datasheet - production data
SO16 (MQ)
Choice of power-fail deselect voltages
(VCC = 2.7 to 5.5 V):
– THS = VSS; 2.55 V VPFD 2.70 V
– THS = VCC; 4.20 V VPFD 4.50 V
SNAPHAT® (SH)
battery & crystal
28-lead SOIC package provides direct
connection for a SNAPHAT® top which
contains the battery and crystal
16
1
Packaging includes a 28-lead SOIC and
SNAPHAT® top (to be ordered separately) or
16-lead SOIC
RoHS compliant
– Lead-free second level interconnect
28
1
SOH28 (MH)
Features
Counters for tenths/hundredths of seconds,
seconds, minutes, hours, day, date, month,
year, and century
32 KHz crystal oscillator integrating load
capacitance (12.5 pF) providing exceptional
oscillator stability and high crystal series
resistance operation
Serial peripheral interface (2 MHz SPI)
Ultralow battery supply current of 500 nA (max)
2.7 to 5.5 V operating voltage
2.5 to 5.5 V oscillator operating voltage
Battery low flag
Automatic switchover and deselect circuitry
44 bytes of general purpose RAM
Programmable alarm and interrupt function
(valid even during battery backup mode)
Accurate programmable watchdog timer (from
62.5 ms to 128 s)
Microprocessor power-on reset
December 2014
This is information on a product in full production.
DocID007564 Rev 7
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www.st.com
Contents
M41T94
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
2.1
Serial data output (SDO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2
Serial data input (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3
Serial clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4
Chip enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1
SPI bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2
Read and write cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3
Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Clock operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1
Power-down time-stamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2
Clock registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3
Setting alarm clock registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.5
Square wave output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.6
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.7
Reset inputs (RSTIN1 & RSTIN2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.8
Calibrating the clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.9
Century bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.10
Output driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.11
Battery low warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.12
tREC bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.13
Initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2/39
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M41T94
Contents
8
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9
Environmental information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
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List of tables
M41T94
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
4/39
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Clock register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Alarm repeat mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Square wave output frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Reset AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
tREC definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Default values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Crystal electrical characteristics (externally supplied) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
SO16 – 16-lead plastic small outline package mechanical data. . . . . . . . . . . . . . . . . . . . . 32
SOH28 – 28-lead plastic small outline, battery SNAPHAT®, package mechanical data . . 33
SH – 4-pin SNAPHAT® housing for 48 mAh battery & crystal, package mechanical data . 34
SH – 4-pin SNAPHAT® housing for 120 mAh battery & crystal, package mech. data . . . . 35
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
SNAPHAT® battery table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
DocID007564 Rev 7
M41T94
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
16-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
28-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hardware hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data and clock timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Input timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Output timing requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write mode sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Alarm interrupt reset waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Backup mode alarm waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
RSTIN1 and RSTIN2 timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Crystal accuracy across temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Calibration waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
AC testing input/output waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
SO16 – 16-lead plastic small outline package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
SOH28 – 28-lead plastic small outline, battery SNAPHAT®, package outline . . . . . . . . . . 33
SH – 4-pin SNAPHAT® housing for 48 mAh battery & crystal, package outline. . . . . . . . . 34
SH – 4-pin SNAPHAT® housing for 120 mAh battery & crystal, package outline. . . . . . . . 35
Recycling symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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Description
1
M41T94
Description
The M41T94 is a serial real-time clock with 44 bytes of NVRAM and a RESET output. A
built-in 32,768 Hz oscillator (external crystal controlled) and 8 bytes of the SRAM (see
Table 4 on page 18) are used for the clock/calendar function and are configured in binary
coded decimal (BCD) format.
An additional 12 bytes of RAM provide status/control of alarm, watchdog and square wave
functions. Addresses and data are transferred serially via a serial SPI interface. The built-in
address register is incremented automatically after each WRITE or READ data byte. The
M41T94 has a built-in power sense circuit which detects power failures and automatically
switches to the battery supply when a power failure occurs. The energy needed to sustain
the SRAM and clock operations can be supplied by a small lithium button-cell supply when a
power failure occurs. Functions available to the user include a non-volatile, time-of-day
clock/calendar, alarm interrupts, watchdog timer and programmable square wave output.
Other features include a power-on reset as well as two additional debounced inputs
(RSTIN1 and RSTIN2) which can also generate an output reset (RST). The eight clock
address locations contain the century, year, month, date, day, hour, minute, second and
tenths/hundredths of a second in 24-hour BCD format. Corrections for 28, 29 (leap year valid until year 2100), 30 and 31 day months are made automatically. The ninth clock
address location controls user access to the clock information and also stores the clock
software calibration setting.
The M41T94 is supplied in either a 16-lead plastic SOIC (requiring user supplied crystal and
battery) or a 28-lead SOIC SNAPHAT® package (which integrates both crystal and battery
in a single SNAPHAT top). The 28-pin, 330 mil SOIC provides sockets with gold plated
contacts at both ends for direct connection to a separate SNAPHAT housing containing the
battery and crystal. The unique design allows the SNAPHAT battery/crystal package to be
mounted on top of the SOIC package after the completion of the surface mount process.
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal
damage due to the high temperatures required for device surface-mounting. The SNAPHAT
housing is also keyed to prevent reverse insertion.
The SOIC and battery/crystal packages are shipped separately in plastic anti-static tubes or
in tape & reel form. For the 28-lead SOIC, the battery/crystal package (e.g., SNAPHAT) part
number is “M4TXX-BR12SH” (see Table 21 on page 36).
Caution:
6/39
Do not place the SNAPHAT battery/crystal top in conductive foam, as this will drain the
lithium button-cell battery.
