M74HCT7007RM13TR

M74HCT7007 HEX BUFFER ■ ■ ■ ■ ■ ■ HIGH SPEED: tPD = 14ns (TYP.) at VCC=4.5V LOW POWER DISSIPATION: ICC = 1µA(MAX.) at TA=25°C COMPATIBLE WITH TTL OUTPUTS : VIH = 2V (MIN.) VIL = 0.8V (MAX) BALANCED PROPAGATION DELAYS: tPLH ≅ tPHL SYMMETRICAL OUTPUT IMPEDANCE: |IOH| = IOL = 4mA (MIN) PIN AND FUNCTION COMPATIBLE WITH 74 SERIES 7007 DESCRIPTION The M74HCT7007 is an high speed CMOS HEX BUFFER fabricated with silicon gate C2MOS technology. All inputs are equipped with protection circuits against static discharge and transient excess voltage. ) (s DIP ) s ( ct SOP u d o r P e ORDER CODES PACK. TUBE TSSOP T&R t e l o DIP SOP TSSOP s b O M74HCT7007B1R M74HCT7007M1R M74HCT7007RM13TR M74HCT7007TTR The M74HCT7007 is designed to directly interface HSC2MOS systems with TTL and NMOS components. t c u d o r P e t e l o s b O PIN CONNECTION AND IEC LOGIC SYMBOLS September 2001 1/8 M74HCT7007 INPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION PIN No SYMBOL 1, 3, 5, 9, 11, 13 2, 4, 6, 8, 10, 12 7 NAME AND FUNCTION 1A to 6A Data Inputs 1Y to 6Y Data Outputs GND VCC Ground (0V) 14 Positive Supply Voltage TRUTH TABLE ) s ( ct A Y L H ABSOLUTE MAXIMUM RATINGS Symbol VCC r P e Parameter let Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Current ICC or IGND DC VCC or Ground Current PD Power Dissipation so t(s c u d Tstg Storage Temperature TL Lead Temperature (10 sec) )- b O o r P u d o L H Value Unit -0.5 to +7 V -0.5 to VCC + 0.5 V -0.5 to VCC + 0.5 ± 20 V mA ± 20 mA ± 25 mA ± 50 mA 500(*) mW -65 to +150 °C 300 °C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied (*) 500mW at 65 °C; derate to 300mW by 10mW/°C from 65°C to 85°C e t e ol RECOMMENDED OPERATING CONDITIONS s b O Symbol VCC 2/8 Parameter Value Unit Supply Voltage 4.5 to 5.5 V VI Input Voltage 0 to VCC V VO Output Voltage 0 to VCC V Top Operating Temperature -55 to 125 °C tr, tf Input Rise and Fall Time (VCC = 4.5 to 5.5V) 0 to 500 ns M74HCT7007 DC SPECIFICATIONS Test Condition Symbol VIH Parameter VIL VOL II ICC ∆ ICC Min. 4.5 to 5.5 4.5 to 5.5 Low Level Input Voltage VOH TA = 25°C VCC (V) High Level Input Voltage High Level Output Voltage 4.5 Low Level Output Voltage 4.5 Input Leakage Current Quiescent Supply Current Additional Worst Case Supply Current Value Typ. Max. 2.0 -40 to 85°C -55 to 125°C Min. Min. Max. 2.0 0.8 4.4 4.5 4.4 4.4 IO=-4.0 mA 4.18 4.31 4.13 4.10 0.1 IO=4.0 mA 0.17 0.26 5.5 VI = VCC or GND ± 0.1 5.5 VI = VCC or GND 1 5.5 Per Input pin VI = 0.5V or VI = 2.4V Other Inputs at VCC or GND IO = 0 0.1 r P e let 2.0 o s b V (s) ct u d o 0.33 V 0.8 IO=-20 µA 0.0 Max. 2.0 0.8 IO=20 µA Unit 0.1 0.40 V V ±1 ±1 µA 10 20 µA 2.9 3.0 mA O ) s ( t c AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6ns) u d o Test Condition Symbol Parameter r P e tTLH tTHL Output Transition Time tPLH tPHL Propagation Delay Time t e l o s b O VCC (V) Value TA = 25°C Min. -40 to 85°C -55 to 125°C Min. Min. Max. Unit Typ. Max. Max. 4.5 8 15 19 23 ns 4.5 14 23 29 35 ns CAPACITIVE CHARACTERISTICS Symbol Test Condition Parameter VCC (V) Value TA = 25°C Min. Typ. Max. 10 CIN Input Capacitance 5 CPD Power Dissipation Capacitance (note 1) 22 -40 to 85°C -55 to 125°C Min. Min. Max. 10 Unit Max. 10 pF pF 1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. ICC(opr) = CPD x V CC x fIN + ICC/6 (per buffer) 3/8 M74HCT7007 TEST CIRCUIT ) s ( ct u d o r P e CL = 50pF or equivalent (includes jig and probe capacitance) RT = ZOUT of pulse generator (typically 50Ω) t e l o WAVEFORM : PROPAGATION DELAY TIMES (f=1MHz; 50% duty cycle) ) (s t c u d o r P e t e l o s b O 4/8 s b O M74HCT7007 Plastic DIP-14 MECHANICAL DATA mm. inch DIM. MIN. a1 0.51 B 1.39 TYP MAX. MIN. TYP. MAX. 0.020 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D ) s ( ct 20 E 8.5 e 2.54 e3 15.24 u d o 0.335 7.1 I 5.1 1.27 s ( t c 2.54 e t e ol bs O ) 3.3 Z Pr 0.100 F L 0.787 0.600 0.280 0.201 0.130 0.050 0.100 u d o r P e t e l o s b O P001A 5/8 M74HCT7007 SO-14 MECHANICAL DATA mm. DIM. MIN. TYP A inch MAX. MIN. TYP. a1 1.75 MAX. 0.1 0.068 0.2 a2 0.003 0.007 1.65 0.064 b 0.35 0.46 0.013 b1 0.19 0.25 0.007 C 0.5 0.018 ) s ( ct 0.010 0.019 c1 45° (typ.) D 8.55 8.75 0.336 E 5.8 6.2 0.228 e 1.27 e3 7.62 F 3.8 4.0 4.6 5.3 L 0.5 ) (s e t e l so b O 1.27 S Pr 0.344 0.244 0.050 G M u d o 0.68 0.300 0.149 0.157 0.181 0.208 0.019 0.050 0.026 8° (max.) t c u d o r P e t e l o s b O PO13G 6/8 M74HCT7007 TSSOP14 MECHANICAL DATA mm. inch DIM. MIN. TYP A MAX. MIN. TYP. MAX. 1.2 A1 0.05 A2 0.8 b 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 c 0.09 0.20 0.004 D 4.9 5 5.1 0.193 E 6.2 6.4 6.6 0.244 E1 4.3 4.4 4.48 1 e bs 0.65 BSC K 0° L 0.45 let o s b 0.60 s ( t c 0.75 du ro P e 0.0089 0.197 0.201 0.252 0.260 0.173 0.176 0.0256 BSC 0° 8° 0.018 0.024 0.030 u d o r P e A O ) 8° 0.012 t e l o 0.169 ) s ( ct A2 A1 b O e K c L E D E1 PIN 1 IDENTIFICATION 1 0080337D 7/8 M74HCT7007 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. © The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom © http://www.st.com 8/8