M74HC4050
HEX BUFFER/CONVERTER
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HIGH SPEED:
tPD = 8ns (TYP.) at VCC =6V
LOW POWER DISSIPATION:
ICC = 1µA(MAX.) at TA=25°C
HIGH NOISE IMMUNITY:
VNIH = V NIL = 28 % VCC (MIN.)
SYMMETRICAL OUTPUT IMPEDANCE:
|IOH| = IOL = 6mA (MIN)
BALANCED PROPAGATION DELAYS:
tPLH ≅ tPHL
WIDE OPERATING VOLTAGE RANGE:
VCC (OPR) = 2V to 6V
PIN AND FUNCTION COMPATIBLE WITH
74 SERIES 4050
DESCRIPTION
The M74HC4049 is an high speed CMOS HEX
BUFFER fabricated with silicon gate C2MOS
technology.
The internal circuit is composed of 3 stages, which
enables high noise immunity and a stable output.
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DIP
PACKAGE
TUBE
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TSSOP
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ORDER CODES
DIP
SOP
TSSOP
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SOP
M74HC4050B1R
M74HC4050M1R
T&R
M74HC4050RM13TR
M74HC4050TTR
Input protection circuits are different from those of
the high speed CMOS IC’s.
The Vcc side diodes are designed to allow
logic-level conversion from high-level voltages (up
to 13V) to low level voltages.
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PIN CONNECTION AND IEC LOGIC SYMBOLS
July 2001
1/8
M74HC4050
INPUT AND OUTPUT EQUIVALENT CIRCUIT
PIN DESCRIPTION
PIN No
SYMBOL
2, 4, 6, 10,
12, 15
3, 5, 7, 9, 11,
14
13, 16
8
NAME AND FUNCTION
1Y to 6Y
Data Outputs
1A to 6A
Data Inputs
NC
GND
VCC
1
Not Connected
Ground (0V)
Positive Supply Voltage
TRUTH TABLE
OUTPUT
nA
nY
L
H
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
bs
Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Current
O
)
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(
t
c
du
ICC or IGND DC VCC or Ground Current
PD
Power Dissipation
ro
Tstg
Storage Temperature
TL
Lead Temperature (10 sec)
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Parameter
)
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INPUT
L
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Value
Unit
-0.5 to +7
V
-0.5 to 15
V
-0.5 to VCC + 0.5
− 20
V
mA
± 20
mA
± 25
mA
± 50
mA
500(*)
mW
-65 to +150
°C
300
°C
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is
not implied
(*) 500mW at 65 °C; derate to 300mW by 10mW/°C from 65°C to 85°C
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
Top
Operating Temperature
Input Rise and Fall Time
tr, tf
2/8
Value
Unit
2 to 6
V
0 to 13
V
0 to VCC
V
-55 to 125
°C
VCC = 2.0V
0 to 1000
ns
VCC = 4.5V
0 to 500
ns
VCC = 6.0V
0 to 400
ns
M74HC4050
DC SPECIFICATIONS
Test Condition
Symbol
VIH
Parameter
VOL
II
ICC
Min.
2.0
4.5
6.0
2.0
4.5
6.0
Low Level Input
Voltage
VOH
TA = 25°C
VCC
(V)
High Level Input
Voltage
VIL
Value
High Level Output
Voltage
Low Level Output
Voltage
Typ.
Max.
1.5
3.15
4.2
-40 to 85°C
-55 to 125°C
Min.
Min.
Max.
1.5
3.15
4.2
0.5
1.35
1.8
1.9
2.0
1.9
1.9
IO=-20 µA
4.4
4.5
4.4
4.4
du
IO=-20 µA
5.9
6.0
5.9
4.18
4.31
4.13
5.68
5.9
6.0
IO=-5.2 mA
2.0
IO=20 µA
0.0
0.1
4.5
IO=20 µA
0.0
0.1
o
r
P
6.0
IO=20 µA
0.0
0.1
4.5
IO=4.0 mA
0.17
Input Leakage
Current
6.0
VI = VCC or GND
VI = 13 V
Quiescent Supply
Current
6.0
)-
5.63
0.18
V
4.10
5.60
0.1
0.1
0.1
0.1
0.1
0.1
0.26
0.33
0.40
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6.0
IO=5.2 mA
5.8
V
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IO=-20 µA
4.5
IO=-4.0 mA
V
0.5
1.35
1.8
2.0
4.5
Max.