DocID007564 Rev 7
M41T94
Description
Figure 1. Logic diagram
VCC VBAT
XI
XO
(1)
(1)
(1)
SCL
RST
SDI
IRQ/FT/OUT
M41T94
E
SQW
SDO
RSTIN1
RSTIN2
WDI
THS
VSS
AI03683
1. For SO16 package only.
Figure 2. 16-pin SOIC connections
XI
XO
RST
WDI
RSTIN1
RSTIN2
VBAT
VSS
1
2
3
4
5
6
7
8
M41T94
16
15
14
13
12
11
10
9
VCC
E
IRQ/FT/OUT
THS
SDI
SQW
SCL
SDO
AI03684
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39
Description
M41T94
Table 1. Signal names
E
Chip enable
IRQ/FT/OUT
Interrupt/frequency test/out
output (open drain)
RST
Reset output (open drain)
RSTIN1
Reset 1 input
RSTIN2
Reset 2 input
SCL
Serial clock input
SDI
Serial data input
SDO
Serial data output
SQW
Square wave output
THS
Threshold select pin
WDI
Watchdog input
XI (1)
Oscillator input
XO
(1)
VBAT
(1)
Oscillator output
Battery supply voltage
VCC
Supply voltage
VSS
Ground
1. For SO16 package only.
Figure 3. 28-pin SOIC connections
SQW
NC
NC
NC
NC
NC
NC
WDI
RSTIN1
RSTIN2
NC
NC
NC
VSS
1
2
3
4
5
6
7
M41T94
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AI03685
8/39
DocID007564 Rev 7
VCC
E
IRQ/FT/OUT
NC
NC
THS
NC
NC
SCL
NC
RST
SDI
SDO
NC
M41T94
Description
Figure 4. Block diagram
REAL TIME CLOCK
CALENDAR
E
44 BYTES
USER RAM
SDO
SPI
INTERFACE
SDI
(1)
IRQ/FT/OUT
WDF
WATCHDOG
32KHz
OSCILLATOR
Crystal
AF
RTC w/ALARM
& CALIBRATION
SCL
SQUARE WAVE
SQW
WDI
VCC
VBAT
VBL= 2.5V
COMPARE
VSO = 2.5V
COMPARE
VPFD = 4.4V
COMPARE
BL
POR
(2.65V if THS = VSS)
RSTIN1
RST(1)
RSTIN2
AI04785
1. Open drain output
Figure 5. Hardware hookup
SPI Interface with
(CPOL, CPHA)(1) =
('0','0') or ('1','1')
Master
(ST6, ST7, ST9,
ST10, Others)
D
Q
C
C
Q
D
C
M41T94
CS3
CS2
CS1
E
Q
D
C
XXXXX
E
Q
D
XXXXX
E
AI03686
1. CPOL (clock polarity) and CPHA (clock phase) are bits that may be set in the SPI control register of the MCU.
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39
Description
M41T94
Table 2. Function table
Mode
E
SCL
SDI
SDO
Disable reset
H
Input disabled
Input disabled
High Z
WRITE
L
Data bit latch
High Z
X
Next data bit shift (1)
AI04630
READ
L
AI04631
1. SDO remains at High Z until eight bits of data are ready to be shifted out during a READ.
Figure 6. Data and clock timing
CPOL
CPHA
0
0
C
1
1
C
SDI
MSB
LSB
SDO
MSB
LSB
AI04632
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M41T94
Signal description
2
Signal description
2.1
Serial data output (SDO)
The output pin is used to transfer data serially out of the memory. Data is shifted out on the
falling edge of the serial clock.
2.2
Serial data input (SDI)
The input pin is used to transfer data serially into the device. Instructions, addresses, and
the data to be written, are each received this way. Input is latched on the rising edge of the
serial clock.
2.3
Serial clock (SCL)
The serial clock provides the timing for the serial interface (as shown in Figure 7 on page 13
and Figure 8 on page 14). The W/R bit, addresses, or data are latched, from the input pin,
on the rising edge of the clock input. The output data on the SDO pin changes state after the
falling edge of the clock input.
The M41T94 can be driven by a microcontroller with its SPI peripheral running in either of
the two following modes:
(CPOL, CPHA) = ('0', '0') or
(CPOL, CPHA) = ('1', '1').
For these two modes, input data (SDI) is latched in by the low-to-high transition of clock
SCL, and output data (SDO) is shifted out on the high-to-low transition of SCL (see Table 2
on page 10 and Figure 6 on page 10).
2.4
Chip enable (E)
When E is high, the memory device is deselected, and the SDO output pin is held in its high
impedance state. After power-on, a high-to-low transition on E is required prior to the start of
any operation.
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39
Operation
3
M41T94
Operation
The M41T94 clock operates as a slave device on the SPI serial bus. Each memory device is
accessed by a simple serial interface that is SPI bus compatible. The bus signals are SCL,
SDI and SDO (see Table 1 on page 8 and Figure 5 on page 9). The device is selected when
the chip enable input (E) is held low. All instructions, addresses and data are shifted serially
in and out of the chip. The most significant bit is presented first, with the data input (SDI)
sampled on the first rising edge of the clock (SCL) after the chip enable (E) goes low. The 64
bytes contained in the device can then be accessed sequentially in the following order:
1st byte: tenths/hundredths of a second register
2nd byte: seconds register
3rd byte: minutes register
4th byte: century/hours register
5th byte: day register
6th byte: date register
7th byte: month register
8th byte: year register
9th byte: control register
10th byte: watchdog register
11th - 16th bytes: Alarm registers
17th - 19th bytes: reserved
20th byte: square wave register
21st - 64th bytes: user RAM
The M41T94 clock continually monitors VCC for an out-of tolerance condition. Should VCC
fall below VPFD, the device terminates an access in progress and resets the device address
counter. Inputs to the device will not be recognized at this time to prevent erroneous data
from being written to the device from a an out-of-tolerance system. When VCC falls below
VSO, the device automatically switches over to the battery and powers down into an ultra
low current mode of operation to conserve battery life. As system power returns and VCC
rises above VSO, the battery is disconnected, and the power supply is switched to external
VCC.
Write protection continues until VCC reaches VPFD (min) plus tREC (min). For more
information on battery storage life refer to application note AN1012.
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M41T94
3.1
Operation
SPI bus characteristics
The serial peripheral interface (SPI) bus is intended for synchronous communication
between different ICs. It consists of four signal lines: serial data input (SDI), serial data
output (SDO), serial clock (SCL) and a chip enable (E).
By definition a device that gives out a message is called “transmitter,” the receiving device
that gets the message is called “receiver.” The device that controls the message is called
“master.” The devices that are controlled by the master are called “slaves.”
The E input is used to initiate and terminate a data transfer. The SCL input is used to
synchronize data transfer between the master (micro) and the slave (M41T94) devices.
