MLPF-WB55-02E3

MLPF-WB55-02E3 Datasheet 2.4 GHz low pass filter matched to STM32WB55Vx Features Top view (pads down) OUT • • • • • • • • • • Integrated impedance matching to STM32WB55Vx LGA footprint compatible 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low thickness ≤ 450 μm High RF performance RF BOM and area reduction ECOPACK2 compliant component GND3 Applications GND4 GND2 IN GND1 • • • • • Bluetooth 5 OpenThread Zigbee® IEEE 802.15.4 Optimized for STM32WB55Vx Description Product status link MLPF-WB55-02E3 The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance. DS13176 - Rev 2 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com MLPF-WB55-02E3 Characteristics 1 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol PIN VESD TOP Parameter Input power RFIN Value Unit 10 dBm ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others connected to GND 2000 ESD ratings machine model, all I/O 200 Maximum operating temperature -40 to +105 V °C Table 2. Impedances(Tamb = 25 °C) Symbol ZIN ZOUT Parameter Value Unit Min. Typ. Max. STM32WB55xx single-ended impedance - matched to STM32WB55Vx - Ω Antenna impedance - 50 - Ω Table 3. Electrical characteristics and RF performance (Tamb = 25 °C) Symbol Parameter f Frequency range IL Insertion loss lS21l RLIN RLOUT Typ. 1.0 Max. Unit 2500 MHz 1.2 dB Input return loss IS11I 13 17 dB Output return loss lS22l 15 18 dB 43 45 dB 47 53 dB 41 56 dB 38 44 dB (4800-5825) MHz Attenuation at 3fo Harmonic rejection levels IS21I (7200 – 7500) MHz Attenuation at 4fo (9600 – 10000) MHz Attenuation at 5fo (12000 – 12500) MHz DS13176 - Rev 2 Min. 2400 Attenuation at 2fo Att Value page 2/14 MLPF-WB55-02E3 RF measurement 1.1 RF measurement Figure 2. Insertion loss (dB) Figure 1. Transmission (dB) S21(dB) S21(dB) 0 -0.7 -10 -0.8 -20 -0.9 -30 -40 -1.0 -50 -1.1 -60 f(GHz) -70 2 0 10 8 6 4 14 12 f(GHz) -1.2 Figure 3. Input return loss (dB) -10 -10 -15 -15 -20 -20 -25 -25 f(GHz) -30 2.42 f(GHz) 2.42 2.40 Figure 5. Attenuation 2f0 (dB) -30 2.50 S22(dB) -30 2.50 2.48 2.46 2.44 2.48 2.46 2.44 Figure 4. Output return loss (dB) S11(dB) 2.40 2.42 2.40 2.48 2.46 2.44 2.50 Figure 6. Attenuation 3f0 (dB) S21(dB) -30 -35 -35 -40 -40 -45 -45 -50 -50 -55 -55 -60 -60 -65 S21(dB) -65 f(GHz) -70 4.8 4.9 DS13176 - Rev 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 f(GHz) -70 7.20 7.25 7.30 7.35 7.40 7.45 7.50 page 3/14 MLPF-WB55-02E3 RF measurement Figure 7. Attenuation 4f0 (dB) -30 Figure 8. Attenuation 5f0 (dB) S21(dB) -30 -35 -35 -40 -40 -45 -45 -50 -50 -55 -55 -60 -60 -65 f(GHz) -70 9.60 S21(dB) -65 f(GHz) -70 9.65 DS13176 - Rev 2 9.70 9.75 9.80 9.85 9.90 9.95 10.00 12.00 12.05 12.10 12.15 12.20 12.25 12.30 12.35 12.40 12.45 12.50 page 4/14 MLPF-WB55-02E3 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 Bumpless CSP package information Figure 9. Bumpless CSP package outline BOTTOM VIEW (pads up) B1 X OUT SIDE VIEW T GND2 GND4 B Y B GND3 GND1 A A1 IN Coating 25µm B1 a a A1 Table 4. Bumpless CSP package mechanical data Parameter DS13176 - Rev 2 Description Min. Typ. Max. Unit X X dimension of the die 975 1000 1025 µm Y Y dimension of the die 1575 1600 1625 µm A X pitch 500 µm B Y pitch 587 µm A1 Distance from bump to edge of die on X axis 250 µm B1 Distance from pad to edge of die on Y axis 213 µm a Pad dimension 200 µm T Substrate thickness 375 400 425 µm page 5/14 MLPF-WB55-02E3 Bumpless CSP package information Figure 10. Marking Figure 11. Top view Top view (pads down) OUT GND3 GND4 GND2 IN GND1 More packing information is available in the application note: • AN2348 Flip-Chip: “Package description and recommendations for use Figure 12. Tape and reel outline P0 Pin 1 located according to EIA-481 Ø D0 A0 F W B0 K0 P1 P2 Ø D1 0.03 RAISED CROSS-BAR User direction of unreeling Note: DS13176 - Rev 2 Pocket dimensions are not on scale Pocket shape may vary depending on package page 6/14 MLPF-WB55-02E3 Bumpless CSP package information Table 5. Tape and reel mechanical data Dimensions Ref Millimeters Min Typ Max A0 1.04 1.09 1.14 B0 1.64 1.69 1.74 K0 0.47 0.52 0.57 P1 3.9 4.0 4.1 P0 3.9 4.0 4.1 Ø D0 1.4 1.5 1.6 Ø D1 0.35 0.40 0.45 F 3.45 3.50 3.55 P2 1.95 2.00 2.05 W 7.9 8.0 8.3 Table 6. Pad description top view (pads down) DS13176 - Rev 2 Pad ref Pad name Description A1 OUT Antenna A2 GND4 Ground A3 IN STM32WB55 RF out B1 GND3 Ground B2 GND2 Ground B3 GND1 Ground page 7/14 MLPF-WB55-02E3 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Land pattern Figure 13. PCB land pattern recommendations DS13176 - Rev 2 page 8/14 MLPF-WB55-02E3 Land pattern Figure 14. PCB stack-up recommendations DS13176 - Rev 2 Material Thickness Copper1 62 µm Dielectric1 82 µm Copper2 41 µm Dielectric2 1180 µm Copper3 42 µm Dielectric3 87 µm Copper4 66 µm Dielectric constant 3.69 3.69 3.69 page 9/14 MLPF-WB55-02E3 Stencil opening design 3.2 Stencil opening design Figure 15. Stencil opening recommendations 3.3 Solder paste 1. 2. 3. 4. 5. DS13176 - Rev 2 100 µm solder stencil thickness is recommended Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during PCB movement. Solder paste with fine particles: powder particle size is 20-45 μm. page 10/14 MLPF-WB55-02E3 Placement 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. DS13176 - Rev 2 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. page 11/14 MLPF-WB55-02E3 Ordering information 4 Ordering information Figure 16. Ordering information scheme MLPF- WB55 - 02 E3 Matched low pass filter Impedance matched to STM32WB55 02: Version E3: Coated CSP on glass Table 7. Ordering information DS13176 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode MLPF-WB55-02E3 TT CSP Bumpless 1.546 mg 5000 Tape and reel (7") page 12/14 MLPF-WB55-02E3 Revision history Table 8. Document revision history DS13176 - Rev 2 Date Version Changes 28-Nov-2019 1 Initial release. 14-Jan-2020 2 Updated Section Cover image. page 13/14 MLPF-WB55-02E3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS13176 - Rev 2 page 14/14