1.5
3.15
4.2
0.5
1.35
1.8
6.0
Unit
V
0.26
0.33
0.40
± 0.1
± 0.5
±1
±5
±1
µA
1
10
20
µA
s
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t
c
VI = VCC or GND
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AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6ns)
Symbol
Pr
Parameter
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t
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ol
tTLH tTHL Output Transition
Time
O
bs
tPLH tPHL Propagation Delay
Time
Test Condition
VCC
(V)
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
CL
(pF)
50
50
150
Value
TA = 25°C
Min.
Typ.
Max.
25
7
6
30
9
8
45
14
12
60
12
10
75
15
13
100
20
17
-40 to 85°C
-55 to 125°C
Min.
Min.
Max.
75
15
13
95
19
16
125
25
21
Unit
Max.
90
18
15
115
23
20
150
30
26
ns
ns
3/8
M74HC4050
CAPACITIVE CHARACTERISTICS
Test Condition
Symbol
Parameter
Value
TA = 25°C
VCC
(V)
Min.
Typ.
Max.
10
CIN
Input Capacitance
5.0
5
CPD
Power Dissipation
Capacitance (note
1)
5.0
26
-40 to 85°C
-55 to 125°C
Min.
Min.
Max.
10
Unit
Max.
10
pF
pF
1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without
load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + ICC/6 (per gate)
)
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TEST CIRCUIT
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CL = 50pF or equivalent (includes jig and probe capacitance)
RT = ZOUT of pulse generator (typically 50Ω)
P
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WAVEFORM : PROPAGATION DELAY TIMES (f=1MHz; 50% duty cycle)
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4/8
M74HC4050
Plastic DIP-16 (0.25) MECHANICAL DATA
mm.
inch
DIM.
MIN.
a1
0.51
B
0.77
TYP
MAX.
MIN.
TYP.
MAX.
0.020
1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
)
s
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ct
20
E
8.5
e
2.54
e3
17.78
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0.335
7.1
I
5.1
s
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c
1.27
e
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bs
O
)
3.3
Z
Pr
0.100
F
L
0.787
0.700
0.280
0.201
0.130
0.050
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P001C
5/8
M74HC4050
SO-16 MECHANICAL DATA
mm.
DIM.
MIN.
TYP
A
inch
MAX.
MIN.
TYP.
a1
1.75
MAX.
0.1
0.068
0.2
a2
0.003
0.007
1.65
0.064
b
0.35
0.46
0.013
b1
0.19
0.25
0.007
C
0.5
0.018
)
s
(
ct
0.010
0.019
c1
45° (typ.)
D
9.8
10
0.385
E
5.8
6.2
0.228
e
1.27
e3
8.89
F
3.8
4.0
4.6
5.3
L
0.5
)
(s
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1.27
S
Pr
0.393
0.244
0.050
G
M
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0.62
0.350
0.149
0.157
0.181
0.208
0.019
0.050
0.024
8° (max.)
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PO13H
6/8
M74HC4050
TSSOP16 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
A
MAX.
MIN.
TYP.
MAX.
1.2
A1
0.05
A2
0.8
b
0.047
0.15
0.002
0.004
0.006
1.05
0.031
0.039
0.041
0.19
0.30
0.007
c
0.09
0.20
0.004
D
4.9
5
5.1
0.193
E
6.2
6.4
6.6
0.244
E1
4.3
4.4
4.48
1
e
bs
0.65 BSC
K
0°
L
0.45
let
o
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b
0.60
s
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0.75
du
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P
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0.0089
0.197
0.201
0.252
0.260
0.173
0.176
0.0256 BSC
0°
8°
0.018
0.024
0.030
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8°
0.012
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0.169
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A2
A1
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D
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PIN 1 IDENTIFICATION
1
0080338D
7/8
M74HC4050
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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