The SCL input, which is generated by the microcontroller, is active only during address and
data transfer to any device on the SPI bus (see Figure 5 on page 9).
The M41T94 can be driven by a microcontroller with its SPI peripheral running in either of
the two following modes:
(CPOL, CPHA) = ('0', '0') or
(CPOL, CPHA) = ('1', '1').
For these two modes, input data (SDI) is latched in by the low-to-high transition of clock
SCL, and output data (SDO) is shifted out on the high-to-low transition of SCL (see Table 2
on page 10 and Figure 6 on page 10).
There is one clock for each bit transferred. Address and data bits are transferred in groups
of eight bits. Due to memory size the second most significant address bit is a Don’t Care
(address bit 6).
Figure 7. Input timing requirements
tEHEL
E
tELCH
tCHEH
tEHCH
SCL
tDVCH
tCHCL
tCHDX
SDI
SDO
tCLCH
MSB IN
LSB IN
HIGH IMPEDANCE
tDLDH
tDHDL
AI04633
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Operation
M41T94
Figure 8. Output timing requirements
E
tCH
SCL
tCLQV
tCL
tEHQZ
tCLQX
LSB OUT
MSB OUT
SDO
tQLQH
tQHQL
SDI
ADDR. LSB IN
AI04634
Table 3. AC characteristics
Parameter(1)
Symbol
Min
Max
Unit
2
MHz
fSCL
Serial clock input frequency
DC
tCH(2)
Clock high
200
tCHCL(3)
Clock transition (fall time)
ns
1
μs
tCHDX
Serial clock input high to input data transition
50
ns
tCHEH
Serial clock input high to chip enable high
200
ns
tCL(2)
Clock low
200
ns
tCLCH(3)
Clock transition (rise time)
tCLQV
Serial clock input low to output valid
tCLQX
Serial clock input low to output data transition
1
μs
150
ns
0
ns
tDHDL(3)
Input data transition (fall time)
1
μs
tDLDH(3)
Input data transition (rise time)
1
μs
tDVCH
Input data to serial clock input high
40
ns
tEHCH
Chip enable high to serial clock input high
200
ns
tEHEL
Chip enable high to chip enable low
200
ns
tEHQZ(3)
tELCH
Chip enable high to output high-z
Chip enable low to serial clock input high
250
200
ns
ns
tQHQL(3)
Output data transition (fall time)
100
ns
tQLQH(3)
Output data transition (rise time)
100
ns
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.7 to 5.5 V (except where noted).
2. tCH + tCL 1/fSCL
3. Value guaranteed by design, not 100% tested in production.
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M41T94
3.2
Operation
Read and write cycles
Address and data are shifted MSB first into the serial data input (SDI) and out of the serial
data output (SDO). Any data transfer considers the first bit to define whether a READ or
WRITE will occur. This is followed by seven bits defining the address to be read or written.
Data is transferred out of the SDO for a READ operation and into the SDI for a WRITE
operation. The address is always the second through the eighth bit written after the Enable
(E) pin goes low. If the first bit is a '1,' one or more WRITE cycles will occur. If the first bit is
a '0,' one or more READ cycles will occur (see Figure Figure 9 on page 16 and Figure 10 on
page 16).
Data transfers can occur one byte at a time or in multiple byte burst mode, during which the
address pointer will be automatically incremented. For a single byte transfer, one byte is
read or written and then E is driven high. For a multiple byte transfer all that is required is
that E continue to remain low. Under this condition, the address pointer will continue to
increment as stated previously. Incrementing will continue until the device is deselected by
taking E high. The address will wrap to 00h after incrementing to 3Fh.
The system-to-user transfer of clock data will be halted whenever the address being read is
a clock address (00h to 07h). Although the clock continues to maintain the correct time, this
will prevent updates of time and date during either a READ or WRITE of these address
locations by the user. The update will resume either due to a deselect condition or when the
pointer increments to an non-clock or RAM address (08h to 3Fh).
Note:
This is true both in READ and WRITE mode.
3.3
Data retention mode
With valid VCC applied, the M41T94 can be accessed as described above with READ or
WRITE cycles. Should the supply voltage decay, the M41T94 will automatically deselect,
write protecting itself when VCC falls between VPFD (max) and VPFD (min) (see Figure 17 on
page 30). At this time, the reset pin (RST) is driven active and will remain active until VCC
returns to nominal levels. When VCC falls below the switchover voltage (VSO), power input is
switched from the VCC pin to the SNAPHAT battery (or external battery for SO16) at this
time, and the clock registers are maintained from the attached battery supply. All outputs
become high impedance. On power-up, when VCC returns to a nominal value, write
protection continues for tREC by internally inhibiting E. The RST signal also remains active
during this time (see Figure 17 on page 30). Before the next active cycle, chip enable should
be taken high for at least tEHEL, then low.
For a further more detailed review of battery lifetime calculations, please see application
note AN1012.
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Operation
M41T94
Figure 9. Read mode sequence
E
0
3
2
1
5
4
7
6
9
8
12 13 14 15 16 17
22
SCL
7 BIT ADDRESS
W/R BIT
SDI
7
6
5
4
3
2
1
0
MSB
SDO
DATA OUT
(BYTE 1)
7
HIGH IMPEDANCE
6
5
4
3
2
DATA OUT
(BYTE 2)
1
0
7
6
5
4
3
2
1
0
MSB
MSB
AI04635
Figure 10. Write mode sequence
E
0
1
3
2
4
5
6
7
8
9
15
10
SCL
SDI
DATA BYTE
7 BIT ADDR
W/R BIT
7
MSB
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
MSB
SDO
HIGH IMPEDANCE
AI04636
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M41T94
4
Clock operations
Clock operations
The eight byte clock register (see Table 4 on page 18) is used to both set the clock and to
read the date and time from the clock, in a binary coded decimal format. Tenths/hundredths
of seconds, seconds, minutes, and hours are contained within the first four registers. Bits D6
and D7 of clock register 03h (century/hours register) contain the CENTURY ENABLE bit
(CEB) and the CENTURY bit (CB). Setting CEB to a '1' will cause CB to toggle, either from
'0' to '1' or from '1' to '0' at the turn of the century (depending upon its initial state). If CEB is
set to a '0,' CB will not toggle. Bits D0 through D2 of register 04h contain the day (day of
week). Registers 05h, 06h, and 07h contain the date (day of month), month and years. The
ninth clock register is the control register (this is described in the clock calibration section).
