MP34DT01

MP34DT01 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Description The MP34DT01 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. Features • • • • • • • • Single supply voltage Low power consumption 120 dBSPL acoustic overload point 63 dB signal-to-noise ratio Omnidirectional sensitivity –26 dBFS sensitivity PDM output HCLGA package − Top-port design − SMD-compliant − EMI-shielded ® − ECOPACK , RoHS, and “Green” compliant Applications • • • • • • • • • Mobile terminals Laptop and notebook computers Portable media players VoIP Speech recognition A/V eLearning devices Gaming and virtual reality input devices Digital still and video cameras Antitheft systems February 2015 The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. The MP34DT01 has an acoustic overload point of 120 dBSPL with a 63 dB signal-to-noise ratio and –26 dBFS sensitivity. The MP34DT01 is available in a top-port, SMDcompliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Table 1: Device summary Order codes Temp. range [°C] Package Packing MP34DT01 -40 to +85 HCLGA (3x4 x1 mm) 4LD Tray MP34DT01TR -40 to +85 HCLGA (3x4x1 mm) 4LD Tape and reel DocID022331 Rev 12 This is information on a product in full production. 1/20 www.st.com Contents MP34DT01 Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications ........................................... 6 2.1 Acoustic and electrical characteristics............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Carrier tape mechanical specifications ......................................... 9 4 5 Process recommendations ........................................................... 10 Sensing element ............................................................................ 12 6 Absolute maximum ratings........................................................... 13 7 Functionality .................................................................................. 14 7.1 8 9 2/20 L/R channel selection ...................................................................... 14 Package information ..................................................................... 15 8.1 Soldering information ...................................................................... 15 8.2 HCLGA package information........................................................... 16 Revision history ............................................................................ 19 DocID022331 Rev 12 MP34DT01 List of tables List of tables Table 1: Device summary ........................................................................................................................... 1 Table 2: Pin description .............................................................................................................................. 5 Table 3: Acoustic and electrical characteristics .......................................................................................... 6 Table 4: Distortion specifications ................................................................................................................ 6 Table 5: Timing characteristics ................................................................................................................... 7 Table 6: Frequency response mask for digital microphones ...................................................................... 8 Table 7: Absolute maximum ratings ......................................................................................................... 13 Table 8: L/R channel selection ................................................................................................................. 14 Table 9: Recommended soldering profile limits ........................................................................................ 15 Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions ................................................................ 17 Table 11: Document revision history ........................................................................................................ 19 DocID022331 Rev 12 3/20 List of figures MP34DT01 List of figures Figure 1: Pin connections ........................................................................................................................... 5 Figure 2: Timing waveforms ....................................................................................................................... 7 Figure 3: Frequency response and mask ................................................................................................... 8 Figure 4: Carrier tape without microphone (top view) ................................................................................. 9 Figure 5: Carrier tape with microphone (top view) ...................................................................................... 9 Figure 6: Recommended picking area ...................................................................................................... 10 Figure 7: Recommended picker design .................................................................................................... 11 Figure 8: Recommended soldering profile limits ...................................................................................... 15 Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline ......................................................................... 16 Figure 10: Land pattern............................................................................................................................. 18 4/20 DocID022331 Rev 12 MP34DT01 1 Pin description Pin description Figure 1: Pin connections Table 2: Pin description Pin # Pin name Function 1 Vdd Power supply 2 LR Left/Right channel selection 3 CLK Synchronization input clock 4 DOUT Left/Right PDM data output 5 (ground ring) GND 0 V supply DocID022331 Rev 12 5/20 Acoustic and electrical specifications MP34DT01 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Symbol Parameter Test condition Vdd Supply voltage Idd Current consumption in normal mode IddPdn Current consumption in power(2) down mode Scc Short-circuit current AOP Acoustic overload point So Min. Typ. 1.64 1.8 Mean value (1) -29 PSR Power supply rejection Clock Input clock frequency (4) Turn-on time Top Operating temperature range VIOL Low-level logic input/output voltage VIOH High-level logic input/output voltage V mA 20 µA 10 -26 dBSPL -23 (2) dB Guaranteed by design -70 dBFS 1 3.25 MHz 10 ms -40 +85 °C Iout = 1 mA -0.3 0.35xVdd V Iout = 1 mA 0.65xVdd Vdd+0.3 V