MP34DT05-A
Datasheet
MEMS audio sensor omnidirectional digital microphone
Features
•
•
•
•
•
•
•
•
Single supply voltage
Low power consumption
AOP = 122.5 dBSPL
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS ±3 dB sensitivity
PDM output
HCLGA package
–
Top-port design
–
SMD-compliant
–
EMI-shielded
–
ECOPACK, RoHS, and “Green” compliant
Applications
Product status link
MP34DT05-A
Product summary
Order code
MP34DT05TR-A
Temperature
range [°C]
-40 to +85
Package
Packing
HCLGA
(3 x 4 x 1 mm) 4LD
Tape and reel
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Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
Description
The MP34DT05-A is an ultra-compact, low-power, omnidirectional, digital MEMS
microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a
specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a
dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT05-A is a low-distortion digital microphone with a 64 dB signal-to-noise
ratio and –26 dBFS ±3 dB sensitivity.
The MP34DT05-A is available in a top-port, SMD-compliant, EMI-shielded package
and is guaranteed to operate over an extended temperature range from -40 °C to
+85 °C.
DS12239 - Rev 4 - April 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
MP34DT05-A
Pin description
1
Pin description
Figure 1. Pin connections
LR
CLK
DOUT
Vdd
GND
BOTTOM VIEW
Table 1. Pin description
DS12239 - Rev 4
Pin #
Pin name
1
Vdd
Power supply
2
LR
Left/Right channel selection
Function
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
Ground
page 2/17
MP34DT05-A
Acoustic and electrical specifications
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise
noted.
Table 2. Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in normal mode
IddPdn
Current consumption in power-down
Scc
Short-circuit current
AOP
Acoustic overload point
So
Max.
Unit
1.6
1.8
3.6
V
Mean value
650
Signal-to-noise ratio
PSR
Power supply rejection
fCLK
frequency(3)
1
Turn-on
Top
Operating temperature range
VIOL
Low-level logic input/output voltage
VIOH
High-level logic input/output voltage
10
122.5
A-weighted @1 kHz,
-26
100 mVpp sine 1 kHz
1.2
Guaranteed by design
2.4
µA
mA
dBSPL
-23
64
94 dB SPL
time(4)
Ton
µA
5
-29
SNR
CLOAD
Typ.(1)
mode(2)
Sensitivity
Input clock
Min.
dBFS
dB(A)
-90
dBFS
3.25
MHz
10
ms
-40
+85
°C
Iout = 1 mA
-0.3
0.35xVdd
V
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
100
pF
Capacitive load
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.
Table 3. Distortion specifications @ 1 kHz
Parameter
Test condition
Typical value (1)
Distortion
94 dBSPL
0.2% THD + N
Distortion
110 dBSPL
0.7% THD + N
Distortion
120 dBSP
6% THD + N
1. Typical specifications are not guaranteed.
DS12239 - Rev 4
page 3/17
MP34DT05-A
Timing characteristics
2.2
Timing characteristics
Table 4. Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
Min.
Max.
Unit
1.2
3.25
MHz
0.23
MHz
1000
ns
TCLK
Clock period for normal mode
308
TR,EN
Data enabled on DATA line, L/R pin = 1
40
TR,DIS
Data disabled on DATA line, L/R pin = 1
TL,EN
Data enabled on DATA line, L/R pin = 0
TL,DIS
Data disabled on DATA line, L/R pin = 0
ns
30
40
ns
ns
30
ns
Figure 2. Timing waveforms
TCLK
CLK
TL,DIS
TR,EN
TR,DIS
High Z
PDM R
High Z
TL,EN
PDM L
DS12239 - Rev 4
High Z
High Z
page 4/17
MP34DT05-A
Frequency response
2.3
Frequency response
Figure 3. Typical frequency response normalized to 1 kHz
DS12239 - Rev 4
page 5/17
MP34DT05-A
Application recommendations
3
Application recommendations
Figure 4. MP34DT05-A electrical connections (top view)
Vdd
1µF
100nF
L/R
1
4
2
3
Dout
CLK
CODEC
TOP VIEW
5
Ground ring
Figure 5. MP34DT05-A electrical connections for stereo configuration (top view)
Vdd
1µF
100nF
TOP VIEW
L/R
1
4
2
3
Dout
Dout
Vdd
1
4
2
3
5
Ground ring
CLK
CODEC
Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin
1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection).