Bit D7 of register 01h contains the STOP bit (ST). Setting this bit to a '1' will cause the
oscillator to stop. If the device is expected to spend a significant amount of time on the shelf,
the oscillator may be stopped to reduce current drain. When reset to a '0' the oscillator
restarts within one second.
The eight clock registers may be read one byte at a time, or in a sequential block. The
control register (address location 08h) may be accessed independently. Provision has been
made to assure that a clock update does not occur while any of the eight clock addresses
are being read. If a clock address is being read, an update of the clock registers will be
halted. This will prevent a transition of data during the READ.
4.1
Power-down time-stamp
When a power failure occurs, the halt update bit (HT) will automatically be set to a '1.' This
will prevent the clock from updating the clock registers, and will allow the user to read the
exact time of the power-down event. Resetting the HT bit to a '0' will allow the clock to
update the clock registers with the current time. For more information, see application note
AN1572.
4.2
Clock registers
The M41T94 offers 20 internal registers which contain clock, alarm, watchdog, flag, square
wave and control data (see Table 4 on page 18). These registers are memory locations
which contain external (user accessible) and internal copies of the data (usually referred to
as BiPORT™ cells). The external copies are independent of internal functions except that
they are updated periodically by the simultaneous transfer of the incremented internal copy.
The internal divider (or clock) chain will be reset upon the completion of a WRITE to any
clock address.
The system-to-user transfer of clock data will be halted whenever the clock addresses (00h
to 07h) are being written. The update will resume either due to a deselect condition or when
the pointer increments to a non-clock or RAM address.
Clock and alarm registers store data in BCD. Control, watchdog and square wave registers
store data in binary format.
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Clock operations
M41T94
Table 4. Clock register map(1)
Addr
Function/range
D7
00h
D6
D5
D4
D3
0.1 seconds
D2
D0
BCD format
0.01 seconds
Seconds
00-99
01h
ST
10 seconds
Seconds
Seconds
00-59
02h
0
10 minutes
Minutes
Minutes
00-59
03h
CEB
CB
04h
TR
0
05h
0
0
06h
0
0
08h
OUT
FT
09h
WDS
BMB4 BMB3
BMB2 BMB1 BMB0
0Ah
AFE
SQWE
Al 10M
0Bh
RPT4 RPT5
0Ch
RPT3
0Dh
RPT2
0Eh
RPT1
0Fh
WDF
AF
0
BL
0
0
0
0
Flags
10h
0
0
0
0
0
0
0
0
Reserved
11h
0
0
0
0
0
0
0
0
Reserved
12h
0
0
0
0
0
0
0
0
Reserved
13h
RS3
RS2
RS1
RS0
0
0
0
0
SQW
07h
10 Hours
0
0
Hours (24 hour format)
0
10 date
0
Day
01-7
Date: day of month
Date
01-31
Month
Month
01-12
Year
00-99
10M
10 Years
Year
S
Calibration
Control
RB1
RB0
Watchdog
Alarm month
Al month
01-12
AI 10 date
Alarm date
Al date
01-31
AI 10 hour
Alarm hour
Al hour
00-23
Alarm 10 minutes
Alarm minutes
Al min
00-59
Alarm 10 seconds
Alarm seconds
Al sec
00-59
HT
ABE
Century/hours 0-1/00-23
Day of week
1. Keys:
S = Sign bit
FT = Frequency test bit
ST = Stop bit
0 = Must be set to zero
BL = Battery low flag (read only)
BMB0-BMB4 = Watchdog multiplier bits
CEB = Century enable bit
CB = Century bit
OUT = Output level
AFE = Alarm flag enable flag
RB0-RB1 = Watchdog resolution bits
WDS = Watchdog steering bit
ABE = Alarm in battery back-up mode enable bit
RPT1-RPT5 = Alarm repeat mode bits
WDF = Watchdog flag (read only)
WDF = Watchdog flag (read only)
AF = Alarm flag (read only)
SQWE = Square wave enable
RS0-RS3 = SQW frequency
HT = Halt update bit
TR = tREC bit
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M41T94
4.3
Clock operations
Setting alarm clock registers
Address locations 0Ah-0Eh contain the alarm settings. The alarm can be configured to go
off at a prescribed time on a specific month, date, hour, minute, or second, or repeat every
year, month, day, hour, minute, or second. It can also be programmed to go off while the
M41T94 is in the battery backup to serve as a system wake-up call.
Bits RPT5-RPT1 put the alarm in the repeat mode of operation. Table 5 on page 19 shows
the possible configurations. Codes not listed in the table default to the once per second
mode to quickly alert the user of an incorrect alarm setting.
When the clock information matches the alarm clock settings based on the match criteria
defined by RPT5-RPT1, the AF (alarm flag) is set. If AFE (alarm flag enable) is also set, the
alarm condition activates the IRQ/FT/OUT pin.
Note:
If the address pointer is allowed to increment to the flag register address, an alarm condition
will not cause the interrupt/flag to occur until the address pointer is moved to a different
address. It should also be noted that if the last address written is the “Alarm Seconds,” the
address pointer will increment to the flag address, causing this situation to occur.
To disable the alarm, write '0' to the alarm date register and to RPT1–5. The IRQ/FT/OUT
output is cleared by a READ to the flags register. This READ of the flags register will also
reset the alarm flag (D6; register 0Fh). See Figure 11 on page 19.
The IRQ/FT/OUT pin can also be activated in the battery backup mode. The IRQ/FT/OUT
will go low if an alarm occurs and both ABE (alarm in battery backup mode enable) and AFE
are set. The ABE and AFE bits are reset during power-up, therefore an alarm generated
during power-up will only set AF. The user can read the flag register at system boot-up to
determine if an alarm was generated while the M41T94 was in the deselect mode during
power-up. Figure 12 on page 20 illustrates the backup mode alarm timing.