Guaranteed by design 2.4 Typical specifications are not guaranteed. Input clock in static mode. (3) Duty cycle: min = 40% max = 60%. (4) Time from the first clock edge to valid output data. Table 4: Distortion specifications 6/20 dBFS 63 Notes: (1) mA A-weighted at 1 kHz, 1 Pa (3) Ton 3.6 120 Sensitivity Signal-to-noise ratio Unit 0.6 1 SNR Max. Parameter Test condition Value Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N DocID022331 Rev 12 MP34DT01 2.2 Acoustic and electrical specifications Timing characteristics Table 5: Timing characteristics Parameter Description fCLK Clock frequency for normal mode fPD Clock frequency for power-down mode TCLK TR,EN Data enabled on DATA line, L/R pin = 1 Data disabled on DATA line, L/R pin = 1 TL,DIS Max. Unit 1 3.25 MHz 0.23 MHz 1000 ns Clock period for normal mode TR,DIS TL,EN Min. Data enabled on DATA line, L/R pin = 0 308 18 18 Data disabled on DATA line, L/R pin = 0 (1) ns 16 (1) 16 (1) (1) ns ns ns Notes: (1) From design simulations Figure 2: Timing waveforms DocID022331 Rev 12 7/20 Acoustic and electrical specifications 2.3 MP34DT01 Frequency response Figure 3: Frequency response and mask Table 6: Frequency response mask for digital microphones Frequency / Hz (1) Lower limit Upper limit Unit 100...4000 -2 +2 dBr 1 kHz 4000...10000 -2 +4 dBr 1 kHz Notes: (1) 8/20 At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL) DocID022331 Rev 12 MP34DT01 3 Carrier tape mechanical specifications Carrier tape mechanical specifications Figure 4: Carrier tape without microphone (top view) Figure 5: Carrier tape with microphone (top view) DocID022331 Rev 12 9/20 Process recommendations 4 MP34DT01 Process recommendations To ensure a consistent manufacturing process it is strongly advised to comply with the following recommendations: • • • • • • • The recommended pick-up area for the MP34DT01 package must be defined using the worst case (ie. no device alignment during the picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). The picker tolerance shall be considered as well. To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area For the package outline please refer to Figure 5: "Carrier tape with microphone (top view)". Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for picking. Device alignment before picking is highly recommended. A vacuum force greater than 7 psi must be avoided 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances Figure 6: Recommended picking area To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle. The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device). The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel. 10/20 DocID022331 Rev 12 MP34DT01 Process recommendations Figure 7: Recommended picker design DocID022331 Rev 12 11/20 Sensing element 5 MP34DT01 Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. 12/20 DocID022331 Rev 12 MP34DT01 6 Absolute maximum ratings Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7: Absolute maximum ratings Symbol Ratings Vdd Supply voltage Vin Input voltage on any control pin TSTG Storage temperature range ESD Electrostatic discharge protection DocID022331 Rev 12 Maximum value Unit -0.3 to 6 V -0.3 to Vdd +0.3 V -40 to +125 °C 2 (HBM) kV 13/20 Functionality MP34DT01 7 Functionality 7.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 8: L/R channel selection 14/20 L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid DocID022331 Rev 12 MP34DT01 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK is an ST trademark. 8.1 Soldering information The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 8: Recommended soldering profile limits Table 9: Recommended soldering profile limits Description Average ramp rate Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) Ramp-up rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec TSMAX to TL Time maintained above liquids temperature Liquids temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID022331 Rev 12 15/20 Package information 8.2 MP34DT01 HCLGA package information Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline Note: The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes. 16/20 DocID022331 Rev 12 MP34DT01 Package information Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions mm Symbol Min. Typ. Max. A 0.90 1.00 1.10 A1 0.00 - 0.05 b 0.35 0.45 0.50 D 3.90 4.00 4.10 D1 3.05 3.10 3.15 D2 3.75 3.80 3.85 D3 0.30 0.50 0.70 E 2.90 3.00 3.10 E1 2.05 2.10 2.15 E2 2.75 2.80 2.85 E3 -0.20 0.00 0.20 e1 1.30 1.35 1.40 e2 0.80 0.85 0.90 h 0.25 0.30 0.35 L 0.90 0.95 1.00 L1 - 0.10 - N 4 R1 0.30 0.40 0.50 R2 - 0.40 - aaa 0.15 ccc 0.10 eee 0.08 DocID022331 Rev 12 17/20 Package information MP34DT01 Figure 10: Land pattern 0.85 GND 0.85 0.35 1.30 0.35 GND Pad + solder paste 18/20 DocID022331 Rev 12 2.30 GND LR Vdd 0.95 CLK GND DOUT 0.40 MP34DT01 9 Revision history Revision history Table 11: Document revision history Date Revision Changes 06-Oct-2011 1 Initial release 18-Nov-2011 2 Removed “stereo” from title, Section "Features", and Section "Description" 29-Nov-2011 3 Updated Section "Features" and Section "Description" 04-Jan-2012 4 Updated Added So limits to Table 3: "Acoustic and electrical characteristics" Minor textual updates 23-Mar-2012 5 Updated Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline" Pin 1 indicator removed from top view of package on page 1 and Figure 1: "Pin connections" Updated Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions" 06-Apr-2012 6 Updated maximum supply voltage in Table 3: "Acoustic and electrical characteristics" 07-May-2012 7 Added VIOL, VIOH to Table 3: "Acoustic and electrical characteristics" 18-May-2012 8 Updated Table 5: "Timing characteristics" 05-Jul-2012 9 Added Section 5: "Sensing element" Added Figure 10: "Land pattern" Updated temperature range to -40 to +85 °C throughout datasheet 21-Feb-2013 10 Updated dimension T2 in Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions" 07-Jun-2013 11 Updated - Figure 3: "Frequency response and mask" - Table 6: "Frequency response mask for digital microphones" - HCLGA mechanical data Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline" and Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions" Added - Section 3: "Carrier tape mechanical specifications" - Section 4: "Process recommendations" 27-Feb-2015 12 Minor textual updates Added note below Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline" DocID022331 Rev 12 19/20 MP34DT01 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 20/20 DocID022331 Rev 12