MP34DT04-C1
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
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Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
Description
The MP34DT04-C1 is an ultra-compact, lowpower, omnidirectional, digital MEMS microphone
built with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
Features
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Single supply voltage
Low power consumption
120 dBSPL acoustic overload point
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS sensitivity
PDM output
HCLGA package
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Top-port design
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SMD-compliant
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EMI-shielded
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ECOPACK®, RoHS, and “Green”
compliant
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT04-C1 has an acoustic overload
point of 120 dBSPL with a 64 dB signal-to-noise
ratio and –26 dBFS sensitivity.
The MP34DT04-C1 is available in a top-port,
SMD-compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp. range
[ºC]
Package
Packing
MP34DT04TR-C1
-40 to +85
HCLGA
(3x4 x1.095 mm)
4LD
Tape and
reel
Applications
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Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
December 2016
DocID029851 Rev 2
This is information on a product in full production.
1/21
www.st.com
Contents
MP34DT04-C1
Contents
1
Pin description ................................................................................ 5
2
Acoustic and electrical specifications ........................................... 6
2.1
Acoustic and electrical characteristics............................................... 6
2.2
Timing characteristics ....................................................................... 7
2.3
Frequency response ......................................................................... 8
3
Application recommendations ....................................................... 9
4
5
Carrier tape mechanical specifications ....................................... 11
Process recommendations........................................................... 12
6
Sensing element............................................................................ 14
7
Absolute maximum ratings........................................................... 15
8
Functionality .................................................................................. 16
8.1
9
10
2/21
L/R channel selection...................................................................... 16
Package information ..................................................................... 17
9.1
Soldering information ...................................................................... 17
9.2
HCLGA package information........................................................... 18
Revision history ............................................................................ 20
DocID029851 Rev 2
MP34DT04-C1
List of tables
List of tables
Table 1: Device summary ...........................................................................................................................1
Table 2: Pin description ..............................................................................................................................5
Table 3: Acoustic and electrical characteristics ..........................................................................................6
Table 4: Distortion specifications ................................................................................................................6
Table 5: Timing characteristics ...................................................................................................................7
Table 6: Frequency response mask for digital microphones ......................................................................8
Table 7: Absolute maximum ratings .........................................................................................................15
Table 8: L/R channel selection .................................................................................................................16
Table 9: Recommended soldering profile limits........................................................................................17
Table 10: Document revision history ........................................................................................................20
DocID029851 Rev 2
3/21
List of figures
MP34DT04-C1
List of figures
Figure 1: Pin connections ...........................................................................................................................5
Figure 2: Timing waveforms .......................................................................................................................7
Figure 3: Frequency response and mask ...................................................................................................8
Figure 4: MP34DT04-C1 electrical connections (top view) ........................................................................9
Figure 5: MP34DT04-C1 electrical connections for stereo configuration (top view) ................................10
Figure 6: Carrier tape without microphone (top view)...............................................................................11
Figure 7: Carrier tape with microphone (top view)....................................................................................11
Figure 8: Recommended picking area......................................................................................................12
Figure 9: Recommended picker design ....................................................................................................13
Figure 10: Recommended soldering profile limits ....................................................................................17
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data ........................................18
Figure 12: Land pattern.............................................................................................................................19
4/21
DocID029851 Rev 2
MP34DT04-C1
1
Pin description
Pin description
Figure 1: Pin connections
LR
2
3
CLK
Vdd
1
4
DOUT
5
GND
Table 2: Pin description
Pin #
Pin name
Function
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
0 V supply
DocID029851 Rev 2
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Acoustic and electrical specifications
MP34DT04-C1
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25
°C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Vdd
Supply voltage
Idd
Current consumption in
normal mode
IddPdn
Current consumption in
power-down mode(2)
Scc
Short-circuit current
AOP
Acoustic overload point
So
Test condition
Min.
Typ.(1)
Max.
Unit
1.6
1.8
3.6
V
Mean value
650
1
μA
10
μA
10
mA
120
Sensitivity
-29
-26
dBSPL
-23
dBFS
SNR
Signal-to-noise ratio
A-weighted at 1 kHz, 94
dB SPL
64
dB (A)
PSR
Power supply rejection
100 mVpp sine 1 kHz
-70
dBFS
fCLK
Input clock frequency(3)
Ton
Turn-on time(4)
Top
Operating temperature range
VIOL
Low-level logic input/output
voltage
VIOH
High-level logic input/output
voltage
CLOAD
1.2
3.25
MHz
10
ms
-40
+85
°C
Iout = 1 mA
-0.3
0.35xVdd
V
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
100
pF
Guaranteed by design
Capacitive load
2.4
Notes:
(1)Typical
specifications are not guaranteed.
(2)Input
clock in static mode.
(3)Duty
cycle: min = 40% max = 60%
(4)Time
from the first clock edge to valid output data.
Table 4: Distortion specifications
Parameter
Test condition
Typ. value(1)
Distortion
100 dBSPL (50 Hz - 4 kHz)
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