Table 5. Alarm repeat mode
RPT5
RPT4
RPT3
RPT2
RPT1
Alarm setting
1
1
1
1
1
Once per second
1
1
1
1
0
Once per minute
1
1
1
0
0
Once per hour
1
1
0
0
0
Once per day
1
0
0
0
0
Once per month
0
0
0
0
0
Once per year
Figure 11. Alarm interrupt reset waveforms
0Eh
0Fh
10h
ACTIVE FLAG
HIGH-Z
IRQ/FT/OUT
AI03664
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Clock operations
M41T94
Figure 12. Backup mode alarm waveforms
VCC
VPFD
VSO
tREC
ABE, AFE Bits in Interrupt Register
AF bit in Flags Register
IRQ/FT/OUT
HIGH-Z
HIGH-Z
AI03920
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M41T94
4.4
Clock operations
Watchdog timer
The watchdog timer can be used to detect an out-of-control microprocessor. The user
programs the watchdog timer by setting the desired amount of time-out into the Watchdog
register, address 09h. bits BMB4-BMB0 store a binary multiplier and the two lower order bits
RB1-RB0 select the resolution, where 00 = 1/16 second, 01 = 1/4 second, 10 = 1 second,
and 11 = 4 seconds. The amount of time-out is then determined to be the multiplication of
the five-bit multiplier value with the resolution. (For example: writing 00001110 in the
Watchdog register = 3*1 or 3 seconds).
Note:
Accuracy of timer is within ± the selected resolution.
If the processor does not reset the timer within the specified period, the M41T94 sets the
WDF (watchdog flag) and generates a watchdog interrupt or a microprocessor reset. WDF
is reset by reading the flags register (0Fh).
The most significant bit of the watchdog register is the watchdog steering bit (WDS). When
set to a '0,' the watchdog will activate the IRQ/FT/OUT pin when timed-out. When WDS is
set to a '1,' the watchdog will output a negative pulse on the RST pin for tREC. The watchdog
register and the AFE, ABE, SQWE, and FT bits will reset to a '0' at the end of a watchdog
time-out when the WDS bit is set to a '1.'
The watchdog timer can be reset by two methods:
1. a transition (high-to-low or low-to-high) can be applied to the watchdog input pin (WDI),
or
2. the microprocessor can perform a WRITE of the watchdog register.
The time-out period then starts over. The WDI pin should be tied to VSS if not used. In order
to perform a software reset of the watchdog timer, the original time-out period can be written
into the watchdog register, effectively restarting the count-down cycle.
Should the watchdog timer time-out, and the WDS bit is programmed to output an interrupt,
a value of 00h needs to be written to the watchdog register in order to clear the IRQ/FT/OUT
pin. This will also disable the watchdog function until it is again programmed correctly. A
READ of the flags register will reset the watchdog flag (bit D7; register 0Fh).
The watchdog function is automatically disabled upon power-up and the watchdog register
is cleared. If the watchdog function is set to output to the IRQ/FT/OUT pin and the frequency
test (FT) function is activated, the watchdog function prevails and the frequency test
function is denied.
4.5
Square wave output
The M41T94 offers the user a programmable square wave function which is output on the
SQW pin. RS3-RS0 bits located in 13h establish the square wave output frequency. These
frequencies are listed in Table Table 6 on page 22. Once the selection of the SQW
frequency has been completed, the SQW pin can be turned on and off under software
control with the square wave enable bit (SQWE) located in register 0Ah.
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Clock operations
M41T94
Table 6. Square wave output frequency
Square wave bits
4.6
Square wave
RS3
RS2
RS1
RS0
Frequency
Units
0
0
0
0
None
–
0
0
0
1
32.768
kHz
0
0
1
0
8.192
kHz
0
0
1
1
4.096
kHz
0
1
0
0
2.048
kHz
0
1
0
1
1.024
kHz
0
1
1
0
512
Hz
0
1
1
1
256
Hz
1
0
0
0
128
Hz
1
0
0
1
64
Hz
1
0
1
0
32
Hz
1
0
1
1
16
Hz
1
1
0
0
8
Hz
1
1
0
1
4
Hz
1
1
1
0
2
Hz
1
1
1
1
1
Hz
Power-on reset
The M41T94 continuously monitors VCC. When VCC falls to the power fail detect trip point,
the RST pulls low (open drain) and remains low on power-up for tREC after VCC passes
VPFD (max). The RST pin is an open drain output and an appropriate pull-up resistor should
be chosen to control rise time.
4.7
Reset inputs (RSTIN1 & RSTIN2)
The M41T94 provides two independent inputs which can generate an output reset. The
duration and function of these resets is identical to a reset generated by a power cycle.
Table 7 on page 23 and Figure 13 on page 23 illustrate the AC reset characteristics of this
function. Pulses shorter than tRLRH1 and tRLRH2 will not generate a reset condition. RSTIN1
and RSTIN2 are each internally pulled up to VCC through a 100 k resistor.
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M41T94
Clock operations
Figure 13. RSTIN1 and RSTIN2 timing waveforms
RSTIN1
tRLRH1
RSTIN2
tRLRH2
RST
(1)
tR1HRH
tR2HRH
AI03665
Table 7. Reset AC characteristics(1)
Symbol
Parameter
Min
Max
Unit
tRLRH1(2)
RSTIN1 low to RSTIN1 high
200
ns
tRLRH2(3)
RSTIN2 low to RSTIN2 high
100
ms
tR1HRH(4)
RSTIN1 high to RST high
40
200
ms
tR2HRH(4)
RSTIN2 high to RST high
40
200
ms
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.7 to 5.5 V (except where noted).
2. Pulse width less than 50 ns will result in no RESET (for noise immunity).
3. Pulse width less than 20 ms will result in no RESET (for noise immunity).
4. Programmable (see Table on page 26).
4.8
Calibrating the clock
The M41T94 is driven by a quartz-controlled oscillator with a nominal frequency of
32,768 Hz. Uncalibrated clock accuracy will not exceed ±35 ppm (parts per million) oscillator
frequency error at 25°C, which equates to about ±1.53 minutes per month. When the
Calibration circuit is properly employed, accuracy improves to better than ±2 ppm at 25°C.
The oscillation rate of crystals changes with temperature (see Figure 14 on page 24).
Therefore, the M41T94 design employs periodic counter correction. The calibration circuit
adds or subtracts counts from the oscillator divider circuit at the divide by 256 stage, as
shown in Figure 15 on page 25. The number of times pulses are blanked (subtracted,
negative calibration) or split (added, positive calibration) depends upon the value loaded
into the five calibration bits found in the control register. Adding counts speeds the clock up,
subtracting counts slows the clock down.
