MP33AB01

MP33AB01 MEMS audio surface-mount bottom-port silicon microphone with analog output Datasheet - production data Description The MP33AB01 is a compact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP33AB01 has an acoustic overload point of 125 dBSPL with a 63 dB signal-to-noise ratio. RHLGA 3.76 x 2.95 x 1.0 mm The MP33AB01 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -30 °C to +100 °C. Features  Single supply voltage  Low power consumption  Omnidirectional sensitivity  High signal-to-noise ratio  High bandwidth  Package compliant with reflow soldering Table 1. Device summary Order code Temperature range [°C] Package Packing MP33AB01 -30 to +100 RHLGA (3.76 x 2.95 x 1.0) mm Tray MP33AB01TR -30 to +100 RHLGA (3.76 x 2.95 x 1.0) mm Tape and reel September 2013 This is information on a product in full production. DocID24159 Rev 2 1/13 www.st.com Contents MP33AB01 Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 DocID24159 Rev 2 MP33AB01 1 Pin description Pin description Figure 1. Pin connections 4 5 1 6 3 TOP VIEW 2 BOTTOM VIEW Table 2. Pin description Pin # Pin name Function 1 Output 2 GND 0 V supply 3 GND 0 V supply 4 Vdd Power supply 5 GND 0 V supply 6 GND 0 V supply Analog output DocID24159 Rev 2 3/13 13 Acoustic and electrical specifications MP33AB01 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 2.2 V unless otherwise noted. Table 3. Acoustic and electrical characteristics Symbol Parameter Test condition Vdd Supply voltage Idd Current consumption FR Frequency range So Sensitivity at 1 kHz (0 dB = 1 V/Pa) SNR Signal-to-noise ratio at 1 kHz (0 dB = 1 V/Pa) Top Operating temperature range Min. Typ.(1) Max. Unit 1.5 2.2 3.6 V 0.25 mA 10000 Hz -35 dBV mean value = 2 V 100 -41 -38 63 -30 dB +100 1. Typical specifications are not guaranteed. Table 4. Distortion specifications at 1 kHz 4/13 Parameter Test condition Value Distortion 94 dBSPL < 1% THD Distortion 125 dBSPL 10% THD (typ.) DocID24159 Rev 2 °C MP33AB01 Frequency response Figure 2. Typical frequency response normalized at 1 kHz 30 20 10 Sensitivity (dBV) 2.2 Acoustic and electrical specifications 0 -10 -20 -30 10 100 1000 10000 Frequency (Hz) DocID24159 Rev 2 5/13 13 Absolute maximum ratings 3 MP33AB01 Absolute maximum ratings Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Ratings Vdd Supply voltage TSTG Storage temperature range Maximum value Unit -0.5 to 4 V -40 to +100 °C This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is ESD-sensitive, improper handling can cause permanent damage to the part. 6/13 DocID24159 Rev 2 MP33AB01 4 Application recommendations Application recommendations Figure 3. MP33AB01 electrical connections and external component values Vdd R2 - Vref C2 C3 R1 Pin.4 MP33AB01 C1 Pin.1 (Vout ) + Pin.2,3,5,6 Typical values: C1 > 1 µF C2 ~ 1000 pF C3 = 1 µF (Ground) R Vref Ext. gain = (R1+R2) / R1 The DC-blocking capacitor C1 is required on the Vout pin as shown in Figure 3. The C1 value and the input resistance of the interface circuit (R) affect the cut-off frequency of the Audio signal path as: 3 dB cut-off freq = 1 / 2 RC1 It's advisable to have a cut-off frequency well below 20 HZ, so for a typical input resistance of about 20 kit is recommended to use a C1 > 1 µF. DocID24159 Rev 2 7/13 13 Package mechanical data 5 MP33AB01 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Soldering information The RHLGA (3.76 x 2.95) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 4. Recommended soldering profile limits tp TP CRITICAL ZONE RAMP-UP TL to T P TL TEMPERATURE TSMAX tL TSMIN ts PREHEAT RAMP-DOWN T25°C to PEAK 30 60 90 120 150 180 TIME 210 240 270 300 330 360 390 AM045166v1 Table 6. Recommended soldering profile limits Description Average ramp rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) TSMAX to TL Ramp-up rate Time maintained above liquidous temperature Liquidous temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 8/13 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID24159 Rev 2 MP33AB01 Package mechanical data Figure 5. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package outline Pin 1 Indicator E1 A1 G1 C N2 // K C E Pin 1 Indicator L2 K d P2 N1 K P1 KE Pad 5 G3 L1 D1 D D2 Pad 6 R1 G4 G2 N3 KD G5 E2 L3 TOP VIEW BOTTOM VIEW 8233292_D Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions mm inch. Symbol Min. Typ. Max. Min. Typ. Max. A1 0.900 1.000 1.100 0.0354 0.0394 0.0433 D1 3.660 3.760 3.860 0.1441 0.1480 0.1520 D2 0.600 0.750 0.900 0.0236 0.0295 0.0354 R1 0.200 0.250 0.300 0.0079 0.0098 0.0118 E1 2.850 2.950 3.050 0.1122 0.1161 0.1201 E2 1.325 1.475 1.625 0.0522 0.0581 0.0640 L1 2.690 2.740 2.790 0.1059 0.1079 0.1098 L2 1.882 1.932 1.982 0.0741 0.0761 0.0780 L3 1.981 2.031 2.181 0.0780 0.0800 0.0859 N1 1.300 1.350 1.400 0.0512 0.0531 0.0551 N2 0.916 0.966 1.116 0.0361 0.0380 0.0440 N3 0.965 1.015 1.065 0.0380 0.0400 0.0419 G1 0.673 0.723 0.763 0.0265 0.0285 0.0300 G2 0.512 0.562 0.612 0.0202 0.0221 0.0241 G3 0.562 0.612 0.662 0.0221 0.0241 0.0261 G4 0.562 0.612 0.662 0.0221 0.0241 0.0261 G5 1.174 1.224 1.274 0.0462 0.0482 0.0502 P1 1.680 1.730 1.780 0.0661 0.0681 0.0701 P2 1.275 1.325 1.375 0.0502 0.0522 0.0541 DocID24159 Rev 2 9/13 13 Package mechanical data MP33AB01 Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued) mm inch. Symbol Min. Typ. Max. Min. Typ. d 0.150 0.0059 K 0.050 0.0020 Figure 6. Device footprint and PCB land pattern 10/13 DocID24159 Rev 2 Max. MP33AB01 Package mechanical data Figure 7. Recommended stencil openings DocID24159 Rev 2 11/13 13 Revision history 6 MP33AB01 Revision history Table 8. Document revision history 12/13 Date Revision Changes 17-Jan-2013 1 Initial release 13-Sep-2013 2 Modified Figure 3 on page 7 DocID24159 Rev 2 MP33AB01 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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