MP23ABS1TR

MP23ABS1 High-performance MEMS audio sensor: single-ended analog bottom-port microphone Datasheet - production data Description The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP23ABS1 has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio. RHLGA metal cap 5-lead 3.5 x 2.65 x 0.98 mm The sensitivity of the MP23ABS1 is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz. Features  Single supply voltage operation 1.52 V - 3.6 V  Omnidirectional sensitivity  High signal-to-noise ratio The MP23ABS1 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.  High acoustic overload point: 130 dBSPL typ. Applications  Package compliant with reflow soldering  Mobile phones  Enhanced RF immunity  Wearables  Ultra-flat frequency response  Hearables  Low latency  Smart speakers  Ultra-low-power: 150 μA max  Active noise-canceling headsets  ECOPACK, RoHS, and “Green” compliant Table 1. Device summary Order code Temperature range (C) Package Packing MP23ABS1 -40 to +85 (3.5 x 2.65 x 0.98) mm Tray MP23ABS1TR -40 to +85 (3.5 x 2.65 x 0.98) mm Tape and reel October 2020 This is information on a product in full production. DocID031167 Rev 6 1/15 www.st.com Contents MP23ABS1 Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 MP23ABS1 schematic hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Reliability tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 2/15 7.1 RHLGA-5L package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.2 Land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.3 RHLGA-5L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DocID031167 Rev 6 MP23ABS1 1 Pin description Pin description Figure 1. Pin connections (bottom view) Table 2. Pin description Pin n° Pin name Function 1 Out 2 GND GND 3 GND GND 4 GND GND 5 Vdd Supply voltage Output DocID031167 Rev 6 3/15 15 Acoustic and electrical specifications MP23ABS1 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 2.75 V, no load, Tamb = 25 °C unless otherwise specified. Table 3. Acoustic and electrical characteristics Symbol Parameter Vdd Supply voltage Idd Current consumption So Sensitivity SNR Test condition 1 kHz @ 94 dBSPL Power Supply Rejection AOP Acoustic Overload Point Top Max. Unit 1.52 2.75 3.6 V 120 150 μA -38 -37 dBV -39 Load resistance 100 mVpp sine wave, 1 kHz, Vdd > 1.6 V (1) 64 dB(A) 60 dB 130 dBSPL kΩ 15 Operating temperature range 1. Guaranteed by design 4/15 Typ. Signal-to-noise ratio PSRR Rload Min. DocID031167 Rev 6 -40 +85 °C MP23ABS1 Frequency response Figure 2. Typical free-field frequency response normalized at 1 kHz ϭϬ ϴ ϲ DĂŐŶŝƚƵĚĞ;ĚͿ 2.2 Acoustic and electrical specifications ϰ Ϯ Ϭ ͲϮ Ͳϰ ϭϬ ϭϬϬ ϭϬϬϬ ϭϬϬϬϬ ĨƌĞƋƵĞŶĐLJ;,njͿ Table 4. Frequency response mask Frequency (Hz) LSL USL Unit 35 -2 0 dBr 1kHz 100 -1.5 0.5 dBr 1kHz 900 -1 1 dBr 1kHz 1000 0 0 dBr 1kHz 1100 -1 1 dBr 1kHz 8000 -1 4 dBr 1kHz 15000 0 9 dBr 1kHz DocID031167 Rev 6 5/15 15 Absolute maximum ratings 3 MP23ABS1 Absolute maximum ratings Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Ratings Maximum value Unit Vdd Supply voltage -0.5 to 4.8 V TSTG Storage temperature range -40 to +125 °C Operating temperature range -40 to +105 °C Top This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part. 6/15 DocID031167 Rev 6 MP23ABS1 Application recommendations 4 Application recommendations 4.1 MP23ABS1 schematic hints Figure 3. MP23ABS1 electrical connections and external component values DocID031167 Rev 6 7/15 15 Soldering information 5 MP23ABS1 Soldering information Figure 4. Recommended soldering profile limits WS 73 &5,7,&$/=21( 5$0383 7/ WR7 3 7/ 7(03(5$785( 760$; W/ 760,1 WV 35(+($7 5$03'2:1 7ƒ&WR3($. 7,0(  Table 6. Recommended soldering profile limits Description Average ramp rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) Ramp-up rate TSMAX to TL Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 8/15 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t = 25 °C) to peak temperature 8 minutes max DocID031167 Rev 6 MP23ABS1 6 Reliability tests Reliability tests The device passed all reliability tests on three different assembly lots under the following conditions given in the table below. Table 7. Reliability specifications Test name Description Conditions ESD-GUN: 25 discharges at ±8 kV, direct contact to housing of MIC Reference specification IEC 61000-4-2 Electrostatic Discharge Immunity Test (ESD) To classify ESD susceptibility the device is submitted to a high ESD-HBM 3 discharges up to ±2 kV pin-to-pin voltage peak on all his pins, Reference specification ANSI/ESDA/JEDEC JS001 simulating ESD stress according ESD-MM, 3 discharges up to ±200 V pin-to-pin to different simulation models Reference specification JEDEC JESD22-A115C (GUN, HBM, MM, CDM) ESD-CDM, 3 discharges up to ±750 V Reference specification ANSI/ESDA/JEDEC JS002 Latch-Up (LU) High Temperature Operative Life (HTOL) To verify latch-up immunity the device is submitted to a current injection on I/O or supply overvoltage ±100 mA & 1.5 x Vdd @ 85 °C Reference specification JEDEC JESD78 To simulate the worst-case application stress conditions, the Ta 125 °C, Tj 125 °C, 1000 Hrs, @ Max Op Voltage Preconditioning (PC) before device is