The calibration bits occupy the five lower order bits (D4-D0) in the control register (8h).
These bits can be set to represent any value between 0 and 31 in binary form. Bit D5 is a
sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration occurs
within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have one
second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is
loaded into the register, only the first 2 minutes in the 64 minute cycle will be modified; if a
binary 6 is loaded, the first 12 will be affected, and so on.
Therefore, each calibration step has the effect of adding 512 or subtracting 256 oscillator
cycles for every 125,829,120 actual oscillator cycles, that is +4.068 or –2.034 ppm of
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Clock operations
M41T94
adjustment per calibration step in the calibration register. Assuming that the oscillator is
running at exactly 32,768 Hz, each of the 31 increments in the calibration byte would
represent +10.7 or –5.35 seconds per month which corresponds to a total range of +5.5 or
–2.75 minutes per month.
Two methods are available for ascertaining how much calibration a given M41T94 may
require.
The first involves setting the clock, letting it run for a month and comparing it to a known
accurate reference and recording deviation over a fixed period of time. Calibration values,
including the number of seconds lost or gained in a given period, can be found in application
note AN934: TIMEKEEPER® calibration. This allows the designer to give the end user the
ability to calibrate the clock as the environment requires, even if the final product is
packaged in a non-user serviceable enclosure. The designer could provide a simple utility
that accesses the calibration byte.
The second approach is better suited to a manufacturing environment, and involves the use
of the IRQ/FT/OUT pin. The pin will toggle at 512 Hz, when the stop bit (ST, D7 of 1h) is '0,'
the frequency test bit (FT, D6 of 8h) is '1,' the alarm flag enable bit (AFE, D7 of Ah) is '0,' and
the watchdog steering bit (WDS, D7 of 9h) is '1' or the watchdog register (9h = 0) is reset.
Any deviation from 512 Hz indicates the degree and direction of oscillator frequency shift at
the test temperature. For example, a reading of 512.010124 Hz would indicate a +20 ppm
oscillator frequency error, requiring a –10 (XX001010) to be loaded into the calibration byte
for correction.
Note:
Setting or changing the calibration byte does not affect the frequency test output frequency.
The IRQ/FT/OUT pin is an open drain output which requires a pull-up resistor for proper
operation. A 500 to 10 k resistor is recommended in order to control the rise time. The FT
bit is cleared on power-down.
Figure 14. Crystal accuracy across temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
ΔF = K x (T –T )2
O
F
–100
K = –0.036 ppm/°C2 ± 0.006 ppm/°C2
–120
TO = 25°C ± 5°C
–140
–160
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
Temperature °C
AI00999b
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M41T94
Clock operations
Figure 15. Calibration waveform
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
AI00594B
4.9
Century bit
Bits D7 and D6 of clock register 03h contain the CENTURY ENABLE bit (CEB) and the
CENTURY bit (CB). Setting CEB to a '1' will cause CB to toggle, either from a '0' to '1' or
from '1' to '0' at the turn of the century (depending upon its initial state). If CEB is set to a '0,'
CB will not toggle.
4.10
Output driver pin
When the FT bit, AFE bit and watchdog register are not set, the IRQ/FT/OUT pin becomes
an output driver that reflects the contents of D7 of the control register. In other words, when
D7 (OUT bit) and D6 (FT bit) of address location 08h are a '0,' then the IRQ/FT/OUT pin will
be driven low.
Note:
The IRQ/FT/OUT pin is an open drain which requires an external pull-up resistor.
4.11
Battery low warning
The M41T94 automatically performs battery voltage monitoring upon power-up and at
factory-programmed time intervals of approximately 24 hours. The battery low (BL) bit, bit
D4 of flags register 0Fh, will be asserted if the battery voltage is found to be less than
approximately 2.5 V. The BL bit will remain asserted until completion of battery replacement
and subsequent battery low monitoring tests, either during the next power-up sequence or
the next scheduled 24-hour interval.
If a battery low is generated during a power-up sequence, this indicates that the battery is
below approximately 2.5 volts and may not be able to maintain data integrity in the SRAM.
Data should be considered suspect and verified as correct. A fresh battery should be
installed.
If a battery low indication is generated during the 24-hour interval check, this indicates that
the battery is near end of life. However, data is not compromised due to the fact that a
nominal VCC is supplied. In order to insure data integrity during subsequent periods of
battery backup mode, the battery should be replaced. The SNAPHAT® top may be replaced
while VCC is applied to the device.
Note:
This will cause the clock to lose time during the interval the SNAPHAT® battery/crystal top is
disconnected.
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Clock operations
M41T94
The M41T94 only monitors the battery when a nominal VCC is applied to the device. Thus
applications which require extensive durations in the battery backup mode should be
powered-up periodically (at least once every few months) in order for this technique to be
beneficial. Additionally, if a battery low is indicated, data integrity should be verified upon
power-up via a checksum or other technique.
4.12
tREC bit
Bit D7 of clock register 04h contains the tREC bit (TR). tREC refers to the automatic
continuation of the deselect time after VCC reaches VPFD. This allows for a voltage setting
time before WRITEs may again be performed to the device after a power-down condition.
The tREC bit will allow the user to set the length of this deselect time as defined by Table 8
on page 26.
4.13
Initial power-on defaults
Upon initial application of power to the device, the following register bits are set to a '0' state:
Watchdog register, TR, FT, AFE, ABE, and SQWE. The following bits are set to a '1' state:
ST, OUT, and HT (see Table 9: Default values).
Table 8. tREC definitions
tREC bit (TR)
STOP bit (ST)
0
0
tREC time
Units
Min
Max
96
98
ms
(1)
ms
μs
0
1
40
200
1
X
50
2000
1. Default setting
Table 9. Default values
Condition
Initial power-up
(battery attach for
SNAPHAT®)(2)
Subsequent power-up
(with battery backup)(3)
TR
ST
HT
Out
FT
AFE
ABE
SQWE
WATCHDOG
register(1)
0
1
1
1
0
0
0
0
0
UC
UC
1
UC
0
0
0
0
0
1. BMB0-BMB4, RB0, RB1.
2. State of other control bits undefined.
3. UC = Unchanged
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5
Maximum ratings
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 10. Absolute maximum ratings
Symbol
Parameter
TSTG
Storage temperature (VCC off, oscillator off)
VCC
Supply voltage
TSLD
(1)
VIO
SNAPHAT
SOIC
Value
Unit
–40 to 85
°C
–55 to 125
°C
–0.3 to 7
V
260
°C
–0.3 to VCC+0.3
V
®
Lead solder temperature for 10 seconds
Input or output voltage
IO
Output current
20
mA
PD
Power dissipation
1
W
1. For SO16 and SOH28 package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (the
time above 255°C must not exceed 30 seconds).
