MP34DB02TR

MP34DB02 MEMS audio sensor omnidirectional digital microphone Datasheet - production data • • • • • Speech recognition A/V eLearning devices Gaming and virtual reality input devices Digital still and video cameras Antitheft systems ) s t( Description c u d o r P The MP34DB02 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface with stereo operation capability. e t le o s b The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. O ) Features • • • • • • • Single supply voltage Low power consumption 120 dBSPL acoustic overload point 62.6 dB signal-to-noise ratio Omnidirectional sensitivity –26 dBFS sensitivity PDM single-bit output with option for stereo configuration RHLGA package − Bottom-port design − SMD-compliant − EMI-shielded ® − ECOPACK , RoHS and “Green” compliant s ( t c • u d o let o s b O r P e The MP34DB02 has an acoustic overload point of 120 dBSPL with a best-on-the-market 62.6 dB signal-to-noise ratio and -26 dBFS sensitivity. The MP34DB02 is available in a bottom-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Table 1: Device summary Applications • • • • The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. Mobile terminals Laptop and notebook computers Portable media players VoIP April 2016 Part number Temp. range [°C] Package Packing MP34DB02TR -40 to +85 RHLGA 4 LD (3x4x1) mm Tape and reel DocID026103 Rev 2 This is information on a product in full production. 1/17 www.st.com Contents MP34DB02 Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications ........................................... 6 2.1 Acoustic and electrical characteristics............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Sensing element .............................................................................. 9 4 5 Absolute maximum ratings........................................................... 10 Functionality .................................................................................. 11 ) s t( 6 c u Application recommendations ..................................................... 12 d o r Package information ..................................................................... 13 P e t le o Revision history ............................................................................ 16 s b O ) s t( c u d o r P e t e l o 7 8 5.1 L/R channel selection ...................................................................... 11 7.1 Soldering information ...................................................................... 13 7.2 RHLGA package information........................................................... 14 s b O 2/17 DocID026103 Rev 2 MP34DB02 List of tables List of tables Table 1: Device summary ........................................................................................................................... 1 Table 2: Pin description .............................................................................................................................. 5 Table 3: Acoustic and electrical characteristics .......................................................................................... 6 Table 4: Distortion specifications ................................................................................................................ 6 Table 5: Timing characteristics ................................................................................................................... 7 Table 6: Absolute maximum ratings ......................................................................................................... 10 Table 7: L/R channel selection ................................................................................................................. 11 Table 8: Recommended soldering profile limits ........................................................................................ 13 Table 9: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package mechanical data ....................... 14 Table 10: Document revision history ........................................................................................................ 16 ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 3/17 List of figures MP34DB02 List of figures Figure 1: Pin connections ........................................................................................................................... 5 Figure 2: Timing waveforms ....................................................................................................................... 7 Figure 3: Frequency response .................................................................................................................... 8 Figure 4: MP34DB02 electrical connections ............................................................................................. 12 Figure 5: MP34DB02 electrical connections for stereo configuration ....................................................... 12 Figure 6: Recommended soldering profile limits ...................................................................................... 13 Figure 7: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package outline ..................................... 