MP23AB02TR

MP23AB02B MEMS audio sensor high-performance analog bottom-port microphone Datasheet - production data Description The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element. ) s t( The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. c u d o r P The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio. RHLGA metal cap 3-lead e t le 3.35 x 2.5 x 0.98 mm The MP23AB02B is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. o s b Features O )  Single supply voltage operation s ( t c  Low power consumption  Omnidirectional sensitivity u d o  High signal-to-noise ratio  High bandwidth r P e  Package compliant with reflow soldering t e l o s b O Table 1. Device summary Order code Temperature range (C) Package Packing MP23AB02B -40 to +85 (3.35 x 2.5 x 0.98) mm Tray MP23AB02BTR -40 to +85 (3.35 x 2.5 x 0.98) mm Tape and reel September 2014 This is information on a product in full production. DocID026104 Rev 3 1/12 www.st.com Pin description 1 MP23AB02B Pin description Figure 1. Pin connections 2 1 ) s t( c u d 3 e t le o r P Table 2. Pin description Pin n° Pin name 1 Out Analog output 2 Vdd Power supply 3 GND ) s t( so b O - Ground c u d e t le o r P o s b O 2/12 DocID026104 Rev 3 Function MP23AB02B Acoustic and electrical specifications 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Tamb = 25 °C unless otherwise specified. Table 3. Acoustic and electrical characteristics Symbol Parameter Test condition Vdd Supply voltage Idd Current consumption mean value = 2 V So Sensitivity 1 kHz (0 dB = 1 V/Pa) SNR Signal-to-noise ratio A-weighted, 1 kHz (0 dB = 1 V/Pa) Top Operating temperature range Min. Typ.(1) Max. 1.6 1.8 3.6 150 220 -41 -35 od r P e -40 ) s ( t c u -38 64 Unit +85 V μA dBV/PA dBA °C t e l o 1. Typical specifications are not guaranteed s b O Table 4. Distortion specifications at 1 kHz Parameter Test condition )- Distortion t(s Distortion uc Distortion d o r P e et Value 94 < 0.5% 120 < 2% 124 = 10% Figure 2. Frequency response l o s Ob DocID026104 Rev 3 3/12 12 Absolute maximum ratings 3 MP23AB02B Absolute maximum ratings Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Ratings Vdd Supply voltage TSTG Storage temperature range Maximum value Unit -0.5 to 4 V ) s t( -40 to +125 °C c u d This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. o r P This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part. e t le o s b O ) s ( t c u d o r P e t e l o s b O 4/12 DocID026104 Rev 3 MP23AB02B 4 Application recommendations Application recommendations Figure 3. MP23AB02B electrical connections and external component values Vdd R2 - Vref C2 C3 R1 Pin.2 MP23AB02B Pin.1 (Vout ) C1 + Pin.3 (Ground) Typical values: C1 > 1µF C2 ~ 1000pF C3 = 1µF ) s t( R c u d Vref o r P Ext. gain = (R1+R2) / R1 e t le GAMS1103141450SG o s b O ) s ( t c u d o r P e t e l o s b O DocID026104 Rev 3 5/12 12 Package mechanical data 5 MP23AB02B Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 6/12 DocID026104 Rev 3 o r P MP23AB02B Figure 4. RHLGA metal cap 3-lead 3.35 mm x 2.5 mm x 0.98 mm package outline ) s ( ct u d o r P e t e l o DocID026104 Rev 3 ) (s s b O t c u d o r P e s b O 8419346_A 7/12 Package mechanical data t e l o Package mechanical data MP23AB02B Table 6. RHLGA metal cap 3-lead (3.35 x 2.5 x 0.98 mm9 package dimensions Dimensions (mm) Reference Min. Typ. Max. A1 0.880 0.980 1.080 A2 0.200 0.250 0.300 D1 3.250 3.350 3.450 D2 0.495 0.595 0.695 D3 2.770 2.920 3.070 R1 0.275 0.325 0.375 R2 0.28 R3 0.25 E1 2.400 2.500 E2 1.150 1.250 E3 1.920 L1 1.480 L2 1.180 N1 0.885 2.220 1.260 0.925 0.965 0.570 0.610 0.650 0.860 0.900 0.940 0.640 0.680 0.720 0.900 0.950 1.000 1.400 1.550 1.600 0.100 0.150 0.200 P1 1.425 1.475 1.525 P2 1.000 1.050 1.100 ) s ( t c u od G1 Pr G2 8/12 1.350 1.220 T2 Ob 2.600 1.560 T1 so o r P c u d 1.520 N2 e t le e t le 2.070 ) s t( G3 so b O - d 0.150 K 0.050 DocID026104 Rev 3 MP23AB02B Package mechanical data Figure 5. RHLGA tape and reel (dimensions are in mm.) ) s t( c u d e t le o r P *$066* o s b O ) s ( t c u d o r P e t e l o s b O DocID026104 Rev 3 9/12 12 Soldering information 6 MP23AB02B Soldering information Figure 6. Recommended soldering profile limits tp TP CRITICAL ZONE RAMP-UP TL to T P TL TEMPERATURE TSMAX tL ) s t( TSMIN ts PREHEAT e t le T25°C to PEAK 30 60 90 c u d RAMP-DOWN 120 150 180 TIME 210 240 so b O - 270 300 o r P 330 360 390 AM045166v1 Table 7. Recommended soldering profile limits Description Average ramp rate Preheat ) s ( u d o ct Minimum temperature Maximum temperature Time (TSMIN to TSMAX) r P e Ramp-up rate 10/12 Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec TSMAX to TL t e l o s b O Parameter Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t = 25 °C) to peak temperature 8 minutes max DocID026104 Rev 3 MP23AB02B 7 Revision history Revision history . Table 8. Document revision history Date Revision Changes 21-Mar-2014 1 Initial release. 16-Jun-2014 2 Updated Figure 5 on page 9. 22-Sep-2014 3 Updated acoustic overload point in Description. ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026104 Rev 3 11/12 12 MP23AB02B ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. t e l o s b O Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 12/12 DocID026104 Rev 3