Caution:
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Caution:
Do NOT wave solder SOIC to avoid damaging SNAPHAT® sockets.
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39
DC and AC parameters
6
M41T94
DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristic
tables are derived from tests performed under the measurement conditions listed in the
relevant tables. Designers should check that the operating conditions in their projects match
the measurement conditions when using the quoted parameters.
Table 11. DC and AC measurement conditions(1)
Parameter
M41T94
VCC supply voltage
2.7 to 5.5 V
Ambient operating temperature
–40 to 85°C
Load capacitance (CL)
100 pF
Input rise and fall times
50 ns
Input pulse voltages
0.2 to 0.8VCC
Input and output timing ref. voltages
0.3 to 0.7VCC
1. Output Hi-Z is defined as the point where data is no longer driven.
Figure 16. AC testing input/output waveforms
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI02568
Table 12. Capacitance
Parameter(1)(2)
Symbol
CIN
COUT
tLP
(3)
Min
Max
Unit
Input capacitance
7
pF
Output capacitance
10
pF
Low-pass filter input time constant (SDA and SCL)
50
ns
1. Effective capacitance measured with power supply at 5 V; sampled only, not 100% tested.
2. At 25°C, f = 1 MHz.
3. Outputs are deselected.
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M41T94
DC and AC parameters
Table 13. DC characteristics
Symb.
IBAT
Battery current OSC on
Supply current
ICC2
Supply current (standby)
(2)
Input leakage current
(3)
Output leakage current
ILO
Min
TA = 25°C, VCC = 0 V,
VBAT = 3 V
Battery current OSC off
ICC1
ILI
Test condition(1)
Parameter
Typ
Max
Unit
400
500
nA
50
nA
f = 2 MHz
2
mA
SCL, SDI = VCC – 0.3 V
1.4
mA
0 V VIN VCC
±1
μA
0 V VOUT VCC
±1
μA
VIH
Input high voltage
0.7VCC
VCC + 0.3
V
VIL
Input low voltage
–0.3
0.3VCC
V
VBAT
VOH
VOL
VPFD
VSO
Battery voltage
Output high
Output low
2.5
voltage(5)
IOH = –1.0 mA
voltage(5)
3.5
(4)
V
2.4
V
IOL = 3.0 mA
0.4
Output low voltage (open drain)(6)
IOL = 10 mA
0.4
Pull-up supply voltage (open drain)
RST, IRQ/FT/OUT
5.5
Power fail deselect (THS = VCC)
4.20
4.40
4.50
Power fail deselect (THS = VSS)
2.55
2.60
2.70
Battery backup switchover
V
V
V
2.5
V
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.7 to 5.5 V (except where noted).
2. RSTIN1 and RSTIN2 internally pulled up to VCC through 100 k resistor. WDI internally pulled-down to VSS through
100 k resistor.
3. Outputs deselected.
4. For rechargeable back-up, VBAT (max) may be considered VCC.
5. For SQW pin (CMOS).
6. For IRQ/FT/OUT, RST pins (open drain): if pulled up to supply other than VCC, this supply must be equal to, or less than
3.0 V when VCC = 0 V (during battery backup mode).
Table 14. Crystal electrical characteristics (externally supplied)
Symbol
Parameter(1)(2)
f0
Resonant frequency
RS
Series resistance
CL
Load capacitance
Typ
Min
Max
32.768
Unit
kHz
50
12.5
k
pF
1. Load capacitors are integrated within the M41T94. Circuit board layout considerations for the 32.768 kHz crystal of
minimum trace lengths and isolation from RF generating signals should be taken into account. These characteristics are
externally supplied.
2. STMicroelectronics recommends the KDS DT-38: 1TA/1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S:
1TJS125FH2A212, (SMD) quartz crystal for industrial temperature operations.
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39
DC and AC parameters
M41T94
Figure 17. Power down/up mode AC waveforms
VCC
VPFD (max)
VPFD (min)
VSO
tF
tR
tFB
tRB
tDR
INPUTS
tREC
DON'T CARE
RECOGNIZED
RECOGNIZED
RST
HIGH-Z
OUTPUTS
VALID
VALID
(PER CONTROL INPUT)
(PER CONTROL INPUT)
AI03687
Table 15. Power down/up AC characteristics
Symbol
tF(2)
Parameter(1)
Min
Typ
Max
Unit
VPFD (max) to VPFD (min) VCC fall time
300
μs
VPFD (min) to VSS VCC fall time
10
μs
tR
VPFD (min) to VPFD (max) VCC rise time
10
μs
tRB
VSS to VPFD (min) VCC rise time
1
μs
Power up deselect time
40
tFB
(3)
tREC(4)
tDR
Expected data retention time
200
10(5)
ms
YEARS
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 2.7 to 5.5 V (except where noted).
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring
until 200 μs after VCC passes VPFD (min).
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
4. Programmable (see Table 8 on page 26).
5. At 25°C, VCC = 0 V (when using SOH28 + M4T28-BR12SH SNAPHAT® top).
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M41T94
7
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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39
Package mechanical data
M41T94
Figure 18. SO16 – 16-lead plastic small outline package outline
0016020_G
Note:
Drawing is not to scale.
Table 16. SO16 – 16-lead plastic small outline package mechanical data
millimeters
inches
Symbol
Min
Typ
A
Min
Typ
1.75
0.25
Max
0.069
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
9.80
9.90
10.00
0.386
0.390
0.394
E
5.80
6.00
6.20
0.228
0.236
0.244
E1
3.80
3.90
4.00
0.150
0.154
0.157
e
0.004
0.010
0.050
1.27
0.050
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
0°
8°
0°
8°
ccc
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Max
0.10
DocID007564 Rev 7
0.004
M41T94
Package mechanical data
Figure 19. SOH28 – 28-lead plastic small outline, battery SNAPHAT®, package outline
1011859_I
Note:
Drawing is not to scale.