DS12239 - Rev 4
page 6/17
MP34DT05-A
Carrier tape mechanical specifications
4
Carrier tape mechanical specifications
Figure 6. Carrier tape without microphone (top view)
Figure 7. Carrier tape with microphone (top view)
DS12239 - Rev 4
page 7/17
MP34DT05-A
Process recommendations
5
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations:
•
The recommended pick-up area for the MP34DT05-A package must be defined using the worst case (ie. no
device alignment during picking process). This area has been defined considering all the tolerances of the
components involved (reel, package, sound inlet). Picker tolerance shall be considered as well.
•
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the
component on the inlet area
•
For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape,
size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the
picking.
•
Device alignment before picking is highly recommended.
•
A vacuum force greater than 7 psi must be avoided
•
1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
•
MSL (moisture sensitivity level) Class 3
•
Maximum of 3 reflow cycles is recommended
•
All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment
tolerances
Figure 8. Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the
porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always
left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air
disturbances during the picking or placing of the devices in the tape and reel.
DS12239 - Rev 4
page 8/17
MP34DT05-A
Process recommendations
Figure 9. Recommended picker design
DS12239 - Rev 4
page 9/17
MP34DT05-A
Sensing element
6
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate
placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity
between those two plates.
DS12239 - Rev 4
page 10/17
MP34DT05-A
Absolute maximum ratings
7
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Table 5. Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
Maximum value
Unit
-0.3 to 5
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
±2000 (HBM)
ESD
Electrostatic discharge protection
±200 (MM)
V
±750 (CBM)
ESD
Product standard EN 55024:2010 - 3 air discharges
±15000
V
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.
DS12239 - Rev 4
page 11/17
MP34DT05-A
Functionality
8
Functionality
8.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 6. L/R channel selection. The
L/R pin must be connected to Vdd or GND.
Table 6. L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is not mandatory to
connect the pin itself to GND for the respective channel selection.
DS12239 - Rev 4
page 12/17
MP34DT05-A
Package information
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
9.1
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for
soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10. Recommended soldering profile limits
tp
TP
CRITICAL ZONE
RAMP-UP
TL to T P
TL
TEMPERATURE
TSMAX
tL
TSMIN
ts
PREHEAT
RAMP-DOWN
T25° to PEAK
30 60 90 120 150 180
210
TIME
240
270
300
330
360 390
Table 7. Recommended soldering profile limits
Description
Parameter
Pb free
TL to TP
3 °C/sec max
Minimum temperature
TSMIN
150 °C
Maximum temperature
TSMAX
200 °C
Time (TSMIN to TSMAX)
tS
60 sec to 120 sec
Average ramp rate
Preheat
Ramp-up rate
Time maintained above liquidus temperature
tL
60 sec to 150 sec
Liquidus temperature
TL
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
DS12239 - Rev 4
TSMAX to TL
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
page 13/17
MP34DT05-A
HCLGA package information
9.2
HCLGA package information
Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
ITEM
Length [L]
W idth [W ]
Height [H]
AP
DIMENSION [mm]
3
4
1.00
Ø 0.25
TOLERANCE [mm]
±0.1
±0.1
±0.1
±0.1
DM00231908_3
1.
2.
DS12239 - Rev 4
The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected
to thermal processes. This variation does does not affect acoustic or electrical performance.
Ring plating can be subject to change not affecting acoustic and electrical performance.
page 14/17
MP34DT05-A
HCLGA package information
Figure 12. Land pattern
0.85
GND
0.85
0.35
1.30
2.30
GND
LR
Vdd
0.95
CLK
GND
DOUT
0.40
0.35
GND
Pad + solder paste
DS12239 - Rev 4
page 15/17
MP34DT05-A
Revision history
Table 8. Document revision history
DS12239 - Rev 4
Date
Revision
Changes
24-Jul-2017
1
Initial release
21-Sep-2017
2
Updated Section 6: "Sensing element"
13-Dec-2018
3
Document status promoted to "production data"
29-Apr-2019
4
Updated Table 4. Timing characteristics
page 16/17
MP34DT05-A
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DS12239 - Rev 4
page 17/17