14 ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 4/17 DocID026103 Rev 2 o r P MP34DB02 1 Pin description Pin description Figure 1: Pin connections ) s t( c u d e t le o s b o r P Table 2: Pin description Pin number Pin name 1 CLK ) s ( 2 3 t c u 4 d o r 5 (ground ring) -O Function Synchronization input clock LR Left/right channel selection Vdd Power supply DOUT GND Left/right PDM data output 0 V supply P e et l o s Ob DocID026103 Rev 2 5/17 Acoustic and electrical specifications MP34DB02 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Sym. Parameter Test condition Vdd Supply voltage Idd Current consumption in normal mode IddPdn Current consumption in (3) power-down mode Scc Short-circuit current AOP Acoustic overload point So Mean value A-weighted at 1 kHz, 1 Pa PSR Power supply rejection 100 mVpp square wave @ 217 Hz, A-weighted Clock Input clock frequency (5) TWK Wake-up time Top Operating temperature range (4) (5) -29 e t le -26 V t c u od µA 10 -23 mA dBSPL dBFS dB -86 dBFS 1 guaranteed by design u d o 3.6 62.6 o s b O ) s ( t c Unit mA Pr 120 (4) Max. ) s ( 1 Signal-to-noise ratio (3) 1.8 20 SNR (2) 1.64 (1) 0.65 at 1 kHz, 1 Pa (1) Typ. (2) Sensitivity Notes: Min. -40 2.4 3.25 MHz 10 ms +85 °C r P e Typical specifications are not guaranteed. No load on DOUT line. t e l o Input clock in static mode. Duty cycle: min = 40% max = 60% s b O Time from the first clock edge to valid output data. 6/17 Table 4: Distortion specifications Parameter Test condition Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N DocID026103 Rev 2 Value MP34DB02 2.2 Acoustic and electrical specifications Timing characteristics Table 5: Timing characteristics Parameter Description fCLK Clock frequency for normal mode fPD Clock frequency for power-down mode TCLK TR,EN Clock period for normal mode Max Unit 1 3.25 MHz 0.23 MHz 1000 ns 30 (1) ns 16 (1) ns 30 (1) ns 16 (1) ns 308 Data enabled on DATA line, L/R pin = 1 TR,DIS Min 18 (1) TL,EN Data disabled on DATA line, L/R pin = 1 TL,DIS Data enabled on DATA line, L/R pin = 0 18 (1) Data disabled on DATA line, L/R pin = 0 ) s t( Notes: (1) c u d From design simulations Figure 2: Timing waveforms e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 7/17 Acoustic and electrical specifications 2.3 MP34DB02 Frequency response Figure 3: Frequency response ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 8/17 DocID026103 Rev 2 o r P MP34DB02 3 Sensing element Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 9/17 Absolute maximum ratings 4 MP34DB02 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 6: Absolute maximum ratings Symbol Ratings Vdd Supply voltage Vin Input voltage on any control pin TSTG Storage temperature range ESD Electrostatic discharge protection Maximum value -0.3 to 6 V -0.3 to Vdd +0.3 V °C ct 2 (HBM) r P e t e l o s b O t c u d o r P e et l o s Ob 10/17 ) s ( -40 to +125 u d o ) (s Unit DocID026103 Rev 2 kV MP34DB02 Functionality 5 Functionality 5.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 7: L/R channel selection L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 11/17 Application recommendations 6 MP34DB02 Application recommendations Figure 4: MP34DB02 electrical connections CLK DOUT C ODE C Vdd ) s t( 100nF L/R 1 4 2 3 c u d 10 µF 5 o r P Top view e t le o s b Figure 5: MP34DB02 electrical connections for stereo configuration O ) DOUT s ( t c CLK C ODE C u d o r P e o s b Mic2 Mic1 let 5 Vdd 1 4 1 4 2 3 2 3 5 Top view Top view O 100 nF 10 µF Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 3 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection"). 12/17 DocID026103 Rev 2 MP34DB02 7 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK is an ST trademark. 7.1 Soldering information The RHLGA (3 x 4 x 1) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. ) s t( Landing pattern and soldering recommendations are available at www.st.com. Figure 6: Recommended soldering profile limits c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o Table 8: Recommended soldering profile limits Desription Parameter Average ramp rate bs Preheat O Minimum temperature Maximum temperature Time (TSMIN to TSMAX) Ramp-up rate Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec TSMAX to TL Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID026103 Rev 2 13/17 Package information 7.2 MP34DB02 RHLGA package information Figure 7: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package outline E1 N2 K G5xG5 Pin 1 Indicator R3 4 1 3 2 G2 G1 D4 L1 KE T1 d T1 K 2X G6 D2 D ) s t( D3 j D1 L2 N1 d T2 T2 M E4 j G7 KD c u d G8 A2 R1 R2 E E2 G3 A1 G4 o r P BOTTOM VIEW TOP VIEW e t e l o s 8413120_A Table 9: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package mechanical data Symbol s ( t c A2 D1 D3 du o r P D4 so e t le Ob 14/17 R1 Typ. Max. 0.900 1.000 1.100 0.200 0.250 0.300 3.900 4.000 4.100 0.900 1.000 1.100 1.000 1.100 1.200 3.610 3.700 3.790 0.200 0.250 0.300 )- A1 D2 Ob Min. mm. R2 0.280 R3 0.250 E1 2.900 3.000 3.100 E2 1.300 1.500 1.700 E4 2.610 2.700 2.790 L1 0.650 0.700 0.750 L2 0.850 0.900 0.950 N1 1.000 1.050 1.100 N2 0.400 0.450 0.500 T1 0.350 0.400 0.450 T2 0.550 0.600 0.650 G1 3.050 3.100 3.150 G2 3.750 3.800 3.850 G3 2.050 2.100 2.150 DocID026103 Rev 2 MP34DB02 Package information mm. Symbol Min. Typ. Max. G4 2.750 2.800 2.850 G5 0.250 0.300 0.350 G6 0.050 0.100 0.150 G7 0.500 0.550 0.600 G8 0.800 0.850 0.900 M 0.100 K 0.050 ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 15/17 Revision history 8 MP34DB02 Revision history Table 10: Document revision history Date Revision Changes 21-Mar-2014 1 Initial release 28-Apr-2016 2 Updated Table 1: "Device summary" Updated PSR in Table 3: "Acoustic and electrical characteristics" ) s t( c u d e t le o s b O ) s ( t c u d o r P e t e l o s b O 16/17 DocID026103 Rev 2 o r P MP34DB02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. ) s t( No license, express or implied, to any intellectual property right is granted by ST herein. c u d Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. o r P ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. e t le Information in this document supersedes and replaces information previously supplied in any prior versions of this document. o s b © 2016 STMicroelectronics – All rights reserved O ) s ( t c u d o r P e t e l o s b O DocID026103 Rev 2 17/17