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MJD32C

MJD32C

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT428

  • 描述:

    TRANS PNP 100V 3A D-PAK

  • 数据手册
  • 价格&库存
MJD32C 数据手册
MJD32C Low voltage PNP power transistor Datasheet − production data Features ■ ■ Surface-mounting TO-252 power package in tape and reel TAB Complementary to the NPN type MJD31C 3 Application ■ 1 General purpose linear and switching equipment DPAK TO-252 Description The device is manufactured in planar technology with “base island” layout. The resulting transistor shows exceptional high gain performance coupled with very low saturation voltage. Table 1. Figure 1. Internal schematic diagram Device summary Order code Marking Package Packaging MJD32CT4 MJD32C DPAK Tape and reel June 2012 This is information on a product in full production. Doc ID 13673 Rev 4 1/13 www.st.com 13 Electrical ratings 1 MJD32C Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Unit VCBO Collector-base voltage (IE = 0) -100 V VCEO Collector-emitter voltage (IB = 0) -100 V VEBO Emitter-base voltage (IC = 0) -5 V Collector current -3 A Collector peak current -5 A Base current -1 A PTOT Total dissipation at Tc = 25 °C 15 W TSTG Storage temperature -65 to 150 °C 150 °C Value Unit Thermal resistance junction-case max 8.3 °C/W Thermal resistance junction-pcb max 50 °C/W IC ICM IB TJ Max. operating junction temperature Table 3. Thermal data Symbol RthJC RthJPCB (1) Parameter 1. When mounted on FR-4 board of 1 inch², 2 oz Cu. 2/13 Value Doc ID 13673 Rev 4 MJD32C 2 Electrical characteristics Electrical characteristics Tcase = 25 °C unless otherwise specified. Table 4. Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit ICES Collector cut-off current (VBE = 0) VCE = - 100 V - -20 µA ICEO Collector cut-off current (IB = 0) VCB = - 60 V - -50 µA IEBO Emitter cut-off current (IC = 0) VEB = - 5 V - -0.1 mA Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) IC = - 30 mA -100 VCE(sat) (1) Collector-emitter saturation voltage IC = - 3 A VBE(on) (1) Base-emitter on voltage IC = - 3 A _ DC current gain IC = - 1 A IC = - 3 A _ _ VCE = - 4 V VCE = - 4 V hFE - V _ IB = - 375 mA - -1.2 V VCE = - 4 V - -1.8 V 25 10 - 50 1. Pulse test: pulse duration ≤300 µs, duty cycle ≤2 % 2.1 Electrical characteristic (curves) Figure 2. Safe operating area Figure 3. Doc ID 13673 Rev 4 Derating curve 3/13 Electrical characteristics 4/13 MJD32C Figure 4. DC current gain (VCE = - 2 V) Figure 5. DC current gain (VCE = - 4 V) Figure 6. Collector-emitter saturation voltage Figure 7. Base-emitter saturation voltage Figure 8. Base-emitter on voltage Figure 9. Resistive load switching time (on) Doc ID 13673 Rev 4 MJD32C Electrical characteristics Figure 10. Resistive load switching time (off) 2.2 Test circuits Figure 11. Resistive load switching test circuit 1. Fast electronic switch 2. Non-inductive resistor Doc ID 13673 Rev 4 5/13 Electrical characteristics MJD32C Figure 12. Inductive load switching test circuit 1. Fast electronic switch 2. Non-inductive resistor 3. Fast recovery rectifier 6/13 Doc ID 13673 Rev 4 MJD32C 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Doc ID 13673 Rev 4 7/13 Package mechanical data Table 5. MJD32C DPAK (TO-252) mechanical data mm Dim. Min. Typ. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 E 5.10 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1 1.50 L1 2.80 L2 0.80 L4 0.60 1 R V2 8/13 Max. 0.20 0° 8° Doc ID 13673 Rev 4 MJD32C Package mechanical data Figure 13. DPAK (TO-252) drawing 0068772_I Doc ID 13673 Rev 4 9/13 Package mechanical data Table 6. MJD32C DPAK (TO-252) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. A0 6.8 7 A B0 10.4 10.6 B 1.5 12.1 C 12.8 1.6 D 20.2 G 16.4 50 B1 Min. Max. 330 13.2 D 1.5 D1 1.5 E 1.65 1.85 N F 7.4 7.6 T K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 18.4 22.4 Figure 14. DPAK footprint(a) 6.7 1.8 3 1.6 2.3 6.7 2.3 1.6 a. All dimensions are in millimeters 10/13 Doc ID 13673 Rev 4 AM08850v1 MJD32C Package mechanical data Figure 15. Tape for DPAK (TO-252) 10 pitches cumulative tolerance on tape +/- 0.2 mm T P0 Top cover tape P2 D E F B1 W K0 B0 For machine ref. only including draft and radii concentric around B0 A0 P1 D1 User direction of feed R Bending radius User direction of feed AM08852v1 Figure 16. Reel for DPAK (TO-252) T REEL DIMENSIONS 40mm min. Access hole At sl ot location B D C N A Full radius Tape slot in core for tape start 25 mm min. width G measured at hub AM08851v2 Doc ID 13673 Rev 4 11/13 Revision history 4 MJD32C Revision history Table 7. 12/13 Document revision history Date Revision Changes 25-Jun-2007 1 Initial release. 09-Nov-2009 2 Updated package mechanical data. 14-Jan-2010 3 Modified Table 3 on page 2. 04-Jun-2012 4 Updated: mechanical data Doc ID 13673 Rev 4 MJD32C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 13673 Rev 4 13/13
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