Table 17. SOH28 – 28-lead plastic small outline, battery SNAPHAT®, package
mechanical data
millimeters
inches
Symbol
Min
Typ
A
Max
Min
Typ
3.048
Max
0.120
A1
0.051
0.355
0.002
0.014
A2
2.337
2.692
0.092
0.106
B
0.355
0.508
0.014
0.020
B1
0.355
0.610
0.014
0.024
C
0.152
0.317
0.006
0.013
D
17.710
18.490
0.697
0.728
E
8.230
8.890
0.324
0.350
H
11.510
12.700
0.453
0.500
e
1.270
0.050
L
0.406
1.270
0.016
0.050
X
0°
8°
0°
8°
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39
Package mechanical data
M41T94
Figure 20. SH – 4-pin SNAPHAT® housing for 48 mAh battery & crystal, package outline
1011860_J
Note:
Drawing is not to scale.
Table 18. SH – 4-pin SNAPHAT® housing for 48 mAh battery & crystal, package
mechanical data
millimeters
inches
Symbol
Min
A
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Typ
Max
Min
9.779
Typ
Max
0.385
A1
7.239
7.747
0.285
0.305
A2
6.477
6.985
0.255
0.275
A3
0.000
0.381
0.000
0.015
B
0.457
0.559
0.018
0.022
D
21.082
21.844
0.830
0.860
E
14.224
14.986
0.560
0.590
eA
15.545
15.951
0.612
0.628
eB
3.200
3.607
0.126
0.142
L
2.032
2.286
0.080
0.090
T
6°
8°
6°
8°
DocID007564 Rev 7
M41T94
Package mechanical data
Figure 21. SH – 4-pin SNAPHAT® housing for 120 mAh battery & crystal, package
outline
7027195_H
Note:
Drawing is not to scale.
Table 19. SH – 4-pin SNAPHAT® housing for 120 mAh battery & crystal, package mech.
data
millimeters
inches
Symbol
Min
A
Typ
Max
Min
10.541
Typ
Max
0.415
A1
8.001
8.509
0.315
0.335
A2
7.239
7.747
0.285
0.305
A3
0.000
0.381
0.000
0.015
B
0.457
0.559
0.018
0.022
D
21.082
21.844
0.830
0.860
E
17.272
18.034
0.680
0.710
eA
15.545
15.951
0.612
0.628
eB
3.200
3.607
0.126
0.142
L
2.032
2.286
0.080
0.090
T
6°
8°
6°
8°
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39
Part numbering
8
M41T94
Part numbering
Table 20. Ordering information scheme
Example:
M41T
94
MH
6
F
Device type
M41T
Supply voltage and write protect voltage
94 = VCC = 2.7 to 5.5 V
THS = VCC; 4.20 V VPFD 4.50 V
THS = VSS; 2.55 V VPFD 2.70 V
Package
MQ = SO16
MH(1)= SOH28
Temperature range
6 = –40 to 85°C
Shipping method
F = Lead-free package (ECOPACK®), tape & reel
1. The 28-pin SOIC package (SOH28) requires the SNAPHAT® battery/crystal package which is ordered
separately under the part number “M4TXX-BR12SHX” in plastic tube or “M4TXX-BR12SHXTR” in tape &
reel form (see Table 21).
Caution:
Do not place the SNAPHAT® battery package “M4TXX-BR12SH” in conductive foam as it
will drain the lithium button-cell battery.
For other options, or for more information on any aspect of this device, please contact the
ST sales office nearest you.
Table 21. SNAPHAT® battery table
Part number
Description
M4T28-BR12SH1
Lithium battery (48 mAh) and crystal SNAPHAT®
M4T32-BR12SHx
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Lithium battery (120 mAh) and crystal SNAPHAT
DocID007564 Rev 7
Package
®
SH
SH
M41T94
9
Environmental information
Environmental information
Figure 22. Recycling symbols
This product contains a non-rechargeable lithium (lithium carbon monofluoride chemistry)
button cell battery fully encapsulated in the final product.
Recycle or dispose of batteries in accordance with the battery manufacturer's instructions
and local/national disposal and recycling regulations.
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39
Revision history
10
M41T94
Revision history
Table 22. Document revision history
Date
Revision
Apr-2002
1
25-Apr-2002
1.1
Adjust graphic (Figure 4 on page 9); fix table text (Table 10 on page 27,
Table 20 on page 36); adjust characteristics (Table 13 on page 29,
Table 14 on page 29)
03-Jul-2002
1.2
Modify DC, Crystal Electrical Characteristics footnotes, Default Value
table (Table 13 on page 29, Table 14 on page 29, Table 9 on page 26)
06-Nov-2002
1.3
Correct dimensions (Table 19 on page 35)
26-Mar-2003
1.4
Update test condition (Table 15 on page 30)
28-Apr-2003
2
New Si changes (Figure 4 on page 9; Table 15 on page 30, Table 7 on
page 23, Table 8 on page 26, Table 9 on page 26)
15-Jun-2004
3
Reformatted; added Lead-free information; update characteristics
(Figure 14 on page 24; Table 10 on page 27, Table 13 on page 29,
Table 20 on page 36)
4
Changed document to new template; amalgamated diagrams in
Features on page 1; updated Package mechanical data in Section 7:
Package mechanical data; small text changes for entire document,
ECOPACK compliant
09-Nov-2007
5
Added lead-free second level interconnect information to cover page and
Section 7: Package mechanical data; minor formatting changes
throughout document; updated Table 10, footnote 1 in Table 14,
Table 20, 21; addition of Section 10: References
13-Jan-2009
6
Updated Table 10; updated text in Section 7: Package mechanical data;
added Section 9: Environmental information.
7
Updated Section 7: Package mechanical data (Figure 18, 19, 20, 21 and
Table 16, 17, 18, 19)
Removed shipping option in tubes from Table 20
Updated Section 9: Environmental information
Removed Section 10: References
29-Aug-2006
01-Dec-2014
38/39
Changes
First edition
DocID007564 Rev 7
M41T94
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2014 STMicroelectronics – All rights reserved
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