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M74HCT174B1R

M74HCT174B1R

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    M74HCT174B1R - HEX D-TYPE FLIP FLOP WITH CLEAR - STMicroelectronics

  • 数据手册
  • 价格&库存
M74HCT174B1R 数据手册
M74HCT174 HEX D-TYPE FLIP FLOP WITH CLEAR s s s s s s HIGH SPEED : fMAX = 56MHz (TYP.) at VCC = 4.5V LOW POWER DISSIPATION: ICC =4µA(MAX.) at TA=25°C COMPATIBLE WITH TTL OUTPUTS : VIH = 2V (MIN.) VIL = 0.8V (MAX) SYMMETRICAL OUTPUT IMPEDANCE: |IOH| = IOL = 4mA (MIN) BALANCED PROPAGATION DELAYS: tPLH ≅ tPHL PIN AND FUNCTION COMPATIBLE WITH 74 SERIES 174 DIP SOP TSSOP ORDER CODES PACKAGE DIP SOP TSSOP TUBE M74HCT174B1R M74HCT174M1R T&R M74HCT174RM13TR M74HCT174TTR DESCRIPTION The M74HCT174 is an high speed CMOS HEX D-TYPE FLIP FLOP WITH CLEAR fabricated with silicon gate C2MOS technology. Information signals applied to D inputs are transferred to the Q output on the positive going edge of the CLOCK (CK) pulse. When the CLEAR (CLR) input is held low, the Q outputs are held low independently of the other inputs. All inputs are equipped with protection circuits against static discharge and transient excess voltage. PIN CONNECTION AND IEC LOGIC SYMBOLS August 2001 1/10 M74HCT174 INPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION PIN No 1 2, 5, 7, 10, 12, 15 3, 4, 6, 11, 13, 14 9 8 16 SYMBOL CLEAR Q0 to Q5 D0 to D5 CLOCK GND Vcc NAME AND FUNCTION Asynchronous Master Reset (Active Low) Flip-Flop Outputs Data Inputs Clock Input (LOW to HIGH, edge triggered) Ground (0V) Positive Supply Voltage TRUTH TABLE INPUTS CLEAR L H H H X : Don’t Care OUTPUTS FUNCTION CK X Q L L H Qn NO CHANGE CLEAR D X L H X LOGIC DIAGRAM This logic diagram has not to be used to estimate propagation delays 2/10 M74HCT174 ABSOLUTE MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO PD Tstg TL Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Current Power Dissipation Storage Temperature Lead Temperature (10 sec) Parameter Value -0.5 to +7 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 ± 20 ± 20 ± 25 ± 50 500(*) -65 to +150 300 Unit V V V mA mA mA mA mW °C °C ICC or IGND DC VCC or Ground Current Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied (*) 500mW at 65 °C; derate to 300mW by 10mW/°C from 65°C to 85°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO Top tr, tf Supply Voltage Input Voltage Output Voltage Operating Temperature Input Rise and Fall Time (VCC = 4.5 to 5.5V) Parameter Value 4.5 to 5.5 0 to VCC 0 to VCC -55 to 125 0 to 500 Unit V V V °C ns DC SPECIFICATIONS Test Condition Symbol Parameter VCC (V) 4.5 to 5.5 4.5 to 5.5 4.5 4.5 5.5 5.5 5.5 IO=-20 µA IO=-4.0 mA IO=20 µA IO=4.0 mA VI = VCC or GND VI = VCC or GND Per Input pin VI = 0.5V or VI = 2.4V Other Inputs at VCC or GND IO = 0 TA = 25°C Min. 2.0 Typ. Max. Value -40 to 85°C Min. 2.0 Max. -55 to 125°C Min. 2.0 Max. V Unit VIH High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Voltage Input Leakage Current Quiescent Supply Current Additional Worst Case Supply Current VIL 0.8 4.4 4.18 4.5 4.31 0.0 0.17 0.1 0.26 ± 0.1 4 2.0 4.4 4.13 0.8 4.4 4.10 0.1 0.33 ±1 40 2.9 0.8 V VOH VOL II ICC ∆ ICC V 0.1 0.40 ±1 80 3.0 V µA µA mA 3/10 M74HCT174 AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6ns) Test Condition Symbol Parameter VCC (V) 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 5 30 TA = 25°C Min. Typ. 8 18 18 56 8 8 2 15 15 10 5 5 Max. 15 28 28 24 19 19 13 6 5 22 22 15 8 5 Value -40 to 85°C Min. Max. 19 35 35 42 -55 to 125°C Min. Max. 22 ns ns ns MHz ns ns ns ns ns Unit tTLH tTHL Output Transition Time tPLH tPHL Propagation Delay Time (CLOCK - Q) tPLH tPHL Propagation Delay Time (CLEAR - Q) fMAX Maximum Clock Frequency Minimum Pulse tW(H) Width (CLOCK) tW(L) tW(L) ts th tREM Minimum Pulse Width (CLEAR) Minimum Set-up Time Minimum Hold Time Minimum Removal Time CAPACITIVE CHARACTERISTICS Test Condition Symbol Parameter VCC (V) TA = 25°C Min. Typ. 5 68 Max. 10 Value -40 to 85°C Min. Max. 10 -55 to 125°C Min. Max. 10 pF pF Unit CIN CPD Input Capacitance Power Dissipation Capacitance (note 1) 1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + I CC/6 (per FLIP/ FLOP) And the total CPD when N pcs of FLIP-FLOP operate can be gained by the following equation : CPD (total) = 38 + 15 x n 4/10 M74HCT174 TEST CIRCUIT CL = 50pF or equivalent (includes jig and probe capacitance) RT = ZOUT of pulse generator (typically 50Ω) WAVEFORM 1 : PROPAGATION DELAY TIME, MINIMUM PULSE WIDTH (CLOCK), SETUP AND HOLD TIME (nD TO CLOCK), CLOCK MAXIMUM FREQUENCY (f=1MHz; 50% duty cycle) 5/10 M74HCT174 WAVEFORM 2 : PROPAGATION DELAY TIME (nQ TO CLEAR )(f=1MHz; 50% duty cycle) W AVEFORM 3 : MINIMUM PULSE WIDTH (CLEAR), MINIMUM REMOVAL TIME (CLEAR TO CLOCK)(f=1MHz; 50% duty cycle) 6/10 M74HCT174 Plastic DIP-16 (0.25) MECHANICAL DATA mm. DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 TYP. MAX. inch P001C 7/10 M74HCT174 SO-16 MECHANICAL DATA DIM. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8° (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45° (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm. MIN. TYP MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.003 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 PO13H 8/10 M74HCT174 TSSOP16 MECHANICAL DATA mm. DIM. MIN. A A1 A2 b c D E E1 e K L 0° 0.45 0.60 0.05 0.8 0.19 0.09 4.9 6.2 4.3 5 6.4 4.4 0.65 BSC 8° 0.75 0° 0.018 0.024 1 TYP MAX. 1.2 0.15 1.05 0.30 0.20 5.1 6.6 4.48 0.002 0.031 0.007 0.004 0.193 0.244 0.169 0.197 0.252 0.173 0.0256 BSC 8° 0.030 0.004 0.039 MIN. TYP. MAX. 0.047 0.006 0.041 0.012 0.0089 0.201 0.260 0.176 inch A A2 A1 b e K c L E D E1 PIN 1 IDENTIFICATION 1 0080338D 9/10 M74HCT174 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. © The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom © http://www.st.com 10/10
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