stressed in dynamic Reference specification JESD22-A108 configuration at operative max. absolute ratings Temperature Humidity Bias (THB) To investigate failure mechanisms activated by electrical field and humidity, the device is biased in static or dynamic operative conditions at controlled high temperature and relative humidity Ta 85°C, R.H. 85%, 1000 Hrs, @ Max Op Voltage Preconditioning (PC) before Reference specification JESD22-A101 Preconditioning MSL3 (PC) To investigate effects of customer manufacturing soldering enhanced by package water absorption, the device is submitted to typical temperature profile after controlled moisture absorption MSL3 as moisture soak conditions followed by n.3 reflow @ Tpeak 260 °C Reference specification JEDEC J-STD-020 To investigate the failure mechanisms activated by extremely cold conditions, the Low Temperature Storage device is stored in unbiased (LTS) condition at the min. temperature allowed by the package materials DocID031167 Rev 6 Ta = -40 °C, 1000 Hrs Reference specification JESD22-A120 9/15 15 Reliability tests MP23ABS1 Table 7. Reliability specifications (continued) Test name Description Conditions To investigate the failure mechanisms activated by high temperature, the device is High Temperature Storage stored in unbiased condition at (HTS) the maximum temperature allowed by the package materials Temperature Cycling (TC) Temperature Humidity Storage (THS) To investigate failure modes related to thermo-mechanical stress, the device is submitted to cycled temperature excursions, between a hot and a cold chamber in air atmosphere Compressed Air Test (CAT) Low T = - 40 °C, High T = +125 °C, 1000 Cys Preconditioning (PC) before Reference specification JESD22-A105 To investigate degradations induced by wet conditions, the device is stored at controlled high temperature and relative humidity To investigate durability to mechanical repeated drops Random Free-Fall on PCB without any preferential impact (TUMBLE) direction simulating drop effect on handheld devices Guided Free-Fall on PCB (GFF) Ta = 125 °C, 1000 Hrs Reference specification JESD22-A104 Ta = 85°C, R.H. = 85%, 1000Hrs Preconditioning (PC) before Reference specification JESD22-A102 Microphone soldered on PCB which is mounted on a specific jig Random drop from 1 mt on steel base, 300 drops Reference specification IEC 60068-2-32 To verify durability of the whole device to mechanical shocks, done by controlling height and impact direction simulating drop effect on handheld devices Microphone soldered on PCB which is mounted on a specific jig Guided drop from 1.5 mt on marble base, 2 drops x 6 directions Reference specification IEC 60068-2-32 Test dedicated on the MEMS Microphone to check mechanical robustness of sensor membrane alone Microphone membrane is subjected to repeated air pulses controlled on duration, rise and fall time and amplitude. Amplitude is varied with increasing steps. ST internal specification Mechanical Shock (MS) To verify mechanical robustness of internal structural elements (MEMS, package components) to withstand severe shocks produced by handling, transportation or field operations Variable Frequency Vibration (VB) The vibration variable frequency Peak acceleration of 20 g, from 20 Hz to 2000 Hz in test is performed to determine three perpendicular directions the effect of vibration, within a Reference specification MIL 883, Method 2007.3-A specified frequency range, on the internal structural elements 10/15 Five pulses of 10,000 g in each of six directions with duration time 0.2 ms Reference specification MIL 883, Method 2002.5 DocID031167 Rev 6 MP23ABS1 7 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 RHLGA-5L package information Figure 5. RHLGA metal cap 5-lead (3.5 x 2.65 x 0.98 mm) package outline and mechanical data 'LPHQVLRQVDUHLQPLOOLPHWHUXQOHVVRWKHUZLVHVSHFLILHG *HQHUDO7ROHUDQFHLVPPXQOHVVRWKHUZLVHVSHFLILHG 287(5',0(16,216 ,7(0 /HQJWK>/@ : LGWK>: @ +HLJKW>+@ ',0(16,21>PP@   0$; 72/(5$1&(>PP@ “ “  '0B DocID031167 Rev 6 11/15 15 Package information 7.2 MP23ABS1 Land pattern Figure 6. Land pattern and recommended stencil opening /DQGSDWWHUQ 6WHQFLORSHQLQJ                 ij  ij  12/15 ij  ij  ij  DocID031167 Rev 6  MP23ABS1 7.3 Package information RHLGA-5L packing information Figure 7. Carrier tape information for RHLGA-5L package DocID031167 Rev 6 13/15 15 Revision history 8 MP23ABS1 Revision history Table 8. Document revision history 14/15 Date Revision Changes 08-Nov-2017 1 Initial release 29-Jan-2018 2 Updated Figure 2: Typical free-field frequency response normalized at 1 kHz Added Table 4 27-Mar-2018 3 Document status promoted to production data Modified title of Table 4 29-Nov-2018 4 Updated Table 3: Acoustic and electrical characteristics Updated storage temperature range in Table 5: Absolute maximum ratings Updated Table 7: Reliability specifications Added Section 7.2: Land pattern 11-Feb-2019 5 Added Figure 7: Carrier tape information for RHLGA-5L package 28-Oct-2020 6 Added operating temperature range to Table 5: Absolute maximum ratings DocID031167 Rev 6 MP23ABS1 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DocID031167 Rev 6 15/15 15